JP2000214803A - Display and its manufacture - Google Patents
Display and its manufactureInfo
- Publication number
- JP2000214803A JP2000214803A JP11017303A JP1730399A JP2000214803A JP 2000214803 A JP2000214803 A JP 2000214803A JP 11017303 A JP11017303 A JP 11017303A JP 1730399 A JP1730399 A JP 1730399A JP 2000214803 A JP2000214803 A JP 2000214803A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- display
- light emitting
- circuit board
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板上に配置した
発光素子を樹脂被覆した表示器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device in which a light emitting element disposed on a substrate is covered with a resin.
【０００２】[0002]
【従来の技術】メッセージボードなどの情報表示装置の
一部分を構成する表示器としては、例えば特開平９−６
２５９号公報に開示されたものが知られており、例えば
図5に示すように、基板１００表面に直接ＬＥＤチップ
２００を配置し、これを透明な樹脂３００で被覆した構
成となっている。樹脂被覆は一般に、硬化前の流動状態
の樹脂を注射針のようなノズルの先端から滴下して形成
しているので、樹脂形状が不安定であったり、製造に時
間がかかるなどの問題が有った。また、基板の表面にＬ
ＥＤチップを配置し、樹脂被覆しているので、広視野角
化を図ることができる反面、一定方向の輝度が要求され
る場合の指向性を高めることが困難な構造であった。2. Description of the Related Art For example, Japanese Patent Application Laid-Open No. Hei 9-6 discloses a display which constitutes a part of an information display device such as a message board.
No. 259 is known. For example, as shown in FIG. 5, an LED chip 200 is arranged directly on the surface of a substrate 100 and this is covered with a transparent resin 300. In general, resin coating is formed by dripping resin in a fluidized state before curing from the tip of a nozzle such as an injection needle, and thus has problems such as unstable resin shape and time-consuming manufacturing. Was. In addition, L
Since the ED chip is arranged and covered with a resin, the viewing angle can be widened, but it is difficult to increase the directivity when luminance in a certain direction is required.
【０００３】[0003]
【発明が解決しようとする課題】そこで本発明は上記の
点を考慮し、表示器の表示品位の向上を図ることを課題
の1つとする。また、表示器の被覆樹脂の形状の安定化
を図るとともに、製造時間を短縮することを課題の1つ
とする。また、指向性の向上、高輝度化を図ることを課
題の1つとする。SUMMARY OF THE INVENTION An object of the present invention is to improve the display quality of a display device in view of the above points. Another object is to stabilize the shape of the coating resin of the display and to shorten the manufacturing time. Another object is to improve the directivity and increase the luminance.
【０００４】[0004]
【課題を解決するための手段】本発明の表示器は、請求
項１に記載のように、回路基板の表面に発光素子配置用
の凹部を形成し、この凹部内に配置した発光素子を覆う
ように透光性の樹脂を前記凹部に充填した表示器であっ
て、前記凹部の上部外周もしくは底部外周に所定の丸み
処理を施していることを特徴とする。According to a first aspect of the present invention, there is provided a display device in which a concave portion for arranging a light emitting element is formed on a surface of a circuit board, and the light emitting element disposed in the concave portion is covered. A display device in which the concave portion is filled with the translucent resin as described above, wherein a predetermined rounding process is performed on an upper outer periphery or a bottom outer periphery of the concave portion.
【０００５】本発明の表示器は、請求項２に記載のよう
に、回路基板の表面に発光素子の高さ寸法よりも深い凹
部を形成し、この凹部内に配置した前記発光素子を透光
性の樹脂によって覆い、前記樹脂の形状を凸レンズ状と
したことを特徴とする。According to a second aspect of the present invention, there is provided a display device, wherein a concave portion deeper than the height of the light emitting element is formed on the surface of the circuit board, and the light emitting element disposed in the concave portion transmits light. The resin is covered with a conductive resin, and the shape of the resin is a convex lens shape.
【０００６】本発明の表示器は、請求項３〜５に記載の
ように、請求項1あるいは２記載の表示器において、前
記樹脂は、印刷処理によって形成していること、前記凹
部の内側面に、反射性のパターンを形成したこと、ある
いは前記樹脂の中に光拡散剤を混合していることを特徴
とする。According to a third aspect of the present invention, there is provided the display according to the first or second aspect, wherein the resin is formed by a printing process; In addition, a reflective pattern is formed, or a light diffusing agent is mixed in the resin.
【０００７】本発明の表示器の製造方法は、請求項６に
記載のように、回路基板の表面に発光素子配置用の凹部
を形成し、回路基板の前記凹部内に発光素子を配置し、
この発光素子を覆うとともに前記凹部に充填するように
被覆用の樹脂を印刷によって塗布した後に硬化すること
を特徴とする。According to a sixth aspect of the present invention, in the method of manufacturing a display device, a concave portion for arranging a light emitting element is formed on a surface of a circuit board, and a light emitting element is disposed in the concave portion of the circuit board.
A coating resin is applied by printing so as to cover the light emitting element and fill the recess, and then is cured.
【０００８】[0008]
【発明の実施の形態】以下本発明の実施形態をドットマ
トリックス式のＬＥＤ表示器を例にとり、図面を参照し
て説明する。ＬＥＤ表示器１は、図4に示すように、1辺
の長さが数ｃｍ前後の回路基板２の表面に、直径が３ｍ
ｍ前後の表示ドット３を４ｍｍ前後のピッチで１６×１
６のマトリックス状に配置しているとともに、回路基板
２の裏面に複数のリードピン４を植設して構成してい
る。回路基板２の表面には、図２、図3に示すように、
発光素子配置用の複数の凹部５が形成され、この凹部５
内に発光素子６を配置している。発光素子６は、チップ
状のＬＥＤ素子で構成し、所定数、この例では2個の素
子を凹部５内に配置している。そして、発光素子６を被
覆するようにエポキシ樹脂等の透光性の樹脂７を前記凹
部５に充填している。指向性を高めるために、被覆用の
樹脂７は、図1に示すように発光素子６から出力される
光を集光するに適した凸レンズ形状とし、基板2の表面
から１ｍｍ程度突出している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below with reference to the drawings, taking a dot matrix type LED display as an example. As shown in FIG. 4, the LED display 1 has a diameter of 3 m on the surface of the circuit board 2 having a side length of about several cm.
Display dots 3 of about m at a pitch of about 4 mm 16 × 1
6 are arranged in a matrix, and a plurality of lead pins 4 are planted on the back surface of the circuit board 2. On the surface of the circuit board 2, as shown in FIGS.
A plurality of recesses 5 for arranging light emitting elements are formed.
The light emitting element 6 is arranged in the inside. The light emitting element 6 is constituted by a chip-shaped LED element, and a predetermined number, in this example, two elements, are arranged in the recess 5. The concave portion 5 is filled with a translucent resin 7 such as an epoxy resin so as to cover the light emitting element 6. In order to improve the directivity, the coating resin 7 has a convex lens shape suitable for condensing the light output from the light emitting element 6 as shown in FIG. 1 and protrudes from the surface of the substrate 2 by about 1 mm.
【０００９】以下、この表示器１の詳細について、その
製造方法を概略的に示す図2を参照して説明する。基板
２として例えばガラスエポキシ製の基板を用意し、図2
（ａ）に示すように、その表面に、発光素子６の高さ寸
法（０．２〜０．３ｍｍ）よりも深い逆円錐台形状の窪
み（深さ０．３〜１．２ｍｍ）を形成する。この窪みを
表示ドット３の配置に対応して形成することにより、マ
トリックス状に凹部５を形成した基板２とする。ここ
で、凹部５の環状内側面５ａと基板２の表面２ａが交わ
る部分、すなわち、凹部５の上部外周部分は、その角が
丸みを持つようにＲ処理が施されている。このＲ処理
は、上部外周部分の一部分のみに施しても良いが、全周
に施しておくのが好ましい。The details of the display 1 will be described below with reference to FIG. For example, a substrate made of glass epoxy is prepared as the substrate 2, and FIG.
As shown in (a), an inverted truncated cone-shaped depression (depth 0.3 to 1.2 mm) deeper than the height (0.2 to 0.3 mm) of the light emitting element 6 is formed on the surface thereof. I do. By forming the depressions corresponding to the arrangement of the display dots 3, the substrate 2 having the concave portions 5 formed in a matrix is obtained. Here, a portion where the annular inner side surface 5a of the concave portion 5 intersects with the surface 2a of the substrate 2, that is, an upper outer peripheral portion of the concave portion 5 is subjected to an R process so that its corner is rounded. This R processing may be performed only on a part of the upper outer peripheral portion, but is preferably performed on the entire circumference.
【００１０】また、凹部５の底面５ｂと内側面５ａが交
わる部分、すなわち、凹部５の底部外周部分は、その角
が丸みを持つようにＲ処理が施されている。このＲ処理
は、底部外周部分の一部分のみに施しても良いが、全周
に施しておくのが好ましい。A portion where the bottom surface 5b of the concave portion 5 intersects with the inner side surface 5a, that is, the outer peripheral portion of the bottom portion of the concave portion 5 is subjected to an R process so that its corner is rounded. This R treatment may be applied to only a part of the bottom outer peripheral portion, but is preferably applied to the entire periphery.
【００１１】この基板２には、前記発光素子６に対する
配線用の導電性パターン（図3のみに図示）が表面に形
成されている。また、必要に応じて裏面にも導電性パタ
ーンを形成することができる。図3は、凹部５の近傍に
おける導電性の配線パターン８を示し、（ａ）は平面
図、（ｂ）は（ａ）のｂ−ｂ断面図である。この図に示
すように、凹部５の環状の内側面５ａ並びに底部５ｂに
は、チップボンド用、ワイヤボンド用、あるいは配線用
として機能する複数個の導電性パターン８（８ａ，８
ｂ，８ｃ）が形成されている。パターン８ａ，８ｂは、
左右方向に位置する他のパターン８ａ，８ｂと基板２の
表側で互いに接続され、また、パターン８ｃは、上下方
向に位置する他のパターン８ｃと基板の裏側でスルーホ
ール８ｄを介して互いに接続されている。凹部５の内側
面５ａに位置するパターンは、図3にクロスハッチング
で示す領域に、金あるいは銀メッキ処理を施すことによ
り光反射率を高めている。このようなメッキ処理は、凹
部５の環状の内側面５ａの面積の８０％以上の範囲に設
けるのが好ましく、また、内側面５ａのみならず底部５
ｂのパターンにも施しておくのが、反射率を高める上で
好ましい。このようにして、凹部５と配線８を形成した
回路基板２が用意される。A conductive pattern (shown only in FIG. 3) for wiring to the light emitting element 6 is formed on the surface of the substrate 2. Also, a conductive pattern can be formed on the back surface as needed. 3A and 3B show the conductive wiring pattern 8 in the vicinity of the concave portion 5, wherein FIG. 3A is a plan view and FIG. 3B is a sectional view taken along line bb of FIG. As shown in this figure, a plurality of conductive patterns 8 (8a, 8a) functioning for chip bonding, wire bonding, or wiring are provided on the annular inner side surface 5a and the bottom 5b of the concave portion 5.
b, 8c) are formed. The patterns 8a and 8b are
The other patterns 8a, 8b located in the left-right direction are connected to each other on the front side of the substrate 2, and the pattern 8c is connected to the other patterns 8c located in the vertical direction, via through holes 8d, on the back side of the substrate. ing. The pattern located on the inner side surface 5a of the concave portion 5 is provided with a gold or silver plating process in a region indicated by cross hatching in FIG. Such a plating treatment is preferably provided in a range of 80% or more of the area of the annular inner surface 5a of the concave portion 5, and not only the inner surface 5a but also the bottom portion 5a.
It is preferable to apply the pattern b to increase the reflectance. Thus, the circuit board 2 on which the concave portions 5 and the wirings 8 are formed is prepared.
【００１２】次に、図2（ｂ）、図3に示すように、発光
素子６がチップボンドのパターン８ｂ，８ｃに導電性接
着剤や半田を用いて固定されるとともに、ワイヤーボン
ド線９，９を用いてワイヤーボンド接続される。次に、
図2（ｃ）に示すように、被覆用樹脂７を充填するため
に用いるスクリーン印刷用の版１０を回路基板２上に重
ねて配置する。この版１０は、凹部５に樹脂７を均一に
充填させるためのもので、ステンレス製基板に硬化前の
樹脂が通過できる穴１０ａを所定のパターンで一体的に
形成した構成としている。Next, as shown in FIGS. 2B and 3, the light emitting element 6 is fixed to the chip bonding patterns 8b and 8c using a conductive adhesive or solder, and the wire bonding lines 9 and 8 are used. 9 for wire bond connection. next,
As shown in FIG. 2C, a screen printing plate 10 used to fill the coating resin 7 is placed on the circuit board 2 so as to overlap. The plate 10 is for uniformly filling the concave portion 5 with the resin 7, and has a structure in which a hole 10a through which the uncured resin can pass is formed integrally with a stainless steel substrate in a predetermined pattern.
【００１３】そして、版１０の上から流動状態の樹脂を
流し込み、版１０の上からスキージを往復させて余分な
樹脂を取り去り、図2（ｄ）に示すような状態とするこ
とにより、スクリーン方式の印刷処理を行う。次に図2
（ｅ）に示すように、樹脂が硬化する前に版１０を取り
去ることにより、回路基板２の各凹部５に一定量の樹脂
７を塗布する。塗布直後の樹脂は、その流動性によって
形状が半球状に変化し、図1に示すように凸レンズ形状
となる。樹脂はその後、必要に応じて真空炉で脱泡処理
された後、熱処理されて硬化する。Then, a resin in a flowing state is poured from above the printing plate 10, and a squeegee is reciprocated from above the printing plate 10 to remove excess resin, and a state as shown in FIG. Print processing. Then Figure 2
As shown in (e), a predetermined amount of the resin 7 is applied to each recess 5 of the circuit board 2 by removing the plate 10 before the resin hardens. The resin immediately after application changes its shape into a hemisphere due to its fluidity, and becomes a convex lens shape as shown in FIG. Thereafter, the resin is defoamed in a vacuum furnace as required, and then heat-treated and cured.
【００１４】ここで、基板２に形成した凹部５の外周部
に上記のようなＲ処理を施していない場合は、上記スク
リーン印刷時に気泡が樹脂に混入し易く、その気泡が樹
脂硬化後も残ることにより、表示不良が生じ易いことが
わかった。そこで、残留気泡を削減するために実験の結
果、上記のように凹部５の上部外周部もしくは底部外周
部の角をＲ処理して丸めることにより、樹脂に混入する
気泡の削減あるいは混入した気泡の脱泡を促進し、硬化
後の樹脂に残留する気泡を大幅に削減できることを見出
した。気泡削減の詳しい理由は明らかではないが、以下
のように推測される。すなわち、凹部５の上部外周部あ
るいは底部外周部の角をＲ処理して丸めることにより、
スクリーン印刷時の樹脂の流れをスムーズにして気泡の
発生要因を抑制することができ、その結果、気泡の混入
を削減することができるものと考えられる。また、凹部
の上部外周部あるいは底部外周部の角をＲ処理して丸め
ることにより、基板２と樹脂７の境界部分に付着し残留
する気泡の離脱を促進して樹脂に残留する気泡の削減を
図ることができるものと考えられる。気泡の離脱促進
は、スクリーン印刷以外の方式で樹脂塗布した場合にも
効果がある。Here, when the outer periphery of the concave portion 5 formed in the substrate 2 is not subjected to the above-described R treatment, bubbles are easily mixed into the resin during the screen printing, and the bubbles remain even after the resin is cured. As a result, it was found that display defects were likely to occur. Therefore, as a result of an experiment to reduce the residual air bubbles, as described above, the corners of the upper outer peripheral portion or the lower outer peripheral portion of the concave portion 5 are rounded by R processing to reduce the amount of bubbles mixed in the resin or reduce the amount of mixed bubbles. It has been found that defoaming is promoted, and air bubbles remaining in the resin after curing can be significantly reduced. Although the detailed reason for the bubble reduction is not clear, it is speculated as follows. That is, by rounding the corners of the upper peripheral portion or the bottom peripheral portion of the concave portion 5 by R processing,
It is considered that the flow of the resin at the time of screen printing can be made smooth to suppress the generation of bubbles, and as a result, the mixing of bubbles can be reduced. Further, by rounding the corners of the upper peripheral portion or the bottom peripheral portion of the concave portion by R processing, the separation of bubbles remaining on the boundary portion between the substrate 2 and the resin 7 is promoted, and the reduction of bubbles remaining in the resin is promoted. It is thought that we can plan. Acceleration of bubble release is also effective when resin is applied by a method other than screen printing.
【００１５】凹部５の上部外周部あるいは底部外周部の
角をＲ処理する際の丸め半径（ｒ）は、大きい値に設定
することが好ましいが、あまり大きくすると凹部５の底
部５ｂの面積が削減されて発光素子６配置面積を十分に
確保できなくなる、あるいは表示ドット３の隙間がなく
なるので、表示ドット３の隙間、この例では１ｍｍより
も小さい寸法に設定するのが好ましい。この例では、表
示ドット３の隙間の半分の０．５ｍｍ前後の寸法に設定
している。また、凹部５の上部外周部と底部外周部のい
ずれか一方にＲ処理を施す場合は、底部外周部に施すの
が好ましい。また、凹部５の上部外周部と底部外周部の
両方にＲ処理を施す場合は、両者の丸め半径（ｒ）を同
じ値に設定することもできるが、実験の結果、好ましく
は上部外周部よりも底部外周部の方を大きな値に設定す
るのが気泡残留を削減できる点で良いことが分かった。The rounding radius (r) for rounding the corners of the upper outer peripheral portion or the bottom outer peripheral portion of the concave portion 5 is preferably set to a large value, but if it is made too large, the area of the bottom portion 5b of the concave portion 5 is reduced. As a result, the area for disposing the light emitting element 6 cannot be sufficiently secured, or the gap between the display dots 3 disappears. Therefore, it is preferable to set the gap between the display dots 3, in this example, a dimension smaller than 1 mm. In this example, the dimension is set to about 0.5 mm, which is half of the gap between the display dots 3. Further, in the case where one of the upper outer peripheral portion and the bottom outer peripheral portion of the concave portion 5 is subjected to the R process, it is preferable to perform the R process on the bottom outer peripheral portion. In addition, when the R processing is performed on both the upper outer peripheral portion and the lower outer peripheral portion of the concave portion 5, the rounding radius (r) of both can be set to the same value. It was also found that setting the outer peripheral portion of the bottom to a larger value was good in that the residual bubbles could be reduced.
【００１６】ここで、樹脂７の中には、光散乱性を高め
るために、超微細シリカなどの光拡散剤を混入しておく
こともできる。Here, a light diffusing agent such as ultrafine silica may be mixed in the resin 7 in order to enhance the light scattering property.
【００１７】上記のように表示器１は、回路基板２の表
面に形成した凹部５に発光素子６を配置し、この素子６
を被覆するように透光性樹脂７を充填しているので、基
板上面に発光素子を配置していた従来タイプに比べて指
向性を高めることができる。また、凹部５の少なくとも
内側面（より好ましくは内側面と底面）の大部分に反射
率を高めた導電性のパターンを形成しているので、発光
素子６の光取出効率を高めることができ、輝度を従来タ
イプに比べて３０％程度向上することができた。As described above, the display 1 has the light emitting element 6 disposed in the concave portion 5 formed on the surface of the circuit board 2.
Is filled with the translucent resin 7 so that the directivity can be improved as compared with the conventional type in which the light emitting element is arranged on the upper surface of the substrate. In addition, since a conductive pattern having an increased reflectance is formed on at least most of the inner surface (more preferably, the inner surface and the bottom surface) of the concave portion 5, the light extraction efficiency of the light emitting element 6 can be increased. The luminance was improved by about 30% as compared with the conventional type.
【００１８】また、表示器１は、回路基板２の表側に形
成した凹部５の上部外周部あるいは底部外周部に丸め処
理を施しているので、この凹部５に充填した樹脂７に残
留する気泡数を削減して表示ドット３の表示状態を良好
にすることができた。また、樹脂を印刷（スクリーン印
刷）によって塗布するので、ノズルから流し込む従来タ
イプに比べて、製造効率を高めることができるととも
に、樹脂量を均一化して表示品位を高めることができ
る。また、樹脂７は発光素子６の高さ寸法よりも深い凹
部５に充填しているので、従来タイプに比べて、発光素
子６を確実に被覆することができるとともに、樹脂形状
の安定化を図ることができる。Further, since the display 1 has a rounded upper peripheral portion or a lower peripheral portion of the concave portion 5 formed on the front side of the circuit board 2, the number of bubbles remaining in the resin 7 filled in the concave portion 5 is reduced. And the display state of the display dots 3 can be improved. In addition, since the resin is applied by printing (screen printing), the production efficiency can be increased and the display quality can be improved by uniforming the amount of resin as compared with the conventional type in which the resin is poured from a nozzle. Further, since the resin 7 is filled in the concave portion 5 which is deeper than the height of the light emitting element 6, the light emitting element 6 can be more reliably covered and the resin shape can be stabilized as compared with the conventional type. be able to.
【００１９】尚、上記の例は基板2として1枚の基板を用
いる場合を例に取ったが、複数枚の基板を貼り合わせた
積層タイプの基板を用いることもできる。In the above example, one substrate is used as the substrate 2. However, a laminated type substrate in which a plurality of substrates are bonded may be used.
【００２０】[0020]
【発明の効果】以上説明したように本発明によれば、表
示品位が均一で、指向性を高め、高輝度化を図った表示
器を提供することができる。また、表示器の製造効率を
高めることができる。As described above, according to the present invention, it is possible to provide a display device with uniform display quality, high directivity, and high luminance. Further, the production efficiency of the display can be improved.
【図１】本発明の表示器の一実施形態を示す要部断面図
である。FIG. 1 is a sectional view of a main part showing an embodiment of a display device of the present invention.
【図２】同表示器の製造手順を示す要部断面図である。FIG. 2 is a fragmentary cross-sectional view showing a procedure for manufacturing the display.
【図３】同表示器の要部平面図（ａ）と、その断面図
（ｂ）である。FIG. 3 is a plan view (a) of a main part of the display and a sectional view (b) thereof.
【図４】同表示器の平面図（ａ）と、その側面図（ｂ）
である。FIG. 4 is a plan view (a) and a side view (b) of the display.
It is.
【図５】従来例の要部断面図である。FIG. 5 is a sectional view of a main part of a conventional example.
１ ドットマトリックス型ＬＥＤ表示器 ２ 回路基板 ３ 表示ドット ５ 凹部 ６ 発光素子 ７ 樹脂 REFERENCE SIGNS LIST 1 dot matrix type LED display 2 circuit board 3 display dot 5 recess 6 light emitting element 7 resin
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5C094 AA10 AA43 AA55 BA25 CA19 DA07 GB01 HA10 5C096 AA04 AA27 BA04 BC20 CA06 CA17 CA29 CA32 CB07 CC06 CC23 CC28 CC30 EB15 EB16 FA12 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5C094 AA10 AA43 AA55 BA25 CA19 DA07 GB01 HA10 5C096 AA04 AA27 BA04 BC20 CA06 CA17 CA29 CA32 CB07 CC06 CC23 CC28 CC30 EB15 EB16 FA12
Claims (6)
を形成し、この凹部内に配置した発光素子を覆うように
透光性の樹脂を前記凹部に充填した表示器であって、前
記凹部の上部外周もしくは底部外周に所定の丸み処理を
施していることを特徴とする表示器。1. A display in which a concave portion for arranging a light emitting element is formed on a surface of a circuit board, and the concave portion is filled with a translucent resin so as to cover the light emitting element arranged in the concave portion. A display device wherein a predetermined rounding process is performed on an upper outer periphery or a bottom outer periphery of a concave portion.
りも深い凹部を形成し、この凹部内に配置した前記発光
素子を透光性の樹脂によって覆い、前記樹脂の形状を凸
レンズ状としたことを特徴とする表示器。2. A recess having a depth larger than the height of the light emitting element is formed on the surface of the circuit board, and the light emitting element disposed in the recess is covered with a translucent resin, and the resin is formed into a convex lens shape. A display characterized by the following.
いることを特徴とする請求項1あるいは２記載の表示
器。3. The display according to claim 1, wherein the resin is formed by a printing process.
を形成したことを特徴とする請求項1あるいは２記載の
表示器。4. The display according to claim 1, wherein a reflective pattern is formed on an inner surface of the recess.
ことを特徴とする請求項1あるいは２記載の表示器。5. The display according to claim 1, wherein a light diffusing agent is mixed in the resin.
を形成し、回路基板の前記凹部内に発光素子を配置し、
この発光素子を覆うとともに前記凹部に充填するように
被覆用の樹脂を印刷によって塗布した後に硬化すること
を特徴とする表示器の製造方法。6. A recess for arranging light emitting elements is formed on a surface of a circuit board, and a light emitting element is arranged in the recess of the circuit board.
A method of manufacturing a display, comprising coating a resin for coating by printing so as to cover the light emitting element and fill the recess, and then curing the resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01730399A JP3631031B2 (en) | 1999-01-26 | 1999-01-26 | Display and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01730399A JP3631031B2 (en) | 1999-01-26 | 1999-01-26 | Display and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000214803A true JP2000214803A (en) | 2000-08-04 |
| JP3631031B2 JP3631031B2 (en) | 2005-03-23 |
Family
ID=11940251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01730399A Expired - Fee Related JP3631031B2 (en) | 1999-01-26 | 1999-01-26 | Display and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3631031B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008537804A (en) * | 2005-03-12 | 2008-09-25 | スリーエム イノベイティブ プロパティズ カンパニー | Illumination device and manufacturing method thereof |
| WO2007130912A3 (en) * | 2006-05-03 | 2008-11-13 | Cree Inc | Multi-element led lamp package |
| US7699500B2 (en) | 2005-06-07 | 2010-04-20 | Fujikura Ltd. | Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment |
| US8436371B2 (en) | 2007-05-24 | 2013-05-07 | Cree, Inc. | Microscale optoelectronic device packages |
| US8860296B2 (en) | 2006-09-11 | 2014-10-14 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
| WO2019031281A1 (en) * | 2017-08-08 | 2019-02-14 | ヤマハファインテック株式会社 | Decorative member and method for producing decorative member |
-
1999
- 1999-01-26 JP JP01730399A patent/JP3631031B2/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013092787A (en) * | 2005-03-12 | 2013-05-16 | Three M Innovative Properties Co | Illumination devices and methods for making the same |
| JP2008537804A (en) * | 2005-03-12 | 2008-09-25 | スリーエム イノベイティブ プロパティズ カンパニー | Illumination device and manufacturing method thereof |
| US7699500B2 (en) | 2005-06-07 | 2010-04-20 | Fujikura Ltd. | Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment |
| US8629459B2 (en) | 2006-05-03 | 2014-01-14 | Cree, Inc. | Multi-element LED lamp package |
| CN101622723B (en) * | 2006-05-03 | 2012-05-09 | 克利公司 | Multi-element LED lamp package |
| US8324635B2 (en) | 2006-05-03 | 2012-12-04 | Cree, Inc. | Multi-element LED lamp package |
| US7829899B2 (en) | 2006-05-03 | 2010-11-09 | Cree, Inc. | Multi-element LED lamp package |
| WO2007130912A3 (en) * | 2006-05-03 | 2008-11-13 | Cree Inc | Multi-element led lamp package |
| US8847242B2 (en) | 2006-05-03 | 2014-09-30 | Cree, Inc. | Multi-element LED lamp |
| US8860296B2 (en) | 2006-09-11 | 2014-10-14 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
| US9303827B2 (en) | 2006-09-11 | 2016-04-05 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
| US9303829B2 (en) | 2006-09-11 | 2016-04-05 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
| US8436371B2 (en) | 2007-05-24 | 2013-05-07 | Cree, Inc. | Microscale optoelectronic device packages |
| WO2019031281A1 (en) * | 2017-08-08 | 2019-02-14 | ヤマハファインテック株式会社 | Decorative member and method for producing decorative member |
| CN111032367A (en) * | 2017-08-08 | 2020-04-17 | 雅马哈精密科技株式会社 | Decorative member and method for manufacturing decorative member |
| US11351695B2 (en) | 2017-08-08 | 2022-06-07 | Yamaha Fine Technologies Co., Ltd. | Decorative member and manufacturing method of decorative member |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3631031B2 (en) | 2005-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111599909B (en) | LED display screen module and preparation method thereof | |
| US7887225B2 (en) | Direct-type backlight unit having surface light source | |
| US8637878B2 (en) | Display panel, display device, illumination panel and illumination device, and methods of manufacturing display panel and illumination panel | |
| JP3163419B2 (en) | Electronic component manufacturing method | |
| EP1482567A9 (en) | Light-emitting device comprising led chip and method for manufacturing this device | |
| US20110133232A1 (en) | Lead frame, its manufacturing method, and semiconductor light emitting device using the same | |
| JP2012074753A (en) | Light emitting diode package | |
| JP2001237462A (en) | Light-emitting device | |
| JPH07231120A (en) | Light emitting device and manufacture thereof and manufacture of led head | |
| JP2010272565A (en) | Leadframe, method of manufacturing the leadframe, and semiconductor light emitting device using the leadframe | |
| CN110047804B (en) | Array substrate, manufacturing method, display panel and spliced screen | |
| WO2020107770A1 (en) | Area light source backlight module, liquid crystal display panel, and led chip soldering method | |
| WO2004044877A2 (en) | A display device and method for making same | |
| JP2000214803A (en) | Display and its manufacture | |
| JP2004087935A (en) | Semiconductor light-emitting device | |
| JPH08264840A (en) | Light emitting diode display device | |
| JPWO2010023992A1 (en) | Light emitting device and manufacturing method thereof | |
| JPH1065300A (en) | Interposer substrate and manufacture thereof | |
| CN114007342A (en) | Preparation method of backlight source | |
| KR20190086129A (en) | Led module and method for making the same | |
| KR0149721B1 (en) | A method of setting printed circuit by using anisotropic conductive adhesive | |
| JP2015111743A (en) | Light emitting device and method for manufacturing the same | |
| CN212400588U (en) | Printing screen | |
| CN112802944A (en) | High-contrast LED display device and manufacturing method and module thereof | |
| CN113809114A (en) | Manufacturing method of LED display module and LED display module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040805 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040824 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041022 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20041130 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20041215 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081224 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081224 Year of fee payment: 4 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081224 Year of fee payment: 4 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081224 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091224 Year of fee payment: 5 |
|
| LAPS | Cancellation because of no payment of annual fees |