JP2000232289A - Cooling structure of electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic equipment cooling structure which can properly cool down heating units of various printed circuit boards mounted in a computer device in the electronic equipment especially including extension card that is standardized in an industrial field. SOLUTION: In the cooling structure of an electronic equipment where an extension card 2 to which a cooling air flow is fed by a cooling fan 25 and another heating unit from which warm air is evacuated by another cooling fan 35 are mounted adjacent to each other on a system board 11, the cooling fan 25 which feeds a cooling air to the extension card 2 is installed on the top surface, a first duct 21 which covers the extension card 2 so as to prevent warm air around the extension card 2 from being discharged to other heating units and a space inside the electronic equipment, and a second duct 31 which sends warm air around the extension card 2 to the other cooling fan 35 which evacuates warm air from the other heating units are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention can suitably cool a heat generating unit in an electronic device including an expansion card standardized in the industry, among various printed circuit boards mounted in a computer device. The present invention relates to a cooling structure for an electronic device.

[0002]

2. Description of the Related Art Among printed circuit boards of a computer device, a PCI expansion card (hereinafter referred to as an expansion card) has become mainstream in the industry. In a high-speed / high-performance machine, a high-power type is used for an expansion card, and effective cooling is required to guarantee its reliability.

[0003] Here, the following terms in this specification are defined and clarified.

An expansion card is a PCI (Periphere).
ral Component Interconnect
t) Refers to an expansion card, which is adopted to solve the problem that it takes a long time to execute an I / O function of a peripheral device due to a narrow bus width. It is intended to provide a bus capable of a data transfer rate of up to 264 MB per second for the purpose of increasing.

FIG. 8 shows a form of an expansion card. The expansion card has two basic forms, a standard type shown in FIG. 8A and a shortened type shown in FIG. 8B. Also, expansion card 2
Reference numerals a and 2b denote rectangular printed circuit boards, for example, a card edge connector 4 connected to a system board, and an external connection connector 3a connected to the outside formed in one vertical direction with respect to the system board. And a front plate 3 provided with a mounting portion (not shown). The front plate 3 is inserted into a guide member (not shown) formed in the other direction perpendicular to the system board, and the mounting portion is fixed to a frame of the system board by fastening screws or the like. To be mounted on the system board.

The physical dimensions of the expansion card are standardized, and the dimensions of the edge forming the card edge connector 4 are 312 mm in the standard type and 174.63 mm in the shortened type. The insertion direction, that is, the dimension of the edge forming the front plate 3 is 10 in the standard type and the shortened type.
It is regulated to 6.68 mm. The expansion card has various functions, and the mounting position of the mounted heating element or the amount of heat generated by the heating element differs for each expansion card.
Further, expansion cards are often implemented at the user level in a timely manner.

FIG. 9 shows the prior art. In the figure, an electronic device 51 includes a system board 11,
The system board 11 connects and controls the CPU unit 50, the power supply unit 60, and the expansion card 2, and is also connected to the input / output device. Further, an external connection connector 3a (see FIG. 8) provided on the expansion card 2 is arranged on the rear surface of the electronic device 51 so as to be connectable from outside the electronic device 51. That is, the front plate 3 provided with the external connection connector 3 a forms a part of the rear surface of the electronic device 51. When the expansion card 2 is mounted on the system board 11, the expansion card 2 is
Card edge connector 4 and system board 1
1 and connected to the connector 12, and an attachment portion formed on the front plate 3 is fixed to the frame 64 of the system board 11 by fastening screws or the like.

For cooling the electronic device 51, a cooling fan is provided for each heat generating unit, and a cooling fan 85 which draws in warm air generated by the CPU unit 50 and discharges it from the rear surface of the electronic device 51 to the outside, and a power supply unit 60. The electronic apparatus 51 includes a cooling fan 85 that sucks in the heated warm air and discharges it from the rear surface of the electronic device 51 to the outside, and a cooling fan 75 that blows cooling air from the guide member 63 side to the expansion card 2.

Referring to FIG. 9B, cooling of the expansion card 2 will be described. The warm air of the expansion card 2 to which the cooling air is supplied by the cooling fan 75 flows to the front plate 3 side, and
It is expected that the flow path will be closed by this, and will mainly flow to the upper surface of the expansion card 2 and be discharged from the rear surface of the electronic device 51 to the outside.

However, actually, the warm air of the expansion card 2 is
The warm air is not blown to the outside from the rear surface of the electronic device 51, the warm air is blown up to the upper surface side of the expansion card, and a part of the warm air is cooled by the cooling fan 85 provided in the CPU unit 50 and the power supply unit 60. Is discharged to the outside. A part of the warm air is taken in by the cooling fan 75 that supplies the cooling air to the expansion card, and the warm air is again supplied to the expansion card. Further, stagnation of air is generated at the lower part on the front plate 3 side, that is, at the system board 11 side.

FIG. 10 shows the prior art. In the figure, for cooling the electronic device 51, a cooling fan is provided for each heat-generating unit, and a cooling fan 85 that draws in warm air generated by the CPU unit 50 and discharges it from the rear surface of the electronic device 51 to the outside. A cooling fan 85 that sucks in the warm air generated by the expansion card 2 and discharges it from the rear surface of the electronic device 51 to the outside, and a cooling fan 75 that blows cooling air from the insertion surface side of the expansion card 2 is provided.

Referring to FIG. 10B, cooling of the expansion card 2 will be described. The warm air of the expansion card 2 to which the cooling air is supplied by the cooling fan 75 flows toward the system board 11, the flow path is blocked by the system board 11, and flows mainly to the upper surface of the expansion card 2, and the electronic device 51. We expect that it will be discharged from the rear.

However, actually, the warm air of the expansion card 2 is
The warm air is not blown to the outside from the rear surface of the electronic device 51, the warm air is blown up to the upper surface side of the expansion card, and a part of the warm air is cooled by the cooling fan 85 provided in the CPU unit 50 and the power supply unit 60. Is discharged to the outside. A part of the warm air is taken in by the cooling fan 75 that supplies the cooling air to the expansion card, and the warm air is again supplied to the expansion card. In addition, air stagnation occurs in the lower portion on the guide member 63 side and the lower portion on the front plate 3 side, that is, on the system board side.

[0014]

As described above, the prior art has the following problems.

1) Since there is no exhaust means for forcibly discharging the warm air of the expansion card to the outside of the electronic device, the warm air of the expansion card circulates in the electronic device and increases the internal temperature of the electronic device. ing.

2) A part of the warm air of the expansion card is discharged to the outside of the electronic device via another heating unit.
In other heating units, the warm air of the expansion card becomes the intake air temperature, and the internal temperature rise is increased.

3) During cooling of the expansion card, stagnation of air occurs at the lower part of the expansion card, that is, on the system board side.

4) In order to forcibly discharge the warm air of the expansion card to the outside of the electronic device, it is necessary to additionally install a cooling fan for discharging the warm air of the expansion card to the outside of the electronic device. In this case, the front panel on which the connector for external connection of the expansion card is provided forms a part of the rear surface of the electronic device, which complicates the mounting form in the electronic device and increases the size and cost of the electronic device. Will be invited.

Therefore, an object of the present invention is to 1) discharge the warm air of an expansion card to the outside of an electronic device without circulating in the electronic device, and reduce the rise in internal temperature in the electronic device.

2) Another object of the present invention is to prevent another heat generating unit from taking in warm air from the expansion card, and to reduce an increase in the internal temperature of the other heat generating unit.

3) Another problem is that stagnation of air is not generated in cooling the expansion card.

4) Another object is to forcibly discharge the warm air from the expansion card to the outside of the electronic device without adding a cooling fan.

[0023]

In order to solve the above problems, the present invention takes the following measures.

In order to exhaust the warm air of the expansion card to the outside of the electronic device, the warm air of the expansion card is supplied to a cooling fan that exhausts the warm air of another heat generating unit mounted adjacent to the expansion card. Discharge means is provided with a duct formed to secure a flow path for circulation without passing through.

By taking the above measures, the warm air of the expansion card is discharged to the outside of the electronic device without circulating in the electronic device. Therefore, an increase in the internal temperature of the electronic device is reduced. Further, since the other heat generating units do not take in the warm air of the expansion card, the rise in the internal temperature of the other heat generating units is reduced. Further, in cooling the expansion card, no air stagnation occurs. Further, the warm air of the expansion card is forcibly discharged to the outside of the electronic device without adding a cooling fan.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention adopts the following embodiments.

As shown in FIGS. 1 and 2, in the cooling structure of an electronic device, an expansion card to which cooling air is supplied by a cooling fan and another heating unit from which warm air is exhausted by another cooling fan are adjacent to each other. In the cooling structure of the electronic device mounted on the system board, the expansion card 2
A cooling fan 25 that supplies cooling air to the CPU is installed, and the expansion card 2
A heat generating unit including the unit 50 and the power supply unit 60 and the first duct 21 for preventing the heat from being discharged to a space in the electronic device 1; and the warming of the expansion card 2 is performed by the CPU unit 50 and the power supply unit 60. And a second duct 31 formed so as to circulate warm air of the heat generating unit to another cooling fan 35 for exhausting the warm air.

By adopting the above-described embodiment, it is possible to prevent the warm air of the expansion card from being discharged to another heat generating unit or the space of the electronic device, to prevent the warm air of the expansion card from circulating in the electronic device, Then, the warm air of the expansion card is circulated to a cooling fan installed in another heat generating unit and discharged outside. For this reason, the cooling efficiency of the expansion card is improved without adding a cooling fan, and the cooling efficiency is improved by not supplying the warm air of the expansion card to other heat generating units.

Further, as shown in FIG. 3, the first duct 21 forms a predetermined gap between the expansion card 2 and the system board 11 in the insertion direction of the expansion card to cover the expansion card. , A shield plate 2 that can be extended and installed on the system board side with respect to the insertion direction of the expansion card
6 is provided.

By adopting the above-described embodiment, the degree of covering the expansion card is appropriately changed according to the amount of heat generated by each mounted expansion card, so that the cooling air velocity and the warm air velocity are appropriately changed. Therefore, the cooling efficiency of the expansion card is improved, and the cooling efficiency of the electronic device is improved. further,
Since the first duct is formed to a minimum size, the first duct can be reduced in size and cost.

Further, as shown in FIG. 4, the first duct 21 is movable in a direction in which the expansion card 2 is inserted into the system board 11.

By adopting the above-described embodiment, cooling for supplying a cooling air to the expansion card and the expansion card with respect to the heat generation amount of each mounted expansion card, the mounting position of the heat generation element, or the heat generation amount of the heat generation element. By appropriately changing the interval with the fan, the supply range of the cooling air to the expansion card and the wind speed of the cooling air are appropriately changed. Therefore, the cooling efficiency of the expansion card is improved, and the cooling efficiency of the electronic device is improved.

Further, as shown in FIG. 5, the first duct 21 is connected to a frame 14 forming the system board 11.
Equipped to be freely rotatable.

By adopting the above embodiment, when mounting or maintaining an expansion card, the expansion duct can be mounted on or removed from the system board without removing the first duct, and the opening and closing of the first duct can be performed. Make work easier.

Further, as shown in FIG. 6, the cooling fan 25 is fixed to a fan mounting plate 23 which is provided above the first duct 21 so as to be movable or / and removable.

By adopting the above-described embodiment, the fan mounting plate is moved by sliding or inverting depending on the mounting mode of the expansion card, and the installation position of the cooling fan can be changed arbitrarily, whereby each expansion The mounting position of the cooling fan is appropriately changed depending on the mounting position of the heating element or the amount of heat generated by the heating element depending on the card. Further, by making the mounting plate detachable, the cooling performance of the cooling fan is appropriately changed so as to correspond to the amount of heat generated by the expansion card and the heat generating element.

As shown in FIGS. 1 to 6, the first duct 21 may be formed so as to cover the front side and the back side of the expansion card 2, the guide member 13 side, and the insertion side. desirable.

By adopting the above-described embodiment, by covering the other surface except the front plate of the expansion card, the expansion card is expanded so that the warm air of the expansion card is not discharged to another heat generating unit or the space of the electronic device. Prevents card warm air from circulating in the electronics. In addition, when mounting the expansion card on the system board, if the ventilation hole is not formed on the surface provided with the guide member for regulating the position of the expansion card, it is not necessary to cover the surface facing the guide member.

Further, as shown in FIG. 7, the second duct 31 is provided with the other cooling fan 35, and is configured to take in warm air from the expansion card and flow the air to the other cooling fan 35. And a shielding part 37 formed to prevent intake of warm air from the expansion card and to allow warm air from another heat generating unit to flow to another cooling fan 35.

By adopting the above-described embodiment, a flow path for flowing the warm air of the expansion card to the cooling fan installed in another heat generating unit is secured, and the warm air of the expansion card has a thermal effect on the other heat generating units. To the outside of electronic equipment without giving

[0041]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A representative embodiment according to the present invention will be described with reference to FIGS. In the following, the same portions are denoted by the same reference numerals, and detailed description may be omitted.

FIG. 1 shows a diagram of an embodiment of the present invention.

In FIG. 1, the electronic apparatus 1 includes a system board 11, which connects the CPU unit 50, the power supply unit 60, and the expansion card 2 to control them and also connects to the input / output device. Is done. Also, the external connection connector 3 provided on the expansion card 2
a indicates that the electronic device 1 can be connected from outside the electronic device 1.
It is located on the rear side. That is, the front plate 3 provided with the external connection connector 3 a forms a part of the rear surface of the electronic device 1. When the expansion card is mounted on the system board, the expansion card 2 is inserted into the guide member 13, the card edge connector 4 is connected to the connector 12 provided on the system board 11, and a mounting portion formed on the front plate 3 is mounted on the system board. The board 11 is fixed to the frame 14 by fastening screws or the like.

In the cooling structure of the electronic device 1, the expansion card 2 has a first duct 2 covering the front and back sides of the expansion card 2, the guide member 13 and the insertion surface (upper surface).
1 is set. The first duct 21 prevents the warm air generated by the expansion card 2 from being discharged to the CPU unit 50, the power supply unit 60, and the space in the electronic device 1. Further, the first duct 21 is provided with a cooling fan 25 that blows cooling air to the expansion card 2 from the insertion surface (upper surface) side of the expansion card 2.

When no ventilation hole is formed on the surface on which the guide member 13 is provided, in forming the first duct 21,
It is not always necessary to cover the surface facing the guide member 13.

On the other hand, the CPU unit 50 and the power supply unit 60 which draw in the warm air generated by the CPU unit 50 and the power supply unit 60 and exhaust them from the rear surface of the electronic device 1 to the outside.
And a second duct 3 formed so as to allow the warm air of the expansion card 2 to flow to the cooling fans 35 installed respectively.
1 is set. The second duct 31 covers the exhaust unit of the CPU unit 50 and the power supply unit 60, respectively,
The cooling fan 35 is formed so as to take in the warm air of the expansion card 2.

That is, as shown in FIG. 7A, the second duct 31 is provided with the cooling fan 35 so that the warm air of the expansion card 2 can be taken in and flowed to the cooling fan 35. Of the expansion card 2 is prevented from being sucked in, and only the warm air of the CPU unit 50 and the power supply unit 60 can be circulated to the cooling fan 35. Shield part 3
7 are formed.

Referring to FIG. 1B, cooling of the expansion card 2 will be described. The warm air of the expansion card 2 supplied with the cooling air by the cooling fan 25 flows to the system board 11 side, and the system board 11 and the expansion card 2 formed by the height dimension of the connector 12 provided on the system board 11.
Flows from the gap to the cooling fan 35 and is discharged to the outside from the rear surface of the electronic device 1.

FIG. 2 shows a diagram of an embodiment of the present invention.

In the figure, in the cooling structure of the electronic device 1, the second ducts 31
And the exhaust unit of the power supply unit 60, so that the cooling fan 35 can draw in warm air from the expansion card 2.
It is installed adjacent to the first duct 21 shown in FIG.

That is, as shown in FIG. 7B, the second duct 31 is provided with the cooling fan 35, and the first duct 31 draws the warm air of the expansion card 2 to flow through the cooling fan 35. An intake section 36 provided with an opening having a cutout shape on one side adjacent to 21, prevents intake of warm air from the expansion card 2, and allows only warm air from the CPU unit 50 and the power supply unit 60 to flow to the cooling fan 35. And a shielding portion 37 to be formed.

In the configuration shown in FIGS. 1 and 2, by covering the other surface of the expansion card 2 except for the front plate 3, the heat of the expansion card 2 is reduced by the CPU unit 50 and the power supply unit 6.
0 to prevent the heat of the expansion card 2 from circulating in the electronic device 1 by preventing the heat from being exhausted into the space of the electronic device 1, and the heat of the expansion card 2 to the CPU unit 5.
0 and the cooling fan 35 installed in the power supply unit 60 and discharged outside the electronic device 1.

Next, the configuration of the first duct will be described.

FIG. 3 shows a diagram of an embodiment of the present invention.

In the figure, the first duct 21 is formed so as to form a predetermined gap between the expansion card 2 and the system board 11 in the insertion direction of the expansion card and to cover the expansion card. The gap allows the warm-up of the expansion card 2 to be controlled by the CP.
The purpose is to circulate the cooling fan 35 installed in the U unit 50 and the power supply unit 60, but for another purpose, the degree of covering the expansion card is appropriately changed according to the heat value of each expansion card. And

That is, there is provided a shielding plate 26 which can be extended and installed on the system board 11 side in the insertion direction of the expansion card 2. The mounting structure of the shielding plate 26 is the shielding plate 2
A long hole in the vertical direction is formed in the mounting portion of No. 6, and the shielding plate 26 is fixed to the first duct 21 at an arbitrary position by fastening a screw. In addition, the shielding plate 26 is installed at a location where the first duct 21 covers the expansion card 2.

In the configuration of FIG. 3, the first duct 21
Since it is formed in the minimum size, the cost can be reduced by reducing the size of the first duct 21. In addition, the shielding plate 26 is moved to the first duct 2 according to the heat value of each expansion card.
By fixing the expansion card to an arbitrary position, the degree of covering the expansion card can be changed as appropriate, and the cooling wind and warm air can be changed as appropriate.

FIG. 4 shows a diagram of an embodiment of the present invention.

In FIG. 7A, the first duct 21
Allows the expansion card 2 to move in the direction of inserting the expansion card 2 into the system board 11. That is, the system board 1
A support 27 made of a plate material is provided on 1, a longitudinal slot is formed in a mounting portion of the first duct 21, and the first duct 21 is fixed to the support 27 at an arbitrary position by fastening a screw.

In FIG. 6B, the first duct 21 is moved upward and fixed so as to increase the distance between the expansion card 2 and the cooling fan 25 that supplies cooling air to the expansion card. In this case, the cooling air blown from the cooling fan 25 is relatively uniformly supplied to the entire expansion card 2.

In the configuration of FIG. 4, the distance between the expansion card 21 and the cooling fan 25 is appropriately changed with respect to the heat value of each expansion 21 card, the mounting position of the heat element, or the heat value of the heat element. The supply range of the cooling air to the expansion card 21 and the wind speed of the cooling air are appropriately changed.

FIG. 5 shows a diagram of an embodiment of the present invention.

In the figure, the first duct 21 is rotatably mounted on the frame 14 forming the system board 11. That is, the first duct 21 is rotatably attached at one end to the frame 14 on the guide member 13 side and the fulcrum 28. The other end is fixed to the frame 14 on the front plate 3 side by screwing.

In the configuration shown in FIG. 5, the first duct 21
It will be equipped rotatably with one end as a fulcrum. Therefore, when mounting or maintaining the expansion card 2, the expansion card 2 can be mounted on or removed from the system board 11 without removing the first duct 221.

Next, the cooling fan installed in the first duct will be described.

FIG. 6 shows a diagram of an embodiment of the present invention. FIG. 3 is a schematic view for explaining an installation mode of the cooling fan.

As shown in FIG. 6A, the cooling fan 25
Is installed on the first duct 21 via the fan mounting plate 23. That is, the fan mounting plate 23 is
5 is fixed to the first duct 21 and the fan mounting plate 2
The opening 22 smaller than the moving range of No. 3 is formed. The fan mounting plate 23 is fixed to the first duct 21 by fastening screws. In addition, the fan mounting plate 23 is the first duct 2
Elongate holes or mounting holes are formed at predetermined intervals in the moving direction so as to be able to move with respect to 1.

The fan mounting plate 23 can be moved by forming a slidable groove in the first duct 21 or by mounting the fan mounting plate 23 on the first duct 21 by inverting the fan mounting plate 23 in the left-right direction. Good.

FIG. 6B shows a case where the fan mounting plate 23 shown in FIG. FIG. 6 (c) is the same as FIG.
The case where the fan mounting plate 23 shown in (a) is moved to the guide member side (right direction) and mounted is shown.

In the configuration shown in FIG.
Cooling fan 2 by sliding or reversing
By allowing the installation position of the cooling fan 25 to be arbitrarily changed, the installation position of the cooling fan 25 is appropriately changed with respect to a cooling element such as a mounting position of a heating element that differs depending on each expansion card or a heat generation amount of the heating element. Further, the cooling fan 25 is adapted to correspond to the heat generated by the expansion card and the heat generating element.
Can be changed as appropriate.

[0071]

As described above, according to the present invention, the following effects can be expected.

A cooling fan for supplying cooling air to the expansion card is provided on the upper surface, and a first fan for covering the expansion card and preventing the warm air of the expansion card from being discharged to other heat generating units and the space in the electronic device. By providing a duct and a second duct formed so as to circulate the warm air of the expansion card to another cooling fan that exhausts the warm air of another heat generating unit, the warm air of the expansion card is heated by another heat generating unit or electronic device. Of the expansion card can be prevented from circulating in the electronic device, and the expansion card can be circulated to the cooling fans installed in other heat-generating units and discharged to the outside. can do. Therefore, the cooling efficiency of the expansion card can be improved without adding a cooling fan, and the cooling efficiency is improved by not supplying the warming air of the expansion card to other heat generating units, thereby improving the cooling efficiency of the electronic device. Cooling efficiency can be improved.

Further, the first duct forms a predetermined gap between the expansion card and the system board in the insertion direction of the expansion card to cover the expansion card, and the first duct covers the system in the insertion direction of the expansion card. By providing a shield plate that can be extended and installed on the board side, the degree of covering the expansion card can be appropriately changed according to the amount of heat generated by each mounted expansion card, and the cooling wind and the warm air velocity can be appropriately adjusted. Can be changed. Therefore, the cooling efficiency of the expansion card can be improved, and the cooling efficiency of the electronic device can be improved. Further, since the first duct is formed to have a minimum size, it is possible to reduce the size and cost of the first duct.

Further, the first duct is movable in the direction in which the expansion card is inserted into the system board, so that the amount of heat generated by each of the mounted expansion cards, the mounting position of the heat generating element, or the heat generating element. The space between the expansion card and the cooling fan that supplies cooling air to the expansion card can be changed as appropriate for the heat generation, and the supply range of the cooling air to the expansion card and the wind speed of the cooling air can be changed as appropriate. Can be. Therefore, the cooling efficiency of the expansion card can be improved, and the cooling efficiency of the electronic device can be improved.

Further, the first duct is rotatably mounted on a frame forming a system board, so that when the expansion card is mounted or maintained, the first duct can be attached to the system board without removing the first duct. Can be mounted or removed. Also, work such as opening the first duct can be facilitated.

Further, the cooling fan is moved to the upper part of the first duct and / or is fixed to a fan mounting plate that is detachably mounted, so that the cooling fan moves the fan mounting plate according to the mounting form of the expansion card, and By arbitrarily changing the installation position of the fan, it is possible to appropriately change the installation position of the heating fan or the installation position of the cooling fan with respect to the amount of heat generated by the heating element for each expansion card. Also, by making the mounting plate removable,
The cooling performance of the cooling fan can be appropriately changed so as to correspond to the amount of heat generated by the expansion card and the heating element.

Further, the first duct covers the front side and the back side of the expansion card, the guide member side, and the insertion surface side, thereby covering other surfaces except the front plate of the expansion card, thereby expanding the first card. It is possible to prevent the warm air of the card from being discharged to another heat generating unit or the space of the electronic device, thereby preventing the warm air of the expansion card from circulating in the electronic device.

Further, the second duct is provided with the other cooling fan, and has a suction portion for drawing in the warm air of the expansion card and flowing it to the other cooling fan; And a shielding portion formed so as to allow the warm air of another heat generating unit to flow to another cooling fan, so that the warm air of the expansion card can be circulated to the cooling fan installed in the other heat generating unit. By securing a path, the warm air of the expansion card can be discharged to the outside of the electronic device without thermally affecting other heat generating units.

[Brief description of the drawings]

FIG. 1 is a diagram of an embodiment of the present invention.

FIG. 2 is a diagram of an embodiment of the present invention.

FIG. 3 is a diagram of an embodiment of the present invention.

FIG. 4 is a diagram of an embodiment of the present invention.

FIG. 5 is a diagram of an embodiment of the present invention.

FIG. 6 is a diagram of an embodiment of the present invention.

FIG. 7 is a diagram of an embodiment of the present invention.

FIG. 8 is a diagram showing a form of an expansion card.

FIG. 9 is a diagram of the prior art.

FIG. 10 is a diagram of the prior art.

[Explanation of symbols]

 21: First duct 23: Fan mounting plate 25: Cooling fan 26: Shielding plate 27: Post 28: Supporting point 31: Second duct 35: Cooling fan 36: Intake unit 37: Shielding unit

Claims (7)

[Claims] 1. An electronic device cooling structure in which an expansion card to which cooling air is supplied by a cooling fan and another heat generating unit from which warm air is exhausted by another cooling fan are mounted adjacently on a system board. A cooling fan (2) that supplies cooling air to the expansion card
5) installing a first duct (21) that covers the expansion card and prevents the heat of the expansion card from being discharged to the space of the other heat generating unit and the electronic device; A second duct (31) formed so as to circulate to another cooling fan (35) for exhausting warm air from the heat generating unit. 2. The first duct (21) covers the expansion card by forming a predetermined gap between the expansion card and the system board in the direction of insertion of the expansion card and covers the expansion card in the insertion direction of the expansion card. The cooling structure for an electronic device according to claim 1, further comprising a shielding plate (26) that can be extended and installed on the system board side. 3. The cooling structure for an electronic device according to claim 1, wherein said first duct is movable in a direction in which an expansion card is inserted into a system board. 4. The cooling structure for an electronic device according to claim 1, wherein said first duct is rotatably mounted on a frame forming a system board. 5. The cooling fan (25) is fixed to a fan mounting plate (23) which is mounted on a first duct (21) so as to be movable and / or removable. 5. A cooling structure for an electronic device according to claim 2, 3, 3 or 4. 6. The first duct (21) is formed so as to cover the front side and the back side, the guide member side, and the insertion side of the expansion card. 6. The cooling structure for an electronic device according to 3, 4, or 5. 7. The second duct (31) is provided with the other cooling fan (35), and has an intake unit that draws in warm air from the expansion card and circulates the air to the other cooling fan (35). (36), and a shielding part (37) for preventing intake of warm air from the expansion card and for flowing warm air from another heat generating unit to another cooling fan (35). The cooling structure for an electronic device according to claim 1.