JP2000236198A - Part mounting device and optical axis offset quantity measuring method for image pickup means therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To highly accurately measure optical offset quantity by moving an image pickup means to a first position, storing a proofreading mark as a micro movement second position on the optical axis of a second image pickup part and storing the difference between both positions as optical axis offset quantity. SOLUTION: The parallel degree of the respective parts of a part mounting device is adjusted (STP1), a printed board is sucked/fixed to the upper face of X-Y stages (STP2), and a chip storage tray is fixed on the upper face of a Y stage. A control unit moves the chip storage tray in the Y direction and positions it. Then, it moves the tray to a chip storage side and positions it. A prescribed chip in the chip storage tray is sucked (STP4). A chip inversion X stage is moved to a printed board-side and is positioned (STP5). It is moved to a tray-side and is sheltered (STP6). The control unit recognizes the chip mounting position of the printed board with the operation of a camera (STP7), and the chip mounting position of the printed board is corrected for the correction of a chip position (STP8). Then, the chip can be mounted with high accuracy (STP10).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting components on a substrate and a method for measuring an optical axis offset amount of an image pickup means in the apparatus.

[0002]

2. Description of the Related Art Generally, a flip chip bonder (F / C bonder) is used to mount a bare chip (hereinafter simply referred to as a chip), which is an IC before a package divided from a wafer, onto a printed circuit board or a glass substrate. It is used. The F / C bonder includes a table device for mounting and fixing a printed circuit board, a tool device for sucking a chip and mounting it on the printed circuit board, and a camera device for recognizing images of the printed circuit board and the chip, respectively. It is roughly composed of

[0003] The table device is disposed on the body of the F / C bonder. The tool device is disposed above the table device. The camera device is disposed between the table device and the tool device so as to be able to enter and exit. An opening of the chip recognition camera for recognizing the position of the chip and an opening of the board recognition camera for recognizing the mounting position of the chip on the printed circuit board are arranged substantially coaxially on the upper and lower surfaces of the camera device. Has been established.

An F / F equipped with a camera device having such a configuration
In the C bonder, the offset amount of each optical axis of the board recognition camera and the chip recognition camera needs to be zero in order to accurately align the chip mounting position of the printed circuit board with the chip position. However, it is very difficult to make the optical axis offset amount zero when manufacturing an F / C bonder. For this reason, usually, when the F / C bonder is used, the optical axis offset amount is measured in advance, and the chip is mounted on the printed circuit board based on the measured optical axis offset amount.

FIG. 12 is a perspective view showing an example of a special measuring jig used for measuring the optical axis offset amount.
The special measuring jig 10 is formed in a block shape having a C-shaped cross section, and for example, circular calibration marks 11 and 12 are respectively added to the approximate center of the upper and lower inner surfaces.
Each of the calibration marks 11 and 12 is formed so as to be coaxial when the special measurement jig 10 is placed on a table device.

When measuring the optical axis offset amount using the special measuring jig 10 having such a configuration, first, the special measuring jig 10 is placed on a table device, and the camera device is moved to the special measuring jig 10. Move between the inner upper and lower surfaces. Next, the optical axis of the board recognition camera is aligned with the calibration mark 11, and the position of the camera device at that time is measured. Subsequently, the optical axis of the chip recognition camera is aligned with the calibration mark 12, and the position of the camera device at that time is measured. Then, a difference between the measured positions of the camera device is obtained and set as an optical axis offset amount.

[0007]

SUMMARY OF THE INVENTION The above-mentioned conventional F / C
In the method of measuring the optical axis offset amount of the camera device in the bonder, a special measuring jig 10 in which the calibration marks 11 and 12 are formed coaxially must be manufactured. Further, a jig for measuring whether or not the calibration marks 11 and 12 are formed coaxially with high accuracy is further required. Therefore,
The production of the special measuring jig 10 and the like is troublesome, and has the disadvantage of increasing the cost.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a component mounting apparatus and an optical axis offset measuring method capable of solving the above-mentioned problems and accurately measuring the optical axis offset of the imaging means with a simple configuration. .

[0009]

According to the present invention, there is provided a component mounting apparatus for mounting a component on a board.
The component is movable in two orthogonal axes directions (X direction and Y direction), and is capable of moving in a direction (Z direction) orthogonal to the two orthogonal axes and a mounting means for mounting the substrate. Mounting means for mounting on the substrate mounted on the mounting means, and the substrate mounted on the mounting means movable in three orthogonal axes directions (X direction, Y direction, Z direction); An imaging unit having a first imaging unit for recognizing and a second imaging unit for recognizing the component mounted on the mounting unit, wherein an opening of each of the imaging units is coaxially arranged; Controlling each of the means, measuring the optical axis offset amount of each of the imaging units, and mounting the component mounted on the mounting means on the mounting means based on the optical axis offset amount; Control means for mounting the substrate on the second imaging apparatus, wherein the control means Opening parts is moving the imaging means so as to be positioned on the mounting axis of the mounting means, and storing the position of the imaging unit at that time as a first position,
The placement means is slightly moved so that the calibration mark of the calibration jig previously placed on the placement means is positioned on the optical axis of the first imaging unit, and the imaging means is moved. Retreating, moving the mounting means, transferring the calibration jig from the mounting means to the mounting means, moving the imaging means to the first position, and the calibration mark The imaging means is slightly moved so as to be located on the optical axis of the second imaging section, and the position of the imaging means at that time is set to the second position.
And the difference between the first position and the second position is obtained and stored as the optical axis offset amount in the imaging means.

According to the above configuration, the first and second imaging units recognize the calibration marks of the calibration jig positioned at a fixed position on the XY plane, respectively. Since the position of the optical axis of the first imaging unit and the position of the optical axis of the second imaging unit are grasped by the position of the imaging unit, the position of the optical axis of the first imaging unit and the second imaging The difference from the position of the optical axis of the section is the optical axis offset amount in the imaging means. Therefore, when the component mounted on the mounting means is mounted on the substrate mounted on the mounting means, the mounting means is moved by this difference, thereby enabling high-precision mounting.

[0011] Further, according to the present invention, there is provided a component mounting apparatus for mounting a component on a substrate, the component mounting device being movable in two orthogonal directions (X direction and Y direction), and mounting the substrate. Mounting means and direction orthogonal to two orthogonal axes (Z direction)
And mounting means for mounting the component on the substrate mounted on the mounting means, and movable in three orthogonal axes directions (X direction, Y direction, and Z direction). A first imaging unit for recognizing the substrate mounted on the mounting unit and a second imaging unit for recognizing the component mounted on the mounting unit, wherein the openings of the imaging units are coaxial. By controlling the imaging means provided above and each of the means,
A control unit that measures an optical axis offset amount of each of the imaging units, and mounts the component mounted on the mounting unit on the substrate mounted on the mounting unit based on the optical axis offset amount. The control means stores the initial position of the mounting means as a first position, and moves the mounting means to move the calibration jig previously mounted on the mounting means forward. The image pickup means is moved from the placement means to the mounting means, and the image pickup means is moved so that the opening of the second imaging section is located on the mounting axis of the mounting means, and the calibration mark is The imaging means is slightly moved so as to be located on the optical axis of the second imaging unit, the position of the imaging means at that time is stored as a second position, the imaging means is moved and retracted, and the mounting means is moved. Move the calibration jig to the mounting hand To the placing means, and moving the imaging means to the second position, and minutely moving the placing means so that the calibration mark is located on the optical axis of the first imaging section. The position of the placing means at that time is stored as a third position, and the first position and the third position are stored.
The position difference is obtained and stored as the optical axis offset amount in the placing means.

According to the above configuration, the first and second imaging units recognize the calibration mark of the calibration jig positioned at a fixed position on the XY plane, respectively. Since the position of the optical axis of the first imaging unit and the position of the optical axis of the second imaging unit are grasped by the position of the mounting unit, the position of the optical axis of the first imaging unit and the position of the second The difference from the position of the optical axis of the imaging unit is the optical axis offset amount in the mounting means. Therefore, when the component mounted on the mounting means is mounted on the substrate mounted on the mounting means, the mounting means is moved by this difference, thereby enabling high-precision mounting.

[0013]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIGS. 1, 2 and 3 are a plan view, a front view and a side view, respectively, showing an embodiment of a component mounting apparatus according to the present invention. The component mounting apparatus 100 includes a flip chip bonder (F / F) for mounting a chip 102 on a printed circuit board 101.
A frame (mounting means) 106, a substrate XY stage (mounting means) 111, a chip inversion X stage 118, and a tray Y stage 119 are attached to a base 105 of a gantry 104.

A tool Z linear guide (mounting means) 107, a tool Z motor (mounting means) 1
08, tool control mechanism (mounting means) 109, tool rotation axis (mounting means) 110, tilt mechanism (mounting means) 125
And a bonding tool (mounting means) 126 are attached. The bonding tool 126 moves in the Z direction along the tool Z linear guide 107 by driving the tool Z motor 108 under the control of the tool control mechanism 109, rotates around the Z axis by the tool rotation shaft 110, and The degree of parallelism in the XY direction with respect to the XY stage 111 is adjusted.

Further, the frame 106 includes a camera base (imaging means) 114, a camera Z motor (imaging means) 1
15, a camera (imaging means) 116 and a camera Z stage (imaging means) 117 are attached. The camera 116 attached to the camera Z stage 117 moves in the Z direction by driving the camera Z motor 115. Although not shown, the camera 116
Also has an X-Y direction movement function.

The substrate XY stage 111 has a substrate X motor (mounting means) 112 and a substrate Y motor (mounting means).
On the upper surface of the substrate XY stage 111, a mechanism (not shown) for adsorbing the printed circuit board 101 to a predetermined position is mounted.
The substrate XY stage 111 moves in the XY directions by driving the substrate X motor 112 and the substrate Y motor 113.

The chip reversing X stage 118 includes a chip reversing X motor 121, a chip reversing cylinder 122, a chip reversing arm 123, and a chip reversing linear guide 124.
Is attached. Chip inversion X stage 118
Is moved in the X direction along the chip reversing linear guide 124 by the driving of the chip reversing X motor 121. Further, the tip reversing arm 123 turns in the X direction by driving the tip reversing cylinder 122.

A tray Y motor 120 is mounted on the tray Y stage 119. Further, on the upper surface of the tray Y stage 119, a mechanism (not shown) for holding a chip storage tray 103 storing a plurality of chips 102 at a predetermined position is attached. The tray Y stage 119 is moved in the Y direction by driving the tray Y motor 120. Then, a control unit (control means) 130 as shown in FIG.
And the operation panel (control means) 140 is, for example,
4 is built-in or externally attached.

FIGS. 5A, 5B and 5C show the camera 1.
It is the top view, side view, and front view which show the schematic structure of 16. This camera 116 has two cameras, a chip recognition camera 116b for recognizing the position of the chip 102 and a board recognition camera 116c for recognizing the chip mounting position of the printed circuit board 101, inside the housing 116a. They are juxtaposed so as to be in the same direction in the Y direction.

Mirrors 116d and 116e are arranged on the imaging side of the cameras 116b and 116c, for example, at an angle of ± 45 degrees in the X direction with respect to the Y axis.
A double-sided mirror 116f is, for example, Y intermediate between 6d and 116e.
It is configured to be arranged at an angle of 45 degrees in the Z direction with respect to the axis. A chip recognition camera 116b is provided on the upper and lower surfaces of the housing 116a in the Z direction with respect to the double-sided mirror 116f.
Image capture opening 116g and a board recognition camera 116
The image capturing openings 116h for c are provided so as to be substantially coaxial with each other.

According to the camera 116 having such a configuration,
Images on the printed circuit board 101 and the chip 102 can be simultaneously recognized. That is, the image of the printed circuit board 101 entered through the image capturing opening 116h is
f to the mirror 116e side,
The light is reflected by e and is taken into the board recognition camera 116c. On the other hand, the chip 1 inserted through the image capturing opening 116g
The image 02 is reflected by the double-sided mirror 116f toward the mirror 116d, further reflected by the mirror 116d, and captured by the chip recognition camera 116b.

FIG. 6 shows a calibration jig (calibration jig) used when measuring the offset amount of each optical axis of the chip recognition camera 116b and the board recognition camera 116c.
It is a perspective view which shows an example. The calibration jig 20 is formed in a plate shape from, for example, glass, which is a light transmitting material, and has, for example, a circular calibration mark (calibration mark) 21 substantially at the center of the upper surface. Since the calibration jig 20 itself is formed of a light transmitting material, the calibration mark 21 can be recognized not only from the upper surface side but also from the lower surface side.

An operation example of such a configuration will be described with reference to a flowchart of FIG. First,
The worker adjusts the parallelism of each part of the component mounting apparatus 100 (STP1). Then, the printed board 101 is replaced with the board X
-Stuck on the upper surface of the Y stage 111 (ST
P2) The chip storage tray 103 storing the chips 102 is fixed to the upper surface of the tray Y stage 119 (STP3). Note that the above steps STP1 to STP1 may be automated depending on the component mounting apparatus.

Next, the control unit 130 drives the tray Y motor 120 to move and position the chip storage tray 103 fixed on the upper surface of the tray Y stage 119 in the Y direction. Motor 1
The chip reversing X stage 118 is moved in the X direction, that is, toward the chip storage tray 103, and positioned.

Then, the control unit 130 drives the chip reversing cylinder 122 so that the chip reversing X stage 1
The chip reversing arm 123 on the chip 18 is swiveled toward the chip storage tray 103, and a chip suction nozzle (not shown) attached to the tip of the chip reversing arm 123.
A predetermined chip 102 in the chip storage tray 103
Is adsorbed (STP4).

Thereafter, the chip reversing cylinder 122 is driven in the reverse direction to the above, and the chip reversing arm 123 on the chip reversing X stage 118 is moved 180 degrees toward the printed board 101 side.
At the same time, the chip inversion X motor 121 is driven in the reverse direction to move the chip inversion X stage 118 in the X direction, that is, toward the printed circuit board 101, and is positioned (STP5).

After passing the chip 102 from the chip suction nozzle of the chip reversing arm 123 to the bonding tool 126, the control unit 130 drives the chip reversing X motor 121 to drive the chip reversing X stage 11
8 is moved in the X direction, that is, toward the chip storage tray 103, and is retracted (STP6). Then, the control unit 1
Reference numeral 30 denotes the printed circuit board 10 operated by the camera 116 or the like.
The position of chip 102 is confirmed, and the position of chip 102 is confirmed (STP7).

Then, the control unit 130 checks the chip mounting position of the printed circuit board 101 and the chip 102
The tool control mechanism 109 is controlled based on the position of
The tool rotation shaft 110 is rotated around the Z axis, and the tip 10 is rotated.
2 is corrected, and the substrate X motor 112 and the substrate Y motor 113 are driven so that the substrate XY stage 11
1 is moved in the XY directions to correct the chip mounting position of the printed circuit board 101 (STP8).

Further, the control unit 130 drives the substrate X motor 112 and the substrate Y motor 113 based on the measured optical axis offset amount, and
11 is slightly moved in the XY directions. Subsequently, the control unit 130 drives the tool Z motor 108 to move the bonding tool 126 in the Z direction, that is, the printed circuit board 10.
The chip 102 is lowered to the first side, and the chip 102 is mounted on a target position on the printed circuit board 101 (STP9).

The control unit 130 controls the tool control mechanism 109 to pressurize the chip 102 and controls the bonding tool 126 to control the chip 102.
Is heated (STP10). Thus, the chip 102
Is mounted on the printed circuit board 101 with high precision.

FIG. 8 is a flowchart showing a first embodiment of the method for measuring the optical axis offset amount of the present invention. First, the operator places the calibration jig 20 on the substrate X-
It is fixed by suction on the Y stage 111 (STP701).
The control unit 130 moves and positions the camera 116 toward the bonding tool 126 such that the image capturing opening 116g of the camera 116 is located directly below the bonding tool 126, that is, on the mounting axis (STP70).
2). Then, the position of the camera 116 at this time is pos
A (first position) is stored (STP703).

Subsequently, the control unit 130 sets the calibration mark 21 of the calibration jig 20
Are located at the center of the field of view of the board recognition camera 116c, that is, on the optical axis.
By driving the substrate 13, the substrate XY stage 111 is finely moved in the XY directions to perform correction (STP704). next,
The control unit 130 moves and retreats the camera 116 so that the bonding tool 126 does not hit the camera 116 even when the bonding tool 126 is lowered to the substrate XY stage 111 (S
TP705).

Then, the control unit 130 controls the tool Z
The motor 108 is driven to lower the bonding tool 126 in the Z direction, that is, toward the substrate XY stage 111. Subsequently, the control unit 130 controls the tool control mechanism 1
In step S706, the calibration jig 20 is sucked to the bonding tool 126 by controlling the bonding tool 126, and at the same time, the suction of the calibration jig 20 of the substrate XY stage 111 is released. Next, the control unit 130 drives the tool Z motor 108 to
After raising the camera 26 in the Z direction, that is, the side away from the substrate XY stage 111, the camera 116 is positioned at posA (STP707).

Subsequently, the control unit 130 sets the calibration mark 21 of the calibration jig 20
Is corrected by slightly moving the camera 116 in the X-Y directions so that it is located at the center of the visual field of the chip recognition camera 116b, that is, on the optical axis (STP708). Then, the position of the camera 116 at this time is stored as posB (second position) (STP709). Next, the control unit 130
Moves and retracts the camera 116, and the tool Z motor 10
8, the bonding tool 126 is moved down in the Z direction, that is, toward the substrate XY stage 111 side.

Subsequently, the control unit 130 controls the tool control mechanism 109 to release the suction of the calibration jig 20 of the bonding tool 126 and drives the tool Z motor 108 to move the bonding tool 126 to the Z position.
The substrate is raised in the direction, that is, on the side away from the substrate XY stage 111 (STP710). And the control unit 13
0 indicates the difference between the stored posA and posB by the camera Z
It is obtained as an optical axis offset amount of the chip recognition camera 116b and the board recognition camera 116c on the stage 117 (STP711).

FIG. 9 is a flowchart showing a second embodiment of the optical axis offset measuring method according to the present invention. First, the operator places the calibration jig 20 on the substrate X-
It is fixed by suction on the Y stage 111 (STP721).
Then, the control unit 130 controls the substrate XY at this time.
The position of the stage 111 is stored as posA ′ (first position) (STP722).

The control unit 130 moves and retracts the camera 116 so that the bonding tool 126 does not hit the camera 116 even if it descends to the substrate XY stage 111 (STP723). And the control unit 13
0 drives the tool Z motor 108 to move the bonding tool 126 in the Z direction, that is, the substrate XY stage 111.
To the side.

Subsequently, the control unit 130 controls the tool control mechanism 109 so that the calibration jig 20 is attracted to the bonding tool 126 and, at the same time, the substrate X-
The suction of the calibration jig 20 of the Y stage 111 is released (STP724). Next, the control unit 13
0 drives the tool Z motor 108 to move the bonding tool 126 in the Z direction, that is, the substrate XY stage 111.
To the side away from

The control unit 130 moves the camera 116 toward the bonding tool 126 and positions it so that the image capturing opening 116g of the camera 116 is directly below the bonding tool 126, that is, on the mounting axis (S).
TP725). Subsequently, the control unit 130 checks the calibration mark 21 of the calibration jig 20.
Is corrected by slightly moving the camera 116 in the X-Y directions so that it is located at the center of the visual field of the chip recognition camera 116b, that is, on the optical axis (STP726). Then, the position of the camera 116 at this time is stored as posB ′ (second position) (STP727).

Next, the control unit 130 controls the camera 11
6 is moved and retracted (STP728), and the tool Z motor 1
08 to drive the bonding tool 126 in the Z direction,
That is, it is lowered to the substrate XY stage 111 side. Subsequently, the control unit 130 controls the tool control mechanism 109 to release the suction of the calibration jig 20 of the bonding tool 126, and drives the tool Z motor 108 to move the bonding tool 126 in the Z direction, that is, the substrate X.
-Ascend to the side away from Y stage 111 (STP
729).

Next, the control unit 130 controls the camera 11
6 is positioned at posB ′ (STP730), and the calibration mark 21 of the calibration jig 20 is set.
Are located at the center of the field of view of the board recognition camera 116c, that is, on the optical axis.
By driving the substrate 13, the substrate XY stage 111 is finely moved in the XY directions to perform correction (STP731). Then, the position of the substrate XY stage 111 at this time is defined as po.
Stored as sC ′ (third position) (STP73
2).

Then, the control unit 130 obtains the difference between the stored posA 'and posC' as the optical axis offset amount of the chip recognition camera 116b and the board recognition camera 116c in the board XY stage 111 (STP
733).

FIGS. 10A and 10B are a plan view and a side view showing another schematic configuration of the camera. This camera 21
Reference numeral 6 denotes two cameras, ie, a chip recognition camera 216b for recognizing the position of the chip 102, inside the housing 216a.
And a board recognition camera 216c for recognizing the chip mounting position of the printed circuit board 101 are arranged in series such that each imaging side faces in the X direction.

A double-sided mirror 216f is arranged, for example, at an angle of 45 degrees in the Z direction with respect to the X axis in the middle of the imaging side of each of the cameras 216b and 216c.
Then, the housing 216 in the Z direction is positioned with respect to the double-sided mirror 216f.
On the upper and lower surfaces of a, an image capturing opening 216g for the chip recognition camera 216b and an image capturing opening 216h for the board recognition camera 216c are provided so as to be substantially coaxial.

With the camera 216 having such a configuration, images on the printed circuit board 101 and the chip 102 can be simultaneously recognized. That is, the image capturing opening 216h
The image of the printed circuit board 101 entered from the
The light is reflected at 16f and is captured by the camera 216c. On the other hand, the image of the chip 102 entered through the image capturing opening 216g is reflected by the double-sided mirror 216f and is reflected by the camera 216.
b. According to this camera 216, the number of parts can be smaller than that of the camera 116 shown in FIG.
Cost can be reduced.

FIGS. 11A and 11B are a plan view and a side view showing still another schematic configuration of the camera. The camera 316 includes two cameras, that is, a chip recognition camera 31 that recognizes the position of the chip 102, inside the housing 316a.
6b and a board recognition camera 316c for recognizing the chip mounting position of the printed circuit board 101 are arranged in series such that each imaging side faces in the opposite direction to the X direction.

Then, on the upper and lower surfaces of the housing 316a in the Z direction with respect to the imaging side of each of the cameras 316b and 316c, an image capturing opening 316g for the chip recognition camera 316b and an image capturing opening for the board recognition camera 316c are provided. The opening 316h is
Each is provided so as to be substantially coaxial.

With the camera 316 having such a configuration, images on the printed circuit board 101 and the chip 102 can be simultaneously recognized. That is, the image capture opening 316h
The image of the printed circuit board 101 entered from the camera 316
c directly. On the other hand, the image capture opening 316g
The image of the chip 102 entered from is input directly to the camera 316b. According to the camera 316, the number of parts can be further reduced as compared with the cameras 116 and 216 shown in FIGS. 5 and 10, so that the cost can be further reduced.

In each of the above embodiments of the method for measuring the optical axis offset amount, the operator arranges the calibration jig 20 on the substrate XY stage 111. If 20 is provided in advance at the end on the substrate XY stage 111, it can be automated.

[0051]

As described above, according to the present invention,
The optical axis offset amount of the imaging means can be accurately measured with a simple configuration.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a component mounting apparatus of the present invention.

FIG. 2 is a front view of the component mounting apparatus of FIG. 1;

FIG. 3 is a side view of the component mounting apparatus of FIG. 1;

FIG. 4 is a block diagram showing a relationship between a control unit and an operation panel of the component mounting apparatus of FIG. 1;

FIG. 5 is a plan view, a side view, and a front view showing a schematic configuration of a camera of the component mounting apparatus of FIG. 1;

FIG. 6 is a perspective view showing an example of a calibration jig used when measuring an offset amount of an optical axis.

FIG. 7 is a flowchart showing an operation example of the component mounting apparatus of FIG. 1;

FIG. 8 is a flowchart showing a first embodiment of a method for measuring an optical axis offset amount according to the present invention.

FIG. 9 is a flowchart showing a second embodiment of the optical axis offset amount measuring method according to the present invention.

10 is a plan view and a side view showing another schematic configuration of the camera of the component mounting apparatus of FIG. 1;

11 is a plan view and a side view showing still another schematic configuration of the camera of the component mounting apparatus of FIG. 1;

FIG. 12 is a perspective view showing an example of a conventional special measurement jig used when measuring an optical axis offset amount.

[Explanation of symbols]

Reference numeral 20: calibration jig, 21: calibration mark, 100: component mounting device, 10
1 ... printed circuit board, 102 ... chip, 103
..Trays for storing chips, 104...
..Base, 106 ... frame, 107 ... tool Z linear guide, 108 ... tool Z motor, 10
9: Tool control mechanism, 110: Tool rotation axis,
111: substrate XY stage, 112: substrate X
Motor, 113: Substrate Y motor, 114: Camera base, 115: Camera Z motor, 116:
Camera, 116b: chip recognition camera, 116c
..Substrate recognizing camera, 117 ... Camera vertical mechanism, 1
18: chip reversal X stage, 119: tray Y stage, 120: tray Y motor, 121
・ Chip inversion X motor, 122 ・ ・ ・ Chip inversion cylinder, 123 ・ ・ ・ Chip inversion arm, 124 ・ ・ ・ Chip inversion linear guide, 125 ・ ・ ・ Tilt mechanism, 126
... bonding tool, 130 ... control unit, 140 ... operation panel

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Taketo Tanaka 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo F-term in Sony Corporation (reference) 5E313 AA02 AA11 AA23 CC03 CC04 DD02 DD03 DD13 DD21 EE02 EE03 EE24 EE33 EE35 EE37 FF24 FF26 FF28 FF29 FF31 FF32

Claims (8)

[Claims] 1. A component mounting apparatus for mounting a component on a substrate, the component mounting device being movable in two orthogonal axes directions (X direction, Y direction), and a mounting means for mounting the substrate; Direction (Z direction),
Mounting means for mounting the component on the substrate mounted on the mounting means; movable in three orthogonal directions (X direction, Y direction, Z direction), and mounted on the mounting means; A first image pickup unit for recognizing the board and a second image pickup unit for recognizing the component mounted on the mounting means, wherein the openings of the respective image pickup units are coaxially arranged. An imaging unit that controls the units, measures an optical axis offset amount of each of the imaging units, and places the component mounted on the mounting unit based on the optical axis offset amount. Control means for mounting the image pickup means on the substrate mounted on the mounting means, wherein the control means moves the image pickup means such that the opening of the second image pickup section is positioned on a mounting axis of the mounting means. And the position of the imaging means at that time is recorded as a first position. Then, the placement means is slightly moved so that a calibration mark of a calibration jig previously placed on the placement means is located on the optical axis of the first imaging section, and the imaging means Moving the mounting means, moving the mounting means to transfer the calibration jig from the mounting means to the mounting means, moving the imaging means to the first position, the calibration mark, The imaging unit is slightly moved so as to be located on the optical axis of the second imaging unit, and the position of the imaging unit at that time is stored as a second position, and the first position and the second position are stored.
Wherein the difference between the positions is determined and stored as the optical axis offset amount in the imaging means. 2. The component mounting apparatus according to claim 1, wherein the calibration jig is formed of a light transmitting material. 3. A component mounting apparatus for mounting a component on a substrate, wherein the component mounting device is movable in two orthogonal directions (X direction and Y direction), and a mounting means for mounting the substrate; Direction (Z direction),
Mounting means for mounting the component on the substrate mounted on the mounting means; movable in three orthogonal directions (X direction, Y direction, Z direction), and mounted on the mounting means; A first image pickup unit for recognizing the board and a second image pickup unit for recognizing the component mounted on the mounting means, wherein the openings of the respective image pickup units are coaxially arranged. An imaging unit that controls the units, measures an optical axis offset amount of each of the imaging units, and places the component mounted on the mounting unit based on the optical axis offset amount. Control means for mounting the mounting means on the substrate mounted thereon, wherein the control means stores an initial position of the mounting means as a first position, and moves the mounting means to move the mounting means. The calibration jig previously placed on the The second mark is moved to the mounting means, and the image pickup means is moved so that the opening of the second image pickup section is located on the mounting axis of the mounting means. The imaging unit is slightly moved so as to be located on the optical axis, the position of the imaging unit at that time is stored as a second position, the imaging unit is moved and retracted, and the mounting unit is moved to perform the calibration. The tool is transferred from the mounting means to the mounting means, and the imaging means is moved to the second position so that the calibration mark is positioned on the optical axis of the first imaging unit. And the position of the placing means is slightly moved, and the position of the placing means at that time is stored as a third position,
A component mounting apparatus, wherein a difference between the first position and the third position is obtained and stored as the optical axis offset amount in the placing means. 4. The component mounting apparatus according to claim 3, wherein the calibration jig is formed of a light transmitting material. 5. A moving means which can move in two orthogonal directions (X direction, Y direction), and a mounting means for mounting the substrate, and can move in a direction (Z direction) orthogonal to the two orthogonal axes. Mounting means for mounting the component on the substrate mounted on the mounting means; and movable in three orthogonal directions (X direction, Y direction, Z direction), and mounted on the mounting means. A first image pickup unit for recognizing the board and a second image pickup unit for recognizing the component mounted on the mounting means, wherein the openings of the respective image pickup units are coaxially arranged. The imaging device includes an imaging unit that controls each of the units to measure an optical axis offset amount of each of the imaging units, and the component mounted on the mounting unit based on the optical axis offset amount. The optical axis in the component mounting apparatus mounted on the substrate mounted on the mounting means In the method for measuring the offset amount, a calibration jig is placed on the placing means, and the imaging means is arranged such that an opening of the second imaging section is located on a mounting axis of the mounting means. The position of the imaging unit at that time is stored as a first position, and the calibration mark of the calibration jig is positioned on the optical axis of the first imaging unit. Moving the image pickup means, retreating the image pickup means, moving the attachment means to transfer the calibration jig from the placement means to the attachment means, and moving the image pickup means to the first position. The imaging means is slightly moved so that the calibration mark is located on the optical axis of the second imaging unit, and the position of the imaging means at that time is stored as a second position; The difference between the first position and the second position is obtained, and the difference An optical axis offset amount measuring method in the component mounting apparatus, wherein the optical axis offset amount is stored as the optical axis offset amount. 6. The method according to claim 5, wherein the calibration jig is formed of a light transmitting material. 7. It is movable in two orthogonal axes directions (X and Y directions), and is capable of moving in a direction (Z direction) orthogonal to the two orthogonal axes with a mounting means for mounting the substrate. Mounting means for mounting the component on the substrate mounted on the mounting means; and movable in three orthogonal directions (X direction, Y direction, Z direction), and mounted on the mounting means. A first image pickup unit for recognizing the board and a second image pickup unit for recognizing the component mounted on the mounting means, wherein the openings of the respective image pickup units are coaxially arranged. The imaging device includes an imaging unit that controls each of the units to measure an optical axis offset amount of each of the imaging units, and the component mounted on the mounting unit based on the optical axis offset amount. The optical axis in the component mounting apparatus mounted on the substrate mounted on the mounting means In the method for measuring the offset amount, a calibration jig is placed on the placing means, the position of the placing means at that time is stored as a first position, and the mounting means is moved to perform the calibration. Transferring the jig from the mounting means to the mounting means, moving the imaging means so that the opening of the second imaging unit is positioned on the mounting axis of the mounting means, The imaging unit is slightly moved so that a mark is located on the optical axis of the second imaging unit, the position of the imaging unit at that time is stored as a second position, and the imaging unit is moved and retracted. Moving the mounting means to transfer the calibration jig from the mounting means to the mounting means; moving the imaging means to the second position; Place the hand so that it is located on the optical axis of the imaging unit The step is slightly moved, and the position of the placing means at that time is stored as a third position, and a difference between the first position and the third position is obtained as the optical axis offset amount in the placing means. A method for measuring an optical axis offset amount in a component mounting apparatus, characterized by storing. 8. The method according to claim 7, wherein the calibration jig is formed of a light transmitting material.