JP2000233161A - Highly accurate washing method of glass substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a washing method for removing the compd. caused by a slaking phenomenon on the surface of a glass substrate disk even after a final polishing process. SOLUTION: Active ion water used in the washing of a precise glass substrate (glass for a magnetic disk, semiconductor glass or a crystallizing glass substrate) is washed with anode electrolytic water with a pH of 2.0-5.0, 8.0-11.0 containing either one of ions selected from H+ ions, NH4+ ions, CO3++ ions, OH- ions, NO3-- ions, Cl- ions, SO4-- ions and PO43- ions to remove the alkali metal adherend adhered to the surface of the substrate during a washing process or a compd. generated by slaking during a washing process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various types of disk substrates such as magnetic (perpendicular magnetization) disks, optical disks, and magneto-optical disks used as hard disks used as large-scale storage media for computers, semiconductor glass substrates, and the like.
The present invention relates to a method of cleaning a glass substrate for a liquid crystal or the like, and particularly to a method of slacking a surface with respect to a polishing medium (decomposing the surface by being exposed to air or water so that the surface is ragged,
The present invention also relates to a high-precision cleaning method for a glass substrate in which a residue caused by a ragged state and an alkali metal component are prevented from being corroded during a standing period.

[0002]

2. Description of the Related Art In recent years, a hard disk (magnetic disk substrate) used as a large-scale storage medium of a computer.
In recent years, substrates made of aluminum alloy and nickel-phosphorus-plated on the surface have been widely used. For example, the proportion of glass substrates used has been increasing. Disk substrates such as magnetic (perpendicular magnetization) disks, optical disks, and magneto-optical disks, semiconductor glass substrates, glass substrates for liquid crystal, etc. are particularly polished and polished for glass substrates used as high precision disk substrates. The degree is
Ra (Roughness) was 5 ° <.

[0003] Further, in a glass substrate for a semiconductor (such as a photomask) and a liquid crystal glass substrate, the surface accuracy of Ra5Å ≧ and Rp20Å ≧ in terms of the roughness and the leak,
Demands have been increasing with higher densities.

As described above, magnetic disks, optical disks,
Glass is used as a substrate material for various disk substrates such as magneto-optical disks, various types of disk substrates such as semiconductor glass substrates and liquid crystal glass substrates. First, the glass composition is a composition that is extremely stable physicochemically. That is, the smoothness of the surface is easily obtained.

[0005]

In particular, as described above, a disk whose surface quality is required is required to have a surface smoothness. For example, medium noise generated when this disk is used as a magnetic disk is required. The medium noise based on the roughness of the disk surface is caused by the surface smoothness of the glass substrate and moisture adsorbed during the magnetic film sputter attaching step. This water, during the production, there may be residual washing water when it is washed immediately before entering the medium production process, or, at the time of production, even if completely dried and moisture removed, Due to the presence of a small amount of alkali component on the disk surface, while the disk is continuously used, the alkali component causes water to be adsorbed by hydrolysis, and the adsorbed water causes the S / S of the disk, which is a medium characteristic, to be present. This caused the N ratio to deteriorate.

Further, when an alkali component is present on the surface of the glass substrate, the surface roughness is deteriorated due to a slaking phenomenon (a phenomenon in which the surface is exposed to air or water and is only broken down), and the surface roughness is deteriorated. The alkali component itself diffuses into the magnetic film formed on the glass substrate surface, causing corrosion (corrosion) on the disk surface. In particular, when sodium ions are present on the disk surface, the worst case is to cause deterioration of the storage medium layer when forming a film of the storage medium at the time of manufacturing the disk. That is, protrusions grow on the disk surface, and crater-like depressions are generated by erosion, which greatly affects the surface roughness.

Similarly, in the manufacture of a semiconductor disk, the presence of these alkali components causes a change in resistance of the semiconductor itself, leading to a partially defective portion, resulting in frequent problems.

In order to manufacture a glass substrate having a surface roughness Ra of about 10 to 20 °, it is not necessary to consider the presence of an alkali component and the presence of a medium residue, particularly, the presence of sodium ions. In the case of a glass substrate having a surface roughness Ra of 5 ° or less, final polishing (final polishing step) is required, and the exposed surface is subjected to an alkali component rich condition by this polishing step.

Further, the disk substrate that has undergone the final polishing step may have a large number of microcracks, which are minute cracks. In such a case, the polishing liquid or the like penetrates into the microcracks. Therefore, during long-term use, it causes corrosion of the contacting medium.

[0010] Even after the final polishing step, an alkaline component may be present on the disk surface.
Such an alkaline component has a surface that is exposed to air or the like and is decomposed by breaking down (slacking phenomenon). In order to remove the compound due to this slaking phenomenon, the surface of the disk is treated with hydrochloric acid,
Washing with an acid-based material such as nitric acid, sulfuric acid, phosphoric acid, etc., may remove the alkali component, but this time, on the contrary, by using a solution containing an acid, etching (etching) or Slaking (slak
ing) occurs and the surface roughness decreases. Further, a new cleaning step is required to remove an acid component remaining on the surface of the glass substrate due to the treatment with the solution containing an acid.

In addition, when cleaning with an acid is performed, a component mainly composed of an acid still remains on the surface, or penetrates into microcracks on the glass substrate to remove these surface residues and microcracks. By the infiltration of
In particular, ion migration is generated in the magnetic recording medium film due to film separation and sputtering of the magnetic recording medium, and S / M
This can also result in lowering the N ratio. The same applies to semiconductors and glass substrates for liquid crystals.

[0012]

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art and relates to a conventional glass substrate (including crystallized glass) after final polishing. The protrusions and attachments generated after the cleaning, that is, the protrusions and the deposits generated by erosion and corrosion in the final cleaning step are converted into anode electrolyzed water (hereinafter referred to as "active ion water" or "active ion water") by electric polarization. Washed with "ion water"),
The purpose is to remove alkali ions on the substrate surface,
After processing and polishing the glass substrate to a predetermined size, a step of dissolving and removing an alkali salt attached to the surface of the glass substrate with a normal acid, and a final polishing step until the surface roughness Ra of the glass substrate becomes 5 ° or less. And a step of immersing the glass substrate in anodic electrolyzed water containing hydrogen ions (hydronium ions) at a predetermined concentration for a predetermined time, a step of washing with pure water, and a step of washing with pure water and drying. And the step of performing. In addition, as the electrolyte at the time of electrolysis, particularly, electrolytic water containing an ammonium salt was used.

[0013] That is, the present invention provides a method for cleaning a glass substrate with high precision, in which the glass substrate is cleaned with active ionized water by adding an electrolyte, and an alkali metal adhering substance on the substrate surface which adheres during the conventional cleaning step. The purpose of the present invention is to remove compounds generated by slaking generated in the washing step.

Further, the invention of the present application provides that each of the glass substrates is treated with an active ionized water having an electric polarization ("anode electrolyzed water") obtained by electrolysis by adding an electrolyte solution such as an ammonium salt. It is intended to remove the alkali metal from the surface of the glass substrate by washing, and also to remove slaking which occurs during the washing process.
ng) at the same time.

For this reason, the present invention is characterized in that the active ion water used for cleaning precision glass substrates (glass for magnetic disks, glass for semiconductors, glass substrates for crystals, etc.)
H ⁺ ions of 2.0 to 5.0, pH 8.0 to 11.0,
NH ₄ ⁺ ion, _CO ^{3 ++} ions or OH ^- ions, _NO ^{3 -,} wherein ions, that the anode electrolyzed water having any ions _PO ^{4 3-} ions ^- ions, Cl ^- ions, _SO ⁴ And

Further, according to the present invention, after a manufacturing process for finishing to a predetermined surface roughness, the glass substrate surface is immersed for a predetermined time in an active ionized water by electric polarization.
(King) and an alkali component are selectively removed. Specifically, the invention according to claim 1 of the present application is directed to a high-precision cleaning method for a glass substrate, wherein the polished glass substrate (including crystallized glass) is immersed in active ion water by electric polarization or the active ion water. In the cleaning step after the polishing, the alkali component and the slaking-disrupted metal ions or the compound ions thereof adhered to the surface of the glass substrate are removed.

According to a second aspect of the present invention, in the high-precision cleaning method for a glass substrate according to the first aspect, the slaking collapse metal ions or the compound ions thereof attached to the glass substrate surface are alkali metal. It is an ion. Furthermore, the invention according to claim 3 of the present application is characterized in that, in the high-precision cleaning method for a glass substrate according to claim 1, the active ionic water is anodic electrolyzed water.

According to a fourth aspect of the present invention, there is provided the method of cleaning a glass substrate according to the first aspect, wherein
The active ion water has a pH of 2.0 to 5.0 and a pH of 8.0 to 8.0.
It is characterized by being 11.0 anode electrolyzed water. According to a fifth aspect of the present invention, in the method for cleaning a glass substrate with high precision according to the first aspect, the active ionized water due to the electric polarization is converted into an ammonium salt (ammonium chloride, Ammonium carbonate, ammonium nitrate, ammonium sulfate, ammonium hydroxide, ammonium phosphate, etc.) and H ⁺
Ions, NH4 ⁺ ions and / or ^OH -, CO _{3
^{2-, Cl -, NO 3 -}} , SO 4 -, wherein one either _PO ^{4 3-,} and the type of the sleigh King disintegrating metal to adhere to the glass substrate surface ion or a compound thereof ions, the ammonia It is characterized in that it is anode electrolyzed water generated by selecting a salt.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment for carrying out the method for cleaning a glass substrate with high precision according to the present invention will be described. First, in the present embodiment, the following glass composition was used for the glass material substrate to be processed. SiO ₂ 62.4 Al ₂ O ₃ 3.0 B ₂ O ₃ 1.1 Na ₂ O 9.0 K ₂ O 9.0 MgO 3.0 ZnO 12.0 TiO ₂ 0.6 As ₂ O ₃ 0.0. 2 Sb ₂ O ₃ 0.3 All numerical values are indicated by (WT%). In this embodiment, a glass material substrate having the above composition is used, but this is not limited to the above composition, and an appropriate glass material substrate, for example, a crystallized glass substrate may be used. .

The above components are dissolved and bubbles (including seeds)
The glass material substrate is formed by a direct press or sheeting method so as to obtain a stria-free ultra-homogeneous glass material substrate. After that, inner and outer circumference processing and roughing (Rough)
Processed to predetermined dimensions after polishing and precision polishing.

Next, the processed glass material substrate is
Then, 10 to 10000 angstroms (Å) (1 to 10
Polishing is performed using a polishing agent such as so-called colloidal silica in which a particle phase having a size of (00 nm) is dispersed in another phase, so that the glass material substrate surface roughness Ra is 5 ° or less.

Thereafter, the alkali salt attached to the surface of the glass substrate is dissolved and removed with a usual acid. As this acid,
For example, hydrochloric acid, sulfuric acid, phosphoric acid, chromate, perchlorate, or the like at a predetermined concentration may be used. Further, final polishing is performed using colloidal silica until the surface roughness Ra of the glass substrate becomes 5 ° or less.

Further, the glass substrate is immersed for a predetermined time in anodic electrolyzed water containing a predetermined concentration of hydronium ion (specifically, active polarized water).

This anode electrolyzed water is generated by the apparatus shown in FIG. FIG. 1 shows an outline of this anode electrolyzed water generating apparatus. In FIG. 1, 1 is an electrolytic cell provided with an anode and a cathode, 2 is an electrolytic cell, and 3 is A pure water device (ion exchanger) for converting water into pure water, 4 is an alkaline water storage tank, 5 is an acidic water storage tank, and 6 is a power supply to each anode and cathode.
C power supply. In the anode electrolyzed water generating apparatus shown in FIG. 1, water is supplied from the water tap 7, which is purified by the deionizer 3, and a predetermined ratio of electrolyte is added to the electrolyte tank 2. This is guided to the electrolytic cell 1 and applied to the cathode and anode by the DC power supply to perform electrolysis, and the cathodic electrolyzed water and the anodic electrolyzed water are stored in the water storage tanks 4 and 5, respectively. Therefore, the DC power source 6 and other electrolysis conditions were as follows.

First, as the water to be electrolyzed, pure water which has been ion-exchanged in an ion exchanger or a ROC device in advance is supplied. In this case, the electric conductivity is 2 μs / cm ² or less (excluding alkali ions).

Second, as the electrolyte, basically, an ammonium salt is used, and an electrolyte having no alkali ion is used. In particular, as described later in detail, the electrolyte to be added is appropriately selected depending on the object to be removed.

Third, the electrolytic cell and the electrode material used are titanium (Ti) based (base), which is plated with an alloy of platinum (Pt) and iridium (Ir). Further, when the electrolytic power is about 200 watts, the water discharge amount is 1 liter / min on the acidic side,
A performance of 1 liter / min is provided on the alkaline side.

Fourth, the pH range of the obtained electrolyzed water is as follows: pH 2.0 to 5.0 on the acidic side, pH on the alkaline side.
8.0 to 11.0 of electrolytic water is obtained. Fifth, the pH and redox potential of the discharged water are determined by the concentration of the electrolyte. For this reason, the adjustment is performed by controlling the speed of an addition pump (not shown) in the electrolyte tank 2 so that the desired pH and oxidation-reduction potential can be obtained by mixing the two liquids of acidic ion water and alkali ion water. To do.

As described above, regarding the generation of the electrolyzed water, the electrolyte used may be an ammonia salt, for example,
Ammonium chloride, ammonium carbonate, ammonium nitrate, ammonium sulfate, ammonium hydroxide, ammonium phosphate and the like are used as appropriate, and an electrolyte obtained by mixing them at a predetermined ratio is used. Use anodic electrolyzed water.

As the anode electrolyzed water, water generated from any of the acidic side and the alkaline side can be used. However, since the glass substrate is mainly washed with metal ions, the acidic side is preferably used. Other ammonium salts may be selected depending on the nature of the attachments, such as components that adhere by slaking. For example, when decaying metal ions or compounds thereof due to slaking on the surface of the glass substrate, especially alkali metal ions Na ⁺ ions and K ⁺ ions adhere, OH ⁻ and CO ₃ are removed to remove the ions. ^2-, Cl ^-, NO ₃
^2-, SO ₄ ^2-, to include ions of PO ₄ ^3-, etc., by selecting the electrolyte as appropriate, to produce the anode electrolyzed water.

Further, for example, in the case where a decay metal ion or a compound thereof, particularly an alkali metal ion Ce ⁺⁺ ion adheres by slaking on the surface of the glass substrate, in order to remove the ion,
The electrolyte is appropriately selected so as to include ions such as Cl ⁻ and NO ₃ ^2- . The anode electrolyzed water is generated.

Further, a compound of decay metal ion by slaking on the surface of the glass substrate,
In particular, when alkali metal ions Ca ⁺⁺ ions and Mg ⁺⁺ ions adhere, Cl 2 is removed to remove the ions.
^- to include ions NO ₃ ^2-like, and selects the electrolyte as appropriate, to produce the anode electrolyzed water.

The anode electrolyzed water can be adjusted to a pH of 2.0 to 2.0 by appropriately selecting the additive concentration of the electrolyte such as a simple substance and a mixture of a plurality of liquids (such as a mixture of an acidic liquid and an alkaline liquid). 5.0 or pH 8.0-
11.0 H ⁺ ion and NH ₄ ⁺ ion and OH
⁻ , CO ₃ ²⁻ , Cl ⁻ , NO ₃ ⁻⁻ , SO ₄ ⁻⁻ , P
Anode electrolyzed water having ions such as O ₄ ^3- may be used.

Next, the glass substrate is immersed in anodic electrolyzed water having the ion concentration for a predetermined time, washed with pure water, then washed with pressure water, so-called showering cleaning, or the disk substrate itself is rotated. So-called spin cleaning is performed. That is, drying is performed after washing with pure water.

The outline of the showering cleaning and the spin cleaning will be described. FIG. 2A is a diagram showing an outline of the showering washer, and FIG. 2B is a diagram showing an outline of the spin washer.

In FIG. 2A, 10 is a glass disk substrate, 11 is a front and back brush for polishing and cleaning the front and back surfaces of the glass disk substrate 10, and 12 is a polishing of the inner periphery of the glass disk 10. The inner circumference brushes 13 and 14 to be cleaned are outer circumference brushes for polishing and cleaning the outer circumference, and include a reverse rotation outer circumference brush 13 and a normal rotation outer circumference brush 14, respectively.

Further, 15 and 16 are shower nozzles for polishing and washing while spraying a pure water shower on the glass disk substrate 10, 17 and 18 are nozzle taps, and 19 is a scattering prevention cover. In order to polish and clean the glass disk substrate with the shower ring cleaning machine shown in FIG. 2A, first, the glass disk 10 is mounted, and pure water is sprinkled from the shower nozzles 15 and 16 while spraying. The front and back brushes 11 are rotated to polish and clean the front and back surfaces of the disk. At this time, the inner peripheral brush 12 is rotated in the reverse direction while polishing and cleaning the front and rear surfaces, and further, the forward rotating outer brush 14 and the reverse rotating outer brush 13 are respectively rotated, and the inner rotating brush 12 is rotated in the reverse direction. By rotating, the inner peripheral portion of the disk 10 is polished and cleaned.

In FIG. 2B, reference numeral 10 denotes the same glass disk substrate as described above, and reference numeral 20 denotes the same disk substrate 1.
Supporter for supporting 0 and providing spin operation, 21, 22
Is a hot pure water rinsing nozzle for spraying water on the front and back surfaces of the disk substrate 10, and 23 is a cover member.

In order to wash and dry the glass disk substrate 10 of the spin washer shown in FIG. 2B, first, the glass disk substrate 10 is mounted on a support 20 and the disk substrate 10 is gently rotated. , A hot pure water rinse is sprayed from the hot pure water rinsing nozzle onto the front and back surfaces of the disk substrate to neutralize the acid and the like used in the previous step. The cleaning liquid, rinsing liquid and the like adhering to the surface are blown off and dried.

The glass disk substrate thus obtained was then subjected to a relative humidity (Rel) of 80 ° C. and 90%.
In addition, a corrosion resistance test was performed for 10 days using an active humidity, and the substrate roughness and the maximum protrusion amount of the glass substrate were measured.

Table 1 shows the state of treatment of the glass substrate with ionized water, which was treated with activated ionized water to which a 3% NH ₄ Cl solution was added as an electrolyte.

[0042]

[Table 1]

In Table 1, the symbol Ra indicates the initial average roughness of the center line. A portion of the measured length is extracted from the roughness curve in the direction of the center line, and the center line of the extracted portion and the roughness curve are extracted. The absolute value of the deviation is arithmetically averaged, and the same sign Rp specifically indicates the difference between the maximum peak height and the minimum valley depth on the measured line, that is, the so-called maximum and minimum peak to This indicates a peak.

As can be seen from Table 1, the pH concentration was 2-6.
It can be seen that this treatment does not degrade the surface roughness of the glass substrate even when immersed in anode electrolyzed water having a moderate ion concentration. The ion-treated glass substrate was subjected to a test at 80 ° C. and 90% RH for 10 days, which is a kind of semiconductor evaluation standard, to verify the maximum surface protrusion on the glass substrate surface.
For comparison, FIG. 3 is a diagram showing the state of projections on the substrate surface due to the corrosion of the glass substrate in a normal pure water cleaning and IPA (isopropyl alcohol) vapor deposition process, and an AFM (Atomic Force).
Microscope).

As can be seen from FIG. 3, the substrate subjected to this treatment was obtained after the corrosion resistance test for 10 days at 80 ° C. and 90% RH.
It can be seen that a and Rt hardly change.

FIGS. 4, 5 and 6 show the results of measurement, respectively, showing that the alkali deposition component due to washing with active ion water and the corrosion projection due to the slaking are preferentially removed and become flat. FIG. 5 and FIG. 6 show A as in FIG. 3 described above.
FM (Atomic Force Microscope)
This was taken in e).

In general, when the surface of the alkali ion exchange strengthened glass substrate is treated in a state where the pH ion concentration is high, the glass matrix is broken and the corrosion of the surface of the glass substrate is accelerated. As shown in the figure, when the surface of the glass substrate is treated with anodic electrolyzed water having an appropriate pH concentration, that is, in this embodiment, the anodic electrolyzed water having a pH concentration (ion concentration) of 2 to 6 gives It is understood that the alkali metal present on the surface of the glass substrate is removed without breaking the glass matrix, and as a result, as can be seen from FIGS. 4 to 6, the corrosion resistance of the glass substrate is rather improved. .

Further, such a glass substrate treated by immersion in anodic electrolyzed water having an ion concentration of about 5 to 6 has a low alkali surface concentration, and therefore has a small amount of adsorbed water and is suitable as a high-density magnetic recording medium. I have.

That is, in the final polishing step of manufacturing a medium for a glass substrate, a polishing liquid containing an alkali component is used to improve the surface roughness of the substrate. Reacts with the silicic acid component generated in the polishing process to form S, which is the skeleton of the medium glass.
Breaks the i-O bonds, thereby significantly reducing their surface hardness. Therefore, in the final step of polishing, the alkali component is removed by immersion in ion water, and the surface is subjected to a dealkalization treatment and an etching treatment at the same time, thereby improving the surface roughness, and also improving the surface hardness and corrosion resistance. Can be improved.

[0050]

As described above, the cleaning of a magnetic disk substrate with reinforced ion projections using ionic water containing hydronium ions can reduce the alkali component concentration on the substrate surface without lowering the surface roughness. The ion concentration to be used, which is expected to be effective in improving the corrosion of the substrate and the SN ratio of the medium, which is a problem of the substrate, and in preventing the corrosion of the magnetic recording film, can be appropriately changed depending on the glass component and the conditions of ion strengthening.

That is, the present invention focuses on the phenomenon that the diffusion of alkali metal in glass is remarkably accelerated by hydronium ions H ₃ O. Used for cleaning an ion exchange enhanced magnetic disk substrate. Anode electrolyzed water, obtained by electrolysis of water, is very active and selectively replaces the alkali metal component on the surface of the glass substrate, thereby reducing the alkali component concentration on the surface of the glass substrate. It is possible,
More specifically, since the substitution reaction with the alkali component is selectively performed, the surface roughness of the glass substrate is deteriorated by appropriately setting the concentration of the electrolyzed water to be used appropriately. In addition, there is a remarkable effect that only the alkali ion concentration on the surface of the glass substrate can be reduced.

In addition, the anode electrolyzed water generally has a small molecular size, has good permeability to microcracks (microcracks) in a glass substrate, and easily penetrates into cracks. Even if a component is present, the alkali component in the crack can be efficiently removed. Furthermore, since other base ions other than hydronium ions need only be relatively small,
After washing with anode electrolyzed water, there is no need to use a special acid or alkali-based detergent, and only washing with pure water is sufficient.Conventionally, there is no need to take the extra washing step required. This has the effect.

Since such a cleaning method is employed, as in the conventional case, IPA (isopropyl alcohol) and IPA (isopropyl alcohol) deposition (v
apour) drying line no longer needs to be used,
All cleaning processes can be performed with ultrapure water,
The equipment can be configured simply and inexpensively.

[Brief description of the drawings]

FIG. 1 is a diagram showing an outline of an electrolyzed water generating apparatus.

FIG. 2A is a diagram illustrating an outline of the showering washer, and FIG. 2B is a diagram illustrating an outline of the spin washer.

FIG. 3 is a diagram illustrating an AFM (Atomic Force Microsco) showing a state of a projection on a substrate surface due to corrosion of a glass substrate after normal pure water cleaning and IPA (isopropyl alcohol) vapor deposition (vapor) processing.
pe) Photo

FIG. 4 is a diagram showing measurement results showing that alkali deposition components by active ion water washing and projections by corrosion by slakingtec are preferentially removed and flattened.

FIG. 5 shows an AFM (Atomic Force Micros) showing a measurement result showing that alkali deposition components due to washing with active ion water and projections due to corrosion by slakingetc are preferentially removed and flattened.
copy) photo

FIG. 6 shows an AFM (Atomic Force Micros) showing a measurement result showing that alkali deposition components due to washing with active ion water and projections due to corrosion by slakingetc are preferentially removed and flattened.
copy) photo

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electrolysis tank, 2 ... Electrolyte tank, 3 ... Pure water device (ion exchanger), 4 ... Alkaline water storage tank, 5 ... Acid water storage tank, 6 ... DC power supply, 7: Tap, 10: Glass disk substrate, 11: Front and back brushes, 12: Inner circumference brush, 13: Reverse rotation outer circumference brush 14: Forward rotation outer circumference brush, 15, 16 ··· Shower nozzle, 17 and 18 ······························································································································· · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · ... ATOMIC FORCE Micros
Cope Ra ・ ・ ・ Center line average roughness (surface roughness) Rp ・ ・ ・ Center line peak height Rt ・ ・ ・ Maximum surface roughness

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor, Kazuo Kazama 3-3-1-16 Kawagishigami, Okaya City, Nagano Prefecture Inside Casama Engineering Co., Ltd. (72) Inventor, Taitaro Mabuchi 1842-1, Tatsuno-cho, Tatsuno-cho, Kamiina-gun, Nagano Prefecture 7 No.F-term in Mabuchi S & T Co., Ltd. EB30 EB39 ED12 GC02 5D112 AA02 AA24 BA03 GA08 GA28

Claims (5)

[Claims] 1. A glass substrate (including a crystallized glass) after polishing is immersed in or washed with active ion water by electric polarization, and the surface of the glass substrate is washed in the polishing step after polishing. A high-precision cleaning method for a glass substrate, comprising removing an alkali component and a slaking-disrupted metal ion or a compound ion thereof adhering to a glass substrate. 2. The high-precision cleaning method for a glass substrate according to claim 1, wherein the slaking collapse metal ion or its compound ion attached to the surface of the glass substrate is an alkali metal ion. 3. The method according to claim 1, wherein the active ion water is anodic electrolyzed water. 4. The active ionized water has a pH of 2.0 to 5.5.
The method for cleaning a high-precision glass substrate according to claim 1, wherein the electrolyzed water is 0, pH 8.0 to 11.0. 5. The active ionized water by the electric polarization uses an ammonium salt (ammonium chloride, ammonium carbonate, ammonium nitrate, ammonium sulfate, ammonium hydroxide, ammonium phosphate, etc.) as an electrolyte used in the electrolysis. , H ⁺ ion, NH 4 ⁺ ion and / or OH ⁻ , CO ₃ ²⁻ , Cl ⁻ , NO
₃ ^-, _SO ⁴ -, wherein one either _PO ^{4 3-} of
2. The glass substrate according to claim 1, wherein the anode is electrolyzed water generated by selecting the ammonia salt according to the type of a slaking collapse metal ion or its compound ion attached to the surface of the glass substrate. 3. High precision cleaning method.