JP2000223625A - Method of pasting adhesive tape to substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the attachment of a tape for adhesion to a carrier table even if such material as to have a high tacking property at normal temperature such as a thermosetting adhesive is used for the material of the tape for adhesion. SOLUTION: Materials 13a-13d for a tape for adhesion, each constituted of an adhesive layer 10 and a first and a second protective film 11, 12 formed on the surface of the adhesive layer 10 are punched with a punch die into pieces 9a-9d of a tape for adhesion. These tape pieces are pasted onto a strip adhesive tape 20 and then the adhesive tape 20 is transferred to an after process. In the after process, the first protective film 11 is removed from each tape piece 9a-9d to expose the adhesive layer 10. By abutting a substrate frame 2a against the exposed adhesive layers 10, the tape pieces 9a-9d can be attached to the substrate frame 2a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device substrate, and more particularly to a method for attaching an adhesive tape for attaching a support substrate or the like to one surface of a semiconductor device substrate. It is.

[0002]

2. Description of the Related Art In recent years, a semiconductor device called a BGA (Ball Grid Array package) has been spotlighted in order to meet the demand for miniaturization and thinning of the semiconductor device. FIG. 8 shows an example of this type of semiconductor device.

[0003] A semiconductor device 1 shown in FIG. 8 includes a substrate 2, a semiconductor chip 3 mounted at a substantially central portion of one surface of the substrate 2,
A support substrate 4 disposed so as to surround the periphery of a semiconductor chip 3 mounted on the substrate 2, and a tape having a plurality of wiring patterns formed on one surface of an insulating resin attached to the surface of the support substrate 4 A substrate 5, bonding wires 6 for electrically connecting the electrodes of the semiconductor chip 3 to the wiring pattern of the tape substrate, and the semiconductor chip 3 and the tape substrate 5
And the external connection terminal 8 such as a solder ball mounted on one end of the wiring pattern of the tape substrate 5.

When the substrate 2 and the supporting substrate 4 are joined together, as shown in FIG. 7, an adhesive tape 9 is usually used. As shown in FIG. 6, the adhesive tape 9 usually has a first protective film 11 on one surface of an adhesive layer 10 made of a thermosetting resin or a thermoplastic resin.
The other surface is formed in a three-layer structure on which a second protective film 12 is mounted.

Now, a general method of joining the two will be described. As shown in FIG. 4, a band-shaped adhesive film in a state where the protective film on the die contact surface side, in this example, the first protective film 11 is peeled off. While the feed tape material 13 is intermittently fed in the direction of the arrow by a feed mechanism (not shown), first, a vertically movable inner punch 14 that punches an inner diameter of a predetermined shape from the adhesive tape material 13, The inner diameter part is punched by the corresponding inner diameter die 15,
Next, an outer diameter punch 16, which is provided downstream of the inner diameter punch 14 and the die 15 and punches an outer diameter of a predetermined shape into the adhesive tape material 13, and is also movable up and down, and corresponds to the outer diameter punch 16. By punching the outer diameter portion with the outer diameter die 17, an annular adhesive tape 9 is sequentially formed, and the punched adhesive tape 9 is transferred along the traveling direction of the tape material 13 in the figure. The substrate frame 2a is pressed by a punch 13 and is attached by heating if necessary. Thereafter, the protective film 12 of the die 2 of the adhesive tape 9 is peeled off to expose the adhesive layer 10, and a supporting substrate (not shown) is brought into contact with the adhesive layer 10 and heated to join the two.

[0006]

However, in the conventional bonding method, the band-shaped bonding tape material 13 is punched in a ring shape to form the bonding tape 9, so that as shown in FIG. There is a problem that many parts are discarded from necessary parts and waste of material is large, so that the yield is very poor and the cost is high. As a means for solving this problem, a band-shaped adhesive tape material formed in a required width in advance is fed into the cutting die from, for example, four directions until the tip thereof corresponds to the tape attaching position of the substrate, and is fed. The leading end of the adhesive tape material is cut by a punch in the width direction and cut by a predetermined length, and the cut adhesive tape piece is placed at the tape attaching position below the cutting die as it is by the cutting punch. A bonding method is used in which the bonding is performed by pressure bonding to a predetermined portion of a substrate that has been made (similarly, Japanese Patent Publication No. 1-17263). According to this method, there is no portion of the adhesive tape material to be discarded, so that the material can be used without waste and cost can be reduced.

As described above, since a protective film is usually mounted on the surface of the adhesive tape material to protect the adhesive layer, when the adhesive tape material is fed, the adhesive tape piece is After the punching, the protective film on the side opposite to the punch contact surface of the adhesive tape material, that is, the contact surface side with the feed plate, etc., is peeled off to adhere the adhesive tape piece to the substrate as it is, and the adhesive layer is removed. It is performed in an exposed state.

However, when the material is fed while the adhesive layer of the adhesive tape material is exposed as described above, a material having a high tack property at normal temperature, such as a thermosetting resin tape, is used as the adhesive tape material. When used, there is a problem that the adhesive tape material sticks to a feed stand or the like, and it is very difficult to feed the material.

[0009]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a method in which an adhesive tape piece cut by a predetermined length by a punching die is attached to an adhesive tape for conveyance. And affixing the adhesive tape to the substrate in the subsequent steps. As a result, the adhesive tape material can be fed and punched without peeling off the protective film mounted on the surface of the adhesive tape material. Of the adhesive layer of the adhesive tape on the feed table can be prevented.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a method for punching an adhesive tape piece into a desired shape from an adhesive tape material having protective films attached to both surfaces of an adhesive layer and sticking the piece to one surface of a substrate. Then, the punched adhesive tape piece is attached to a belt-shaped adhesive tape for conveyance and sent to the subsequent step, and in the subsequent step the protective film of the adhesive tape piece is peeled off to expose the adhesive layer, By bringing the substrate into contact with the exposed adhesive layer, the adhesive tape piece is attached to the substrate in a step different from the step of punching the adhesive tape.

Preferably, the adhesive tape piece cut by the punching die is attached to an adhesive tape for transport and transported to a subsequent step. An adhesive tape for peeling off the protective film is brought into contact with the protective film attached to the surface opposite to the adhesive tape contact surface, and the protective film is peeled off by the adhesive force of the adhesive tape, and the exposed adhesive is adhered. The adhesive tape may be attached to the substrate by bringing the substrate into contact with the adhesive layer of the adhesive tape. When a plurality of adhesive tape pieces are present, each of the plurality of adhesive tape pieces may be individually peeled off with an adhesive tape, but all of the plurality of adhesive tape pieces are covered. It is desirable that the pressure-sensitive adhesive tape formed into the size is simultaneously brought into contact with the protective film of each adhesive tape piece, and the protective film of each adhesive tape piece is desirably peeled off at once. According to such a method, since the protective films of the plurality of adhesive tape pieces can be collectively peeled off without requiring a complicated mechanism, workability is improved.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for attaching an adhesive tape to a substrate according to the present invention will be described in detail with reference to the drawings. FIG.
FIG. 1 is a view showing a flow of an adhesive tape attaching method of the present invention. FIG. 1A is a plan view and FIG. 1B is a cross-sectional view. First, in step 1, as shown in FIG. 1A, strip-shaped adhesive tape materials 13a, 13b, 13c, 13d made of a thermosetting resin formed in a required width.
In this example, is fed into the cutting mold from four directions such that the tip thereof corresponds to the bonding tape attaching position of the substrate.
Here, the portions indicated by broken lines at the tips of the adhesive tape materials 13a to 13d in the drawing indicate regions that are punched out by a cutting die and become adhesive tape pieces 9a to 9d. In this embodiment, as shown in FIG. 1B, the adhesive tape materials 13a to 13d have the first protective film 11 and the second protective film 12 attached to both surfaces of the adhesive layer 10, respectively. It has a three-layer structure.

As shown in FIG. 2, the tips of the supplied adhesive tape materials 13a to 13d are made to protrude from the die 18 by a predetermined length. In this state, the punch 19 corresponding to the die 18 is lowered, and Adhesive tape material 13a-1
The tip of 3d is cut by a predetermined length across the width direction of each adhesive tape material to form adhesive tape pieces 9a to 9d. Then, each of the cut adhesive tape pieces 9a to 9d
Is adhered by a punch 19 to a band-shaped first adhesive tape 20 arranged directly below the die 18. In the present embodiment, the first adhesive tape 20 has a structure in which an adhesive layer is formed only on one surface, and the second protective film 12 side of each of the adhesive tape pieces 9a to 9d is provided on the adhesive layer forming surface side. Affixed.

The first adhesive tape 20 to which the adhesive tape pieces 9a to 9d are attached is conveyed to the next step (step 2) by a feed mechanism (not shown). In this step 2,
As shown in FIG. 1A, a second adhesive tape 21 formed to have a width enough to cover all of the adhesive tape pieces 9a to 9d attached to the adhesive tape 20 is used as the first adhesive tape 21 in this example. Each of the adhesive tape pieces 9a to 9a attached to the first adhesive tape 20 in a direction perpendicular to the traveling direction of the adhesive tape 20 of FIG.
d. Then, as shown in FIG. 1 (b), the second adhesive tape 21 is brought into contact with the first protective film 11 of each of the adhesive tape pieces 9a to 9d, and the adhesive force of the second adhesive tape 21 causes The first protective films 11 of the adhesive tape pieces 9a to 9d are peeled off in a lump to expose the adhesive layer 10 of each of the adhesive tape pieces 9a to 9d. In the present embodiment, the second adhesive tape 21 also has a structure in which an adhesive layer is formed only on one surface, similarly to the first adhesive tape 20, and the adhesive layer forming surface side is attached to each adhesive tape piece 9
The first protective films 11 a to 9 d are in contact with each other.

As described above, in order to peel off the first protective film 11 by the adhesive force of the second adhesive tape 21, each of the adhesive portions of the adhesive tape piece 9a, the first adhesive tape 20, and the second adhesive tape The relationship between the bonding strength of the bonding portion of the tape 21 and the bonding strength of the bonding portion of the second adhesive tape 21 and the first protective film 11 of the bonding tape piece 9a is shown in FIG. A and the first protective film 1
In the relationship between No. 1 and the bonding portion B between the adhesive layer 10 and the bonding strength, A> B, and the bonding portion A, the bonding portion C between the bonding layer 10 and the second protective film 12 and the second bonding portion. In the relationship between the protective film 12 and the bonding site D of the first adhesive tape 20, the bonding strength needs to be set to A <C and D.

Each of the adhesive tape pieces 9a to 9d with the adhesive layer 10 exposed is further conveyed to the next step (step 3) by the first adhesive tape 20. In step 3, as shown in FIG. 1A, the substrate frame 2a formed by connecting a plurality of strips or strips is perpendicular to the traveling direction of the first adhesive tape 20 in this example. To the respective adhesive tape pieces 9a to 9d adhered to the adhesive tape 20 of FIG. Then, as shown in FIG. 1B, each of the adhesive tape pieces 9a to 9d with the adhesive layer 10 exposed.
The substrate frame 2a is brought into contact with the adhesive layer 10 and pressed, and if necessary, the adhesive tape pieces 9a to 9d are adhered to the substrate frame 2a by slightly heating.

Then, as shown in FIG. 1B, the adhesive tape pieces 9a to 9d are peeled off from the first adhesive tape 20 together with the second protective film 12, and the subsequent feeding follows the feeding of the substrate frame 2a. At this time, the second protective film 12 may be sent to the subsequent steps with the first adhesive tape 20 left as it is, that is, with the adhesive layer 10 exposed. Here, the substrate frames 2a connected in a plurality of strips or strips may be individually separated, and the transfer to the subsequent steps may be performed by the first adhesive tape 20.

In these cases, the adhesive tape pieces 9
FIG. 3 (b) shows the relationship between each of the bonding portions a and the bonding strength of each of the bonding portions of the substrate frame 2a and the first adhesive tape 20.
According to the reference numerals of the respective parts shown in FIG. 1, the adhesive tape pieces 9a to 9d are first attached to the substrate frame 2a, and then the adhesive tape pieces 9
When peeling off the first protective tape 20a from the first adhesive tape 20 together with the second protective film, the adhesive portion E between the substrate frame 2a and the adhesive layer 10 of the adhesive tape piece 9a, the adhesive layer 10 and the second Bonding portion C with second protective film 12 and second
In the relationship between the protective film 12 and the bonding portion D between the first pressure-sensitive adhesive tape 20, the bonding strength is E> C and D, and C
> D must be set. When the second protective film 12 is left on the first pressure-sensitive adhesive tape 20, that is, when it is sent to a subsequent step with the adhesive layer 10 exposed, E> C and D and C <D It is necessary to set.

Then, in the subsequent steps, the adhesive tape pieces 9
If the second protective films 12a to 9d are mounted, the second protective films 12 are peeled off to expose the adhesive layer 10, the support substrate is aligned with the exposed adhesive layer 10, and abutted, and heated. This cures the adhesive layer 10 and joins the two.

[0020]

The present invention is embodied in the form described above and has the following effects.

The adhesive tape piece cut by a predetermined length by a punching die is attached to an adhesive tape for conveyance and sent to a subsequent step, and the attachment of the adhesive tape piece to the substrate is a punching step. Since it is performed in a separate process, it is possible to feed and transport the adhesive tape without peeling off the protective film of the adhesive tape, so that the adhesive layer of the adhesive tape directly contacts the feeder etc. Therefore, even when an adhesive tape material having a high tack property at room temperature is used, it is possible to prevent the adhesive tape from sticking to a feed stand or the like, thereby improving workability.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a diagram showing a method of forming an adhesive tape by a punching die.

FIG. 3 is a diagram showing the relationship between the bonding strength of each bonding site.

FIG. 4 is a view showing a method for forming an adhesive tape by a conventional punching die.

FIG. 5 is a view showing a problem of a conventional adhesive tape forming method.

FIG. 6 is a view showing the structure of an adhesive tape.

FIG. 7 is a view showing a method of bonding a substrate and a support substrate.

FIG. 8 is a diagram showing a BGA type semiconductor device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Substrate 2a Substrate frame 3 Semiconductor chip 4 Support substrate 5 Tape substrate 6 Bonding wire 7 Mold resin 8 External connection terminal 9 Adhesive tape 9a, 9b, 9c, 9d Adhesive tape piece 10 Adhesive layer 11 First Protective film 12 Second protective film 13, 13a, 13b, 13c, 13d Adhesive tape material 14 Inner diameter punch 15 Inner diameter die 16 Outer diameter punch 17 Outer diameter die 18 Die 19 Punch 20 First adhesive tape 21 Second adhesive tape

Claims (2)

[Claims] 1. A method for punching an adhesive tape piece into a desired shape from an adhesive tape material having a protective film attached to a surface of an adhesive layer and attaching the piece to a substrate,
The punched adhesive tape piece is adhered to a belt-shaped adhesive tape and transported, and the protective film attached to the surface of the adhesive tape piece opposite to the surface in contact with the adhesive tape is peeled off to form an adhesive layer. And bonding the adhesive tape piece to the substrate by exposing the substrate and bringing the substrate into contact with the exposed adhesive layer. 2. The method according to claim 1, wherein the adhesive tape is brought into contact with a protective film attached to one surface of the adhesive tape piece, and the adhesive film is peeled off by the adhesive force of the adhesive tape to expose the adhesive layer. Item 4. The method for attaching an adhesive tape to a substrate according to Item 1.