JP2000182918A - Developing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To control the temperature of a developer liquid and rinse liquid (normally, water of high purity) supplied on a body to be processed, for example, a semiconductor wafer to an optimum value according to the kind of developer liquid. SOLUTION: A developer liquid and rinse liquid are supplied on a wafer 8 through an inner pipe 13 of pipings 13a and 14a of double piping structure, respectively, while a constant temperature liquid for the temperature for adjusting with developer liquid and rinse liquid is allowed to pass outer pipes 19 and 20. The constant temperature liquid is circulated between the outer pipes 19 and 20 of the pipings 13a and 14a and a constant-temperature liquid- temperature adjusting circulation device through a supply pipe and discharge pipe so that the temperature is stably kept at a specified value.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a developing device,
The present invention relates to a developing device that performs development by supplying a developing solution and a rinsing liquid to the surface of a processing target.

[0002]

2. Description of the Related Art In the manufacture of semiconductor devices, photolithography technology is indispensable, and the photolithography technology requires development as well as exposure. FIG. 3A is a plan view schematically showing an exposure coating and developing apparatus used for manufacturing a semiconductor device. In the figure, 1 is an indexer, 2
Is a hot plate, 3 is a cooling plate, 4 is a hot plate, 5 is a cooling plate, 6 is an exposure projection device, 7 is a wafer cassette, 8 is a wafer, 9 is a coating unit, 10 is a wafer transfer robot, and 11 is a developing device ( Developing units) and 12 are coating mechanisms of the developing device 11, and these devices and mechanisms are arranged as shown in FIG.

FIG. 3B is a schematic configuration diagram showing a conventional example of a developing device. A rinsing liquid nozzle 13 supplies a rinsing liquid (generally pure water), a developing liquid nozzle 14 supplies a developing liquid, 15 is a wafer chuck, 16 is a developing cup, 17
Denotes an arrow indicating the rotation direction of the wafer chuck 15, and 18 denotes a chuck rotation motor.

First, how the exposure is performed will be described with reference to FIG. In the exposure unit 9, the wafer 8 coated with a photoresist, which is a photosensitive organic material, is coated on the hot plate 2 or the cooling plate 3.
After that, the wafer 8 is sent into an exposure projection apparatus 6, where the surface of the wafer 8 is irradiated with UV light through a mask in the apparatus 6 for exposure.
After that, the wafer 8 is further sent to the developing device 11 via the hot plate 4 and the cooling plate 5, where the development is performed.

In the developing device 11, pure water as a rinsing liquid is supplied from a rinsing liquid nozzle 13 onto the surface of the wafer 8, and pure water and an alkali developing liquid are applied from the developing liquid nozzle 14 on the surface of the wafer 8 in this order. Then, the substrate is left standing for about 60 seconds in a state where the alkaline developer is filled, and thereafter, pure water is rinsed again from the rinsing liquid nozzle 13 onto the wafer 8, and then the wafer 8 is rotated at a high speed to remove the pure water. Shake off.
Thus, the patterning on the wafer 8 is completed.

[0006]

One of the important things in patterning is to transfer a predetermined pattern uniformly on a wafer. In order to transfer the pattern uniformly, it is necessary to transfer a predetermined pattern onto the wafer. It is necessary to keep the temperature of the developer within an appropriate temperature range. If the temperature is out of the range, the uniformity of pattern transfer deteriorates, and it becomes difficult to perform patterning with high and uniform resolution over the whole.

Conventionally, however, temperature control in a pure water line for supplying pure water to the developing device 11 and a developing solution line for supplying a developing solution has not been generally performed. Therefore, it is difficult to sufficiently increase the uniformity of pattern transfer, and the time required for development tends to be long. Of course, there were cases where the temperature was adjusted for the development line, but even in that case, the temperature was not adjusted for pure water, so the temperature control was incomplete, and the uniformity of transfer was sufficiently high. It was not free from the problem of difficulty in raising.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and controls the temperature of an object to be processed, for example, a developing solution and a rinsing solution supplied on a semiconductor wafer to an optimum value. The purpose is to be able to.

[0009]

According to the present invention, there is provided a developing device comprising:
The developer and the rinsing liquid are supplied onto the workpiece through one of the inner pipe and the outer pipe of the double-pipe structure, and the developing liquid and the rinsing liquid are passed through a constant temperature liquid for adjusting the temperature of the rinsing liquid. It is characterized by the following.

Therefore, according to the developing device of the first aspect, the temperature of the developing solution and the rinsing solution can be controlled by the constant temperature solution, and the developing solution and the rinsing solution supplied onto the wafer are extended on the wafer. It is possible to control the temperature to an optimum value.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is basically directed to a developing apparatus for developing by supplying a developing solution and a rinsing solution to the surface of an object to be processed. The pipe is supplied onto the processing object through one of the inner pipe and the outer pipe, and a developing solution and a constant temperature liquid for controlling the temperature of the rinsing liquid are passed through the other pipe. It is better to let the developing solution and the rinsing solution pass through, and pass the constant temperature solution for temperature adjustment to the outer tube.
This is because the developer and the rinsing solution can be effectively heated from the surroundings and can be easily adjusted to a predetermined temperature.

It is preferable that the rinsing liquid and the developing liquid supplied to the surface of the object to be processed are circulated through a constant temperature liquid circulating path for controlling the temperature of the developing liquid at a predetermined temperature.
This is because the temperature can be stably controlled and the temperature change can be eliminated. The constant temperature liquid is preferably water, for example,
It is not necessarily limited to this. In addition, high-purity pure water is generally used as the rinsing liquid, but it is not necessarily limited thereto, and it goes without saying that pure water mixed with a special substance may be used.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the illustrated embodiments. 1A and 1B show one embodiment of the developing device of the present invention, wherein FIG. 1A is a configuration diagram of a main part, FIG. 1B is a plan view, and FIG. FIG. 2 is a schematic plan view of an exposure coating and developing device provided with a developing device. In the figure, 1 is an indexer, 2 is a hot plate, 3 is a cooling plate, 4 is a hot plate, 5 is a cooling plate, 6
Is an exposure projection device, 7 is a wafer cassette, 8 is a wafer, 9
Denotes a coating unit, 10 denotes a wafer transfer robot, 11 denotes a developing device of the present invention (developing unit), 12 denotes a coating mechanism of the developing device 11, 21 denotes a constant temperature liquid supply pipe, 22 denotes a constant temperature liquid discharge pipe,
Reference numeral 23 denotes a thermostatic liquid temperature control circulation device, which is shown in FIG.
They are arranged as shown in FIG.

As shown in FIG. 1B, the coating mechanism 12 includes a rinse pipe 13a having a double pipe structure and a developer pipe 14a having a double pipe structure. A rinsing liquid supply pipe 13a for supplying a rinsing liquid (generally pure water) is an inner pipe 13
Are passed through the rinsing liquid, and the outer tube 19 passes through a constant temperature liquid that heats the rinsing liquid from around the rinsing liquid. The developing solution supply pipe 14a for supplying the developing solution is such that the inner tube 14 passes the developing solution, and the outer tube 20 passes the constant temperature solution for heating the rinsing solution from around the tube.

Then, the outer pipes 19 and 20 are connected to the inner pipe 13.
The rinsing liquid and the constant temperature liquid for heating the developing liquid to a predetermined temperature are supplied from the constant temperature liquid circulating device 23 to the developing device 11 through the constant temperature liquid supply pipe 21, and are returned from the developing apparatus 11 to the constant temperature liquid discharge pipe 22. You. In this way, the constant temperature liquid is heated and circulated by the constant temperature liquid temperature adjusting and circulating device 23 so as to be maintained at a constant temperature.
Further, the adjustment temperature can be switched according to the type of the developer.

Reference numeral 15 denotes a wafer chuck, 16 denotes a developing cup, 17 denotes an arrow indicating the rotation direction of the wafer chuck 15, and 18 denotes a chuck rotation motor.

The exposure is performed as follows. In an exposure unit 9, a wafer 8 coated with a photoresist, which is a photosensitive organic material, is sent into an exposure projection device 6 via a hot plate 2 or a cooling plate 3, and a mask is formed on the surface of the wafer 8 in the device 6. It is exposed by irradiating UV light through it. Thereafter, the wafer 8 is further sent to the developing device 11 via the hot plate 4 and the cooling plate 5, and
Therefore, development is performed.

In the developing device 11, pure water as a rinsing liquid is supplied onto the surface of the wafer 8 from a rinsing liquid nozzle 13, and the pure water and alkali developing liquid are supplied from the nozzle 14 of the developing liquid pipe 14a in the order of the wafer. 8 and left standing for about 60 seconds with the alkali developer on it, then rinse the pure water again from the nozzle 13 of the rinsing liquid pipe 13a onto the wafer 8 and then rinse the wafer 8 Spin at high speed to shake off the pure water. Thus, the patterning on the wafer 8 is completed.

In this case, the temperature of the constant temperature solution is adjusted by the constant temperature solution circulating device 23 in accordance with the type of the developing solution used for development, and the rinsing solution and the developing solution are each adjusted to a temperature most suitable for the type of the developing solution. It can be supplied onto the wafer 8 for development. Therefore, the uniformity of pattern transfer can be increased, and patterning with high and uniform resolution over the whole can be performed. Further, since the temperature of the rinsing liquid and the temperature of the developing solution are set to appropriate temperatures according to the type of the developing solution, the time required for development can be reduced. This naturally leads to an increase in productivity.

[0020]

According to the first aspect of the present invention, the temperature of each of the developing solution and the rinsing solution can be controlled by the constant temperature solution. Accordingly, it is possible to control the temperature of the developing solution and the rinsing liquid supplied on the wafer on the wafer to an optimum value. Therefore, the pattern can be transferred with uniform accuracy and resolution over the entire surface of the object to be processed,
Further, the time required for development can be shortened.

According to the second aspect of the present invention, the rinsing liquid and the constant temperature liquid for controlling the temperature of the developing liquid are circulated through the constant temperature liquid circulation path for maintaining the temperature at a predetermined temperature. Changes can be reduced or eliminated.

[Brief description of the drawings]

FIGS. 1A and 1B show an embodiment of the developing device of the present invention, wherein FIG. 1A is a configuration diagram of a main part, and FIG. 1B is a plan view.

FIG. 2 is a schematic plan view of an exposure coating and developing apparatus including the developing apparatus shown in FIG.

FIGS. 3A and 3B are views for explaining a conventional example, in which FIG. 3A is a plan view schematically showing the configuration of an exposure coating and developing apparatus used for manufacturing a semiconductor device, and FIG. FIG. 2 is a configuration diagram illustrating a main part of the developing device.

[Explanation of symbols]

12 ... Coating device, 13a ... Rinse liquid pipe with double pipe structure, 13 ... Rinse liquid nozzle, 14a ...
・ Development solution piping of double piping structure, 14 ・ ・ ・ Development solution piping, 19, 20 ・ ・ ・ Outer tube, 23 ・ ・ ・ Constant temperature solution temperature circulating device.

Claims (2)

[Claims] 1. A developing device for performing development by supplying a developing solution and a rinsing liquid to the surface of an object to be processed, wherein the developing solution and the rinsing liquid are supplied to an inner pipe and an outer pipe of each pipe having a double pipe structure. A developing device, wherein the developing solution and the rinsing solution are supplied through one side, and the temperature of the developing solution and the rinsing solution is adjusted by passing a constant temperature solution for temperature adjustment through the other of the inner pipe and the outer pipe of each pipe. 2. The developing apparatus according to claim 1, wherein the constant temperature liquid is circulated through a constant temperature liquid temperature control circulation path for maintaining a predetermined temperature.