JP2000215977A - High frequency heating device - Google Patents

High frequency heating device

Info

Publication number
JP2000215977A
JP2000215977A JP11015603A JP1560399A JP2000215977A JP 2000215977 A JP2000215977 A JP 2000215977A JP 11015603 A JP11015603 A JP 11015603A JP 1560399 A JP1560399 A JP 1560399A JP 2000215977 A JP2000215977 A JP 2000215977A
Authority
JP
Japan
Prior art keywords
temperature
heated
heating
frequency
temperature probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11015603A
Other languages
Japanese (ja)
Inventor
Masaaki Yoneda
正昭 米田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11015603A priority Critical patent/JP2000215977A/en
Publication of JP2000215977A publication Critical patent/JP2000215977A/en
Pending legal-status Critical Current

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  • Control Of High-Frequency Heating Circuits (AREA)
  • Electric Ovens (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

PROBLEM TO BE SOLVED: To effectively and ideally heat an object to be heated to its inside by high frequency heating, while preventing overheating of the surface part of the object. SOLUTION: This high frequency heating device has a temperature probe 24 for measuring a temperature of an object 5 to be heated. Plural temperature measurement elements are disposed in the temperature probe 24, while an output from each the temperature measurement element is connected to a control part 11A of a magnetron 2 of a heating means. The temperatures from the core of the heated body 5 to its surface part are measured by inserting a temperature measurement part of the temperature probe 24 into the heated body 5, so that the magnetron 2 of the heating means is controlled according to the measured result to control the temperatures of the inside and the surface part of the heated body 5.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は高周波により食材を
加熱する加熱装置で、温度プローブにより加熱を制御す
るものに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating device for heating foodstuffs with high frequency, wherein the heating is controlled by a temperature probe.

【0002】[0002]

【従来の技術】図7は従来の高周波加熱装置の要部断面
図である。加熱室1の外側にマグネトロン2と導波管3
を設け、給電開口部4から加熱室1内へ高周波が給電さ
れる。加熱室1には被加熱物載置台6の上に被加熱物5
が置かれ、被加熱物5には温度プローブ7が差し込まれ
ている。温度プローブ7はプローブ用リード線9と差込
端子8を介して加熱室1の外のリセプタクル10に接続
され、そこから制御用電子回路11へリード線12で配
線される構成である。
2. Description of the Related Art FIG. 7 is a sectional view of a main part of a conventional high-frequency heating device. Magnetron 2 and waveguide 3 outside heating chamber 1
And a high frequency is supplied from the power supply opening 4 into the heating chamber 1. In the heating chamber 1, a heating object 5 is placed on a heating object mounting table 6.
Is placed, and a temperature probe 7 is inserted into the object 5 to be heated. The temperature probe 7 is connected to a receptacle 10 outside the heating chamber 1 via a probe lead wire 9 and an insertion terminal 8, and is connected to a control electronic circuit 11 by a lead wire 12 therefrom.

【0003】図8(a)は従来の高周波加熱装置の温度
プローブ7の外観全体図と図8(b)は2点鎖線で囲ま
れた要部の断面部分拡大図である。2点鎖線で囲まれた
部分が温度プローブ7の先端部で、この部分に測温素子
14が組み込まれている。この測温素子14は、金属パ
イプ13で覆われ、測温素子14は素子リード線15、
素子リード線16で差込端子8の電極17、電極18に
接続されている。測温素子14を含めそれの配線は、加
熱室1の高周波の影響を受けないよう遮蔽した構成であ
る。
FIG. 8A is an overall external view of a temperature probe 7 of a conventional high-frequency heating device, and FIG. 8B is an enlarged cross-sectional view of a main part surrounded by a two-dot chain line. The portion surrounded by the two-dot chain line is the tip of the temperature probe 7, and the temperature measuring element 14 is incorporated in this portion. The temperature measuring element 14 is covered with a metal pipe 13, and the temperature measuring element 14 has an element lead 15,
The element lead 16 is connected to the electrodes 17 and 18 of the insertion terminal 8. The wiring including the temperature measuring element 14 is shielded so as not to be affected by the high frequency of the heating chamber 1.

【0004】図9は他の従来の高周波加熱装置の要部断
面図である。加熱室1への高周波の給電、被加熱物、被
加熱物載置台は図7での説明と同じで、被加熱物の仕上
がりを赤外線センサー19を用い被加熱物5の表面部温
度に応じその出力値を制御用電子回路11に入力する構
成である。
FIG. 9 is a sectional view of a main part of another conventional high-frequency heating device. The high-frequency power supply to the heating chamber 1, the object to be heated, and the mounting table for the object to be heated are the same as those described with reference to FIG. 7, and the finish of the object to be heated is determined according to the surface temperature of the object 5 using the infrared sensor 19. The output value is input to the control electronic circuit 11.

【0005】図10は他の従来の高周波加熱装置の要部
断面図である。加熱室1への高周波の給電、被加熱物、
被加熱物載置台は図7での説明と同じで、被加熱物の仕
上がりを湿度センサー20を用い被加熱物5から加熱の
仕上がり近辺で多量に出る蒸発水蒸気を検知しその信号
を制御用電子回路11に入力する構成である。
FIG. 10 is a sectional view of a main part of another conventional high-frequency heating device. High-frequency power supply to the heating chamber 1;
The heated object mounting table is the same as that described with reference to FIG. 7, and the finish of the heated object is detected by using the humidity sensor 20 to detect a large amount of evaporated water vapor from the heated object 5 near the finish of the heating, and the signal is sent to the control electronics. This is a configuration for inputting to the circuit 11.

【0006】図11は従来の高周波加熱装置の回路図で
ある。高圧トランス23の二次回路に半波整流回路を形
成しマグネトロン2に高圧半波整流を加えて高周波を発
振させるもので、高圧トランス23の一次側回路には断
続リレー22を直列に接続させている。断続リレー22
は温度プローブ、あるいは赤外線センサー、あるいは湿
度センサーからの入力信号に従い制御用電子回路11で
制御され、被加熱物の過熱状態に応じON/OFFす
る。
FIG. 11 is a circuit diagram of a conventional high-frequency heating device. A half-wave rectification circuit is formed in the secondary circuit of the high-voltage transformer 23, and high-frequency half-wave rectification is applied to the magnetron 2 to oscillate high frequency. An intermittent relay 22 is connected in series to the primary circuit of the high-voltage transformer 23. I have. Intermittent relay 22
Is controlled by the control electronic circuit 11 in accordance with an input signal from a temperature probe, an infrared sensor, or a humidity sensor, and is turned on / off according to an overheated state of the object to be heated.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、従来の
高周波加熱装置では、被加熱物を高周波で加熱する事に
よる欠点つまり被加熱物表面部が必要以上に温度が上が
り脱水ぎみに仕上がる事である。特に大きな固まりの被
加熱物を高周波で加熱する場合温度プローブを被加熱物
に差し込み被加熱物のほぼ中心部の温度を監視しながら
表面部の温度が過度に温度上昇し過ぎないように高周波
の出力を制御していた。この方法は、高周波の制御内容
が被加熱物重量、被加熱物の材質に応じ変化するので、
予め実験をしおおよその制御内容を制御用電子回路にプ
ログラムする方法をとっていた。つまり、決められた範
囲でしか対応がとれないものでその点被加熱物の加熱に
失敗もあり使い勝手の悪いものであった。
However, the conventional high-frequency heating apparatus has a drawback in that the object to be heated is heated at a high frequency, that is, the surface of the object to be heated is unnecessarily heated to be dehydrated. In particular, when heating an object to be heated in a large lump with a high frequency, insert a temperature probe into the object to be heated and monitor the temperature at almost the center of the object to be heated, so that the surface temperature does not rise excessively. Output was controlled. In this method, the control content of the high frequency changes according to the weight of the object to be heated and the material of the object to be heated.
An experiment was performed in advance, and a method of programming the approximate control contents into the control electronic circuit was employed. In other words, it is only possible to take measures within a predetermined range, and there is a failure in heating the object to be heated at that point, which is inconvenient.

【0008】被加熱物の加熱検知方法が、湿度センサー
を用いるものでも被加熱物表面部の温度と中心部の温度
にはっきりした関連がないため、被加熱物表面部が内部
より温度が早く上がり、それによる水蒸気で被加熱物内
部が十分温度が上がらないまま加熱終了となる。
Even if the method of detecting the heating of the object to be heated uses a humidity sensor, there is no clear relation between the temperature of the surface of the object to be heated and the temperature of the central part. The heating is completed before the temperature of the inside of the object to be heated is not sufficiently increased by the steam generated by the heating.

【0009】また、被加熱物の加熱検知法が赤外線セン
サーによる方法でも同様で、被加熱物の温度が表面部の
みで内部の温度が検知できないため、予め決められた被
加熱物の材質、重量の区分でプログラムによる予測加熱
を行っていた。いずれも被加熱物内部と表面部温度が同
時に把握できないための問題である。 温度プローブと
赤外線センサー或いは湿度センサーを併用する方法もあ
るが、制御用電子回路が併用する分複雑となり高価なも
のになるし、赤外線センサーや、湿度センサーは被加熱
物の温度を間接的に測定する方法なので各センサーの信
号以外の外来ノイズの分離も課題として常につきまとっ
ていた。
The same applies to the method of detecting the heating of an object to be heated by an infrared sensor. Since the temperature of the object to be heated is only the surface portion and the internal temperature cannot be detected, the material and weight of the object to be heated are determined in advance. Predicted heating by the program was performed in the category of. In any case, there is a problem that the temperature inside the object to be heated and the surface temperature cannot be simultaneously grasped. There is also a method of using a temperature probe and an infrared sensor or a humidity sensor together, but the use of a control electronic circuit is complicated and expensive, and the infrared sensor and humidity sensor indirectly measure the temperature of the object to be heated. Because of this, the separation of extraneous noise other than the signals from each sensor has always been an issue.

【0010】まず図7と図8と図11に示す従来例で
は、被加熱物5の中心部に温度プローブ7の先端部を挿
入し、その測定結果を制御用電子回路11に取り込み、
マグネトロン2による高周波出力を制御するもので,温
度プローブ7の測温素子14の位置が、それの先端部に
あるので、被加熱物5の中心部の温度で被加熱物5の加
熱が制御されている。温度プローブ7による被加熱物5
の中心部の温度制御以外は測定されていないため予測制
御になり被加熱物5の表面部が過加熱になる事による失
敗が生じ得る問題があった。更に温度プローブの挿入位
置が図に示す以外の例えば表面部としても今度は内部の
温度が分からないので生じる問題は同じである。
First, in the conventional example shown in FIGS. 7, 8 and 11, the tip of the temperature probe 7 is inserted into the center of the object 5 to be heated, and the measurement result is taken into the control electronic circuit 11.
The high-frequency output of the magnetron 2 is controlled. Since the position of the temperature measuring element 14 of the temperature probe 7 is located at the front end thereof, the heating of the object 5 is controlled by the temperature of the center of the object 5. ing. Heated object 5 by temperature probe 7
Since there is no measurement other than the temperature control at the central portion of the above, the prediction control is performed, and there is a problem that a failure may occur due to overheating of the surface of the object 5 to be heated. Furthermore, even if the insertion position of the temperature probe is other than that shown in the figure, for example, on the surface, the same problem arises because the internal temperature is not known this time.

【0011】また図9に示す従来例では、図7と図8と
図11で示した従来例の内、被加熱物5の仕上がり状態
を温度プローブ7の代わりに赤外線センサー19で感知
するものである。赤外線センサー19は被加熱物5から
出る赤外線を感知するものであるが、被加熱物5の表面
部の温度情報のみであるので、被加熱物内部は感知でき
ないため予め実験した値に基づく予測加熱になり被加熱
物内部の加熱不足による失敗が生じ得る。更に赤外線は
被加熱物以外にも加熱室1の内壁や、被加熱物載置台6
の温度上昇によっても発生し、被加熱物の表面温度が正
確に捉えられない原因にもなり前述の加熱の失敗を助長
するものであった。
In the conventional example shown in FIG. 9, the finished state of the object 5 to be heated is detected by the infrared sensor 19 instead of the temperature probe 7 in the conventional examples shown in FIGS. 7, 8 and 11. is there. The infrared sensor 19 detects infrared rays emitted from the object 5 to be heated. However, since the infrared sensor 19 only detects temperature information on the surface of the object 5 to be heated, it cannot detect the inside of the object to be heated. And failure may occur due to insufficient heating inside the object to be heated. Further, the infrared rays are emitted from the inner wall of the heating chamber 1 and the heating object mounting table 6 in addition to the object to be heated.
This also occurs due to an increase in the temperature, causing the surface temperature of the object to be heated to be inaccurately captured, and promoting the above-mentioned failure in heating.

【0012】また図10に示す従来例では、図7と図8
と図11で示した従来例の内、被加熱物5の仕上がり状
態を温度プローブ7の代わりに湿度センサー20で感知
するものである。湿度センサー20は被加熱物5の水分
が沸騰点に達し蒸発すること事により、その時点で多量
に出始める水蒸気を検知する。但し被加熱物5の表面部
から水蒸気が出る時点の被加熱物内部の温度は被加熱物
の材質、被加熱物重量により変化するので加熱終了は予
め実験した値に基づく予測加熱をせざるを得ず、やはり
加熱の失敗が生じ得る問題があった。
In the conventional example shown in FIG. 10, FIGS.
In the conventional example shown in FIG. 11 and FIG. 11, the finished state of the object to be heated 5 is detected by a humidity sensor 20 instead of the temperature probe 7. The humidity sensor 20 detects water vapor that starts to be emitted in a large amount at that time when the water in the object 5 reaches the boiling point and evaporates. However, since the temperature inside the object to be heated at the time when water vapor is emitted from the surface portion of the object to be heated 5 varies depending on the material of the object to be heated and the weight of the object to be heated, the end of the heating has to be predicted based on a previously experimental value. However, there is still a problem that heating may fail.

【0013】そこで本発明は、高周波加熱による被加熱
物の加熱で被加熱物表面部の過加熱を防止しながら被加
熱物内部まで効率よく、より理想的な加熱が出来ること
を第1の課題としている。
Accordingly, a first object of the present invention is to efficiently and more ideally heat the inside of the object to be heated while preventing overheating of the surface of the object to be heated by heating the object by high-frequency heating. And

【0014】また第2の課題は、被加熱物の仕上がり状
態を良くするのに高周波にヒータ、ガスあるいは水蒸気
を付加した場合、それらの加熱手段を効果的に組み合わ
せ、被加熱物の仕上がりを良くする高周波加熱装置を提
供することにある。
A second problem is that when a heater, gas or water vapor is added to a high frequency wave to improve the finished state of the object to be heated, those heating means are effectively combined to improve the finish of the object to be heated. To provide a high-frequency heating device.

【0015】また第3の課題は、第1の課題をより精度
良く行えるよう温度プローブの長手方向の測温精度を向
上させた高周波加熱装置を提供することにある。
A third object is to provide a high-frequency heating apparatus in which the accuracy of the temperature measurement in the longitudinal direction of the temperature probe is improved so that the first object can be performed with higher accuracy.

【0016】また第4の課題は、第1の課題をより精度
良く行えるよう温度プローブの各測温部の温度測定精度
を向上させた高周波加熱装置を提供することにある。
A fourth object is to provide a high-frequency heating apparatus in which the temperature measurement accuracy of each temperature measuring section of the temperature probe is improved so that the first object can be performed with higher accuracy.

【0017】また第5の課題は、加熱途中で被加熱物の
温度を確認しながら状況に応じ加熱手段の選択とその出
力が調整できるため被加熱物の加熱の失敗が防げ、思い
通りの加熱が出来る高周波加熱装置を提供することにあ
る。
A fifth problem is that, while checking the temperature of the object to be heated during heating, the selection of the heating means and the output thereof can be adjusted according to the situation, so that failure of heating of the object to be heated can be prevented, and the desired heating can be achieved. An object of the present invention is to provide a high-frequency heating device that can be used.

【0018】[0018]

【課題を解決するための手段】本発明は上記の諸課題を
解決するために、被加熱物の温度を測る温度プローブ
は、棒状の測温部を有し、前記棒状の測温部は複数の測
温素子が配置され、前記複数の測温素子からの出力を高
周波照射の制御部に接続した構成にしている。その為、
測温部を被加熱物に差し込むことにより被加熱物の中心
部から表面部にわたる温度が測定できるので、その測定
結果に基づき高周波出力を調整して、被加熱物内部と表
面部の温度を制御できる。つまり、加熱開始時は強い高
周波出力で加熱を開始し、表面部温度が適度の温度にな
ったら高周波出力を弱くして、表面部の温度上昇が過度
にならないようにする。次に中心部の温度が適当な温度
になったら加熱終了。この加熱シーケンスが被加熱物の
温度を実測しながら行うので、被加熱物を思い通りに加
熱できる。従って、被加熱物表面部の過加熱、内部の加
熱不足をなくした、高周波によるスピード加熱が可能と
なる。
According to the present invention, in order to solve the above-mentioned problems, a temperature probe for measuring the temperature of an object to be heated has a rod-shaped temperature measuring section, and the rod-shaped temperature measuring section includes a plurality of rod-shaped temperature measuring sections. Are arranged, and outputs from the plurality of temperature measuring elements are connected to a control unit for high-frequency irradiation. For that reason,
By inserting the temperature measuring part into the object to be heated, the temperature from the center to the surface of the object can be measured, and the high-frequency output is adjusted based on the measurement result to control the temperature of the inside and the surface of the object. it can. That is, at the start of heating, heating is started with a strong high-frequency output, and when the surface temperature reaches an appropriate temperature, the high-frequency output is weakened so that the temperature of the surface does not rise excessively. Next, when the temperature of the central portion reaches an appropriate temperature, the heating is completed. Since this heating sequence is performed while actually measuring the temperature of the object to be heated, the object to be heated can be heated as desired. Therefore, it is possible to perform high-speed heating with high frequency without overheating the surface of the object to be heated and insufficient heating inside.

【0019】[0019]

【発明の実施の形態】本発明の高周波加熱装置は、被加
熱物を加熱する加熱室と、高周波発生源のマグネトロン
と、マグネトロンの制御部と、被加熱物の温度を計る温
度プローブを備え、前記温度プローブは、棒状の測温部
を有し、前記棒状の測温部は複数の測温素子を配置し
て、前記複数の測温素子からの出力を前記マグネトロン
の制御部に接続した構成で温度プローブの測温部を被加
熱物に差し込むことにより被加熱物の中心部から表面部
にわたる温度を測定して、その測定結果に基づき加熱手
段を調整し、被加熱物の内部と表面部の温度を制御する
ようにしたものである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A high-frequency heating apparatus according to the present invention includes a heating chamber for heating an object to be heated, a magnetron of a high-frequency generation source, a control unit for the magnetron, and a temperature probe for measuring the temperature of the object to be heated. The temperature probe has a rod-shaped temperature measuring section, and the rod-shaped temperature measuring section has a plurality of temperature measuring elements arranged therein, and outputs from the plurality of temperature measuring elements are connected to a control section of the magnetron. By inserting the temperature measuring part of the temperature probe into the object to be heated, the temperature from the center to the surface of the object to be heated is measured, and the heating means is adjusted based on the measurement result. Is controlled.

【0020】そして、高周波加熱による被加熱物の加熱
で被加熱物表面部の過加熱を防止しながら被加熱物内部
まで効率よく、より理想的な加熱が出来る。
Further, the heating of the object by high-frequency heating prevents overheating of the surface of the object to be heated while efficiently and more ideally heating the inside of the object to be heated.

【0021】また、被加熱物を加熱する電気ヒータ、ガ
スあるいは、水蒸気を高周波に付加し、それらの加熱を
制御する制御部を有する構成としたものである。
Further, an electric heater for heating the object to be heated and a control section for adding gas or water vapor to the high frequency and controlling the heating thereof are provided.

【0022】そして、被加熱物の仕上がりを良くする事
が出来る。
Further, the finish of the object to be heated can be improved.

【0023】また、温度プローブの複数の測温素子は、
連接して並べた構成としたものである。
Further, the plurality of temperature measuring elements of the temperature probe are:
It is configured to be connected and arranged.

【0024】そして、温度プローブによる被加熱物の表
面部から中心部の温度測定がより精度良く行う事が出
来、より精度の良い加熱が出来る。
Further, the temperature from the surface to the center of the object to be heated can be measured more accurately by the temperature probe, and more accurate heating can be performed.

【0025】また、温度プローブの測温部を光ファイバ
ーとし、前記光ファイバーの温度測定ポイントの先端部
を複数、棒状の測温部に配列し、前記光ファイバーから
の赤外線の出力を電気信号に変換し、高周波、ヒータ、
ガス、水蒸気等による加熱を制御する制御部に接続した
構成としたものである。
The temperature measuring section of the temperature probe is an optical fiber, a plurality of tip portions of the temperature measuring points of the optical fiber are arranged in a rod-shaped temperature measuring section, and the output of the infrared ray from the optical fiber is converted into an electric signal. High frequency, heater,
It is configured to be connected to a control unit that controls heating by gas, water vapor, or the like.

【0026】そして、温度プローブの各測温部の温度測
定精度を向上でき、より理想的な加熱が精度良く出来
る。
Further, the accuracy of temperature measurement of each temperature measuring section of the temperature probe can be improved, and more ideal heating can be performed with high accuracy.

【0027】また、高周波加熱装置の制御パネルと、前
記制御パネルに温度プローブによる測定結果を表示する
表示手段と、加熱手段の出力を加減する調節手段を備え
たものである。
[0027] The apparatus further comprises a control panel of the high-frequency heating device, display means for displaying a measurement result by the temperature probe on the control panel, and adjusting means for adjusting the output of the heating means.

【0028】そして、加熱途中で被加熱物の温度を確認
しながら状況に応じ加熱手段の選択とその出力が調整で
きるため被加熱物の加熱の失敗が防げ、思い通りの加熱
が出来る。
Further, while checking the temperature of the object to be heated during heating, the selection of the heating means and the output thereof can be adjusted according to the situation, so that failure of heating the object to be heated can be prevented, and the desired heating can be performed.

【0029】[0029]

【実施例】以下本発明の実施例について図面を用いて説
明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0030】(実施例1)図1は本発明の実施例1の高
周波加熱装置の要部断面図である。図2(a)は図1に
使用の温度プローブ外観図、(b)はそれの要部拡大断
面図。図5は図1の回路図、図6(a)は図1の温度プ
ローブによる高周波加熱時の被加熱物の温度測定値の説
明図、(b)は同高周波と、その他の手段による加熱時
の説明図を示す。
(Embodiment 1) FIG. 1 is a sectional view of a main part of a high-frequency heating apparatus according to Embodiment 1 of the present invention. 2A is an external view of a temperature probe used in FIG. 1, and FIG. 2B is an enlarged sectional view of a main part thereof. FIG. 5 is a circuit diagram of FIG. 1, FIG. 6 (a) is an explanatory diagram of a temperature measurement value of an object to be heated at the time of high-frequency heating by the temperature probe of FIG. 1, and FIG. FIG.

【0031】図1において、マグネトロン2で発生した
高周波を導波管3と給電開口部4を介して加熱室1内に
導き、被加熱物載置台6に置かれた被加熱物5が加熱さ
れる。被加熱物5には、温度プローブ24の先端部が被
加熱物5の表面部近くで止まるよう、かつ被加熱物5の
中心部を通過するように差し込まれている。温度プロー
ブ24は図2(a)に示すように被加熱物5に差し込む
金属パイプ13の中に図2(b)の示す如く測温素子1
4が多数配列されている。測温素子14は例えば負性抵
抗など温度により電気特性が変化するものを用いる。各
測温素子14はそれぞれに共通の配線の素子共通リード
線29と各測温素子14への各素子リード線30とで接
続され、差込端子部26の素子共通電極27と各素子電
極28に配線されている。これら測温素子14から差込
端子26までは途中の配線部のプローブ用リード線25
を含め高周波から遮蔽されている。温度プローブ24の
差込端子26は加熱室1の外のリセプタクル31に接続
され、そこからリード線32を介して制御用電子回路1
1Aへとつながっている。これによって、被加熱物5の
表面部の温度と中心部の温度に対応する温度プローブの
測定値が制御用電子回路11Aに取り込まれそれに応じ
た高周波の出力制御が可能となる。
In FIG. 1, the high frequency generated by the magnetron 2 is guided into the heating chamber 1 through the waveguide 3 and the power supply opening 4, and the object 5 placed on the object mounting table 6 is heated. You. The tip of the temperature probe 24 is inserted into the object 5 so as to stop near the surface of the object 5 and pass through the center of the object 5. As shown in FIG. 2A, the temperature probe 24 is inserted into the metal pipe 13 inserted into the object 5 to be heated as shown in FIG.
4 are arranged in large numbers. As the temperature measuring element 14, an element whose electric characteristics change with temperature, such as a negative resistance, is used. Each temperature measuring element 14 is connected by an element common lead wire 29 of common wiring and each element lead wire 30 to each temperature measuring element 14, and the element common electrode 27 and the element electrode 28 It is wired to. From these temperature measuring element 14 to the insertion terminal 26, a probe lead 25
And is shielded from high frequencies. The insertion terminal 26 of the temperature probe 24 is connected to a receptacle 31 outside the heating chamber 1, from which the control electronic circuit 1 is connected via a lead wire 32.
It is connected to 1A. As a result, the measured value of the temperature probe corresponding to the temperature of the surface portion and the temperature of the central portion of the object to be heated 5 is taken into the control electronic circuit 11A, and the high-frequency output control can be performed accordingly.

【0032】次に高周波の出力制御を図5の回路図で説
明する。マグネトロン2に高圧トランス23を用い高周
波を発生させる。高周波の出力制御は高圧トランス23
の一次回路に断続リレー22の接点を断続し、その断続
頻度により行う。断続する信号は、制御用電子回路11
Aで発生し断続リレー22のコイルを駆動させる。制御
用電子回路11Aの制御信号は、温度プローブ24の被
加熱物5の温度測定結果に基づき決める。
Next, high-frequency output control will be described with reference to the circuit diagram of FIG. The high frequency transformer 23 is used for the magnetron 2 to generate a high frequency. High-frequency output control is performed by high-voltage transformer 23.
The connection of the contact of the intermittent relay 22 is intermittently connected to the primary circuit, and the operation is performed according to the intermittent frequency. The intermittent signal is the control electronic circuit 11
A is generated at A and drives the coil of the intermittent relay 22. The control signal of the control electronic circuit 11A is determined based on the temperature measurement result of the object 5 to be heated by the temperature probe 24.

【0033】その制御内容は、図6(a)の<高周波加
熱時>で説明する。グラフの横軸に温度プローブ24の
先端部を含む位置、縦軸は温度プローブ24の測温素子
14の測定温度値で、グラフ中の曲線は各測温素子14
の測定結果を線で結んだものである。グラフに表示の結
果は被加熱物5を高周波である程度加熱した後の状態で
あるが、被加熱物5の表面部は中心部より温度が高い。
温度プローブ24は先端部が被加熱物5の表面部で止ま
るよう差し込まれているので、被加熱物5の温度に対応
した感熱素子14の値が温度プローブ14より出力され
る。温度プローブ24の被加熱物5から出た部分は被加
熱物5の中より温度が低いので図6(a)に示すような
曲線になる。被加熱物5の温度制御は、温度プローブ2
4の先端部の温度を被加熱物5の表面部の温度とし、ま
た先端部の次に来る温度の谷の部分を被加熱物5の中心
部の温度とする。この表面部と、中心部の温度を制御デ
ータとし、それに基づき高周波の出力を変化させること
により、被加熱物5の表面部と中心部の温度を制御す
る。つまり、高周波を強くすると、表面部が中心部より
早く温度上昇する。また、高周波を弱めにすると、被加
熱物内部での熱伝導の働きにより、表面部と中心部の温
度差が小さくなる。この特徴を利用し被加熱物の加熱温
度を制御するものである。この被加熱物5の温度の傾向
は、ほぼどの被加熱物でも該当するもので、被加熱物に
ただ温度プローブ24を挿入するのみで被加熱物の表面
部、中心部の温度が常時把握、且つ制御でき、被加熱物
表面部の過加熱、内部の加熱不足をなくして被加熱物の
加熱を効率よく自在に出来るものである。この被加熱物
の実測温度に対応する加熱の制御は、制御用電子回路1
1Aに予め加熱シーケンスを組み込めば自動加熱が可能
であり、もちろんマニュアルも可能。
The contents of the control will be described with reference to FIG. The horizontal axis of the graph indicates the position including the tip of the temperature probe 24, the vertical axis indicates the measured temperature value of the temperature measuring element 14 of the temperature probe 24, and the curve in the graph indicates the temperature measuring element 14
Are connected by a line. The result shown in the graph is a state after the object 5 has been heated to a high frequency to some extent, but the surface of the object 5 has a higher temperature than the central part.
Since the temperature probe 24 is inserted so that the tip end stops at the surface of the object 5 to be heated, a value of the thermosensitive element 14 corresponding to the temperature of the object 5 is output from the temperature probe 14. Since the temperature of the portion of the temperature probe 24 protruding from the object to be heated 5 is lower than that of the inside of the object to be heated 5, the curve becomes as shown in FIG. The temperature of the object to be heated 5 is controlled by the temperature probe 2
The temperature at the tip of 4 is defined as the temperature of the surface of the article 5 to be heated, and the valley of the temperature following the tip is defined as the temperature of the center of the article 5 to be heated. The temperature of the surface and the center of the article 5 to be heated is controlled by changing the high-frequency output based on the temperature of the surface and the center as control data. In other words, when the high frequency is increased, the temperature of the surface increases faster than that of the center. Further, when the high frequency is weakened, the temperature difference between the surface portion and the central portion becomes small due to the heat conduction inside the object to be heated. By utilizing this feature, the heating temperature of the object to be heated is controlled. This tendency of the temperature of the object to be heated 5 is applicable to almost any object to be heated, and the temperature of the surface portion and the central portion of the object to be heated is always grasped by simply inserting the temperature probe 24 into the object to be heated. In addition, it is possible to efficiently and freely heat the object to be heated by eliminating overheating of the surface of the object to be heated and insufficient heating inside the object. The heating control corresponding to the actually measured temperature of the object to be heated is performed by a control electronic circuit 1.
Automatic heating is possible by incorporating a heating sequence into 1A in advance, and of course, manual operation is also possible.

【0034】尚、温度プローブによる被加熱物内部の測
温箇所の温度精度は、測温素子14を連接して並べれば
よりきめ細かく測定できるので向上する。この点の説明
は図に依らなくても理解可能であり図面を省略する。更
に測温素子14を包む金属パイプ13は厚みがより薄
く、また熱伝導性が悪い方が測定ポイントの熱が金属パ
イプで拡散しにくくなるので温度の測定精度は更に向上
する。
It should be noted that the temperature accuracy of the temperature measuring point inside the object to be heated by the temperature probe is improved if the temperature measuring elements 14 are connected and arranged, so that the measurement can be performed more finely. The description of this point can be understood without depending on the drawings, and the drawings are omitted. Further, the metal pipe 13 surrounding the temperature measuring element 14 is thinner and has a lower thermal conductivity, so that the heat at the measuring point is less likely to diffuse through the metal pipe, so that the temperature measurement accuracy is further improved.

【0035】(実施例2)図3は本発明の実施例2の高
周波加熱装置の要部断面図である。
(Embodiment 2) FIG. 3 is a sectional view of a main part of a high-frequency heating apparatus according to Embodiment 2 of the present invention.

【0036】図5の回路図、図6の温度プローブによる
被加熱物の温度測定値の説明図については、共に図1で
の説明に用いたものであるが、図3の実施例2の機能や
説明を含んでおり今回の説明にも用いる。図3と図1と
共通部分の重複箇所の説明は出来るだけ省いた。
The circuit diagram of FIG. 5 and the explanatory diagram of the measured value of the temperature of the object to be heated by the temperature probe of FIG. 6 are used in the description of FIG. 1, but the functions of the embodiment 2 of FIG. And explanations, which are also used in this explanation. The description of the overlapping portions of FIG. 3 and FIG.

【0037】実施例1と異なる点は、被加熱物5の加熱
源を高周波に加えヒータあるいは水蒸気を付加した点で
ある。ガスによる説明は熱源が電気ヒータによるものを
ガスバーナーにしたのみであり加熱する機能はヒータと
同じとなるので説明を省略する。
The difference from the first embodiment is that a heating source for the article 5 to be heated is added to a high frequency and a heater or steam is added. In the description using gas, only the heat source using an electric heater is replaced with a gas burner, and the function of heating is the same as that of the heater.

【0038】図3において、まずヒータによる被加熱物
5への熱源を説明する。加熱室1の壁面に対向した外側
にコンベクションファン34を設け、その回りにコンベ
クションヒータ33を配置する。コンベクションファン
34が対向する加熱室1の壁面には、加熱室1の空気が
出入りする開口穴37があり、コンベクションヒータ3
3が通電されコンベクションファン34が回転すると熱
風が開口穴37から加熱室に流入する。次に水蒸気によ
る熱源については、加熱室1の外に配置された水蒸気発
生装置51の上部の水35が給水弁38を介し蒸発ヒー
タ36に滴下し水蒸気を発生させ、それを加熱室1の壁
面の開口穴52から加熱室1の中に送り込まれる。ヒー
タと水蒸気の制御について、図5も加え説明する。コン
ベクションヒータ33はヒータリレー39を断続するこ
とで通電量を制御し加熱室1の温度をコントロールす
る。水蒸気は、ヒータリレー40の断続で蒸発ヒータ3
6の加熱量を制御し、また給水弁38の制御で発生蒸気
量を制御する。実施例1で説明した高周波の制御と同じ
くヒータ、水蒸気においても制御用電子回路11Aで制
御を行う。勿論、温度プローブ24で被加熱物5の表面
部と中心部の温度に基づき、高周波、ヒータ、水蒸気の
選択とそれぞれの出力を決める。
Referring to FIG. 3, first, the heat source to the object 5 to be heated by the heater will be described. A convection fan 34 is provided on the outside facing the wall surface of the heating chamber 1, and a convection heater 33 is arranged therearound. On the wall surface of the heating chamber 1 facing the convection fan 34, there is an opening hole 37 through which the air in the heating chamber 1 enters and exits.
When 3 is energized and the convection fan 34 rotates, hot air flows into the heating chamber through the opening 37. Next, as for the heat source by steam, water 35 above the steam generator 51 disposed outside the heating chamber 1 is dropped on the evaporation heater 36 through the water supply valve 38 to generate steam, and the steam is generated on the wall surface of the heating chamber 1. Is fed into the heating chamber 1 through the opening hole 52 of the heater. The control of the heater and the steam will be described with reference to FIG. The convection heater 33 controls the amount of electricity by turning the heater relay 39 on and off to control the temperature of the heating chamber 1. The water vapor is supplied to the evaporator 3
6 is controlled, and the amount of generated steam is controlled by controlling the water supply valve 38. Similarly to the high-frequency control described in the first embodiment, the control of the heater and the steam is performed by the control electronic circuit 11A. Of course, the selection of the high frequency wave, the heater, and the steam and the respective outputs are determined by the temperature probe 24 based on the temperatures of the surface portion and the central portion of the object 5 to be heated.

【0039】次に図6(b)の<高周波とヒータ、ガ
ス、水蒸気等による加熱時>で温度プローブ24による
被加熱物5の温度制御を説明する。この図は、実施例1
と同様の図であるが、加熱室1の温度は、高周波だけの
時に比べ高温となっている。従って温度プローブ24の
被加熱物5から外にある部分は、被加熱物の温度より高
温であり温度測定曲線が実施例1と異なる。この場合で
も温度プローブ24の先端部が被加熱物5の表面部の温
度を表し、先端部の次に来る温度の谷の部分を被加熱物
5の中心部の温度とするのは実施例1同じであり、被加
熱物5の表面部と内部の温度の把握が可能であるので制
御用電子回路11Aを用いて被加熱物5の加熱制御がヒ
ータや水蒸気による加熱が加わっても実施例1と同様制
御可能である。特に、高周波と電気ヒータあるいは水蒸
気との同時加熱では被加熱物5の表面部の温度が高周波
単独加熱に比べ高くなりがちなので、表面部の脱水に気
を付ける必要がある。この様な場合でも温度プローブ2
4が被加熱物5の温度を直接監視しているので、加熱室
1に流入する熱風、水蒸気でそれぞれの特徴を生かした
加熱が高周波加熱に加えて行え、被加熱物の加熱を仕上
がり良く効果的に出来る。
Next, the control of the temperature of the object 5 to be heated by the temperature probe 24 will be described with reference to FIG. 6B <at the time of heating by high frequency and heater, gas, water vapor, etc.>. FIG.
FIG. 3 is similar to FIG. 1, but the temperature of the heating chamber 1 is higher than when only high frequency is used. Therefore, the portion of the temperature probe 24 outside the object 5 to be heated is higher than the temperature of the object to be heated, and the temperature measurement curve is different from that of the first embodiment. Also in this case, the tip of the temperature probe 24 indicates the temperature of the surface of the object 5 to be heated, and the valley of the temperature following the tip is the temperature of the center of the object 5 in the first embodiment. Since the temperature of the surface portion and the inside of the object to be heated 5 can be grasped, the heating control of the object to be heated 5 using the control electronic circuit 11A can be performed even if heating by a heater or steam is applied. Can be controlled similarly to Particularly, in the simultaneous heating of the high frequency and the electric heater or the steam, the temperature of the surface of the article 5 to be heated tends to be higher than that of the single heating of the high frequency. Even in such a case, the temperature probe 2
4 directly monitors the temperature of the object 5 to be heated, so that heating utilizing the characteristics of each of the hot air and steam flowing into the heating chamber 1 can be performed in addition to the high-frequency heating, and the heating of the object to be heated is effectively finished. I can do it.

【0040】(実施例3)図4(a)は本発明の実施例
3の光ファイバーによる温度プローブ外観図、図4
(b)は要部断面拡大図を示す。本実施例は、実施例1
ないし実施例2の温度プローブ24を光ファイバーによ
る温度プローブに置き換えたもので、温度プローブ以外
の働きは同じであり説明を省く。
(Embodiment 3) FIG. 4A is an external view of a temperature probe using an optical fiber according to Embodiment 3 of the present invention.
(B) is an enlarged cross-sectional view of a main part. This embodiment is similar to the first embodiment.
Alternatively, the temperature probe 24 of the second embodiment is replaced by a temperature probe using an optical fiber, and functions other than the temperature probe are the same, and description thereof will be omitted.

【0041】図4に示すように多数の光ファイバー42
が束になっており、その先端部が測温部43として順次
ずらして配置されている。光ファイバー全体は、透明な
高周波に対し誘電率の小さい固定樹脂44でおおわれ一
体化されている。測定部から入射する赤外線はその部分
の温度に対応するものである。光ファイバーの赤外線は
図5に示す光から電気信号に変換する変換回路45を通
し制御用電子回路11Aに入力され実施例1、実施例2
と同様の動作をする。本実施例は、被加熱物5から出る
赤外線を直接を測温部43が受けるため、従来の湿度セ
ンサーや赤外線センサーを用いる被加熱物温度の間接測
定に伴う測定の誤判断(「被加熱物の中心部が加熱不足
でも表面部のみの加熱で湿度センサーは働く」、「被加
熱物以外の加熱部分や反射材料が介在する事で赤外線セ
ンサーが被加熱物そのものの温度を判別できない」等)
がないので、温度測定が正確且つレスポンス良く出き、
被加熱物の温度がより正確に把握できるため、より理想
的な加熱が精度良く出来る。
As shown in FIG.
Are bundled, and the leading ends of the bundles are sequentially shifted as the temperature measuring unit 43. The entire optical fiber is covered with a fixed resin 44 having a small dielectric constant with respect to a transparent high frequency, and is integrated. Infrared rays incident from the measuring section correspond to the temperature of that section. The infrared light of the optical fiber is input to the control electronic circuit 11A through the conversion circuit 45 for converting light into an electric signal shown in FIG.
Performs the same operation as. In the present embodiment, since the temperature measurement unit 43 directly receives the infrared light emitted from the object 5 to be heated, the measurement error due to the indirect measurement of the temperature of the object to be heated using the conventional humidity sensor or infrared sensor (“the object to be heated” Even if the central part is underheated, the humidity sensor works by heating only the surface part "," The infrared sensor cannot determine the temperature of the heated object itself due to the presence of a heated part or reflective material other than the heated object ")
There is no, temperature measurement comes out accurately and with good response,
Since the temperature of the object to be heated can be grasped more accurately, more ideal heating can be performed with high accuracy.

【0042】(実施例4)図5中に本発明の実施例4の
コントロールパネルの図を示す。
(Embodiment 4) FIG. 5 shows a control panel according to Embodiment 4 of the present invention.

【0043】コントロールパネル46には、被加熱物内
部温度を示す表示パネル47と高周波の出力調整ツマミ
48、ヒータの出力調整ツマミ49、水蒸気の出力調整
ツマミ50が付けられている。表示パネル47は図6中
に示す曲線が表示される。加熱する人は、表示パネルを
見ながら被加熱物5の加熱加減を出力調整ツマミ48、
あるいは出力調整ツマミ49、あるいは出力調整ツマミ
50で行え、加熱中常時被加熱物5の温度が測定されて
いるので、その結果も表示パネルに表示される。勿論、
表示はデジタルでも表示可能である。被加熱物温度の温
度制御、加熱手段の選択もあらかじめ決められた条件、
手順でプログラムしておけば自動運転可能であるが、そ
の運転状態の把握も常に被加熱物の実際の温度を測定し
ているため確認可能であり、経験や勘に頼るのでなく確
実な加熱が出来る。
The control panel 46 has a display panel 47 indicating the internal temperature of the object to be heated, a high-frequency output adjustment knob 48, a heater output adjustment knob 49, and a steam output adjustment knob 50. The display panel 47 displays the curve shown in FIG. The person who heats the output adjustment knob 48, while watching the display panel, adjusts the heating level of the object 5 to be heated.
Alternatively, the adjustment can be performed with the output adjustment knob 49 or the output adjustment knob 50. Since the temperature of the object to be heated 5 is constantly measured during heating, the result is also displayed on the display panel. Of course,
The display can also be displayed digitally. Temperature control of the temperature of the object to be heated, selection of the heating means are also predetermined conditions,
Automatic operation is possible if programmed according to the procedure.However, it is possible to confirm the operation state because the actual temperature of the object to be heated is always measured, and reliable heating can be performed without relying on experience or intuition. I can do it.

【0044】[0044]

【発明の効果】以上のように本発明の高周波加熱装置に
おいては、以下の効果が得られる。
As described above, the high-frequency heating apparatus of the present invention has the following effects.

【0045】多点測定の温度プローブで、被加熱物の表
面部を含む内部温度の把握を行いながら加熱を進める事
が出来るので、被加熱材の過加熱、加熱不足の防止は勿
論、被加熱材にふさわしい加熱シーケンスの実行も容易
になり、おいしさの追求が可能となる。
Heating can be advanced while grasping the internal temperature including the surface portion of the object to be heated by using a temperature probe for multipoint measurement. The heating sequence appropriate for the material can be easily performed, and the taste can be pursued.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例1の高周波加熱装置の要部断面
FIG. 1 is a sectional view of a main part of a high-frequency heating device according to a first embodiment of the present invention.

【図2】(a)本発明の実施例1ないし実施例2の温度
プローブとの外観図 (b)同要部断面拡大図
FIG. 2A is an external view of a temperature probe according to Embodiments 1 and 2 of the present invention. FIG.

【図3】本発明の実施例2の高周波加熱装置の要部断面
FIG. 3 is a sectional view of a main part of a high-frequency heating device according to a second embodiment of the present invention.

【図4】(a)本発明の実施例3の光ファイバーによる
温度プローブの外観図 (b)同要部断面拡大図
4A is an external view of a temperature probe using an optical fiber according to a third embodiment of the present invention, and FIG.

【図5】本発明の実施例1、実施例2、実施例3、実施
例4を含む回路図とコントロールパネルの図
FIG. 5 is a circuit diagram including a first embodiment, a second embodiment, a third embodiment, and a fourth embodiment of the present invention, and a diagram of a control panel.

【図6】(a)本発明の実施例1と実施例2と実施例3
の温度プローブによる高周波加熱時の被加熱物の温度測
定値の説明図 (b)同高周波とその他の手段による加熱時の説明図
FIG. 6 (a) Embodiments 1, 2, and 3 of the present invention.
Explanatory drawing of the measured value of the object to be heated at the time of high-frequency heating by the temperature probe shown in FIG.

【図7】従来例の高周波加熱装置の要部断面図FIG. 7 is a cross-sectional view of a main part of a conventional high-frequency heating device.

【図8】(a)従来例の温度プローブの外観図 (b)同要部拡大断面図8A is an external view of a conventional temperature probe, and FIG.

【図9】他の従来例の高周波加熱装置の要部断面図FIG. 9 is a sectional view of a main part of another conventional high-frequency heating device.

【図10】他の従来例の高周波加熱装置の要部断面図FIG. 10 is a sectional view of a main part of another conventional high-frequency heating device.

【図11】従来の回路図FIG. 11 is a conventional circuit diagram.

【符号の説明】[Explanation of symbols]

1 加熱室 2 マグネトロン 5 被加熱物 11A 制御用電子回路 14 測温素子 24 温度プローブ 41 光ファイバー温度プローブ 42 光ファイバー 43 測温部 46 コントロールパネル 47 表示パネル Reference Signs List 1 heating chamber 2 magnetron 5 object to be heated 11A control electronic circuit 14 temperature measuring element 24 temperature probe 41 optical fiber temperature probe 42 optical fiber 43 temperature measuring section 46 control panel 47 display panel

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】被加熱物を加熱する加熱室と、加熱手段で
ある高周波発生源のマグネトロンと、このマグネトロン
の制御部と、前記被加熱物の温度を計る温度プローブを
備え、前記温度プローブは、棒状の測温部を有し、前記
棒状の測温部は複数の測温素子を配置して、前記複数の
測温素子からの出力を前記マグネトロンの制御部に接続
し前記温度プローブの測温部を前記被加熱物に差し込む
ことにより前記被加熱物の中心部から表面部にわたる温
度を測定して、その測定結果に基づき前記加熱手段を調
整し、前記被加熱物の内部と表面部の温度を制御する高
周波加熱装置。
1. A heating chamber for heating an object to be heated, a magnetron of a high-frequency source serving as a heating means, a control unit of the magnetron, and a temperature probe for measuring the temperature of the object to be heated. , A rod-shaped temperature measuring unit, wherein the rod-shaped temperature measuring unit is provided with a plurality of temperature measuring elements, and outputs from the plurality of temperature measuring elements are connected to a control unit of the magnetron to measure the temperature of the temperature probe. The temperature from the center to the surface of the object to be heated is measured by inserting a warm part into the object to be heated, and the heating means is adjusted based on the measurement result. High frequency heating device that controls temperature.
【請求項2】被加熱物を加熱する電気ヒータ、ガスある
いは、水蒸気を高周波に付加し、それらの加熱を制御す
る制御部を有する構成の請求項1記載の高周波加熱装
置。
2. The high-frequency heating apparatus according to claim 1, further comprising an electric heater for heating the object to be heated, a control unit for adding gas or water vapor to the high frequency, and controlling the heating of the high frequency.
【請求項3】温度プローブの複数の測温素子は、連接し
て並べた構成の請求項1または請求項2記載の高周波加
熱装置。
3. The high-frequency heating apparatus according to claim 1, wherein the plurality of temperature measuring elements of the temperature probe are connected and arranged.
【請求項4】温度プローブの測温部を光ファイバーと
し、前記光ファイバーの温度測定ポイントの先端部を複
数、棒状の測温部に配列し、前記光ファイバーからの赤
外線の出力を電気信号に変換し、高周波、電気ヒータ、
ガス、水蒸気等による加熱を制御する制御部に接続した
構成の請求項1または請求項2記載の高周波加熱装置。
4. A temperature measuring section of the temperature probe is an optical fiber, a plurality of tip portions of temperature measuring points of the optical fiber are arranged in a rod-shaped temperature measuring section, and an infrared output from the optical fiber is converted into an electric signal. High frequency, electric heater,
The high-frequency heating device according to claim 1 or 2, wherein the high-frequency heating device is connected to a control unit that controls heating by gas, water vapor, or the like.
【請求項5】高周波加熱装置の制御パネルと、前記制御
パネルに温度プローブによる測定結果を表示する表示手
段と、加熱手段の出力を加減する調節手段を備えた構成
の請求項1または請求項2記載の高周波加熱装置。
5. A high-frequency heating apparatus comprising: a control panel of a high-frequency heating device; display means for displaying a measurement result by a temperature probe on the control panel; and adjusting means for adjusting the output of the heating means. The high-frequency heating device as described.
JP11015603A 1999-01-25 1999-01-25 High frequency heating device Pending JP2000215977A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11015603A JP2000215977A (en) 1999-01-25 1999-01-25 High frequency heating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11015603A JP2000215977A (en) 1999-01-25 1999-01-25 High frequency heating device

Publications (1)

Publication Number Publication Date
JP2000215977A true JP2000215977A (en) 2000-08-04

Family

ID=11893311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11015603A Pending JP2000215977A (en) 1999-01-25 1999-01-25 High frequency heating device

Country Status (1)

Country Link
JP (1) JP2000215977A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005241593A (en) * 2004-02-27 2005-09-08 Tohoku Electric Power Co Inc Apparatus and method for detecting core temperature
US7150891B2 (en) 2000-12-12 2006-12-19 Rational Ag Method for conducting a cooking process with a cooking process probe
JP2009041819A (en) * 2007-08-08 2009-02-26 Sharp Corp Vapor cooker
KR101232488B1 (en) * 2007-08-08 2013-02-12 샤프 가부시키가이샤 Steam cooker
JP2020046121A (en) * 2018-09-19 2020-03-26 三浦工業株式会社 Vacuum cooling device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7150891B2 (en) 2000-12-12 2006-12-19 Rational Ag Method for conducting a cooking process with a cooking process probe
JP2005241593A (en) * 2004-02-27 2005-09-08 Tohoku Electric Power Co Inc Apparatus and method for detecting core temperature
JP4601974B2 (en) * 2004-02-27 2010-12-22 東北電力株式会社 Core temperature detection system and core temperature detection method
JP2009041819A (en) * 2007-08-08 2009-02-26 Sharp Corp Vapor cooker
KR101232488B1 (en) * 2007-08-08 2013-02-12 샤프 가부시키가이샤 Steam cooker
US8420983B2 (en) 2007-08-08 2013-04-16 Sharp Kabushiki Kaisha Vapor cooker
JP2020046121A (en) * 2018-09-19 2020-03-26 三浦工業株式会社 Vacuum cooling device
JP7137131B2 (en) 2018-09-19 2022-09-14 三浦工業株式会社 vacuum cooling system

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