JP2000199832A - Optical fiber supporting device and semiconductor device manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical fiber supporting device for monitoring, which is simple and high in condensing ability, and a semiconductor device manufacturing device. SOLUTION: The optical fiber supporting device Al is provided with a lens holder 1 housing optical lenses 3, 4 and an optical fiber fixing part 5 provided with a fiber coupler 6 for holding the end part of an optical fiber F at its tip. A screw groove 9 to be engaged with a male screw formed on a cylindrical surface inside of the holder 1 is formed on a cylindrical surface outside of the part 5. It is possible to make the focal position of the lens 4 coincide with the end surface of the fiber F while making the optical axes of the lenses 3, 4 and the center of the fiber F coincide with each other by relatively rotating the holder 1 and the part 5. Optical observation can be executed by using this device Al.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus, and more particularly, to a monitoring apparatus for performing an optical evaluation during a manufacturing process of a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art In recent years, with the progress of high integration of semiconductor integrated circuits, there is a demand for miniaturization and high performance of elements such as transistors, which are constituent elements of MOS devices. However, miniaturization of elements such as transistors must not impair the reliability of the entire device. Therefore,
There is a demand for miniaturization and reliability improvement of each element constituting an element such as a transistor.

By the way, in order to realize both miniaturization and reliability of a semiconductor device, it will be indispensable in the future to evaluate the quality of a semiconductor device manufacturing process in-line. In that case, the optical evaluation method is a nondestructive inspection, and is a method that can easily observe the inside of the reaction chamber for performing the manufacturing process. Therefore, the optical evaluation method can be an extremely effective means for monitoring a manufacturing process.

For example, light modulation reflectance spectroscopy is a method for evaluating the characteristics of a semiconductor region by detecting a change in the reflectance of measurement light while intermittently irradiating the semiconductor region with excitation light. Specifically, based on the difference between the reflectance when the excitation light is irradiated and the reflectance when the excitation light is not irradiated, the characteristic in the semiconductor region is determined from the spectral shape of the change rate of the reflectance. Information about is obtained. By utilizing such optical evaluation, it is possible to determine whether or not various processes such as dry etching and heat treatment are appropriate, and to control the processes. Optical measurement such as optical reflectance spectroscopy requires irradiating measurement light or excitation light to a predetermined portion of a wafer to be measured, and obtaining a signal with extremely high sensitivity and as little noise as possible. A high-precision optical measuring device is required.

[0005] In addition, when detecting the etching end point from the change in plasma emission in the chamber, or when judging the maintenance time of the chamber based on the infrared absorptivity of deposits attached to the window of the chamber, etc., a highly sensitive optical system is used. Means for performing dynamic observation are required.

[0006]

However, an optical system conventionally used for optical measurement includes a light source, an optical lens for forming a parallel light beam, an optical lens for narrowing a light beam to a minute point, on an optical bench. Since a phase plate (polarizing plate) and the like are arranged, it is not suitable for use in a manufacturing process of a semiconductor device regardless of a laboratory. In particular, when a manufacturing apparatus itself is compactly arranged in a converged space as in recent years, a space for installing an optical measuring apparatus is extremely limited. In general, operations such as optical axis alignment of an optical system require skill and a great deal of time. Therefore, it is actually difficult to use the conventional optical system as it is for monitoring in a production line.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a compact and highly accurate optical system at a junction between an optical fiber and a chamber for performing optical observation while using the optical fiber. An object of the present invention is to provide an optical fiber supporting device and a semiconductor device manufacturing device suitable for in-line optical monitoring by taking measures that can be configured.

[0008]

An optical fiber supporting device according to the present invention comprises: a cylindrical holder having a thread formed on at least a part of a cylindrical surface; and at least one optical lens housed inside the cylindrical holder. A cylindrical support member having a screw engaged with a screw of the cylindrical holder formed on at least a part of the cylindrical surface and a function of fixing an end of the optical fiber, the cylindrical holder and the cylindrical By rotating the support member relatively, the focal position of the optical lens can be made to coincide with the end face of the optical fiber.

Thus, the optical system necessary for condensing and forming parallel rays can be housed in the cylindrical holder. The relative rotation between the cylindrical holder and the cylindrical support member causes almost no displacement between the center of the optical fiber and the optical axis of the optical lens when performing operations such as adjusting the focal position of the optical lens to the end face of the optical fiber. Since it does not occur, skill and long time work are not required for optical axis alignment.
Then, light such as laser light emitted radially from the end face of the optical fiber can be introduced into the container as a parallel light beam, or can be focused on a minute point (for example, a measured portion of a wafer) in the container and irradiated. . Conversely, it is also possible to efficiently collect the emitted light and the parallel light from one portion in the container and send it to the optical fiber.

Therefore, it is possible to perform optical observation using an optical fiber with high sensitivity while having a simple structure.

In the above-mentioned optical fiber supporting device, it is preferable that the cylindrical holder has a mechanism for detachably supporting the optical filter.

In the optical fiber supporting device, two convex optical lenses are housed in the cylindrical holder, and the light received by one of the two optical lenses is converted into a parallel light beam while the other optical lens is used. By condensing the parallel rays at the focal position, it becomes possible to condense the light emitted from the optical fiber or to efficiently send the light radiated from a part to the optical fiber.

A semiconductor device manufacturing apparatus according to the present invention comprises a container for processing a wafer, an observation means for observing light emitted from the container, and a light guide for guiding light emitted from the container to the observation means. A light guiding optical fiber and a light guiding optical fiber supporting device attached to a part of the container and supporting the light guiding optical fiber, wherein the light guiding optical fiber supporting device is at least a part of a cylindrical surface. A cylindrical holder having a screw formed therein, at least one optical lens housed inside the cylindrical holder, and a screw engaged with the screw of the cylindrical holder formed on at least a part of a cylindrical surface. A cylindrical support member having a function of fixing the end of the optical fiber, and relatively rotating the cylindrical holder and the cylindrical support member. More, and the focal position of the optical lens is configured to be able to match the end face of the optical fiber for the light derived.

Thus, the optical observation in line during the manufacturing process of the semiconductor device can be performed by using the optical fiber supporting device capable of optical observation with high sensitivity while having the above-mentioned miniaturized structure. It is possible to do.

In the semiconductor device manufacturing apparatus, a light generating means for generating measuring light, a light introducing optical fiber for guiding the measuring light into the container, and a light supporting optical fiber for supporting the light introducing optical fiber. The optical fiber supporting device for light introduction further includes a cylindrical holder in which a screw is formed on at least a part of a cylindrical surface, and at least one of the cylindrical holders housed in the cylindrical holder. An optical lens and a cylindrical support member having a screw engaging with a screw of the cylindrical holder formed on at least a part of the cylindrical surface and a function of fixing an end of the optical fiber; And the cylindrical support member are relatively rotated so that the focal position of the optical lens coincides with the end face of the light introducing optical fiber. Doo is capable constitute, the light derived optical fiber supporting unit, the measurement light introduced into the container from the light introducing optical fiber supporting unit can be attached to a position out from the container.

This makes it possible to perform in-line optical observation of the reflectance and absorptance of the measuring light.

In the above-mentioned semiconductor device manufacturing apparatus, a spherical member for holding the light introducing optical fiber supporting device and the light guiding optical fiber supporting device on a spherical surface is further provided to change the focal position of the measuring light. Without doing so, it is possible to finely adjust the degree of opening between the two optical fiber supporting devices, and workability when performing optical observation is improved.

In the above-described apparatus for manufacturing a semiconductor device, the spherical member may be moved by the same amount in a direction opposite to each other on the spherical surface so that the optical fiber supporting device for light introduction and the optical fiber supporting device for light deriving are moved. By making the configuration possible, the workability when performing optical observation is further improved.

The apparatus for manufacturing a semiconductor device may further include an excitation light supply means for intermittently introducing the excitation light into the wafer, and the observation means may determine whether the wafer is being irradiated with the excitation light. It is configured to observe the reflectance of the measurement light when it is not performed and to evaluate the characteristics of the measured portion of the wafer by light modulation reflectance spectroscopy based on the observation result of the observation means. You can also.

In the above-described semiconductor device manufacturing apparatus, the containers may be clustered as a common container that surrounds a space including a plurality of processing chambers for processing a wafer in an atmosphere that is shielded from the atmosphere. Even when performing a series of processes while suppressing the formation of dirt and natural oxide film on the surface by shielding the wafer from the atmosphere, the inline optical system can be used without impairing the superiority of the clustered manufacturing equipment. Observations can be made.

[0021]

(First Embodiment) FIG. 1 is a sectional view showing the internal structure of an optical fiber supporting device A1 for guiding light according to a first embodiment of the present invention. FIG. 2 is a perspective view schematically showing an external structure of the optical fiber supporting device A1. Hereinafter, the optical fiber support device A1 according to the present embodiment will be described with reference to FIGS.

1 and 2, reference numeral 1 denotes an inner diameter of about 20.
mm is a cylindrical lens holder, 2 is an optical filter, 3 is a first optical lens for converting the radial light rays 10 emitted from the light source 11 into parallel light rays, and 4 is a second optical lens for condensing parallel light rays. Optical lens, 5 is an optical fiber fixing part,
Reference numeral 6 denotes a fiber coupler mounted on the optical fiber fixing portion 5, reference numeral 7 denotes a ring for fixing the first optical lens 3, and reference numeral 8 denotes a constant distance between the first optical lens 3 and the second optical lens 4. And a cylindrical fixing member for fixing the second optical lens 4. The combined length of the lens holder unit 1 and the optical fiber fixing unit 5 can be adjusted in accordance with the relative rotation between them, with a center of about 100 mm.

As shown in FIG. 2, a male screw 9 is formed on the outer cylindrical surface of the optical fiber fixing portion 5. On the other hand, although not shown, a female screw is also formed on the inner cylindrical surface of the lens holder portion 1, and the female screw and the male screw 9 of the optical fiber fixing portion 5 are configured to engage with each other. . The distance between the second optical lens 4 and the fiber coupler 6 can be adjusted by rotating the optical fiber fixing part 5 and the lens holder part 1 relatively. That is, the focal position of the second optical lens 4 is made coincident with the base end face of the optical fiber, and the light beam 10 emitted from the light source 11 can be focused on the optical fiber without waste. Male threads are also formed on the outer cylindrical surfaces of the fixing member 8 and the ring 7 so that the position of the first optical lens 3 can be adjusted.

The optical fiber supporting device A1 shown in FIG.
Naturally, it can be used as an optical fiber supporting device for introducing light. In that case, the light source is installed on the distal end side of the optical fiber F, and the light emitted from the base end face of the optical fiber F is converted into a parallel ray by the second optical lens 4, and the first optical lens 3 The dimensions of each part can be set so that the parallel rays are condensed and the measured light is irradiated on the part to be measured with a minute light beam. Even if the light source emits laser light, the laser light has a property of spreading when passing through the optical fiber and then out of the optical fiber. Therefore, the same effects as described above can be exerted even when the optical fiber supporting device A1 according to the present embodiment is used as an optical fiber supporting device for introducing measurement light generated by a light source that emits laser light.

As described above, according to the optical fiber supporting device A1 of this embodiment, it is not necessary to perform any special operation for so-called optical axis alignment for aligning the optical axis Oax of the optical lens with the center of the optical fiber F, and The structure of the optical system can be simplified as compared with an optical system using a conventional optical bench. In addition, such an optical fiber supporting apparatus A1 has an optical system that is collectively housed in a common cylindrical member, so that it can be easily used in a manufacturing apparatus having only a very limited space, such as a clustered manufacturing apparatus. Can be installed.

Further, a male screw 9 is formed on the outer cylindrical surface of the optical fiber fixing portion 5, and a female screw is formed on the inner cylindrical surface of the lens holder portion 1 so as to engage with the male screw. By easily adjusting the position of the optical lens 4 and the fiber coupler 6, the focal position of the second optical lens 4 can be made to coincide with the base end surface of the optical fiber F.

Note that a male member 9 on the outer cylindrical surface of the optical fiber fixing portion 5 and a female member on the inner cylindrical surface of the lens holder portion 1 are not provided, and the two members are formed as a cylindrical member that slides relatively. There may be a method in which a vertical set screw is provided in the cylindrical portion of the lens holder unit 1 and the optical fiber fixing unit 5 is fixed with the set screw. However, in such a method, since the inner optical fiber fixing portion 5 is inclined with respect to the optical axis of the lens holder portion 1 when fixing with the set screw, a special operation is required to align the two optical axes. Become. On the other hand, in the method of the present embodiment, since the optical fiber fixing section 5 and the lens holder section 1 are only relatively rotated, there is no mechanical displacement of the optical axis center between the two. Since there is no shift of the center of the optical axis, focusing can be performed easily and with high accuracy.

As a result, in the optical fiber supporting apparatus A1 of this embodiment, the position of the light source 11 shown in FIG. When a beam is installed to measure the intensity of the light beam from the part to be measured, that is, when it is used for monitoring in semiconductor manufacturing equipment, the light-gathering capacity is much higher than that of a mechanism using only an optical fiber and a fiber coupler. Rises. In our observations, Ar plasma was supplied at 100 mTorr and 300 W RF.
When the discharge was performed, the voltage of the photomultiplier receiving the light generated by the Ar plasma increased relatively five times or more.

In the optical measurement, it is possible to obtain a sufficient amount of light by increasing the lens diameter, but it is not necessary to use an excessive amount of light.
1, a sufficient amount of light can be obtained and the size can be reduced.

Further, by further providing a mechanism for supporting an optical filter or the like in the optical fiber supporting device A1 in the present embodiment, it becomes easy to obtain a signal in a specific wavelength region or to obtain a spectrum.

Although the optical fiber supporting device A1 according to the present embodiment is provided with two convex lenses, the present invention is not limited to such a configuration, and three or more optical lenses or a single An optical lens may be provided. The optical fiber supporting device A1 may include not only a convex lens but also a concave lens.

Further, the diameter of the optical fiber fixing part 5 is made larger than the diameter of the lens holder part 1, and a female screw is formed on the cylindrical surface inside the optical fiber fixing part 5, and
The same effect as in the present embodiment can be exerted by providing a male screw on each of the inner cylindrical surfaces and engaging the two with each other.

(Second Embodiment) Next, a second embodiment will be described. FIG. 3 is a longitudinal sectional view showing the configuration of the plasma processing apparatus according to the second embodiment. In FIG. 3, each symbol indicates the following element. 21 is a vertical cylindrical chamber, 22 is an LSI wafer on which a polysilicon film to be processed is deposited, 23 is a high frequency power supply (for example, a 13.56 MHz industrial power supply), 24 is a coupling capacitor, and 25 is a wafer. A cathode electrode which also functions as a mounting portion, 26 is an anode electrode, and 27 is a quartz window for monitoring provided on the side of the chamber 21.
A closed space surrounded by the chamber 1 is a reaction chamber Rre. The optical fiber supporting device A1 provided with the optical fiber, the optical lens, and the like described in the first embodiment is attached to the side surface of the chamber 21. Reference numeral 30 denotes a plasma region formed in the reaction chamber Rre;
Reference numeral 2 denotes an optical fiber for guiding the light from the optical fiber supporting device A1, and reference numeral 33 denotes a light detection / analysis device for detecting and analyzing (spectroscopy) light emission Lum from the plasma.

In the plasma processing apparatus of this embodiment,
First, an HBr gas and a Cl ₂ gas, which are etching gases, are introduced into the chamber 1 and discharged at a pressure of 100 mTorr, whereby a plasma region 30 is formed in the chamber 21. The power applied at this time is 200W. When the plasma region 30 is formed, active species functioning as an etching agent enter the polysilicon film of the wafer 22. Etching by-products formed by the reaction between the active species and the substance on the surface of the wafer 22 return to the plasma region 30.

FIG. 4 is a diagram showing the results of monitoring the time change of the emission intensity at a wavelength of 470.5 nm, which is considered to be derived from Br-Br bonds in the plasma etching of the polysilicon film. In the figure, the horizontal axis represents the etching time (second), and the vertical axis represents the emission intensity (relative value). For first sheet, as shown by the solid line D ₁ of the drawing shows the increase in clear luminous intensity etching end point. This is because, before the polysilicon film is completely removed, Si generated from the polysilicon film reacts with Br generated from HBr, so that a substance having a Br—Br bond is almost present in the plasma. Not
This is because when the polysilicon film is completely removed, many Br-Br bonds are present in the plasma. Therefore, if it is possible to detect a point where the intensity of the light emission Lum having a wavelength of 470.5 nm sharply increases, it is easy to detect the etching end point. However, after the processing of 1,000 wafers, as shown by the dotted line D' ₁₀₀₀ in the figure, no clear increase in the light emission intensity is shown, and it is difficult to determine the end timing of the etching. This is because the luminous intensity Lum from the plasma region 30 has not been sufficiently collected, so that the luminous intensity sensitivity has decreased. Therefore, conventionally, the determination is performed by making full use of an algorithm of maintenance or an analysis of a temporal change in light emission intensity. However, such a method has problems in operation rate, accuracy, and the like.

On the other hand, the plasma processing apparatus of the present embodiment
In the installation, using the optical fiber supporting device A1,
The light emission Lum from the plasma region 30 can be collected from a wide range.
Can observe the state of the plasma efficiently and with high accuracy.
You. That is, the broken line D in FIG. ₁₀₀₀As shown in
Indicates end point of etching even after processing 0 wafers
The amount of change in emission intensity is large. Therefore, the light emission Lum is detected.
It is possible to catch a large change in the intensity of the output signal
And it is possible to observe a sufficient number of lots
The effect can be exhibited. Further, the quartz window 27
Emission level by absorption by deposits on the inner surface of the
Of the maintenance period because
Can now be performed accurately.

According to the plasma processing apparatus of this embodiment,
The workability, measurement accuracy, measurement sensitivity, and compactness can be achieved by using the optical fiber support device A1, which can be installed in a narrow space and does not require skill in optical axis alignment, as a monitor for determining the end time of plasma processing. In this respect, it is possible to provide an optimal function for in-process monitoring.

(Third Embodiment) Next, a third embodiment of the present invention will be described. FIG. 5 is a longitudinal sectional view of the plasma processing apparatus according to the third embodiment. 3, the same members as those shown in FIG. 3 are denoted by the same reference numerals as those in FIG. 3, and description thereof will be omitted.

Here, in the present embodiment, an infrared ray generator 34, an optical fiber 35 for guiding the infrared ray generated by the infrared ray generator 34, and a first optical fiber supporting device A2 for supporting the optical fiber 35 are provided. , An optical fiber 36 for guiding the infrared light Inf that has passed through the inside of the chamber 21, and a second optical fiber supporting device A 3 for supporting the optical fiber 36. However, the optical fiber supporting devices A2 and A3 are mounted on quartz windows 28 and 27, respectively.

In this embodiment, the infrared rays Inf introduced from one of the quartz windows 28 are applied to the quartz windows 28, 27.
The maintenance time of the chamber 21 and the suitability of the plasma processing conditions are monitored by measuring the amount of absorption received by passing through the deposition film Dep deposited on the substrate.

FIG. 6 is a sectional view showing the structure of the optical fiber supporting devices A2 and A3 used in this embodiment. As shown in the figure, the optical fiber support device A according to the present embodiment
Reference numerals 2 and A3 have a structure in which the first optical lens 3 and the ring 7 in the optical fiber supporting device A1 shown in FIG. 1 are removed. In the first optical fiber supporting device A2, the infrared rays Inf emitted from the optical fiber 35 are converted into parallel rays by the optical lens 4 and introduced into the chamber 21. On the other hand, in the second optical fiber supporting device A3, the optical lens 4 condenses the infrared light Inf coming out of the chamber 21 as a parallel light beam on the base end surface of the optical fiber 36.

However, also in the present embodiment, two optical lenses may be arranged in each of the optical fiber supporting devices A2 and A3 to perform the same operation as in the first embodiment. In this case, the first optical fiber supporting device A2 condenses the infrared rays, which have been once converted into parallel rays, to one portion in the chamber 21 and the second optical fiber supporting device A3.
As a result, the infrared rays once converted into parallel rays are focused on the optical fiber 36. Needless to say, three or more optical lenses may be arranged in each of the optical fiber supporting devices A2 and A3.

According to the present embodiment, even when performing infrared absorption spectroscopy in a semiconductor device manufacturing process using a plasma processing apparatus, the plasma processing can be easily monitored using the optical fiber supporting devices A2 and A3 incorporating the optical system. Can be performed. In particular, in the case of measurement of infrared absorption spectroscopy, generally, the optical axis alignment between the light incident side and the light emitting side is troublesome, but by using the structure of the present embodiment,
No troublesome labor is required for such optical axis alignment.

(Fourth Embodiment) Next, a fourth embodiment will be described. FIG. 7 is a sectional view of an optical measurement chamber 50 which is a part of the semiconductor manufacturing apparatus according to the fourth embodiment. The optical measurement chamber 50 in the present embodiment is assumed to be arranged in a clustered manufacturing apparatus and configured to be able to perform light modulation reflectance spectroscopy, as described later. The wafer 41 and the wafer 41 are placed in the optical measurement chamber 50.
And a wafer table 42 for placing the wafer. A quartz window 44 is provided on the ceiling surface of the chamber 40, and optical fiber supporting devices 46 and 4 are provided on the quartz plate 44.
A spherical member 45 for placing the 7, 48 is placed. Here, each of the above optical fiber supporting devices 46 to 48 is used.
Have the structure shown in FIG. 1 in the first embodiment. The radius of curvature of the slide surface on which the optical fiber supporting devices 46 and 47 move in the spherical member 45 is configured to substantially match the radius of a sphere centered on the measured portion of the wafer 41.

FIG. 8 is a block diagram schematically showing a configuration of an apparatus for manufacturing a clustered semiconductor device according to the present embodiment. In the figure, 51 is a cleaning chamber,
52 is a high-speed oxidation (Rapid Thermal Processing) chamber, 53 is a load lock chamber, 54 is a wafer cooling chamber, and 55 is a wafer load / unload unit. That is, the load lock chamber 53 and the chambers 50, 51, 52, 54,
55 functions as a common container that surrounds a space under a reduced-pressure atmosphere shielded from the atmosphere, and is a so-called clustered manufacturing apparatus. For example, in the process of forming an oxide film, the wafer is cleaned in the cleaning chamber 51 and subsequently oxidized in the high-speed oxidation chamber 52. At that time, the natural oxide film on the wafer is removed in the wafer cleaning step. In addition, load lock room 5
Numeral 3 is configured to optimize and process the transfer of the wafer, and the inside thereof is reduced in pressure. Therefore, even after the completion of the cleaning step, the wafer surface is not oxidized due to exposure to the atmosphere. Then, the optical measurement chamber 50
Are arranged in a common space of the clustered manufacturing apparatus. In the optical measurement chamber 50, a light source 57 for excitation light (Ar ion laser) and a light source 58 for measurement light are provided.
(150 W Xe lamp), a photodetector 59 for detecting the intensity of the reflected light of the measurement light, and a light source 5 for the measurement light, respectively.
8. Optical fibers 61, 62, and 63 serving as light guide paths between the photodetector 59 and the light source 57 for excitation light and the optical measurement chamber 50, and control of equipment at the time of measurement by light modulation reflectance spectroscopy. And a control / analysis system 60 for calculating and analyzing data and the like. The excitation light guided to the optical fiber supporting device 48 is 500 Hz
This is a mechanism for modulating the surface of the semiconductor region of the wafer and observing a change in the reflectance at that time.
This light modulation reflectance spectroscopy (reference: for example, A. Fujimoto
Jpn. J. Appl. Phys. Vol. 34, p. 804, 1995)
It is possible to accurately evaluate the wafer surface condition.

FIG. 9 is a perspective view showing the three-dimensional structure of the spherical member 45. As shown in the figure, a movable portion 49 is provided on the spherical member 45 so that the optical fiber supporting devices 46 and 47 can move. In that case, not shown,
2 attached to each optical fiber support device 46, 47
With a known structure in which the two racks and a pinion attached to the center of the spherical member 45 are engaged with each other, the respective optical fiber supporting devices 46 and 47 move in the opposite direction in conjunction with each other, and the position after the movement. In this configuration, the inclination angles θ of the optical fiber supporting devices 46 and 47 from the center are always equal to each other. Further, the entire spherical member 45 is two-dimensionally moved on the quartz window 44 of the optical measurement chamber 50 so that a measurement area can be selected. The movement of each of the above-described units is configured to be performed by remote control. With such a structure, after the measurement light is converged on a minute area on the wafer surface, the reflected measurement light can be reliably detected.

Each of the optical fiber supporting devices 46, 47
It is also possible to finely tilt each of the optical fiber supporting devices 46 and 47 with respect to the normal line of the spherical surface of the spherical member 45 at the mounting portion. Due to this inclination, the wafer 4
It is possible to adjust the focal position of the measurement light in the one measured section in the vertical direction. The position of the first optical lens 3 can be adjusted by the ring 7 and the fixing member 8 in the optical fiber supporting device A1 shown in FIG.
It is easy to adjust the focal position of an optical lens (not shown) in each of the optical fiber supporting devices 46 and 47 corresponding to the first optical lens 3 shown in FIG.

Although the conventional optical system requires a wide physical space as described above, the use of the optical fiber supporting devices 46 to 47 and the spherical member 45 in the present embodiment makes it possible to reduce the required space. Can be. Therefore, even in a manufacturing apparatus that can secure only a very limited space like a clustered manufacturing apparatus,
Light modulation reflectance spectroscopy can be performed in-line. In particular, because it uses optical fiber,
The light sources 57 and 58, the photodetector 59, and the like can be arranged outside the manufacturing apparatus. By applying the invention to a clustered manufacturing apparatus, a significant effect can be obtained.

In optical measurement such as light modulation reflectance spectroscopy, sufficient sensitivity was not obtained even when an optical fiber was incorporated in a conventional optical system. However, the optical fiber supporting devices 46 to 48 of this embodiment were used. In such a case, a sufficiently high sensitivity can be obtained.

FIG. 10 is a diagram showing the spectrum of a signal (ΔR / R) obtained by light modulation reflectance spectroscopy in the present embodiment, comparing the apparatus of the present embodiment with a conventional optical system in which an optical fiber is incorporated. It is. The vertical axis in FIG. 10 indicates the difference between the reflectance (R ′) of the measurement light when the excitation light is irradiated and the reflectance (R) when the excitation light is not irradiated, and the excitation light is irradiated. Represents the rate of change in reflectance (ΔR / R) obtained by dividing by the reflectance (R) when not performed, and the horizontal axis represents the wavelength of the measurement light. That is, FIG. 10 shows the spectrum of the change ratio (ΔR / R) of the reflectance obtained by changing the wavelength of the measurement light.

As can be seen from the figure, while the signal Sconv of the conventional device does not provide a sufficient signal strength, the signal Sinve of the device of the present embodiment shows a remarkably large signal strength. Measurement accuracy has also improved.
As a result, the manufacture of a high-quality and trouble-free semiconductor device can be promoted by optically and accurately managing the cleaning → the formation of the gate insulating film.

In the present embodiment, each of the optical fiber supporting devices 46 and 47 is moved on a spherical surface, but may be moved on a plane. In this case, if the inclination angle θ of each of the optical fiber supporting devices 46 and 47 is not changed, the vertical position of the measured portion can be adjusted by changing the distance between the two. The vertical position of the measured portion can be adjusted by changing the inclination angle θ between the two.

Further, in the structure shown in FIG. 7, the radius of curvature of the sliding surface of the optical fiber supporting devices 46 and 47 of the spherical member 45 is deviated from the value of the radius of the spherical surface centered on the measured portion of the wafer 41. The tilt angle θ and the vertical focus position may be adjusted simultaneously.

[0054]

According to the optical fiber supporting device of the present invention, screws are provided for engaging each other on the cylindrical surfaces of the cylindrical holder for holding the optical lens and the cylindrical supporting member for fixing the end of the optical fiber. By aligning the focal position of the optical lens with the end of the optical fiber by the relative rotation of the two members, an optical system that does not require skilled or long-time work for optical axis alignment can be configured. It is possible to provide a compact and highly sensitive optical observation system that is used.

According to the semiconductor device manufacturing apparatus of the present invention,
In a semiconductor device manufacturing apparatus for processing a wafer,
By providing the optical fiber, the optical fiber support device, and the observation means, it is possible to perform in-line optical observation during the manufacturing process of the semiconductor device using the optical fiber support device.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an optical fiber supporting device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the optical fiber support device according to the first embodiment of the present invention.

FIG. 3 is a sectional view of a plasma processing apparatus according to a second embodiment of the present invention.

FIG. 4 is a diagram comparing the degree of decrease in the end point detection function of the plasma processing apparatus according to the second embodiment with the number of processed wafers with data obtained by a conventional apparatus.

FIG. 5 is a sectional view of a plasma processing apparatus according to a third embodiment of the present invention.

FIG. 6 is a sectional view of an optical fiber support device used in a third embodiment.

FIG. 7 is a cross-sectional view of a chamber and an optical fiber supporting device attached to a spherical member according to a fourth embodiment of the present invention.

FIG. 8 is a block diagram schematically illustrating a configuration of a clustered manufacturing apparatus according to a fourth embodiment.

FIG. 9 is a perspective view showing a structure when a function of sliding an optical fiber supporting device is added to a spherical member according to a fourth embodiment.

FIG. 10 is a diagram showing a modulated reflectance spectrum obtained by using the optical system according to the fourth embodiment in comparison with data obtained by a conventional optical system.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lens holder part (cylindrical holder) 2 Optical filter 3 1st optical lens 4 2nd optical lens 5 Optical fiber fixing part (cylindrical support member) 6 Fiber coupler 7 Ring 8 Fixing member 9 Screw groove 10 Light beam 11 Light source DESCRIPTION OF SYMBOLS 21 Chamber 22 Wafer 23 High frequency power supply 24 Coupling capacitor 25 Cathode electrode 26 Anode electrode 27, 28 Quartz window 30 Plasma area 32 Optical fiber 33 Optical detection / analysis apparatus 34 Infrared ray generator 35, 36 Optical fiber A Optical fiber support apparatus F Optical fiber Oax Optical axis Dep Depo film Inf Infrared

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H037 AA04 CA21 DA04 DA05 DA06 4K057 DA20 DB06 DD03 DE01 DE11 DJ02 DJ03 DJ07 DM02 DM03 DN01 5F004 AA16 BA04 BA09 CA06 CB02 DA00 DA04 5F045 DP01 DP02 DQ10 EH13 EH14 GB08 GB10

Claims (9)

[Claims] 1. A cylindrical holder in which a screw is formed on at least a part of a cylindrical surface, at least one optical lens housed inside the cylindrical holder, and the above-mentioned lens formed on at least a part of the cylindrical surface. A cylindrical support member having a screw engaging with a screw of the cylindrical holder and a function of fixing an end of the optical fiber; and a relative rotation of the cylindrical holder and the cylindrical support member, An optical fiber supporting device, wherein a focal position of an optical lens is made to coincide with an end face of the optical fiber. 2. The optical fiber supporting device according to claim 1, wherein the cylindrical holder has a mechanism for detachably supporting the optical filter. 3. The optical fiber supporting device according to claim 1, wherein the cylindrical holder accommodates two convex optical lenses, and receives the convex optical lens by one of the two optical lenses. An optical fiber supporting device configured to convert the collimated light into a parallel light beam and to condense the parallel light beam to a focal position by another optical lens. 4. A container for processing a wafer, observation means for observing light emitted from the container, an optical fiber for guiding light emitted from the container to the observation means, and the container And a light guiding optical fiber supporting device for supporting the light guiding optical fiber, wherein the light guiding optical fiber supporting device has a cylindrical shape in which a screw is formed on at least a part of a cylindrical surface. A holder; at least one optical lens housed inside the cylindrical holder; and a function for fixing an end of the optical fiber to a screw engaging with a screw of the cylindrical holder formed on at least a part of a cylindrical surface. And a cylindrical support member having the following: a focus of the optical lens by relatively rotating the cylindrical holder and the cylindrical support member. Apparatus for manufacturing a semiconductor device characterized by being configured to be capable to match the location on the end face of the optical fiber for the light derived. 5. The apparatus for manufacturing a semiconductor device according to claim 4, wherein: a light generating means for generating measuring light; a light introducing optical fiber for guiding the measuring light into the container; The optical fiber supporting device for light introduction for supporting an optical fiber is further provided, wherein the optical fiber supporting device for light introduction includes a cylindrical holder in which a screw is formed on at least a part of a cylindrical surface, and an inside of the cylindrical holder. At least one optical lens housed therein, and a cylindrical support member having a screw engaging with a screw of the cylindrical holder formed on at least a part of a cylindrical surface and having a function of fixing an end of the optical fiber. And, by relatively rotating the cylindrical holder and the cylindrical support member, the focal position of the optical lens is adjusted to the end face of the light introducing optical fiber. It is configured to be able to match, the light guiding optical fiber support device is attached at a position where the measurement light introduced into the container from the light introduction optical fiber support device is emitted from the container. Characteristic semiconductor device manufacturing equipment. 6. An apparatus for manufacturing a semiconductor device according to claim 5, further comprising a spherical member for holding said light introducing optical fiber supporting device and said light guiding optical fiber supporting device on a spherical surface. Characteristic semiconductor device manufacturing equipment. 7. The apparatus for manufacturing a semiconductor device according to claim 5, wherein the spherical member interlocks the light introducing optical fiber supporting device and the light guiding optical fiber supporting device by the same amount in opposite directions on a spherical surface. An apparatus for manufacturing a semiconductor device, characterized in that the apparatus is configured to be able to be moved. 8. The semiconductor device manufacturing apparatus according to claim 5, further comprising: an excitation light supply means for intermittently introducing excitation light into said wafer; and said observation means irradiating said wafer with excitation light. It is for observing the reflectance of the measurement light when it is being irradiated and when it is not illuminated. Based on the observation result of the above-mentioned observation means, the characteristics of the measured portion of the wafer are measured by light modulation reflectance spectroscopy. An apparatus for manufacturing a semiconductor device, which is configured to be able to be evaluated. 9. An apparatus for manufacturing a semiconductor device according to claim 4, wherein the container has a space in which a space including a plurality of processing chambers for processing a wafer is shielded from the atmosphere. An apparatus for manufacturing a semiconductor device, wherein the apparatus is a common container that is surrounded so as to be maintained in a cluster and is clustered.