JP2000195938A - Wafer carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably control variations in the surface resistance of molded articles by forming a wafer carrier of polyether aromatic ketone, having a repeating unit expressed by a prescribed formula and of carbon fiber having a prescribed diameter and a prescribed length and by controlling the surface resistance of such a wafer carrier within a prescribed narrow range. SOLUTION: This wafer carrier contains 90-60 wt.% of polyether aromatic ketone and 10-40 wt.% of carbon fiber. The polyether aromatic ketone has a repeating unit expressed by a formula. The carbon fiber has an average fiber diameter of 3-25 μm and an average fiber length of 50-70,000 μm. Furthermore, the wafer carrier has a surface resistance R which satisfies the inequality, Rmin <= R <= Rmax, where Rmin is the minimum surface resistance of the wafer carrier which equals 106 Ω, and Rmax is its maximum surface resistance which is equal to 1012 Ω. With this arrangement, troubles due to electrical short circuits can be prevented, and adhesion of dust and the like during use can also be suppressed satisfactorily.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition suitable for a molded article used in the field of electric and electronic technology. The invention also relates to molded articles used in the field of electrical and electronic technology. Specific examples of the molded article include, for example, a holding container having a function of holding a semi-finished product or product in a manufacturing process, which is used in a semiconductor manufacturing technology field or a glass substrate manufacturing technology for liquid crystal display. Other specific examples of the molded article include, for example, trays, tweezers, jigs, and the like used in the semiconductor manufacturing technology field and the glass substrate manufacturing technology field for liquid crystal display. As another specific example of the molded product, for example, a molded product used for a part of an electric / electronic component such as a socket can be given.

[0002]

2. Description of the Related Art For example, in the field of semiconductor manufacturing technology and glass substrate manufacturing technology for liquid crystal display, a holding container having a function of holding a semi-finished product or product in a manufacturing process is used.
The surface resistance value is 1 as shown in Expression (1) (Equation 1).
It is required to be controlled narrowly within the range of × 10 ⁶ [Ω] to 1 × 10 ¹² [Ω]. The reason is that by controlling the surface resistance value of such a molded product, it is used as a wafer carrier for manufacturing semiconductors, a glass substrate holding container for manufacturing glass substrates for liquid crystal display, and even electrical and electronic components. In this case, a trouble due to an electric short circuit can be prevented beforehand, and adhesion of dust and the like during use can be sufficiently suppressed.

[0003] For the same reason, the electric and electronic parts also have a surface resistance in the range of 1 × 10 ⁶ [Ω] to 1 × 10 ¹² [Ω] as shown in Expression (1) (Equation 1). Is required to be narrowly controlled. As a resin composition capable of providing a molded product exhibiting a performance capable of controlling the surface resistance value of such a molded product in the range of 10 ⁶ to 10 ¹² [Ω], a thermoplastic resin may be used. Or
There is a resin composition in which conductive fibers such as metal fibers are added at a predetermined ratio. Among the thermoplastic resins, polyether aromatic ketone resins are excellent in heat resistance, chemical resistance, and low water absorption, so they are manufactured in the semiconductor manufacturing technology field and the glass substrate manufacturing technology field for liquid crystal display, and furthermore, It is used as a material suitable for electric and electronic parts.

[Japanese Patent No. 2635253 (Japanese Unexamined Patent Application Publication No.
Japanese Patent No. 2635253 (Japanese Patent Application Laid-Open No. 5-117446) discloses a polymer composition having a suppressed chargeability and a practical insulating property, and an electric power for enabling the polymer composition. A technique relating to a resistance control method is disclosed. Volume specific resistance is 10 ^-1 to
One or more short fibers of 10 ³ [Ωcm]
The short fiber-containing polymer composition having a volume resistivity of 10 ⁵ to 10 ¹³ [Ωcm], which is composed of [wt%] and a polymer of 90 to 60 [wt%], and a volume resistivity of
10 ^-1 [Ωcm] or less of one or more short fibers, and a volume resistivity of 10 ^-1 [Ωcm] or one or more kinds of mixture 10 to 40 parts by weight and the polymer of the short fibers is 90 to 60 Volume specific resistance of 10 ⁵ consisting of parts by weight
The polymer composition containing short fibers having a volume resistivity of 10 ⁵ to 10 ¹³ [Ωcm] and a volume resistivity of 10 ⁵ to 10 ^13.
A technique for controlling the resistance to [Ωcm] is disclosed.

[Japanese Patent Application Laid-Open No. 10-007898]
No. 0-007898 discloses a technique relating to a semiconductor wafer processing / processing carrier excellent in rigidity, dimensional stability, antistatic property and abrasion resistance, and a polyetherketone resin composition providing the same. More specifically, the average fiber diameter is 5 to 20 μm and the average fiber length is 30 to 5 with respect to 100% by weight of the polyetherketone resin.
Carbon fiber 5 to 10 [00m]
0 [% by weight], and the surface resistivity is 10 ⁸
To 10 ¹² [Omega] polyetherketone resin composition is,
And processing of a semiconductor wafer formed with the resin composition.
A technique relating to a processing carrier is disclosed.

[0006] However, the carbon fiber, which is one of the particulars of the present invention, is a general-purpose carbon fiber, and therefore has high conductivity (having a volume resistivity of 1 × 10 ^-2 [Ωc].
m]), if the carbon fiber addition amount and the like are not sufficiently considered, the molded product can be used as a wafer carrier for semiconductor production,
When used as a glass substrate holding container for manufacturing a glass substrate for a liquid crystal display, and further as an electric / electronic component, there is a possibility that a trouble due to an electric short circuit or adhesion of dust or the like during use may occur.

That is, if the amount of carbon fiber added is small, the variation in the surface resistance value becomes large, and a portion exceeding 10 ¹² [Ω] is partially formed in the same molded product. Could be the cause of the Further, there is a possibility that the strength, rigidity and dimensional stability of the molded product cannot be sufficiently secured. Also, as the amount of carbon fiber added increases, the surface resistance decreases sharply, and there are some places where the surface resistance of the molded product is partially reduced in the same molded product, which may cause trouble due to electrical short-circuit. there were.

[0008]

DISCLOSURE OF THE INVENTION The present invention relates to a resin composition in which the variation in the surface resistance of a molded article is stably controlled between 10 ^{6 and} 10 ¹² [Ω], and a resin composition obtained from the resin composition. The object of the present invention is to provide a molded product to be obtained and a molded product in which the surface resistance value of the post-processed cut surface is stably controlled to 10 ⁶ to 10 ¹² [Ω].

[0009]

Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, have completed the present invention. The present invention is specified by the following items [1] to [11].

[1] Polyether aromatic ketone 90-
60% by weight and carbon fiber 10 to 40% by weight
Wherein the polyether aromatic ketone is a polyether aromatic ketone having a repeating unit represented by the chemical formula (1), and the carbon fiber has an average fiber diameter of 3 to 25 [μm], a high electrical resistance carbon fiber having an average fiber length of 50 to 70000 [μm], and the surface resistance R of the wafer carrier is:
A wafer carrier characterized by being narrowly controlled within the range of Expression (1) (Equation 7). In Equation (1) (Equation 7), Rmin is the minimum value of the surface resistance R of the wafer carrier, and is expressed by Equation (2) (Equation 8),
max is the maximum value of the surface resistance value R of the wafer carrier, and is represented by Expression (3) (Equation 9). ).

[0011]

(7) Rmin ≦ R ≦ Rmax (1)

[0012]

Rmin = 10 ⁶ [Ω] (2)

[0013]

## EQU9 ## Rmax = 10 ¹² [Ω] (3)

[0014]

Embedded image [2] High resistivity carbon fiber has a volume resistivity of 10 ^-2
The wafer carrier according to [1], wherein the wafer carrier has a resistivity of 10 to 10 ³ [Ωcm].

[3] The wafer carrier obtained by melt molding [1] or [2].
2. The wafer carrier described in 1. above.

[4] The wafer carrier according to [3], wherein the melt molding is injection molding.

[5] The wafer carrier according to [3], wherein the melt molding is extrusion molding.

[6] The wafer carrier according to [1] or [2], wherein at least a part of the wafer carrier is formed by cutting.

[7] The wafer carrier according to any one of [3] to [5], wherein at least a part of the wafer carrier is further secondary-cut.

[8] Polyether aromatic ketone 90-
60% by weight and carbon fiber 10 to 40% by weight
Wherein the polyether aromatic ketone is a polyether aromatic ketone having a repeating unit represented by the chemical formula (1) (Chemical Formula 2). The carbon fiber has a volume resistivity value of 10 ⁻² to 10 ³ [Ωcm], an average fiber diameter of 3 to 25 [μm], and an average fiber length of 50 to 70000 [μ].
m], and the surface resistance value R of the cut surface of the wafer carrier is controlled to be narrow in the range of Expression (1) (Equation 7). A wafer carrier having In Equation (1) (Equation 7), Rmin is the minimum value of the surface resistance value R of the wafer carrier, and is expressed by Equation (2) (Equation 8), and Rmax
Is the maximum value of the surface resistance R of the wafer carrier,
Equation (3) (Equation 9) shows. [9] Minimum value Rmin of surface resistance R of wafer carrier
And the number of digits of the variation of the surface resistance value calculated by Expression (4) (Equation 10) with respect to the maximum value Rmax of the surface resistance value R of the wafer carrier is 1 to 7,
The wafer carrier according to any one of [1] to [8].

[0021]

## EQU10 ## (the number of digits of the variation of the surface resistance value) = (logRmax)-(logRmin) +1 (4) (In the equation (4), Rmin is the minimum value of the surface resistance value R of the wafer carrier, and Rmax is Is the maximum value of the surface resistance R of the wafer carrier.) [10] Equation (5) (equation) for the surface resistance Rg at the gate portion of the wafer carrier and the surface resistance Rw at the weld portion of the wafer carrier. The wafer carrier according to any one of [1] to [8], wherein the number of digits of the variation of the surface resistance value calculated in 11) is 1 to 7.

[0022]

[Equation 11] (digit number of variation in surface resistance value) = | (logRg) − (logRw) | +1 (5) (In the expression (5), Rg is a gate portion of the wafer carrier (injection of molten resin during molding) Rw indicates the surface resistance value at the welded portion of the wafer carrier (the portion where the molten resin merges when the molten resin is injected from a plurality of gates), and "| (logR
g)-(logRw) |] represents “logRg” and “log
gRw ”. [11] The number of digits of the variation of the surface resistance value calculated by Expression (6) (Equation 12) between the surface resistance value Rg at the gate portion of the wafer carrier and the surface resistance value Re at the flow end portion of the wafer carrier. Is 1 to 7, the wafer carrier according to any one of [1] to [8].

[0023]

(Number of digits of variation of surface resistance value) = | (logRg) − (logRe) | +1 (6) (In the equation (6), Rg is the gate portion of the wafer carrier (the molten resin injected during molding). Part), the surface resistance value is shown, and Re is the flow end of the wafer carrier (the flow end of the molten resin when the molten resin is injected from the gate).
Shows the surface resistance value at “| (logRg) − (l
ogRe) |] indicates the absolute value of the difference between “logRg” and “logRe”. )

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION A molded article provided with conductivity according to the present invention
Has a repeating unit represented by the chemical formula (1)
Volume specific resistance to polyether aromatic ketone resin
10^-2-10 ^ThreeMix carbon fiber controlled to [Ωcm]
Manufactured from the composite material.

[PEEK] The polyether aromatic ketone used in the present invention has a melt viscosity of 50 to 3000 [Pa
[S] (500-30000 [Poise]). If it is less than 50 [Pa · s], the mechanical strength of the molded product is insufficient, and if it exceeds 3000 [Pa · s], the fluidity is reduced, and the moldability is deteriorated. The melt viscosity at this time is such that the resin heated to 400 [° C.]
[Mm], length 10 [mm] nozzle, load 100
It is the apparent melt viscosity measured when extruding in [kg].

[Carbon Fiber] The carbon fiber used in the present invention is a “highly electric resistance carbon fiber” described later. This high electrical resistance carbon fiber differs from so-called general “carbon fiber”, that is, “general-purpose carbon fiber” in electrical characteristics. Therefore, before describing the “high resistance carbon fiber”, a so-called general “carbon fiber” will be described below.

"Chemical Handbook, Applied Chemistry" (June 1, 1986)
(Jan. 15) Table 12.64 on page 967 describes the physical properties of various carbon fibers commercially available as general carbon fibers. In the column of the electrical resistivity, almost all are less than 1 × 10 ^-2 [Ωcm]. Here, the electrical resistivity may be referred to as a volume specific resistance value, an electrical resistivity, a specific resistance, a volume resistivity, or the like. In addition, a catalog issued by Toho Rayon Co., Ltd. shows that the volume resistivity of commercially available carbon fibers is 9 × 10 ^{−4 to} 1.5 × 10 ⁻³ [Ωcm], and chopped fibers mainly used in combination with resin. It is described that the typical value of the volume resistivity of the carbon fiber used for the milled fiber is 1.5 × 10 ⁻³ [Ωcm]. In addition, Otani Sugi et al., "Introduction to Carbon Fiber" (August 25, 1983), published by Ohmsha, 86
Tables 6 and 4 on the page show various carbon fibers (carbon fibers)
Electrical resistivity is described, almost all are 1 ×
It is less than 10 ^-2 [Ωcm].

[Carbon Fiber with High Electrical Resistance] The carbon fiber used in the present invention is “carbon fiber with high electrical resistance” described later. This high electrical resistance carbon fiber differs from so-called general “carbon fiber”, that is, “general-purpose carbon fiber” in electrical characteristics. That is, general carbon fiber is
In contrast to high conductivity and low electrical resistance, the important invention-specific matter of the present invention, “high electrical resistance carbon fiber” has low conductivity and high electrical resistance. It has specific electrical properties that contradict the electrical properties of typical carbon fibers.

The average diameter of the highly electrically resistant carbon fiber is 3 to
25 [μm], average fiber length 50 to 70000 [μm]
Is desirably within the range. If the average diameter of the high electrical resistance carbon fiber is less than 50 [μm], the conductivity increases sharply with respect to the added amount of the carbon fiber, and when the resin composition is formed into a molded product, the surface resistance of the molded product is reduced. It is difficult to control the value R to be narrow in the range of Expression (1) (Equation 7). If the average diameter of the high electrical resistance carbon fibers exceeds 70,000 [μm], the workability at the time of mixing with the resin is reduced.

The carbon fibers with high electrical resistance may be converged with a sizing agent or the like for the purpose of improving the workability of melt-kneading. In the present invention, the high electrical resistance carbon fiber is not particularly limited, but preferred specific examples thereof include, for example, Xylus G manufactured by Osaka Gas Chemical.
CA can be mentioned. High electrical resistance carbon fiber
It is possible to use only one type or to mix and use two or more types together.

[Volume Specific Resistance of Highly Electric Resistant Carbon Fiber] The carbon fiber used in the present invention is a high electric resistance carbon fiber, and its volume specific resistance is 1 × 10 ⁻² to 1 ×.
10 ³ [Ωcm], preferably 5 × 10 ^-2 to 1
× 10 ³ [Ωcm], more preferably 1 × 10 3
⁻¹ to 1 × 10 ³ [Ωcm], more preferably 5
× 10 ^-1 to 1 × 10 ³ [Ωcm], and more preferably 1 to 1 × 10 ³ [Ωcm]. If the volume resistivity is less than 10 ^-2 [Ωcm], the surface resistance of the composition rapidly decreases with respect to the added amount. R is calculated by the equation (1).
It becomes difficult to perform control narrowly within the range of (Equation 7). In Equation (1) (Equation 7), Rmin is the minimum value of the surface resistance value R of the molded product, and is represented by Equation (2) (Equation 8),
Rmax is the maximum value of the surface resistance value R of the molded product, and is represented by Expression (3) (Equation 9). Volume specific resistance is 10 ³
If it exceeds [Ωcm], addition of a large amount of carbon fiber is required to reduce the maximum value of the surface resistance R of the molded product to Rmax, which is a preferable numerical range represented by Expression (3) (Equation 9). It becomes necessary, and the moldability decreases.

[Surface resistance value of molded article]
The surface resistance value R of the molded product is controlled to be narrow in the range of the mathematical formula (1) (Equation 7). In Equation (1) (Equation 7), Rmin
Is the minimum value of the surface resistance value R of the molded product, and is expressed by Expression (2) (Equation 8). Rmax is the maximum value of the surface resistance value R of the molded product, and is expressed by Expression (3) ( It is shown by Equation 9). In the present invention, the minimum value R of the surface resistance value R of the molded article
min is 10 ⁶ [Ω], preferably 10 ⁷ [Ω]
, More preferably 10 ⁸ [Ω], and more preferably 10 ⁹ [Ω].

In the present invention, the maximum value Rmax of the surface resistance value R of the molded product is 10 ¹² [Ω], preferably 1
0 ¹¹ [Ω], more preferably 10 ¹⁰ [Ω], and more preferably 10 ⁹ [Ω]. In the present invention, the surface resistance value of the molded product is controlled to be narrow in the range of 1 × 10 ⁶ [Ω] to 1 × 10 ¹² [Ω] as shown in Expression (1) (Equation 7). By controlling the surface resistance value of such a molded product, it can be used as a wafer carrier for manufacturing semiconductors, a glass substrate holding container for manufacturing glass substrates for liquid crystal displays, and even when used as electrical and electronic components. A trouble due to a short circuit can be prevented beforehand, and adhesion of dust and the like during use can be sufficiently suppressed. That is, 10 ⁶
If it is less than [Ω], the surface resistance value is too low, which may cause a trouble due to an electric short. Also, 10
^If it exceeds ¹² [Ω], it may cause dust to adhere during use.

[Variation in Surface Resistance Value of Molded Article] In the specification of the present application, “variation in surface resistance value” of a molded article is defined as the surface resistance value of a molded article represented by Formula (1) and (Equation 7). It means the numerical range of R.

[Measurement of Surface Resistance Value of Dumbbell-shaped Injection Molded Article] In the present invention, the measurement of the surface resistance value of the molded article was performed by the following method. As a method of measuring the variation of the surface resistance value of the molded article, a method of measuring 187 shown in FIG.
A dumbbell-shaped injection molded product of × 24 × 3 [mm] was prepared, and three points A, B, and C in FIG.
The surface resistance was measured at a measurement voltage of 100 [V]. The measuring device was Hiresta Model HT manufactured by Mitsubishi Yuka Co., Ltd.
-210 was used.

[Measurement of Surface Resistance of Cut Surface of Dumbbell-shaped Injection Molded Product] In the present invention, the measurement of surface resistance of the cut surface of a molded product was performed by the following method. As a method of measuring the variation of the surface resistance value of the cut surface of the molded product, FIG.
-A dumbbell-shaped injection molded product of 187 x 24 x 3 [mm] shown in Fig. 1 (Fig. 1) was prepared, and the thickness of both sides was set to 2 mm as shown in Fig. 1-B (Fig. 1). Cut. At three points A ′, B ′, and C ′ on the cut surface, the surface resistance was measured at a measurement voltage of 100 [V]. The measuring device was manufactured by Mitsubishi Yuka Co., Ltd. Hiresta Model HT-
210 was used.

[Maximum surface resistance Rmax and minimum surface resistance Rmin of molded article] In the present invention, the minimum value Rmin of the surface resistance R of the molded article and the maximum value Rm of the surface resistance R of the molded article.
Regarding ax, the number of digits of the variation of the surface resistance value calculated by Expression (4) (Equation 13) is 7 or less, preferably 6 or less, more preferably 5 or less, and more preferably 4 or less. Or less, and more preferably 3 or less.

[0038]

[Expression 13] (digit number of variation of surface resistance value) = (logRmax) − (logRmin) +1 (4) (In equation (4), Rmin is the minimum value of the surface resistance value R of the molded product, and Rmax is Is the maximum value of the surface resistance value R of the molded product.) [Surface resistance value Rg at the gate portion of the molded product and surface resistance value Rw at the weld portion] In the present invention, the surface resistance value Rg at the gate portion of the molded product And the measurement of the surface resistance value of the cutting surface Rw at the weld site,
It carried out by the following method. As a method of measuring the variation of the surface resistance value of the molded product, a method shown in FIG.
A dumbbell-shaped injection molded product of 7 × 24 × 3 [mm] was prepared, and a measurement voltage of 100 [V] was measured for three points A ″, B ″, and C ″ in FIG. 1-C (FIG. 1). ], The surface resistance was measured.

As a method of measuring the variation of the surface resistance of the cut surface of the molded product, the molded product shown in FIG. 1-C (FIG. 1) was measured by measuring the surface resistance of the cut surface of the dumbbell-shaped injection molded product. ], And both sides were cut to 2 mm.
At three points A ″, B ″, and C ″ on the cut surface, the surface resistance was measured at a measurement voltage of 100 [V]. The measuring device was Hyresta Model HT-2 manufactured by Mitsubishi Yuka Co., Ltd.
10 was used. In the present invention, a mathematical expression (5) (Equation 14) is used for the surface resistance Rg at the gate part of the molded article and the surface resistance Rw at the weld part of the molded article.
The number of digits of the variation of the surface resistance value calculated by the following is 7 or less, preferably 6 or less, more preferably 5 or less, more preferably 4 or less, and further preferably 3 or less.

[0040]

[Expression 14] (digit number of variation in surface resistance value) = | (logRg) − (logRw) | +1 (5) (In Expression (5), Rg is the gate portion of the molded product (the molten resin injection during molding) Rw indicates the surface resistance value at the welded part of the molded article (the part where the molten resin joins when the molten resin is injected from a plurality of gates), and "| (logRg)-(logR
w) |] indicates the absolute value of the difference between “logRg” and “logRw”. [Surface resistance value Rg at gate portion of molded article and surface resistance value Re at flow end portion] In the present invention, the surface resistance value Rg at the gate portion of the molded article and the surface resistance value Re at the flow end portion of the molded article are described. The number of digits of the variation of the surface resistance value calculated by Expression (6) (Equation 15) is 7 to 1, preferably 6 to 1, more preferably 5 to 1, and more preferably 4 to 1, more preferably 3 to 1, and still more preferably 2 to 1.
~ 1.

[0041]

(Number of digits of variation in surface resistance value) = | (logRg) − (logRe) | +1 (6) (In equation (6), Rg is the gate of the molded product (the molten resin injected during molding) Part) indicates the surface resistance value, and R
e indicates the surface resistance value at the flow end portion of the molded article (the flow end portion of the molten resin when the molten resin is injected from the gate), and is expressed as "| (logRg)-(logRe) |"
Indicates the absolute value of the difference between “logRg” and “logRe”. [Kneading] In the present invention, the method for producing the conductive resin composition is not particularly limited, and a generally known method can be employed. For example, after uniformly mixing a polyether aromatic ketone resin and a carbon fiber using a mixer such as a tumbler, a method of pelletizing by melt-kneading with a single-screw or multi-screw extruder having sufficient kneading ability is known. No.

[Additives] At this time, other conductive materials may be used in combination as long as the purpose is not impaired. The conductive material is not particularly limited, and examples thereof include carbon black, metal fibers, and surface-treated ceramics.

Other resins, polymer alloys, reinforcing fibers, warpage improvers, dimensional accuracy improvers, stability improvers, sliding materials, coloring agents, heat stability improvers, as long as the objects of the present invention are not impaired. Fluidity improver, release improver, surface property improver,
Additives such as a crystallization promoter and an antioxidant may be added. The reinforcing fiber is not particularly limited, and examples thereof include other carbon fibers, glass fibers, and aramid fibers. The warp improving material is not particularly limited, and examples thereof include mica, glass flake, talc, and whiskers such as tetrapot-type zinc oxide whiskers and potassium titanate whiskers. The sliding material is not particularly limited,
For example, graphite, polytetrafluoroethylene (PTF)
E) etc. can be exemplified.

[Method of Forming Molded Article] The method of molding these molded articles is not particularly limited, and examples thereof include extrusion molding, injection molding, compression molding, and cutting. A part of the component that does not require surface resistance control may be integrally molded using insert, outsert, multicolor molding, or the like.

[Heat treatment (annealing)] In the present invention,
The molded product may be subjected to heat treatment (annealing) after molding for the purpose of improving chemical resistance, improving dimensional accuracy, correcting warpage, and the like.

[Purpose of Processing] In the present invention, the molded article may be subjected to post-processing in order to increase dimensional accuracy or to correspond to a fine use shape. The processing method employed in the present invention is not particularly limited, and a generally known method can be employed.

[Molded Article] In the present invention, the molded article is not particularly limited. For example, a wafer carrier for manufacturing a semiconductor, a glass substrate holding container for manufacturing a glass substrate for liquid crystal display, and Electric and electronic parts and the like can be mentioned. Other specific examples of the use of the molded article according to the present invention, for example, semiconductor manufacturing, trays used in the production of glass substrates for liquid crystal display, tweezers, jigs, etc.
And molded articles used for a part of electric and electronic parts. The molded article whose surface resistance is controlled is not particularly limited.
Sockets for various integrated circuit packages such as GA sockets,
Tray such as LCD tray and chip tray, spinner chuck, transfer guide, roller, IC chuck jig, jig such as vacuum pad, vacuum tweezers for pickup, tweezers such as pull hook, tweezer, tongue and the like can be mentioned.

[Retaining Container] The use of the molded article according to the present invention is not particularly limited, and examples thereof include a retaining container used in the production of semiconductors and the production of glass substrates for liquid crystal displays. The holding container is not particularly limited. For example, a semiconductor holding container such as a wafer carrier or a slide carrier for TAB, a holding container in manufacturing a glass substrate for a liquid crystal display, a holding container for a thin film semiconductor substrate for driving a flat display body, and a magazine. A rack, a cassette for substrates, and the like can be given. A holding container such as a glass substrate for manufacturing a glass substrate for a liquid crystal display is used for washing, transporting and baking while holding the glass substrate and the like. A holding container (wafer carrier or the like) for semiconductor manufacturing wafers or the like is used for cleaning, transport, and baking while holding the wafers and the like. Further, a holding container (wafer carrier or the like) for semiconductor manufacturing wafers or the like holds a wafer or the like, and is, for example, a reflow device, a flow device, a rework device, an inspection device, a solder bump forming device, a flux cleaning device, a metal mask. Used in semiconductor manufacturing equipment such as cleaning machines.

[Spinner Chuck] In a lithography step in the manufacture of semiconductors, first, a photoresist as a photosensitive resin is applied on the surface of a wafer by using an apparatus called an applicator (coater). With the coater, the wafer is fixed to a rotary support table with a vacuum chuck, and a liquid photoresist is dropped on the wafer surface from a nozzle, and then the wafer is rotated at a high speed to form a thin resist film. The resist film thickness is mainly determined by the resist viscosity, the number of rotations, and the type of material included in the resist. For this reason, the coater is also called a spinner coater or a spin coater. The vacuum chuck is also called a spinner chuck or a spin chuck. For a more detailed description of spinner chucks and spinner coaters, see, for example, "All About Semiconductors."
(Written by Masanori Kikuchi, published by Nihon Jitsugyo Shuppan, 1998). Fig. 2 shows the usage of the spinner chuck.
(FIG. 2).

[0050]

The present invention will be described in more detail with reference to the following examples. The characteristics of the molded articles described in Examples and Comparative Examples were evaluated according to the following methods.

[Measurement of Surface Resistance of Dumbbell-shaped Injection Molded Article] In the present invention, the measurement of the surface resistance of the molded article was performed by the following method. As a method of measuring the variation of the surface resistance value of the molded article, a method of measuring 187 shown in FIG.
A dumbbell-shaped injection molded product of × 24 × 3 [mm] was prepared, and three points A, B, and C in FIG.
The surface resistance was measured at a measurement voltage of 100 [V]. The measuring device was Hiresta Model HT manufactured by Mitsubishi Yuka Co., Ltd.
-210 was used.

[Measurement of Surface Resistance of Cut Surface of Dumbbell-shaped Injection Molded Product] In the present invention, the measurement of the surface resistance of the cut surface of a molded product was performed by the following method. As a method of measuring the variation of the surface resistance value of the cut surface of the molded product, FIG.
-A dumbbell-shaped injection molded product of 187 x 24 x 3 [mm] shown in Fig. 1 (Fig. 1) was prepared, and the thickness of both sides was set to 2 mm as shown in Fig. 1-B (Fig. 1). Cut. At three points A ′, B ′, and C ′ on the cut surface, the surface resistance was measured at a measurement voltage of 100 [V]. The measuring device was manufactured by Mitsubishi Yuka Co., Ltd. Hiresta Model HT-
210 was used.

[Surface resistance value Rg at gate part of molded article and surface resistance value Rw at welded part] In the present invention, surface resistance value Rg at gate part of molded article and surface resistance value Rw at welded part Surface resistance of cut surface The measurement of the value was performed by the following method. As a method for measuring the variation in the surface resistance value of the molded product, a dumbbell-shaped injection molded product of 187 × 24 × 3 [mm] shown in FIG. 1-C (FIG. 1) was prepared, and FIG. A '', B '' in
At three points C ″, the surface resistance was measured at a measurement voltage of 100 [V]. As a method of measuring the variation of the surface resistance value of the cut surface of the molded product, the molded product shown in FIG. 1-C (FIG. 1) was measured in the same manner as the above [Measurement of the surface resistance value of the cut surface of the dumbbell-shaped injection molded product]. And both sides were cut so as to be 2 mm. At three points A ″, B ″, and C ″ on the cut surface, the surface resistance was measured at a measurement voltage of 100 [V]. The measuring device was manufactured by Mitsubishi Yuka Co., Ltd. Hiresta Model HT-
210 was used.

[Taber abrasion test method (Japanese Industrial Standard J
IS K7204)] The Taber abrasion test method has a diameter of 12
A test piece having a thickness of 0 [mm] and a thickness of 5 [mm] is formed, and a load of 1000 is conformed to Japanese Industrial Standard JIS K7204.
It was measured in [gf].

[Strength Test] The strength was evaluated by a tensile test on the above-mentioned dumbbell-shaped injection molded product. [Rigidity test] Rigidity was evaluated by a bending strength test on the above-mentioned dumbbell-shaped injection molded product.

[Dimensional stability test] The dimensional stability of the above-mentioned dumbbell-shaped injection-molded product was measured at 200 ° C. for 24 hours.
[Time] The dimensional change rate [%] after standing was evaluated.

[Examples 1 and 2] PE manufactured by VICTREX
The ratio of EK resin 450P (melt viscosity 650 Pa · s) and carbon fiber Xylus-GCA having a volume resistivity of 1 × 10 ¹ [Ω · cm] in Examples 1 and 2 of Table 1 (Table 1) And kneaded in the range of 380 to 400 [° C.] to form pellets. A molded article was obtained from the pellet by injection molding. Table 1 (Table 1) shows the results of the evaluation of the molded article by the above method. Examples 1.2
Has a small variation in the surface resistance value of the molded product, that is,
The variation of the surface resistance value at each measurement point of the molded product is small and within the required range. Also, the stability does not change when cutting is performed. As a result of the Taber abrasion test, both Examples 1 and 2 were excellent in abrasion resistance. Also, strength,
The rigidity and dimensional stability were also excellent.

[Examples 3 and 4] PE manufactured by VICTREX
EK resin 150P (melt viscosity 120 Pa · s) and carbon fiber Xylus-GCA having a volume resistivity of 1 × 10 ¹ [Ω · cm] are shown in Examples 3.4 of Table 1 (Table 1). And kneaded in the range of 380 to 400 [° C.] to form pellets. A molded article was obtained from the pellet by injection molding. Table 1 (Table 1) shows the results of the evaluation of the molded article by the above method. Examples 3.4
Has a small variation in the surface resistance value of the molded product, that is,
The variation of the surface resistance value at each measurement point of the molded product is small and within the required range. Also, the stability does not change when cutting is performed. As a result of the Taber abrasion test, both Examples 3 and 4 were excellent in abrasion resistance. Also, strength,
The rigidity and dimensional stability were also excellent.

[Comparative Examples 1-2] In Comparative Examples 1-2,
Evaluation was performed in the same manner except that the amount was changed as shown in Table 1 (Table 1). If the amount of carbon fiber added is small, the surface resistance value will be high and will fall outside the required range.
Even when this molded product is cut, the surface resistance of the cut surface is high, which is outside the required range. When the amount of carbon fiber added is large, the surface resistance value becomes low, which is outside the required range. Even when this molded product is cut, the surface resistance of the cut surface is low, which is outside the required range. As a result of the Taber abrasion test, Comparative Example 1 was excellent in abrasion resistance. Comparative Example 2 was inferior in abrasion resistance.

[Comparative Example 3] PEEK manufactured by VICTREX
Resin 450P and Ketjen Black EC (trade name of Akzo, The Netherlands) as carbon powder instead of carbon fiber were blended at the ratio shown in Comparative Example 5 in Table 1 (Table 1).
The mixture was kneaded and pelletized in the range of 390 to 420 [° C].
A molded article was obtained from the pellet by injection molding. Table 1 shows the results of the evaluation of the molded article by the above method.
It is shown in (Table 1). In Comparative Example 3, there is a large variation depending on the location in the molded product, and there is a portion where the surface resistance value is out of the required range. Further, when cutting, the surface resistance of the cut surface is low, which is outside the required range. As a result of the Taber abrasion test method, the abrasion resistance was excellent.

[Comparative Examples 4 and 5] PE manufactured by VICTREX
And EK resin 450P, volume resistivity 10- ³ [.omega.c
m], was mixed at a ratio shown in Comparative Examples 4.5 in Table 1 (Table 1), and kneaded and pelletized in the range of 380 to 410 ° C. A molded product was obtained from the pellet by injection molding. For this molded product, the result of evaluation by the method described above,
It is shown in Table 1 (Table 1). In Comparative Examples 4 and 5, the surface resistance changes greatly with respect to the amount of carbon fiber added, and it is difficult to keep the surface resistance of the molded product within the required range. In Comparative Example 4, there is a large variation depending on the location in the molded product, and there is a portion where the surface resistance value is out of the required range. In addition, even when cutting is performed, there is a large variation depending on the location of the cut surface, and there are portions that are out of the required range. As a result of the Taber abrasion test method, Comparative Examples 4 and 5 were inferior in abrasion resistance.

Examples 5 and 6 and Comparative Examples 6 to 10 Examples 5 and 6 and Comparative Examples 6 to 10 show the composition ratios shown in Table 2 (Table 2) in FIG. This is the result of preparing the molded product shown and evaluating the gate portion, the flow end portion, and the cut surface of the molded product. The results are shown in Table 2 (Table 2).

[Examples 7, 8 and Comparative Examples 11 to 15] In Examples 7, 8 and Comparative Examples 11 to 15, the composition ratios shown in Table 3 (Table 3) are shown in FIG. This is the result of preparing the molded product shown and evaluating the gate portion, the flow end portion, and the cut surface of the molded product. The results are shown in Table 3 (Table 3).

[Production Example 1 of Molded Article] The resin carrier of the composition of Example 1 was injection-molded to make the wafer carrier 5
Created. For each wafer carrier, the surface resistance was measured at 10 points, and the maximum surface resistance Rmax and the minimum surface resistance Rm were measured.
Regarding in, the number of digits of the variation in the surface resistance value was calculated by Expression (4) (Equation 7). For any of the five wafer carriers, the number of digits of the variation in the surface resistance was in the range of 3-1.

[Production Example 2] Five resin spinner chucks as shown in FIG. 2 (FIG. 2) were prepared by injection molding the resin composition of the composition of Example 1. For each carrier spinner chuck, the surface resistance was measured at five points on the upper surface where the wafer, which had been shaped by cutting, was in contact, and the maximum surface resistance Rmax and the minimum surface resistance Rmin were calculated using the formula (4) (Equation 7). The digit number of the variation in the resistance value was calculated. For any of the five spinner chucks, the number of digits of the variation in the surface resistance was in the range of 3-1.

[0066]

[Table 1]

[0067]

[Table 2]

[0068]

[Table 3]

[0069]

According to the present invention, the surface resistance value of the molded product is 1 × 10 4 as shown in Expression (1) (Equation 7).
It is controlled narrowly within the range of ⁶ [Ω] to 1 × 10 ¹² [Ω].
In Equation (1) (Equation 7), Rmin is the minimum value of the surface resistance R of the molded article, and is expressed by Equation (2) (Equation 8), and Rmax is the value of the surface resistance R of the molded article. This is the maximum value and is represented by Expression (3) (Equation 9). In the present invention,
The minimum value Rmin of the surface resistance R of the molded product is 10 ⁶ [Ω], preferably 10 ⁷ [Ω], more preferably 10 ⁸ [Ω], and more preferably 10 ⁹ [Ω]. [Ω]
It is. In the present invention, the maximum value Rmax of the surface resistance value R of the molded product is 10 ¹² [Ω], preferably 10 ¹¹ [Ω].
[Ω], more preferably 10 ¹⁰ [Ω],
More preferably, it is 10 ⁹ [Ω]. Due to such excellent electrical properties of molded products, when using molded products,
Troubles due to electrical shorts can be prevented beforehand, and adhesion of dust and the like during use can be sufficiently suppressed, and can be widely used in fields requiring antistatic properties.

In the present invention, the molded article has excellent strength. In the present invention, the molded article has excellent rigidity. In the present invention, the molded article has excellent dimensional stability. In the present invention, the molded article has excellent wear resistance. Due to the excellent properties of the above-described molded article, in the present invention, the molded article is suitable as a wafer carrier for semiconductor production, a glass substrate holding container for producing a glass substrate for liquid crystal display, and further, as an electric / electronic component. Can be used for
In the present invention, the molded article is also suitably used as a tray, tweezers, a jig, and the like, which are used in the field of semiconductor manufacturing technology and the field of glass substrate manufacturing technology for liquid crystal display. Further, it can be suitably used as a molded product used for a part of electric and electronic parts such as a socket. Even when post-processing is performed on the molded product, the surface resistance value of the cut surface is maintained at 10 ⁶ to 10 ¹² [Ω].

[Brief description of the drawings]

FIG. 1- (a) shows a dumbbell-shaped injection molded product (one gate molded product) used for measuring the surface resistance value. The size of the dumbbell-shaped injection molded product is 1
It is 87 × 24 × 3 [mm]. This dumbbell-shaped injection molded product is made by injection molding. The gate of the injection molding is one place, and the dimension of the gate is 1 × 2
[Mm]. In the figure, A indicates a gate part, and B
Indicates the middle of the flow, and C indicates the end of the flow. At three points A, B, and C shown in the figure, the surface resistance R was measured at a measurement voltage of 100 [V]. From these measurement results, Rmin (the minimum value of the surface resistance R of the molded product) and Rmax (the maximum value of the surface resistance R of the molded product) were determined. In some cases, the number of digits of the variation in the surface resistance was evaluated. The number of digits of the variation of the surface resistance value is calculated by the following equation. (Number of digits of variation in surface resistance value) = [(logRmax)-(logRmin)
+1] Measuring device is Hiresta MOD manufactured by Mitsubishi Yuka Co., Ltd.
EL HT-210 was used. [FIG. 1-B] FIG. 1-B shows a cut dumbbell-shaped injection molded product (one gate molded product) used for measuring the surface resistance value of the cut surface. The dumbbell-shaped injection molded product before cutting is the molded product shown in FIG. In addition, the dotted line shown in FIG. 1-a shows the thickness after cutting. The thickness of the dumbbell-shaped injection molded product before cutting is 3 [m
m], but the thickness 2
[Mm]. In the figure, A ′ indicates a gate site,
B 'indicates the middle part of the flow, and C' indicates the end of the flow. At three points A ′, B ′ and C ′ shown in FIG.
The surface resistance was measured at 0 [V]. From this measurement result,
Rmin (the minimum value of the surface resistance R of the molded product) and Rmax (the maximum value of the surface resistance value R of the molded product) were determined. In some cases, the number of digits of the variation in the surface resistance was evaluated. The number of digits of the variation of the surface resistance value is calculated by the following equation. (The number of digits of the variation of the surface resistance value) = [(logRmax)
− (LogRmin) +1] The measuring device is Hiresta Model, manufactured by Mitsubishi Yuka Co., Ltd.
HT-210 was used. [FIG. 1-C] FIG. 1-C shows a dumbbell-shaped injection molded product (two-gate molded product) used for measuring the surface resistance value. The size of the dumbbell-shaped injection molded product is 187 ×
It is 24 × 3 [mm]. This dumbbell-shaped injection molded product is made by injection molding. Injection molding has two gates, and the dimensions of each gate are 1
× 2 [mm]. In the figure, A ″ and C ″ indicate gate parts. In the figure, B ″ indicates a weld site. At three points A ″, B ″ and C ″ shown in FIG.
The surface resistance was measured at 0 [V]. Regarding the surface resistance Rg at the gate part of the molded article and the surface resistance Rw at the weld part of the molded article, the number of digits of the variation of the surface resistance was calculated. The number of digits of the variation of the surface resistance value is calculated by the following equation. (The number of digits of the variation of the surface resistance value) = | (logRg)
− (LogRw) | +1 (where Rg represents the surface resistance value at the gate part (the molten resin injection part at the time of molding) of the molded product.
Indicates the surface resistance value at the welded portion of the molded product (the portion where the molten resin joins when the molten resin is injected from a plurality of gates), and is expressed as “| (logRg) − (logRw) |”
Indicates the absolute value of the difference between “logRg” and “logRw”. ) Measuring device is Hiresta MO manufactured by Mitsubishi Yuka Co., Ltd.
DEL HT-210 was used.

FIG. 2 shows a usage pattern of a spinner chuck.

[Explanation of symbols]

[FIG. 1-A] In the figure, A indicates the gate portion, B indicates the middle part of the flow, and C indicates the end of the flow. Three points A, B, and C in FIG. 1-A indicate locations where the surface resistance was measured. [FIG. 1-B] In the figure, A ′ indicates a gate portion, and B ′
Indicates the middle part of the flow, and C ′ indicates the end of the flow. Figure 1
The three points A ', B', and C 'in (b) indicate locations where the surface resistance was measured. [FIG. 1-C] In FIG. 1-C, A ″ and C ″ indicate a gate portion, and B ″ indicates a weld portion. This A '',
The surface resistance was measured at three points B ″ and C ″.

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Sato 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa F-term (reference) in Mitsui Chemicals, Inc. 4J002 CH091 DA016 FA006 FA046 GQ05 5F031 DA01 DA05 EA02 EA03

Claims (11)

[Claims] 1. A polyether aromatic ketone 90 to 60.
[Weight%] and 10 to 40 [% by weight] of carbon fibers, wherein the polyether aromatic ketone has a repeating unit represented by a chemical formula (1). A polyether aromatic ketone, wherein the carbon fibers are high electrical resistance carbon fibers having an average fiber diameter of 3 to 25 [μm] and an average fiber length of 50 to 70,000 [μm]; R
Is controlled to be narrow within the range of Expression (1) (Equation 1). (Formula (1)
In (Equation 1), Rmin is the minimum value of the surface resistance R of the wafer carrier, and is represented by Expression (2) (Equation 2), and Rmax is the maximum value of the surface resistance R of the wafer carrier. Thus, it is expressed by Expression (3) (Equation 3). Rmin ≦ R ≦ Rmax (1) Rmin = 10 ⁶ [Ω] (2) Rmax = 10 ¹² [Ω] (3) 2. The wafer carrier according to claim 1, wherein the high-resistance carbon fiber has a volume resistivity of 10 ⁻² to 10 ³ [Ωcm]. 3. The wafer carrier according to claim 1, wherein the wafer carrier is obtained by melt molding. 4. The wafer carrier according to claim 3, wherein the melt molding is injection molding. 5. The wafer carrier according to claim 3, wherein the melt molding is extrusion molding. 6. The wafer carrier according to claim 1, wherein at least a part of the wafer carrier is formed by cutting. 7. The wafer carrier according to claim 3, wherein at least a part of the wafer carrier is further secondary-cut.
The wafer carrier according to any one of the above. 8. Polyether aromatic ketone 90-60
A wafer carrier comprising [wt%] and carbon fibers of 10 to 40 [wt%] and having a cut surface at least in part, wherein the polyether aromatic ketone is represented by the chemical formula (1): )
Wherein the carbon fiber has a volume resistivity of 10 ⁻² to 10 ³ [Ωc
m], average fiber diameter 3 to 25 [μm], average fiber length 50
.About.70000 [.mu.m], and the surface resistance R of the cut surface of the wafer carrier is controlled so as to be narrow in the range of Expression (1) (Equation 1). A wafer carrier having a cutting surface. In Equation (1) (Equation 1), Rmin is the minimum value of the surface resistance R of the wafer carrier, and is expressed by Equation (2) (Equation 2), and Rmax is the surface resistance R of the wafer carrier. Is the maximum value of
It is shown by (Equation 3). ). 9. The variation of the surface resistance value calculated by Expression (4) between the minimum value Rmin of the surface resistance value R of the wafer carrier and the maximum value Rmax of the surface resistance value R of the wafer carrier. 2. The method according to claim 1, wherein the number of digits is 1 to 7.
9. The wafer carrier according to any one of claims 1 to 8. ## EQU4 ## (digit number of variation in surface resistance value) = (logRmax)-(logRmin) +1 (4) (In equation (4), Rmin is the minimum value of the surface resistance value R of the wafer carrier. Is the maximum value of the surface resistance R of the wafer carrier.) 10. The number of digits of the variation of the surface resistance value calculated by the formula (5) with respect to the surface resistance value Rg at the gate portion of the wafer carrier and the surface resistance value Rw at the weld portion of the wafer carrier. The wafer carrier according to any one of claims 1 to 8, wherein is 1 to 7. (Number of digits of variation of surface resistance value) = | (logRg) − (logRw) | +1 (5) (In the expression (5), Rg is a gate portion of the wafer carrier (injection of molten resin during molding) Rw indicates the surface resistance value at the welded portion of the wafer carrier (the portion where the molten resin merges when the molten resin is injected from a plurality of gates), and "| (logR
g)-(logRw) |] represents “logRg” and “log
gRw ”. ) 11. A digit of the variation of the surface resistance value calculated by the formula (6) between the surface resistance value Rg at the gate portion of the wafer carrier and the surface resistance value Re at the flow end portion of the wafer carrier. 9. The wafer carrier according to claim 1, wherein the number is 1 to 7. (Number of digits of variation of surface resistance value) = | (logRg) − (logRe) | +1 (6) (In the equation (6), Rg is the gate portion of the wafer carrier (the molten resin injected during molding). Part), the surface resistance value is shown, and Re is the flow end of the wafer carrier (the flow end of the molten resin when the molten resin is injected from the gate).
Shows the surface resistance value at “| (logRg) − (l
ogRe) |] indicates the absolute value of the difference between “logRg” and “logRe”. )