JP2000227766A - Electro-optic panel, electro-optic panel module and projection type display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure which is capable of facilitating handling and decreasing product defects by changing the shape of transparent substrates and suppressing the overflow of a transparent adhesive in the case of surface-to-surface adhesion of the transparent substrates by using the transparent adhesive to the outside surfaces of the transparent substrates constituting an electro-optic panel. SOLUTION: The end faces of the transparent substrates 31 and 32 are all arranged on the side outer than the end faces of an element substrate 11 and a counter substrate 12 and hold an adhesive part 30a therebetween, by which a difference in level is formed. Consequently, if the protruding quantity of the transparent adhesive is confined within a range of the certain extent when the element substrate 11 and the transparent substrate 31 and the counter substrate 12 and the transparent substrate 32 are subjected to surface-to-surface adhesion by the transparent adhesive 30 as described above, the transparent adhesive 30 is held in the portion of the difference in level described above even if part thereof protrudes outside from the adhesive surfaces. The spreading of the transparent adhesive 30 beyond the portion described above may be prevented. Further, at least one periphery of the transparent substrates 31 and 32 is provided with a light shielding member 55, by which the light intruding diagonally to the panel from the periphery of the panel may be shielded.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electro-optical panel, an electro-optical panel module, and a projection type display device, and more particularly to a structure of an electro-optical panel suitable for use as a light valve of a projection type display device.

[0002]

2. Description of the Related Art In a projection display device such as a liquid crystal projector, an electro-optical panel for modulating light is sometimes used to form a predetermined image. In this case, a condensing optical system for applying light from the light source to the electro-optical panel, and an enlarged projection optical system for projecting light transmitted through the electro-optical panel onto a projection surface such as a screen to form an enlarged image. The light condensed by the condensing optical system is transmitted through the electro-optical panel to form a predetermined image, which is projected forward by the magnifying projection optical system.

[0003]

However, if dust adheres or is scratched on the outer surfaces of the two transparent substrates constituting the above-described electro-optical panel, the outer surfaces of the transparent substrates become condensed optical systems. Is only about 1 mm away from the liquid crystal layer of the electro-optical panel which is focused by the method, the outer surface of the transparent substrate is also in the focus state.
Even if dust or scratches of about 0 to 20 μm exist, there is a problem that the image is enlarged and projected and the image quality of the projected image is significantly reduced.

[0004] In the projection type display device, since the light source emits strong light, a local temperature rise is likely to occur in the electro-optical panel. Such a rise in temperature partially changes the light transmittance of the liquid crystal, thereby deteriorating the display quality. Further, the rise in temperature also causes deterioration of electro-optical materials such as liquid crystals.

Therefore, Japanese Patent Application Laid-Open Nos. 9-105901 and 9-113906 disclose that a transparent material is provided on the outer surface of a transparent substrate of an electro-optical panel at an interval using a bonding material. While improving the heat dissipation by the air layer between the transparent substrate of the electro-optical panel and another transparent substrate,
A technique for preventing scratches and dust from being attached to the outer surface of a transparent substrate of an electro-optical panel is described. However, in this method, since another transparent substrate is placed at an interval, light reflection occurs at the interface between the electro-optical panel and the air layer or at the interface between the air layer and another transparent substrate, resulting in light loss. In addition, there is a problem that an additional step of forming an antireflection film on the substrate surface is required to prevent reflection.

In order to solve the above problems, the inventor of the present application has studied various methods of surface-attaching another transparent substrate to the outer surface of a transparent substrate of an electro-optical panel via a transparent adhesive, and has already filed an application. ing. FIG. 6 schematically shows the structure of such an electro-optical panel. Liquid crystal, which is an electro-optical material, is sealed between a device substrate 11 having pixel electrodes and active elements formed on an inner surface thereof and a counter electrode 12 having a counter electrode formed on the inner surface thereof by a sealing material (not shown). A transparent substrate 28 is surface-bonded on the outer surface of the element substrate 11 with a transparent adhesive 30, and a transparent substrate 29 is surface-bonded on the outer surface of the counter substrate 12 with the transparent adhesive 30.
However, as the transparent adhesive 30 used in this method, the electro-optical panel is not distorted and the element substrate 1
1. Since it is necessary to use a substrate having substantially the same light refractive index as that of the opposing substrate 12 and the transparent substrates 28 and 29, the adhesive material is limited, the viscosity is low, and a certain degree of fluidity is provided even after curing. Material is used. As a result, the transparent adhesive 30 overflows from the outside of the bonding portion between the substrates as shown in the figure after the surface bonding, which makes it difficult to handle during the manufacturing process and after the manufacturing is completed, and causes the outer surfaces of the transparent substrates 28 and 29 to be difficult to handle. Since the transparent adhesive 30 is easily attached by mistake, there is a problem that a product defect is easily generated.

In view of the above, the present invention has been made to solve the above-mentioned problem, and when the transparent substrate is surface-bonded to the outer surface of the transparent substrate constituting the electro-optical panel using a transparent adhesive, the shape of the transparent substrate is changed. Another object of the present invention is to provide a novel structure capable of facilitating handling and reducing product defects by suppressing overflow of the transparent adhesive.

[0008]

Means taken by the present invention to solve the above-mentioned problem is that an electro-optical material is sandwiched between a first substrate and a second substrate, and the first and the second substrates are sandwiched. A third substrate is surface-adhered to the outside of at least one of the second substrates with an adhesive, and the end faces of the first substrate and the third substrate facing each other via the adhesive are shifted from each other. Characterized in that a step is formed.

According to this structure of the present invention, even if the outer surface of the first substrate is scratched or dusted by bonding the third substrate to the surface, these scratches and dust are defocused away from the electro-optical material. Therefore, it is possible to prevent the display quality from deteriorating, increase the heat capacity of the electro-optical panel, and reduce the display quality deteriorating due to overheating of the electro-optical material. In addition, since a step is formed across the bonding portion between the end surface of the first substrate and the end surface of the third substrate, even if the adhesive flows out between the substrates,
If it is a certain amount, it will be accumulated and held on the step, and it will be prevented from flowing out of the step. Therefore, the adhesive adheres to the outer surface of the electro-optical panel during the manufacturing process or after the manufacturing, which makes it difficult to handle during operation, or the adhesive adheres to the light transmitting portion of the electro-optical panel, resulting in a product defect. Can be prevented. Furthermore, since the adhesive is cured in a state where the adhesive has accumulated on the steps,
The adhesive strength between the first substrate and the third substrate can be increased.

The present invention is characterized in that the step is formed by differentiating the planar size of the first substrate and the third substrate.

According to this structure of the present invention, a step can be formed only by changing the size of the substrate, so that there is no need to perform special processing on the end face of the substrate.

The present invention is characterized in that the third substrate is larger than the first substrate, and the end face of the first substrate is arranged inside the end face of the third substrate.

According to this structure of the present invention, the end surface of the first substrate is disposed inside the end surface of the third substrate, that is, the third substrate is formed to be large so as to surround the first substrate. Therefore, even if the adhesive flows out,
Since the electro-optical panel is covered with the third substrate, it is possible to prevent the electro-optical panel from flowing out.

According to the present invention, an electro-optical material is sandwiched between a first substrate and a second substrate.
A third substrate is surface-bonded to an outer surface of at least one of the substrates with an adhesive, and a peripheral portion of at least one of the first substrate and the third substrate on a surface on which the adhesive is formed is provided. It is characterized in that a groove is formed.

According to this structure of the present invention, even if the adhesive overflows from the substrate, a certain amount of the adhesive is accumulated on the step and held, thereby preventing the adhesive from flowing out of the groove. . Therefore, the adhesive adheres to the outer surface of the electro-optical panel during the manufacturing process or after the manufacturing, which makes it difficult to handle during operation, or the adhesive adheres to the light transmitting portion of the electro-optical panel, resulting in a product defect. Can be prevented. Further, since the adhesive is cured in a state where the adhesive is accumulated in the groove, the adhesive strength between the first substrate and the third substrate can be increased.

The present invention is characterized in that at least one end surface of the first substrate and the third substrate has an inclined surface inclined toward the inside of the substrate.

According to the configuration of the present invention, since the inclined surface is provided, an area for storing the outflowing adhesive is widened.
As a result, it is possible to further prevent the adhesive from flowing out.

In the present invention, it is preferable that the inclined surface is formed on a part of the end face on the side of the adhesive surface in the thickness direction of the substrate. The adhesive which has flowed out due to the inclined surface portion can be stored in the inclined surface portion. Further, since the inclined surface portion is partially formed, the portion of the end surface where the inclined surface portion is not formed can be an end surface portion perpendicular to the plate surface as usual, so that the panel is gripped by the end surface portion. And positioning.

The present invention is characterized in that the step is formed by surface-adhering the first substrate and the third substrate so as to be shifted in a plane direction.

According to this structure of the present invention, a step can be formed between the end faces even if the third substrate is formed to have the same size as the first substrate, so that any special processing is performed on the substrate. No need.

In the present invention, it is desirable that the third substrate and the transparent adhesive have substantially the same light refractive index as the first substrate.

According to this structure of the present invention, it is possible to reduce the reflection at the interface between the transparent adhesive and the third transparent substrate.

In the present invention, the transparent adhesive preferably has elasticity even after curing.

According to this structure of the present invention, the use of the transparent adhesive having elasticity after curing can reduce the distortion of the substrate caused by the stress generated during curing.

In the present invention, it is desirable that the penetration of the transparent adhesive after curing is 60 or more and less than 90.

According to the configuration of the present invention, the substrate distortion can be avoided by absorbing the stress of the transparent adhesive itself while minimizing the outflow of the transparent adhesive.

In the present invention, the thickness of the adhesive is preferably 5 μm or more and 30 μm or less.

According to the structure of the present invention, by setting the thickness of the adhesive to 5 μm or more, scratches and dust on the substrate can be hidden by the adhesive. When the thickness is 10 μm or less, the adhesive strength can be made sufficiently high.

In another electro-optical panel according to the present invention, a first substrate and a second substrate are bonded with a sealant, and an electro-optical material is sandwiched between the first substrate and the second substrate. A third substrate is disposed outside at least one of the first substrate and the second substrate. The third substrate is larger than the first substrate, and an end face of the first substrate is the third substrate. It is arranged inside the end face, and a light shielding member is arranged on the third substrate along the periphery of the third substrate.

According to this structure of the present invention, since the third substrate has a larger outer shape than the first substrate and the light-shielding member is formed along the periphery of the third substrate, the third substrate is oblique to the electro-optical panel. Light can be prevented from entering.

In the electro-optical panel according to the present invention, the light incident from the third substrate side is emitted to the second substrate side via the first substrate, and the light-blocking member is formed of the sealing member in plan view. It is characterized in that it overlaps with the material and extends outside the sealing material.

According to this structure of the present invention, since the light shielding member extends outside the sealing material, for example, when a thin film transistor is formed in the display area of the first substrate,
Light scattered by the sealant can be prevented from being incident on the thin film transistor or the like, and deterioration of thin film transistor characteristics can be prevented.

According to the present invention, the light incident from the third substrate side is emitted to the second substrate side via the first substrate, and one of the first substrate and the second substrate has the seal. A light-shielding film is disposed inside the material, and the light-shielding member overlaps the light-shielding film in a plane and extends outside the sealing material.

According to this structure of the present invention, the light shielding film formed inside the sealing material and the light shielding member overlap in a plane, so that light around the display area can be shielded and a display with high contrast is performed. In addition, it is possible to prevent an influence on a panel due to light leakage, for example, deterioration of characteristics of a thin film transistor formed on an element substrate.

[0035] The present invention is characterized in that the light shielding member is disposed on the electro-optical material side of the third substrate.

According to this structure of the present invention, the distance between the light-shielding film and the light-shielding member inside the sealing material is smaller than when the light-shielding member is provided on the third substrate on the side opposite to the liquid crystal layer side. Positioning when the light shielding members are overlapped in a plane can be easily performed.

The present invention is characterized in that the light shielding member is arranged on a surface of the third substrate opposite to the electro-optical material side.

According to this structure of the present invention, since the light shielding member is arranged outside the third substrate, it is more effective to prevent the light obliquely entering the sealing material from entering.

The present invention is characterized in that the first substrate and the third substrate are surface-bonded with an adhesive.

According to this structure of the present invention, since the first substrate and the third substrate are surface-bonded with the adhesive, there is no air layer. Therefore, it is possible to prevent light from being reflected at the interface between the panel and the air layer. In addition, since the third substrate disposed outside the first substrate is larger than the first substrate, even if the adhesive flows out, the adhesive is covered by the third substrate, and thus flows out of the electro-optical panel. Can be suppressed.

The present invention is an electro-optical panel module comprising the electro-optical panel, a wiring member conductively connected to the electro-optical panel, and a case housing the electro-optical panel.

With this configuration of the present invention, the flow of the adhesive can be suppressed by the case body.

The present invention is a projection display device including the electro-optical panel or the electro-optical panel module as a liquid crystal light valve. Here, the projection display device includes a condensing optical system for condensing light emitted from a light source to the electro-optical panel, and expanding the light transmitted through the electro-optical panel and modulated onto a projection surface such as a screen. And an enlarged projection optical system for performing projection. The present invention has a remarkable effect when applied to a projection display device in which the influence of scratches and dust on the outer surface of the substrate of the electro-optical panel is particularly large and the electro-optical panel is likely to overheat.

In the above-mentioned electro-optical panel, it is preferable that the third substrate is surface-bonded to the outer surface of the second substrate via a transparent adhesive.

[0045]

Next, an embodiment according to the present invention will be described in detail with reference to the drawings.

First Embodiment (Overall Structure of Electro-Optical Panel) FIG. 1 is a schematic diagram showing the structure of an electro-optical panel according to a first embodiment of the present invention. In this embodiment, an inner side between a transparent element substrate 11 made of glass or the like having a pixel electrode and an active element formed on an inner surface thereof and a transparent counter substrate 12 made of glass or the like having an opposing electrode formed on the inner surface is provided. An electro-optical panel 10 is formed with a liquid crystal layer sandwiched between the two.
In the electro-optical panel 10, a transparent substrate 31 is surface-bonded on the outer surface of the element substrate 11 with a transparent adhesive 30, and a transparent substrate 32 is surface-bonded on the outer surface of the counter substrate 12 with a transparent adhesive 30. . The transparent substrate 31 has a light refractive index substantially equal to that of the element substrate 11, and is preferably formed of the same material as the element substrate 11.
The transparent substrate 32 also has a light refractive index substantially equal to that of the counter substrate 12, and is preferably formed of the same material as the counter substrate 12.

The transparent adhesive 30 has a light refractive index substantially equal to that of the element substrate 11 and the transparent substrate 31 when the element substrate 11 and the transparent substrate 31 are surface-bonded, and a transparent adhesive after curing is used. Can be Similarly, when the opposing substrate 12 and the transparent substrate 32 are surface-bonded, the opposing substrate 12
A transparent adhesive having a light refractive index substantially equal to that of the transparent substrate 32 and being used after curing is used.

As the transparent substrates 31 and 32, the element substrate 11 and the opposing substrate 12 are made of a quartz substrate (light refractive index = 1.4).
In the case of 6), it is possible to make the optical refractive indices match by using the same quartz substrate. Also, the transparent adhesive 30
As described above, when a quartz substrate is used as described above, a silicon-based adhesive or an acrylic-based adhesive prepared to have a light refractive index of 1.46 can be used.

Of course, if the element substrate 11 and the opposing substrate 12 are high heat-resistant glass plates such as neoceram having a refractive index of 1.54, the same heat-resistant glass plates may be used for the transparent substrates 31 and 32. Further, the transparent adhesive 30 can also be prepared by using the above-mentioned silicone adhesive or acrylic adhesive so that the refractive index becomes 1.54.

In this embodiment, a quartz substrate having a thickness of 1.2 mm,
A quartz substrate with a thickness of 1.1 mm is used, and the transparent substrates 31 and 32 are quartz substrates with a thickness of 1.1 mm. The thickness of the transparent adhesive 30 is preferably in the range of 5 to 30 μm. In particular, by setting the thickness of the adhesive to 5 μm or more, scratches and dust on the substrate can be hidden by the adhesive. When the thickness is 10 μm or less, the adhesive strength can be made sufficiently high.

The transparent substrates 31 and 32 are provided on the electro-optical panel.
In the step of surface bonding, the transparent adhesive 30 is dropped and applied to both the inner surfaces of the transparent substrates 31 and 32 and the outer surfaces of the element substrate 11 and the opposing substrate 12, and then the transparent adhesives 30 are first contacted with each other. By overlapping two substrates and pressing both substrates, the transparent adhesive 30 is pushed and spread between the substrates, and then the transparent adhesive 30 is cured. In this case, no air bubbles remain in the transparent adhesive 30, so that a decrease in display quality due to the air bubbles can be avoided. This bonding step may be performed at any timing before and after the assembly of the electro-optical panel.

Here, it is preferable that the transparent adhesive has elasticity even after curing. If the penetration of the transparent adhesive after curing is 90 or more, the adhesive flows from the substrate at the time of curing, and an appropriate amount of the adhesive cannot be held on the substrate. If the penetration is less than 60, the stress at the time of curing the adhesive cannot be absorbed, and distortion occurs between the substrates. Therefore, the transparent adhesive has a penetration of 60 after curing.
It is preferably at least 90 and less than 90.

In the present embodiment, the transparent substrate 31 is formed to have a larger area than the element substrate 11 of the electro-optical panel 10,
The transparent substrate 32 is formed to have a larger area than the counter substrate 12. Specifically, if the element substrate 11 and the counter substrate 12 have a substantially rectangular planar shape, each side of the transparent substrates 31 and 32 is formed longer than the length of each side. For this reason, the end faces of the transparent substrates 31 and 32 can be all arranged outside the end faces of the element substrate 11 and the counter substrate 12. In this manner, the bonding portion 30a between the end surface of the element substrate 11 or the opposing substrate 12 and the end surfaces of the transparent substrates 31 and 32 (corresponding to the end portion of the bonding layer formed between the two surface-bonded substrates). ) Is formed to form a step as shown. As a result, when the element substrate 11 and the transparent substrate 31 and the opposing substrate 12 and the transparent substrate 32 are surface-bonded with the transparent adhesive 30 as described above, the amount of the transparent adhesive protruding falls within a certain range. For example, even if a part of the transparent adhesive 30 overflows from the bonding surface to the outside, it accumulates at the above-mentioned step, and is held as shown in the figure according to the surface tension of the transparent adhesive and the degree of wettability to the substrate surface. Thus, the spread of the transparent adhesive 30 can be reduced. Further, since the transparent substrates 31 and 32 are larger than the element substrate 11 and the opposing substrate 12 and are covered in a planar manner, it is possible to prevent direct contact with the adhesive that has flowed out.

In order for the protruding portion of the transparent adhesive 30 to be held at the step in the above state, the transparent adhesive 30
Although the amount of the transparent adhesive 30 must be controlled to some extent, the margin of the amount of the transparent adhesive 30 can be sufficiently increased by increasing the amount of the step, so that the transparent adhesive 30 can easily avoid overflow from the step. can do. After the transparent adhesive 30 is dropped and the two substrates are bonded to each other,
The transparent adhesive 30 overflowing to the outer edge of the substrate can be sucked by a suction device or the like. However, even in this case, the transparent adhesive 30 may flow out after sucking and curing, so that this embodiment is very effective. Also,
In some cases, the viscosity of the transparent adhesive 30 temporarily decreases during curing, and in this case, the fluidity is further increased by the decrease in the viscosity. Therefore, the present embodiment is more effective.

Further, since the transparent adhesive 30 accumulates at the step as described above, the two substrates are more firmly adhered at the ends, so that the element substrate 11, the opposing substrate 12, and the transparent substrates 31, 32 Can be increased, and the transparent substrates 31 and 32 can be more securely and firmly bonded and fixed.

(Internal Structure of Electro-Optical Panel) Next, the internal structure of the electro-optical panel 10 in this embodiment will be briefly described. FIG. 7 is a plan view of the electro-optical panel with the transparent substrate 31 and the transparent substrate 32 omitted.
FIG. 8 is a sectional view taken along the line AA ′ of FIG. FIG. 8 is a cross-sectional view including the transparent substrate 31 and the transparent substrate 32.
In this embodiment, a polarizing plate may be provided on the side of the liquid crystal projector as described later, and may not be attached to the electro-optical panel. A wiring layer on the inner surface of the element substrate 11,
Active elements such as pixel electrodes and TFTs are formed in a known pattern, and an alignment film (not shown) is deposited thereon. The alignment film is subjected to a rubbing process in a predetermined direction. On the other hand, a counter electrode (not shown) facing the pixel electrode (not shown) is formed on the inner surface of the counter substrate 12, a similar alignment film is formed thereon, and a rubbing process is similarly performed. . The element substrate 11 and the opposing substrate 12 formed in this way are adhered via the sealing material 14.
In many cases, a photo-curing resin or the like is used as the sealing material 14, and alignment is performed so that the distance between the element substrate 11 and the counter substrate 12 can be maintained at a predetermined value (about 2 to 10 μm). Cures the sealing material 14. Thereafter, the opening 1 is placed inside the sealing material 14 in a vacuum.
Liquid crystal is injected from 4a to form a liquid crystal layer. After injecting the liquid crystal, the opening 14a is kept in a state where the parallelism of both substrates is secured.
Is sealed by a sealing material 15 made of resin. A predetermined external wiring pattern 11a is previously formed on the inner surface of the element substrate 11 having a larger area. An external terminal portion 11b in which a large number of external terminals 19 are arranged is formed at one side end of the element substrate 11, and this external terminal portion 11b includes
The connection portion of the flexible wiring board 16 is conductively connected via an anisotropic conductive film or the like. The light-shielding film 12a is referred to as a picture frame provided for partitioning a boundary between a central display area of the liquid crystal display panel and a non-display area around the liquid crystal display panel. It is formed of metal. Also, on the inner surface of the element substrate 11,
In some cases, a similar light-shielding film is formed just inside the portion overlapping with the sealing material 14.

(Structure of Electro-Optical Panel Module) FIG.
FIG. 9 is an exploded perspective view of an electro-optical panel module including the electro-optical panel 10 as shown in FIGS. 7 and 8. FIG.
As shown in (1), a transparent substrate 31 is attached to the element substrate 11, and a transparent substrate 32 is attached to the opposing substrate 12. Note that, in FIG. 9, the size of the element substrate 11 and the size of the transparent substrate 31 are the same, and the size of the counter substrate 12 and the shape of the transparent substrate 32 are the same in order to clearly show the arrangement relationship. In practice, as described above, it goes without saying that the sizes of the transparent substrate 31 and the transparent substrate 32 are different from those of the element substrate 11 and the counter substrate 12. As shown in FIG.
The electro-optical panel module is accommodated in the accommodating recess 41, and the holding plate 60 is set to form an electro-optical panel module. Fitting holes 62a are provided in fitting pieces 62 formed at both ends of the holding plate 60, and fitting portions 43 formed on the side surfaces of the panel mounting frame 40 fit into the fitting holes 62a. The mating projection 43a fits. Here, for example, a silicon RTV (room temperature hardening type silicon rubber) is provided between a protruding region of the element substrate 11 of the electro-optical panel 10 which protrudes outward from the opposing substrate 12 and the first step portion 42A of the housing recess 41. ), The adhesive mainly containing silicone rubber or the like is poured in, and the adhesive is solidified so that the electro-optical panel 10 is attached to the panel mounting frame 40.
Can be fixed. At this time, the electro-optical panel 1
0, for example, the outer surface of the transparent substrate 32 is positioned in contact with the second step portion 42B.

The escape groove 42b is for preventing the sealing agent 15 of the electro-optical panel from rising as shown in FIG. 7, and prevents the electro-optical panel 10 from floating when housed in the panel mounting body 40. The outer supporting surface portion 48 faces the surface of the flexible wiring board 16 and suppresses unnecessary deformation of the flexible wiring board 16. It is also possible to fill the concave groove 48a provided in the outer support surface portion 48 with an adhesive to adhere the flexible wiring board 16 to the panel mounting body 40. By doing so, the flexible wiring board 16 and the panel mounting frame 40 are fixed outside the connection portion, so that stress is less likely to be applied to the conductive connection portion, and the external terminal portion and the conductive connection portion of the electro-optical panel are hardly applied. The stress is less likely to be applied to the connection portion between the electro-optical panel and the connection portion between the external terminal portion and the conductive connection portion of the electro-optical panel, and the screen shift of the electro-optical panel 10 can be reduced.

In this embodiment, since the transparent adhesive has a step between the end surfaces of the element substrate 11 or the counter substrate 12 and the end surfaces of the transparent substrates 31 and 32 as described above, the transparent adhesive is formed. Is held at the step, and the panel mounting frame 4
It can be prevented from flowing out to the holding plate 60 or the holding plate 60. In addition to this, even if the transparent adhesive flows out of the step,
The groove 48a is formed in the panel mounting frame of the electro-optical panel module.
Alternatively, if 42b is provided, the adhesive is held in these grooves and is effective to prevent the adhesive from flowing out of the panel mounting frame 40. In the electro-optical panel module of FIG. 9, the transparent substrate 31 and the element substrate 11, and the transparent substrate 32 and the opposing substrate 12 are shown to have substantially the same size. 40
What is necessary is just to change the step shape inside.

(Projection Display Device) In FIG. 10, a projection display device 1 using the above-described electro-optical panel module is shown.
100 will be described. Prepare three electro-optical panel modules, each with a light valve 100 for RGB.
It is configured as a projection type display device used as R, 100G and 100B. In the projection display device 1100,
Lamp unit 1 for white light source such as metal halide lamp
When the projection light is emitted from 102, three mirrors 110
With 6 and 2 dichroic mirrors 1108,
Light components R, G, and B corresponding to the three primary colors of RGB are separated, and guided to light valves 100R, 100G, and 100B corresponding to the respective colors. At this time, in particular, the B light is guided through a relay lens system 1121 including an entrance lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss due to a long optical path. The light components corresponding to the three primary colors modulated by the light valves 100R, 100G, and 100B are recombined by the dichroic prism 1112, and then the projection lens 1
The image is projected as a color image on the screen 1120 via the display 114.

In the liquid crystal projector using the electro-optical panel module including the electro-optical panel of the present embodiment as a liquid crystal light valve, it is necessary to prevent the transparent adhesive from flowing out to the outer surface of the panel mounting frame 40 of the electro-optical panel module. Therefore, at the time of manufacturing, assembling or repairing, the transparent adhesive may erroneously adhere to the central portions of the transparent substrates 31 and 32 functioning as dust-proof glass of the electro-optical panel, or may adhere to the surface of the prism unit 140 in the projector. It is possible to prevent the image quality from deteriorating due to the adhesion or the like, thereby preventing the occurrence of product defects. Therefore, since problems such as deterioration of handleability and an increase in product defects do not occur, suppression of image quality deterioration due to the presence of dust and scratches and overheating of the liquid crystal obtained by surface bonding of the transparent substrates 31 and 32 is suppressed. The effect can be enjoyed without hindrance.

In the liquid crystal projector using the electro-optical panel module including the electro-optical panel according to the present embodiment as a liquid crystal light valve, it is necessary to prevent the transparent adhesive from flowing to the outer surface of the panel mounting frame 40 of the electro-optical panel module. Therefore, the transparent adhesive erroneously adheres to the central portions of the transparent substrates 31 and 32 functioning as dustproof glass of the electro-optical panel at the time of manufacturing and assembling or repairing, or the prism unit 1112 in the projector.
It is possible to prevent the image quality from deteriorating due to the adhesion to the surface of the product and the occurrence of product defects. Therefore, since problems such as deterioration of handleability and an increase in product defects do not occur, suppression of image quality deterioration due to the presence of dust and scratches and overheating of the liquid crystal obtained by surface bonding of the transparent substrates 31 and 32 is suppressed. The effect can be enjoyed without hindrance.

[Second Embodiment] Next, a second embodiment of the electro-optical panel according to the present invention will be described with reference to FIG. In this embodiment, the internal structure of the electro-optical panel 10 itself is exactly the same as that of the first embodiment, and the structures of an electro-optical panel module and a liquid crystal projector using this electro-optical panel are also completely the same. Only points will be described.

In this embodiment, as shown in FIG. 2, if the element substrate 11 has a smaller area on the outer surface than the element substrate 11 and the element substrate 11 has A transparent substrate 33 whose both lengths are smaller than the element substrate 11 is surface-bonded with the transparent adhesive 30. Similarly, a transparent substrate 34 surface-bonded to the outer surface of the opposite substrate 12
Also, if it has a smaller area than the counter substrate 12 and has a planar rectangular shape, the lengths of both the vertical and horizontal sides are smaller than the counter substrate 12. Therefore, steps are formed on both sides of the bonding portion 30a between the end surface of the element substrate 11 and the end surface of the transparent substrate 31 and the bonding portion 30a between the end surface of the counter substrate 12 and the end surface of the transparent substrate 32. Is done. The step portion holds the transparent adhesive 30 flowing out of the substrate similarly to the first embodiment, and prevents the transparent adhesive from flowing out from the step portion.

[Third Embodiment] Next, a third embodiment of the electro-optical panel according to the present invention will be described with reference to FIG. In this embodiment, the internal structure of the electro-optical panel 10 itself is exactly the same as that of the first embodiment, and the structures of an electro-optical panel module and a liquid crystal projector using this electro-optical panel are also completely the same. Only points will be described.

In this embodiment, the end surfaces of the transparent substrates 35 and 36, which are surface-adhered to the element substrate 11 and the opposing substrate 12 by the transparent adhesive 30, respectively, are attached to the element substrate 1
1 and the side of the counter substrate 12 (or the side of the bonding portion 30a). Therefore, the element substrate 1
1 between the end face of the transparent substrate 35 and the end face of the transparent substrate 35;
In addition, steps are formed on both sides of the bonding portion 30a between the end surface of the counter substrate 12 and the end surface of the transparent substrate 36.
Therefore, also in this embodiment, the transparent adhesive 30 is held at the stepped portion as in each of the above embodiments, and the overflow of the transparent adhesive 30 is prevented.

In this case, the end faces of the transparent substrates 35 and 36 are not formed obliquely, but the end faces of the element substrate 11 and the counter substrate 12 are formed obliquely as shown by dotted lines in the drawing. A step is formed, and the transparent adhesive 30 is held at the step. Further, as shown in the figure, the end faces of the transparent substrates 35 and 36 are formed obliquely, and at the same time, the end faces of the element substrate 11 and the counter substrate 12 are also formed obliquely. 36
By inclining both end faces so that they face each other, a concave portion is formed between both end faces, and the transparent adhesive 30 can be stored and held here.

[Fourth Embodiment] Next, a fourth embodiment of the electro-optical panel according to the present invention will be described with reference to FIG. Also in this embodiment, the internal structure of the electro-optical panel 10 itself is exactly the same as that of the first embodiment, and the structures of an electro-optical panel module and a liquid crystal projector using this electro-optical panel are also exactly the same. Differences will be described.

In this embodiment, the chamfered portions 37a and 37b are formed on the end surface of the transparent substrate 37 which is surface-adhered to the element substrate 11, so that the bonding portion between the chamfered portion 37a and the end surface of the element substrate 11 is formed. Steps are formed on both sides of the transparent adhesive 30a, and the transparent adhesive 30 is stored and held in the step. Further, a chamfered portion 38a is formed on an end surface of the transparent substrate 38 which is surface-bonded to the opposing substrate 12, a step is formed between the chamfered portion 38a and the end surface of the opposing substrate 12, and a transparent adhesive is formed on the stepped portion. 30 are stored and held.

In this embodiment as well, the transparent adhesive 30 can be held and its outflow can be prevented as in the above embodiments. Here, as shown by the dotted line in the figure, instead of the chamfered portions 37a and 38a, or
Along with a and 38a, a chamfer may be formed on the side of the transparent substrates 37 and 38. In these cases, a concave portion including the adhesive portion 30a is formed.
Can be stored and held. In addition, instead of the above-mentioned chamfered portion, an R-surface portion (curved surface portion) obtained by curving a corner portion of a substrate.
Has exactly the same effect.

In the third and fourth embodiments described above, the ends of the element substrate 11 and the counter substrate 12 and the end surfaces of the transparent substrates 35, 36, 37 and 38 coincide with each other in plan view. Therefore, the panel mounting frame 40 of the electro-optical panel 10
There is an advantage that the positioning with respect to, for example, becomes easy.
In particular, as in the fourth embodiment, a structure such as a chamfered portion is formed only on a part of the end face when viewed in the thickness direction of the substrate, and the remaining portion is a surface perpendicular to the substrate plate surface. In such a case, the panel positioning operation and the gripping operation when the panel is moved can be performed more easily and accurately.

[Fifth Embodiment] A fifth embodiment of the electro-optical panel according to the present invention will be described with reference to FIG.
Also in this embodiment, the internal structure of the electro-optical panel 10 itself is exactly the same as that of the first embodiment, and the structures of an electro-optical panel module and a liquid crystal projector using this electro-optical panel are also exactly the same. Only the differences will be described.

In this embodiment, a transparent substrate 28 surface-bonded to the element substrate 11 with the transparent adhesive 30 and a transparent substrate 29 surface-bonded to the opposing substrate 12 with the transparent adhesive 30 are shown in FIG. As in the case described above, they are formed in substantially the same size.
In the plane direction, and the transparent substrate 2
9 are shifted in the plane direction and are bonded to each other, so that steps are formed on both sides of the bonding portion 30a between the end surfaces of the element substrate 11 and the counter substrate 12 and the end surfaces of the transparent substrates 28 and 29, The transparent adhesive 30 is accumulated and held in the step.

In this embodiment, the transparent substrates 28 and 29 are shown shifted from the element substrate 11 and the counter substrate 12 in the horizontal direction in the figure. A step can be formed over the entire circumference between the end surfaces of the transparent substrate 11 and the opposing substrate 12 and the end surfaces of the transparent substrates 28 and 29. According to this embodiment, the transparent substrate 2
8, 29 can be formed to have the same size as the element substrate 11 and the counter substrate 12, and the end face does not need to be processed into a special shape. Can be manufactured.

In the second to fifth embodiments, the size of the element substrate and the transparent substrate and the size of the opposing substrate and the transparent substrate are different, but the electro-optical panel module shown in FIG. What is necessary is just to change the shape of the panel mounting frame 40 according to the size of a board | substrate.

[Sixth Embodiment] Next, a sixth embodiment of the electro-optical panel according to the present invention will be described with reference to FIG. FIG. 11 is a cross-sectional view corresponding to the cross-sectional view of FIG. 8 illustrating the internal structure of the electro-optical panel of the first embodiment. Also in this embodiment, the internal structure of the electro-optical panel 10 itself is substantially the same as that of the first embodiment, and the structures of an electro-optical panel module and a liquid crystal projector using this electro-optical panel are completely the same, and are different. Only points will be described.

In the present embodiment, similar to the first embodiment,
The transparent substrate 31 surface-bonded to the element substrate 11 by the transparent adhesive 30 is larger than the element substrate 11. The transparent substrate 32 that is surface-bonded to the opposing substrate 12 with the transparent adhesive 30 is larger than the opposing substrate 12. That is, the end faces of the transparent substrate 31 and the transparent substrate 32 are all located outside the end faces of the element substrate 11 and the counter substrate 12, respectively. The present embodiment is different from the first embodiment in that a light shielding member 55 is formed substantially all around the outer periphery of the transparent substrate 31 and the transparent substrate 32. That is, a light-blocking member 55 made of, for example, a metal such as chromium or aluminum, or carbon is disposed on the liquid crystal layer side of the transparent substrates 31 and 32. The light shielding member is made of a sealing material 1
4, and is formed on the transparent substrate 32 along the outer periphery of the transparent substrate 32 from the end of the sealing material 14 toward the outside. Counter substrate 1 from transparent substrate 32 side
When the light incident through the second side is emitted to the element substrate 11 side, since the light shielding member 55 is formed outside the seal member 14, the light that is about to enter the seal member 14 obliquely is blocked. It can be blocked at 55. Therefore, for example, when a thin film transistor is formed in the display region of the element substrate 11, it is possible to prevent light scattered by the sealing material 14 from being incident on the thin film transistor or the like, and to prevent deterioration of the thin film transistor characteristic. That is, the transparent substrate 3
2 and the outer periphery of the counter substrate 12 are the same or the transparent substrate 32
When the outer periphery of the opposing substrate 12 protrudes beyond the outer periphery of the transparent substrate 32, even if the light shielding member 55 is provided on the transparent substrate 32, the end of the transparent substrate 32 is on or inside the formation region of the sealing material 14, Light that enters the sealant 14 at an angle cannot be blocked. On the other hand, when the outer periphery of the transparent substrate 32 protrudes beyond the outer periphery of the opposing substrate 12 as in the present embodiment, the light shielding member 5 formed on the transparent substrate 32 is formed.
5 can extend outside the sealing material 14,
Light can be prevented from entering the sealing material 14. Further, the light shielding member 55 is provided so as to overlap the light shielding film 12a formed on the counter substrate 12 in a planar manner.
Light leakage to the display area other than the display area around the substrate can be prevented,
High-contrast display can be performed.

[Seventh Embodiment] Next, a sixth embodiment of the electro-optical panel according to the present invention will be described with reference to FIG. FIG. 12 is a cross-sectional view corresponding to the cross-sectional view of FIG. 8 illustrating the internal structure of the electro-optical panel of the first embodiment. Also in this embodiment, the internal structure of the electro-optical panel 10 itself is substantially the same as that of the first embodiment, and the structures of an electro-optical panel module and a liquid crystal projector using this electro-optical panel are completely the same, and are different. Only points will be described.

In the present embodiment, similar to the sixth embodiment,
The transparent substrate 31 surface-bonded to the element substrate 11 by the transparent adhesive 30 is larger than the transparent substrate 11. The transparent substrate 32 surface-bonded to the opposing substrate 12 with the transparent adhesive 30 is larger than the opposing substrate 12. In the present embodiment, as in the sixth embodiment, the transparent substrate 31 and the transparent substrate 3
The light shielding member 55 is formed almost all around the outer periphery of the peripheral portion of the second embodiment. However, the light shielding member 55 is arranged on the side opposite to the liquid crystal layer side of the transparent substrates 31 and 32 in the sixth embodiment. Different from form. Thus, the transparent substrate 31 and the transparent substrate 3
By providing the light shielding member 55 on the side opposite to the liquid crystal layer side of No. 2, it is effective to further prevent oblique light from entering the sealing material 14 from the third substrate side.

In the sixth and seventh embodiments described above, the light shielding member 55 may be provided on both the transparent substrate 31 and the transparent substrate 32, or the light shielding member 55 may be provided on one of the transparent substrates. In order to prevent return light from the element substrate side, a light shielding member 55 may be provided on the outer periphery of the transparent substrate 32.

In each of the above-described embodiments, the element substrate 11 of the electro-optical panel 10 and the opposing substrate 12
Although the case where the transparent substrate is surface-bonded to both of them has been described, it is needless to say that the transparent substrate may be surface-bonded to only one of the outer surfaces of the element substrate 11 and the counter substrate 12. .

In each of the above embodiments, a step or a recess is formed between the end faces of the two substrates to be surface-attached, and the transparent adhesive is stored and held therein. A step is formed in the middle of the end face (that is, the bonding portion 30
A step may be formed at the end face portion that is in the vicinity of a but slightly away from the bonding portion 30a), and the transparent adhesive may be stored and held in this step portion. Further, in each of the above embodiments, the case where the end face of the substrate is formed to be flat regardless of whether it is perpendicular or oblique to the substrate plate surface has been described. The end face itself may be formed as, for example, a curved surface instead of a flat surface as long as a step or a concave portion for holding the edge is formed.

Although not shown, instead of forming a step on the end surfaces of the first and third substrates, or along with the step, a groove is provided in the peripheral portion of the first substrate and the third substrate on the side facing the adhesive. Thereby, the outflow of the adhesive can be suppressed. With such a configuration, the adhesive accumulated in the groove can increase the adhesive strength and suppress the flow of the adhesive.

Although the above-described element substrate and counter substrate have been described using transparent substrates, the invention is not limited thereto. For example, in a reflection type electro-optical panel, one substrate may use an opaque substrate such as a silicon substrate, but the present invention can be applied to such a configuration.

[0085]

As described above, according to the present invention, since the outer surface is separated from the electro-optical material and defocused by bonding the third substrate to the surface, the third substrate may be damaged or scratched on the outer surface of the first substrate. The display quality can be prevented from lowering, the heat capacity of the electro-optical panel can be increased, and the display quality lowering due to overheating of the electro-optical material can be reduced. Further, a step formed by sandwiching the bonding portion between the end surface of the first substrate and the end surface of the third substrate, a step formed near the bonding portion, or a concave portion including the bonding portion is formed. Accordingly, even if the adhesive overflows from between the substrates, a certain amount of the adhesive accumulates in the step or the recess and is held, thereby preventing the adhesive from flowing out of the step or the recess. Therefore, the transparent adhesive adheres to the outer surface of the electro-optical panel during and after the manufacturing process, making it difficult to handle during operation, and the adhesive adheres to the light transmitting portion of the electro-optical panel, resulting in a product defect. Can be prevented. Furthermore, since the adhesive is cured in a state where the adhesive is accumulated in the steps and the concave portions, the adhesive strength between the first substrate and the third substrate can be increased.

When the third substrate has a larger outer shape than the first substrate, a light-blocking member is provided along the outer periphery of the first substrate to prevent light from entering the sealing material.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating a schematic schematic structure of an electro-optical panel according to a first embodiment of the invention.

FIG. 2 is a schematic configuration diagram illustrating a schematic schematic structure of an electro-optical panel according to a second embodiment of the invention.

FIG. 3 is a schematic configuration diagram illustrating a schematic schematic structure of an electro-optical panel according to a third embodiment of the invention.

FIG. 4 is a schematic configuration diagram illustrating a schematic schematic structure of an electro-optical panel according to a fourth embodiment of the invention.

FIG. 5 is a schematic configuration diagram showing a schematic schematic structure of an electro-optical panel according to a fifth embodiment of the invention.

FIG. 6 is a schematic configuration diagram showing a schematic schematic structure of a normal electro-optical panel (comparative example) to which dustproof glass is surface-bonded.

FIG. 7 is a schematic plan perspective view showing a schematic internal structure of the electro-optical panel of each embodiment.

FIG. 8 is a schematic cross-sectional view illustrating a schematic internal structure of the electro-optical panel of each embodiment.

FIG. 9 is an exploded perspective view showing the structure of the electro-optical panel module of each embodiment.

FIG. 10 is a schematic configuration diagram showing a structure of a liquid crystal projector using the electro-optical panel module of each embodiment.

FIG. 11 is a schematic cross-sectional view illustrating an internal structure of an electro-optical panel according to a sixth embodiment of the invention.

FIG. 12 is a schematic sectional view showing the internal structure of an electro-optical panel according to a seventh embodiment of the invention.

[Explanation of symbols]

REFERENCE SIGNS LIST 10 electro-optical panel 11 element substrate 12 opposing substrate 28, 29, 31, 32, 33, 34, 35, 36 transparent substrate (dustproof glass) 30 transparent adhesive 37 a, 38 a chamfer 40 panel mounting frame 55 light shielding member 60 holding Board

Claims (19)

[Claims] An electro-optical material is sandwiched between a first substrate and a second substrate, and a third substrate is in contact with an outside of at least one of the first and second substrates by an adhesive. And the first member facing through the adhesive.
An electro-optical panel, wherein a step is formed due to a shift between end faces of the substrate and the third substrate. 2. The electro-optical panel according to claim 1, wherein the first substrate and the third substrate are different in planar size so that the step is formed. 3. The third substrate according to claim 2, wherein the third substrate is larger than the first substrate, and an end face of the first substrate is the third substrate.
An electro-optical panel, which is arranged inside an end face of a substrate. 4. An electro-optical material is sandwiched between a first substrate and a second substrate, and a third substrate is surface-bonded to an outer surface of at least one of the first and second substrates with an adhesive. An electro-optical panel, wherein a groove is formed in a peripheral portion of a surface of at least one of the first substrate and the third substrate on which the adhesive is formed. 5. The substrate according to claim 1, wherein at least one end surface of the first substrate and the third substrate has an inclined surface inclined toward the inside of the substrate. Electro-optical panel. 6. The electro-optical panel according to claim 5, wherein the inclined surface is formed on a part of the substrate in a thickness direction toward the adhesive surface. 7. The step according to claim 1, wherein the step is formed by surface bonding the first substrate and the third substrate so as to be shifted in a plane direction. Electro-optical panel. 8. The electro-optical panel according to claim 1, wherein the third substrate and the adhesive have substantially the same optical refractive index as the first substrate. 9. The electro-optical panel according to claim 1, wherein the adhesive has elasticity after curing. 10. The electro-optical panel according to claim 9, wherein the degree of penetration of the adhesive after curing is 60 or more and less than 90. 11. The electro-optical panel according to claim 9, wherein the thickness of the adhesive is 5 μm or more and 30 μm or less. 12. A first substrate and a second substrate are bonded to each other with a sealant, and an electro-optical material is sandwiched between the first substrate and the second substrate. A third substrate is arranged outside at least one of the substrates, the third substrate is larger than the first substrate, and an end face of the first substrate is arranged inside an end face of the third substrate. An electro-optical panel, wherein a light shielding member is arranged on the third substrate along the periphery of the third substrate. 13. The light-shielding member according to claim 12, wherein light incident from the third substrate side is emitted to the second substrate side via the first substrate, and the light-blocking member is viewed from a plane. An electro-optical panel, wherein the electro-optical panel overlaps with a material and extends outside the sealing material. 14. The method according to claim 12, wherein
A light shielding film is arranged on one of the first substrate and the second substrate inside the sealing material, and the light shielding member is arranged to overlap the light shielding film in a plane. Optical panel. 15. The electro-optical panel according to claim 12, wherein the light-blocking member is disposed on a surface of the third substrate on the side of the electro-optical material. 16. The electro-optical panel according to claim 12, wherein the light-shielding member is arranged on a surface of the third substrate opposite to the electro-optical material side. . 17. The electro-optical panel according to claim 12, wherein the first substrate and the third substrate are surface-bonded with an adhesive. 18. An electro-optical panel according to claim 1, comprising: a wiring member conductively connected to the electro-optical panel; and a case housing the electro-optical panel. An electro-optical panel, characterized in that: 19. A projection display device comprising the electro-optical panel according to claim 1. Description: