JP2000231617A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive IC card with good assembly precision by engaging a contact member into the hole part of a ground plate, fitting it and bringing the contact member into contact with the ground of a connector device for IC card. SOLUTION: A ground plate 20 is formed of a flat plate part 20a and a bend part 20b. Plural hole parts 20c pass through the flat plate part 20a and they are formed. The flat plate part 20a of the ground plate 20 is loaded on the base part of a connector part 16 and the tip of the bend part 20b can be connected to the ground pattern of a substrate member, A contact member 21 is formed of contact part 21a which is spherically (protrusively) projected and a flange part 21b. The contact member 21 is engaged into the hole part 20c of the flat plate part 20a and the flange part 21b is force-fitted to a recessed part 20d and they are abutted each other. When an IC card 10 is loaded on a connector device for IC card, the contact member 21 conducts the IC card 1-0 to the ground of the IC card connector device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a slot type IC card used in electronic equipment, and more particularly to an improvement in an IC card grounding structure.

[0002]

2. Description of the Related Art A conventional IC card 50 is shown in FIGS.
As shown in FIG. 0, a case 51 composed of a rectangular lower cover 52 made of a metal plate and a rectangular upper cover 53 also made of a metal plate, and an insulating material integrally provided in the lower cover 52. Frame 54 and an insulating board member 5 made of a printed board housed in case 51.
5 and a connector part 56 and a socket part 62 partially housed in the case 51.

The lower cover 52 comprises a flat base 52a, side walls 52b formed by bending both sides of the base 52a, and a rear wall 52c formed by bending a rear part of the base 52a.

The upper cover 53 has a flat base 53a, side walls 53b formed by bending both sides of the base 53a, a front wall 53c formed by bending a front part of the base 53a, and a base 53a. And a rear wall 53d formed by bending the rear part.

The frame 54 is formed of a rectangular molded product made of a synthetic resin, and has a frame portion 5 that extends around the entire periphery of the rectangular shape.
4a, a rectangular storage portion 54b formed of a concave portion provided inside the frame portion 54a, and a step portion 54c provided in the storage portion 54b. The frame 54 is provided with the lower cover 5
The second base portion 52a has substantially the same size as the outer shape of the base portion 52a, is mounted on the base portion 52a in a state of being housed in the lower cover 52, and is attached to the lower cover 52 by bending the side wall 52b.

The board member 55 has a conductive pattern so that various electric components 100 can be attached thereto by soldering. The board member 55 is housed in the housing portion 54b while being mounted on the step portion 54c of the frame 54. The entire periphery of the substrate member 55 is positioned by the storage portion 54b of the frame 54.

The connector portion 56 has a rectangular resin base portion 56a, and a part of the base portion 56a is housed in the base portion 56a and penetrates from the front wall portion 56b to the rear wall portion 56c. And a plurality of terminals 57.

The grounding plate 60 is made of a thin metal plate, and includes a rectangular flat plate portion 60a and a bent portion 60b bent substantially at a right angle from one side of the flat plate portion 60a. It is slightly bent. Further, the contact member 6 having a protruding shape is provided on the flat plate portion 60a.
0c are formed in a line. Then, a metal ground plate 60 is placed on the upper surface of the connector section 56.
Further, the tip of the bent portion 60b can be connected to an earth pattern, which is one of the conductive patterns of the substrate member 55.

The socket portion 62 is formed in a female form which is a part of another connector, and has terminals connected to the terminals of the male connector.
4, the terminal is positioned on the front surface of
5 and are attached.

[0010] By combining the upper cover 53 with the lower cover 52 to which the board member 55, the connector portion 56 and the socket portion 62 are attached, the case 51 having the storage portion 51a is formed. And case 51
Is formed, the frame 54,
The board member 55, the connector portion 56, and the socket portion 62 are housed therein, and the flat plate portion 60 of the ground plate 60 is provided on the connector portion 56.
The bent portion 60b is placed between the end of the board member 55 and the rear wall portion 56c of the connector portion 56, and is in contact with the ground pattern of the conductive pattern. The contact member 60c of the ground plate 60 is formed in advance by stamping. The IC card 50 is formed by the above configuration, and the IC card 50 thus configured is
It is designed to be inserted into and removed from the C card connector device. At the time of such mounting, a part of the IC connector device comes into contact with the contact member 60c of the ground plate 60,
The C card 50 is electrically connected to the ground of the IC card connector device.

[0011]

By the way, the ground plate 60
The contact member 60 is formed by stamping as described above.
The contact member 60c must be plated with gold having high conductivity in order to increase the conductivity and to reliably perform the grounding. Therefore, the entire ground plate 60 has to be gold-plated by an erosion method or the like. Therefore, since the unnecessary portion of the ground plate 60 is plated with gold, the plating processing cost is increased and the cost is increased. In addition, since the ground plate 60 is protruded, it is difficult to make the heights of the contact members 60c uniform. There was a problem that the accuracy of the dimension could not be obtained.

The present invention has been made in view of the above points, and has as its object to provide an inexpensive IC card with high assembling accuracy.

[0013]

At least one of the above objects is attained.
As a first solution to solve the problem, a grounding plate made of a conductive metal plate and having a plurality of holes, and a separate contact member having a conductive shape and projecting are provided. The contact member is fitted into the hole of the ground plate, the contact member is attached to the ground plate, and the contact member can be brought into contact with the ground of the IC card connector device to which the IC card is attached and detached.

[0014] As a second solution, the contact member is formed into a protruding shape by press working and is pressed into each hole.

[0015] As a third solution, the contact member includes a contact portion formed in a protruding shape and a flange portion formed integrally with the contact portion, and is provided on the periphery of each hole of the ground plate. Each has a stepped concave portion, a contact portion is inserted into the hole portion, and a flange portion is press-fitted into the concave portion and attached.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An IC card 10 according to an embodiment of the present invention will be described with reference to FIGS.
The card 10 includes a case 11 including a rectangular lower cover 12 made of a metal plate, and a rectangular upper cover 13 also made of a metal plate, and an insulating frame integrally disposed in the lower cover 12. 14 and an insulating board member 15 made of a printed board housed in the case 11
And a connector part 16 and a socket part 22 partially housed in the case 11.

The lower cover 12 includes a flat base 12a, side walls 12b formed by bending both sides of the base 12a, and a rear wall (not shown) formed by bending a rear portion of the base 12a. Become.

The upper cover 13 has a flat base 13a, side walls 13b formed by bending both sides of the base 13a, a front wall 13c formed by bending the front of the base 13a, and a base 53a. And a rear wall 13d formed by bending a rear portion of the rear wall.

The frame 14 is formed of a rectangular molded product made of a synthetic resin, and the frame portion 1 is formed around the entire periphery of the rectangular shape.
4a, a rectangular storage portion 14b formed of a concave portion provided inside the frame portion 14a, and a step portion 14c provided in the storage portion 14b. This frame 14 is used for the lower cover 1
The second base 12a has substantially the same size as the outer shape of the base 12a, is placed on the base 12a while being housed in the lower cover 12, and is attached to the lower cover 12 by bending the side wall 12b.

The board member 15 has a conductive pattern, and various electric components (not shown) can be attached thereto by soldering. The board member 15 is stored on the step portion 14 c of the frame 14. The board member 15 is housed in the housing 14, and the entire periphery of the board member 15 is positioned by the housing 14 b of the frame 14.

The connector section 16 has a rectangular base 16a made of resin, and a part of the base 16a is accommodated in the base 16a and penetrates from the front wall 16b to the rear wall 16c. And a plurality of terminals 17.

The grounding plate 20 is made of a conductive thin metal plate, and has a rectangular flat plate portion 20a and a flat plate portion 20a.
a bent portion 20b bent at a substantially right angle from one side of a
The tip of the bent portion 20b is slightly bent. A plurality of round holes 20c are formed in the flat plate portion 20a along the bent portion with the bent portion 20b so as to be regularly arranged in a row. On the periphery,
Recess 2 having a slightly larger diameter than these holes 20c
0d is formed. Then, the flat plate portion 2 of the ground plate 20
Numeral 0a is placed on the base 16a of the connector portion 16, and the tip of the bent portion 20b can be connected to an earth pattern, which is one of the conductive patterns of the substrate member 15.

The contact member 21 is made of a highly conductive metal such as phosphor bronze, and is called a so-called "dimple".
The contact portion 21a has a hemispherical (projecting) shape and a flange portion 21b formed integrally with the periphery of the root portion of the contact portion 21a. The surface of the contact portion 21a is plated with gold, and has better conductivity than other portions. These contact members 21 are connected to the flat plate portion 20a.
Are inserted into the holes 20c of the
The flange portion 21b is press-fitted and abuts on to prevent slipping. The grounding plate 20 to which the contact member 21 is attached in this manner is fixed to the upper surface of the base 16a of the connector 16 by attaching means (not shown).

The socket portion 22 is formed in a female form which is a part of another connector, and has terminals connected to the terminals of the male connector.
4, the terminal is positioned on the front surface of the substrate member 1.
5 and are attached.

The IC card 10 configured as above is
By combining the upper cover 13 with the lower cover 12 to which the board member 15, the connector 16 and the socket 22 are attached, the case 11 having the storage portion 11a is formed. When the case 11 is formed, the frame 14, the board member 15, the connector 16 and the socket 22 are housed in the housing 11a.
A flat plate portion 20a of the ground plate 20 is placed on the base portion 16a of the base member 16a. Solder and fix in the state of contact. Here, the contact member 21 attached to the ground plate 20
Are formed in a projecting shape by press working. The IC card 10 is formed by assembling and configuring as described above, and the IC card 10 is used by being inserted into and removed from an IC card connector device. At the time of such mounting, the contact member 21 attached to the ground plate 20 contacts a part of the IC card connector device to conduct the IC card 10 to the ground of the IC card connector device.

Therefore, this IC card 10 is
Since the ground area can be increased by 0, high electrical characteristics are maintained, and at the same time, the gold-plated contact member 21 is formed into a protruding shape by press working, and at the same time, material cost is suppressed by being press-fitted into each hole 20c. And the height dimension of the contact member 21 can be accurately determined.
Variations between the contact members 21 can be eliminated, and contact stability can be increased. Also, the number of assembling steps can be reduced.

Next, an IC card 30 according to another embodiment of the present invention will be described with reference to FIG. 7. This IC card 30 has a round shape in which the ground plate 20 is formed so as to penetrate between the front and back surfaces. It has a plurality of holes 31 and a contact member 32 made of the same material as the contact member 21 and having a substantially hemispherical projection 32a at its tip, and press-fits the contact members 32 into the holes 31 respectively. It is intended to be fixed. Other configurations are the same as those of the IC card 10. Therefore, the IC card 30 is assembled by press working in the same manner as in the case of the IC card 10,
With reference to the bottom surface of the ground plate 20, the bottom of the contact member 32 is press-fitted and mounted on the same surface as the bottom surface, so that the height dimensions of the plurality of contact members 32 can be made uniform.

Next, an IC card 40 according to still another embodiment of the present invention will be described with reference to FIG.
The card 40 has a grounded upper cover 41 that is integrated with a ground plate by extending the upper cover, and further penetrates the surface of the upper cover 41 and the back surface thereof, and It has a plurality of round holes 41a formed along it. The upper cover 41 is a thin metal plate,
The hole 41a is also processed into one of the hole 20c and the hole 31 so as to correspond to the shape of the contact members 21 and 32 described above. And the IC card 40
As in the case of the IC cards 10 and 30 described above, by inserting the contact member 21 or 32, the area for gold plating can be reduced, the material cost can be reduced, and the upper cover 41 can be grounded ( (Ground), and a large ground area can be obtained, so that electrical characteristics can be improved.

[0029]

The IC card described above is made of a conductive metal plate and has a plurality of contact holes between a grounding plate having a plurality of holes and a conductive and projectingly formed separate body. A contact member is fitted into the hole of the ground plate, the contact member is attached to the ground plate, and the contact member can contact the ground of the IC card connector device to which the IC card is attached and detached. Since the area plated with gold can be reduced while maintaining a large GND (ground) area and maintaining electrical characteristics, the cost of raw materials can be reduced.

Further, the contact member is formed into a protruding shape by press working, and is press-fitted into each hole, so that a large GND (ground) area is obtained, and the gold-plated area is maintained while maintaining the electrical characteristics. Is reduced, the raw material cost can be reduced, and the contact member is press-fitted into each hole at the time of press working, so that the number of assembling steps can be reduced.

Further, the contact member has a contact portion formed in a protruding shape, and a flange portion formed integrally with the contact portion, and a stepped concave portion is formed on the periphery of each hole of the ground plate. By inserting the contact part into the hole and pressing the flange part into the concave part and mounting it, the GND (ground) area is increased, and the gold plating area is reduced while maintaining the electrical characteristics. In addition, the raw material cost can be reduced, and the flange can be positioned and securely attached to the recess, so that the assembly can be performed with high accuracy.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an IC card of the present invention.

FIG. 2 is a plan view of the IC card of the present invention.

FIG. 3 is a front view of the IC card of the present invention.

FIG. 4 is a side view of a main part of the IC card of the present invention.

FIG. 5 is a vertical sectional view of a main part of the IC card of the present invention, taken along line 5-5 in FIG. 2;

FIG. 6 is a schematic sectional view of a principal part of the IC card of the present invention.

FIG. 7 is a schematic vertical sectional view of an IC card according to another embodiment of the present invention.

FIG. 8 is a schematic plan view of an IC card according to still another embodiment of the present invention.

FIG. 9 is an exploded perspective view of a conventional IC card.

FIG. 10 is an essential part side view of a conventional IC card disassembled.

[Explanation of symbols]

 10, 30, 40 IC card 20 Ground plate 20d Depression 20c, 31, 41a Hole 21, 32 Contact member 21a Contact portion 21b Flange portion

Claims (3)

[Claims] 1. A grounding plate made of a conductive metal plate and having a plurality of holes formed therein, and a separate contact member having a conductive shape and formed in a projecting shape. The contact members are fitted into the holes, respectively, the contact members are attached to the ground plate, and the contact members are attached to and detached from the IC card.
An IC card characterized by being able to contact the ground of a C card connector device. 2. The IC card according to claim 1, wherein said contact member is formed into a projecting shape by press working, and is press-fitted into each of said holes. 3. The contact member includes a contact portion formed in a protruding shape, and a flange portion formed integrally with the contact portion, and a stepped shape is formed on a peripheral edge of each hole of the ground plate. 3. The IC card according to claim 1, further comprising a concave portion, wherein the contact portion is inserted into the hole portion, and the flange portion is press-fitted into the concave portion.