JP2000169993A - Titanium mother plate for copper electrolysis and polishing device for titanium mother plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a titanium mother plate for copper electrolysis which is capable of eliminating the occurrence of such an accident as the undesirable peeling of an electrodeposited seed plate from the mother plate and easily stripping the seed plate from the mother plate at the time of stripping work from the mother plate and a polishing device for the titanium mother plate for copper electrolysis capable of manufacturing the such titanium mother plate for copper electrolysis. SOLUTION: The titanium mother plate 100 for copper electrolysis for electrodeposition of the seed plate is constituted by dividing the region where the seed plate is electrodeposited to three regions; an upper region 100A a middle region 100B and a lower region 100C in a vertical direction and making the surface roughness of the upper region 100A finer and the surface roughness of the middle region 100B and the lower region 100C coarser. The upper region is preferably a region of about 1/3 upper the entire part region where the seed plate is electrodeposited.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a titanium (Ti) base plate for copper electrolysis for producing a seed plate and an apparatus for polishing the titanium base plate.

[0002]

2. Description of the Related Art FIG. 4 shows an example of a copper electrolysis mother plate for producing a seed plate. An edgewise protector 101 made of an insulating material is provided on both sides of the mother plate 100, and a crossbar 102 is attached to the upper end. Mother plate 10
0 is conveyed while being suspended and hooked on the hook of the trolley conveyor via the crossbar 102.

A seed plate is electrodeposited on both surfaces of a mother plate 100 in a seed plate electrolytic cell. The mother plate 100 on which the seed plate has been electrodeposited is conveyed by a trolley conveyor and sent into a spouting device, where the upper portion of the seed plate is hammered to facilitate peeling. After that, it is fed into the opening device, sucked by the suction cup, and only the upper part of the seed plate is peeled off from the mother plate. Next, the seed plate is fed into a stripping device, a stripping arm is inserted above the peeled seed plate, and the arm is lowered to be stripped from the mother plate.

Conventionally, such a mother plate 100 has been
In recent years, US plates or rolled copper plates have been used.
A titanium (Ti) plate having a thickness of about 3.1 mm is used as a base plate because it is lightweight, strong, easy to handle, and has good workability.

[0005]

However, according to the results of research conducted by the present inventors, the titanium base plate is easily oxidized, and an oxide film (TiO ₂ ) is formed on the surface of the base plate. Deterioration of copper electrodeposition, mesh-like (perforated)
It was found that electrodeposition was easy.

To solve this problem, it is conceivable to remove the oxide film. However, in order to remove the oxide film, if the entire surface of the mother plate is uniformly polished to a fine surface, the electrodeposited seed plate is easily peeled off,
An accident occurs in which the seed plate is undesirably peeled off from the mother plate. Conversely, if the surface of the base plate is roughened by polishing, the seed plate is firmly fixed to the base plate and accidents such as the seed plate being inadvertently peeled off from the base plate can be prevented, but the seed plate can be prevented by hammering. Work to make the upper part of the seed plate easy to peel off, and work to remove only the upper part of the seed plate from the mother plate by sucking with the suction cup, and further, insert the peeling arm into the upper part of the peeled seed plate and lower the arm In addition, it is difficult to remove the seed plate from the mother plate.

Further, titanium powder and titanium oxide film powder generated during polishing are scattered around the polishing step, and titanium powder is particularly liable to be oxidized and ignited.

Accordingly, an object of the present invention is to eliminate the occurrence of an accident in which an electrodeposited seed plate is undesirably peeled off from a mother plate, and to easily remove the seed plate from the mother plate at the time of stripping work from the mother plate. It is an object of the present invention to provide a titanium plate for copper electrolysis that can be peeled off from a copper base plate and a polishing apparatus for a titanium base plate for copper electrolysis that can produce such a titanium base plate for copper electrolysis.

Another object of the present invention is to provide an apparatus for polishing a titanium base plate for copper electrolysis which can efficiently produce the titanium base plate for copper electrolysis without danger of ignition during polishing. .

[0010]

The above object is achieved by a titanium base plate for copper electrolysis and an apparatus for polishing a titanium base plate for copper electrolysis according to the present invention. In summary, the present invention is a titanium electroplate for copper electrolysis for electrodepositing a seed plate,
The area where the seed plate is electrodeposited is vertically divided into three areas, an upper area, a middle area, and a lower area, and the surface roughness of the upper area is reduced, and the surface roughness of the middle area and the lower area is increased. It is a titanium base plate for copper electrolysis characterized by the above. According to an embodiment of the present invention, the upper region is approximately one third above the entire region on which the seed plate is electrodeposited, and the surface roughness of the upper region is 0.4 to 1.0 μm Ra, Preferably, 0.6 to 1.0
μmRa, and the surface roughness of the middle region and the lower region is 1.0 to 2.0 μmRa, preferably 1.5 to 2.0 μmRa.
μmRa. Typically, the upper region has a surface roughness of about 0.8 μmRa, and the middle and lower regions have a surface roughness of about 1.7 μmRa.

The above-mentioned titanium base plate for copper electrolysis is a polishing device for polishing both surfaces of the titanium base plate for copper electrolysis for electrodepositing a seed plate, and is provided on both sides of the titanium base plate in a vertical direction. First, second, and third brush rollers aligned with each other and spaced apart from each other; means for rotating and driving the first, second, and third brush rollers; Means for moving the third brush roller in the vertical direction with respect to the titanium base plate, and means for injecting water around the polishing area where the first, second, and third brush rollers are located. And a means for polishing a titanium base plate for copper electrolysis, comprising: According to one embodiment of the present invention, the first brush roller has a surface roughness of the upper region of 0.4 to 1.0 μmRa, preferably,
0.6 to 1.0 μm Ra, and the second and third brush rollers have a surface roughness of the middle region and the lower region of 1.0 to 1.0 μm Ra.
２．０2.0 μmRa, preferably 1.5-2.0 μmR
a. Typically, the surface roughness of the upper region is about 0.5.
The surface roughness of the middle region and the lower region is about 1.7 μmRa.

Preferably, the brush roller is a roller in which a nonwoven fabric mixed with a carbon abrasive is fixed to a core roll.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a titanium base plate for copper electrolysis and a polishing apparatus for the titanium base plate for copper electrolysis according to the present invention will be described in more detail with reference to the drawings.

The titanium base plate for copper electrolysis for producing the seed plate according to the present invention can have the same shape as the conventional base plate 100 described above with reference to FIG. An edgewise protector 101 made of an insulating material is provided,
The crossbar 102 is attached to the upper end.
If necessary, an insulating material can also be arranged at the lower end. The titanium mother plate 100 of this embodiment has a thickness of 3.1 mm,
Width (W ₀ ) 986 mm (polishing range W: 960 m maximum)
m), height (H ₀ ) 1085 mm (polishing range H: maximum 1)
030 mm).

The present inventors have conducted many research experiments and found that the surface roughness of the titanium base plate 100 was 0.4 to 1.0 μm.
mRa, especially 0.6-1.0 μmRa, typically
It has been found that by setting the thickness to about 0.8 μmRa, the electrodeposited seed plate can be easily removed from the mother plate. That is, the work of peeling off the upper part of the seed plate by hammering in the splicer and the work of peeling only the upper part of the seed plate from the mother plate by the suction cup in the piercing device can be achieved very easily.

The surface roughness of the titanium base plate 100 is set to 1.
0 to 2.0 μmRa, especially 1.5 to 2.0 μmRa,
Typically, it was found that the electrodeposited seed plate was firmly fixed to the mother plate 100 by setting the thickness to about 1.7 μm Ra.

Therefore, according to the present invention, the titanium base plate 10
0 indicates three regions in which the seed plate is electrodeposited vertically.
The upper region 100A, the middle region 100B, and the lower region 100C are divided, and the surface roughness of the upper region 100A is reduced.
00B and the lower region 100C are roughened. The upper region 100A is preferably 1/3 of the entire region (H).
In this embodiment, the surface roughness is about 320 mm, and as described above, the surface roughness is 0.4 to 1.0 μmRa, preferably 0.6 to 1.0 μmRa, typically 0.1 μmRa. 8
It is about μmRa. Also, the middle and lower regions 100B, 1
00C is about one-third of the entire area (H), that is, about 320 mm in this embodiment, and has a surface roughness of 1.0 to 2.0 μmRa, preferably 1. 5 to 2.0 μm Ra, typically 1.7 μm
mRa.

In the present invention, the upper, middle, and lower regions are measured using an ultra-small surface roughness measuring device (trade name: Handy Surf E-30A) manufactured by Tokyo Seimitsu Co., Ltd. It is a value obtained by measuring five points in the direction, and is JIS B06
It is a center line average roughness (Ra) defined by 01-1982.

The surface of the titanium base plate 100 is polished by a polishing apparatus in order to obtain the above-mentioned surface roughness. As understood from the above, in particular, by polishing and roughening the surface of the titanium base plate in the middle region 100B and the lower region 100C, undesired peeling of the seed plate from the base plate is prevented, and oxidation is prevented. The membrane is also removed, which also prevents the seedboard from becoming meshed (perforated).

Next, a polishing apparatus constructed according to the present invention will be described.

1 to 3 show one embodiment of the polishing apparatus of the present invention.

Referring to FIG. 2 and FIG. 3, in this embodiment, the polishing apparatus 1 has a base 2. In the base 2, a washing tank 3, which will be described later, is installed.
A pair of movable tables 4 (4A, 4B) is installed on the upper side.
Each of the movable bases 4A and 4B is horizontally movable by the slide means 5A and 5B installed at the lower end thereof slidably fitted on the rail 9 installed on the base. Each of the moving tables 4A and 4B is driven by a driving means (not shown) such as an air cylinder to move on the base 2 toward or away from each other as necessary. Is done.

Each of the movable tables 4A and 4B is provided with a brush roller supporting frame 6 (6A and 6B) on the side facing each other. The support frames 6A and 6B are attached to, for example, slide means 8 (8A and 8B) so as to be vertically movable along rails 7 (7A and 7B) provided on the vertical surfaces of the movable tables 4A and 4B. ing.

The brush roller supporting frames 6A and 6B are driven by driving means (not shown) such as an air cylinder, for example.
It can be moved up and down. In this embodiment, it is possible to reciprocate from the highest (upper limit) position shown by the solid line in FIG. 2 to the lower limit position shown by the dashed line, and the stroke (S
T) was 350 mm at the maximum.

The brush roller supporting frames 6A and 6B are shown in FIG.
As will be understood with reference to FIGS.
And both side plates 21A and 21B, and are formed in a box shape with the sides facing each other opened. Also, three first, second, and third brush rollers 11 are positioned on the brush roller supporting frames 6A and 6B and are aligned in the vertical direction.
A, 12A, 13A; 11B, 12B, 13B are rotatably mounted, and each brush roller is rotationally driven by driving means (not shown) such as an electric motor.
Each of these brush rollers 11A, 12A, 13A; 11
B, 12B, and 13B can be individually controlled, and can be rotated at a predetermined rotation speed and in a predetermined rotation direction. Also, the first of the three support frames 6A and 6B,
Second and third brush rollers 11A, 12A, 13A; 11
B, 12B, and 13B are mounted so as to face each other, and the titanium base plate 100 can be sandwiched therebetween. The first of the two brush roller support frames 6A, 6B,
Second and third brush rollers 11A, 12A, 13A; 11
In the present embodiment, B, 12B, and 13B are rotated so as to rub the sandwiched titanium mother plate 100 downward from above.

The brush rollers 11A and 11B are Shotex # 120 (trade name, manufactured by Showa Denko Kenso Co., Ltd.) in which a nonwoven fabric mixed with a carbon abrasive is radially fixed to a core roll, and brush rollers 12A, 13A; 12B. , 1
For 3B, similar results were obtained using the same Showtex # 80 (trade name: Showa Denko Kenso Co., Ltd.).

In this embodiment, each of the brush rollers 11A, 1
2A, 13A; 11B, 12B, 13B have an outer diameter of 95
mm, the axial length was 960 mm, and the adjacent rollers were spaced apart from each other by a distance (L) of 345 mm.

[0028] The titanium base material 100 is
2 is hooked on the hook 201 of the trolley conveyor 200, and is thereby conveyed to the polishing apparatus 1 while being suspended. At this time, as shown in FIGS. 1 and 2, the moving tables 4A and 4B have moved to positions separated from each other, and accordingly, both brush roller support frames 6A and 6B are also separated from each other, and Brush rollers 11A, 12A, 1
3A; voids are formed between 11B, 12B, and 13B. The titanium base material 100 suspended on the trolley conveyor 200 includes brush rollers 11A, 12A, 13A;
It is fed between 1B, 12B, 13B and installed in the gap. At this time, the brush roller support frame 6A,
6B is located at the highest position on the moving tables 4A and 4B.

Here, the outline of the internal structure of the polishing apparatus 1 will be described with reference to FIG.

According to the present invention, the brush roller supporting frame 6
The brush rollers 11A, 12A, and 13A; 11B, 12B, and 13B are rotatably attached to A and 6B at predetermined intervals as described above.
And 11B, ceiling plates 22A and 22B are arranged above, while below brush rollers 13A and 13B,
Bottom plates 23A and 23B inclined downward in a V-shape are arranged. Also, brush rollers 11A, 12A; 11B, 12
Below B, inclined plates 24A and 24B which are inclined downward from the titanium base material 100 side to the brush roller support frame back plates 20A and 20B side are arranged. Also, the inclined plates 24A, 24
B from the lower end thereof, the brush roller supporting frame back plate 20A, 20B
Partition plates 25A and 25B extending downward along B and with a predetermined gap therebetween are installed. With such a configuration, the first, second and third chambers 16A, 17A, 18A;
B, 17B and 18B are respectively defined.

Further, according to the present invention, water is sprayed onto the brush roller supporting frames 6A, 6B from the titanium base plate 100 toward the back plates 20A, 20B opposite to the titanium base plate. Nozzles 26A and 26B are installed.
Water injected from the injection nozzles 26A and 26B is supplied to the titanium base plate 100 and the brush rollers 11A, 12A and 13A;
The injection direction is adjusted so as not to directly hit 1B, 12B, and 13B. In this embodiment, the support frames 6A, 6B
The injection nozzles 26A and 26B are also installed at positions adjacent to the ceiling plates 22A and 22B. However, the injection nozzle 26
Partition plates 28A, 28B extending downward from ceiling plates 22A, 22B are provided so that water from A, 26B is not sprayed on each brush roller.

The inside of the support frame, that is, each of the brush rollers 11, is sprayed with water sprayed from each of the spray nozzles 26 A and 26 B.
A, 12A, and 13A; The periphery of the polishing area where 11B, 12B, and 13B are located is in a water spray state. Thereby, the brush rollers 11A, 12A, 13A; 11B, 12B,
Titanium (T
i) Prevention of ignition of powder (and titanium oxide (TiO ₂ ) powder). As the water injection amount, for example, 20 to 4
0 liter / min.

The injected water flows down into the gaps between the back plates 20A, 20B and the partition plates 25A, 25B by the inclined plates 24A, 24B, and is drained by the V-shaped bottom plates 23A, 23B. To the cleaning tank 3 via the The cleaning tank 3 will be described later.

According to the present embodiment, the inclined plates 24A, 24B
Cleaning nozzles 27A and 27B are arranged at a position below the upper end portion close to titanium base plate 100. The cleaning nozzles 27A and 27B serve to clean the inside of the brush roller supporting frames 6A and 6B after the polishing operation is completed.

In the above configuration, as described above, the titanium base material 100 suspended on the trolley conveyor 200 is provided with brush rollers 11A, 12A, 13A; 11B, 12B, 13B.
When it is fed into the gap and installed in the gap, then, as shown by a dashed line in FIG.
B move toward each other, and the brush rollers 11A, 12A, 13A; 11B, 12
B and 13B contact the titanium base material.

According to the present embodiment, each brush roller 11
A, 12A, 13A; 11B, 12B, 13B have a diameter of 95 mm and a maximum of 4600 r as described above.
Rotated at pm. Further, as described above, each of the brush rollers 11A, 12A, 13A; 11B, 12B, 13B
The vertical movement of the brush roller supporting frames 6A and 6B from the upper limit position to the lower limit position (ST) is 350 mm and the vertical movement speed is 85 mm / sec. Upper area 100A, middle area 100B, lower area 100 on both surfaces
C was polished.

In this embodiment, the rotational speed is set to about 4300 r.
By setting pm, the surface roughness of the upper region 100A could be polished to about 0.8 μmRa, and the surface roughness of the middle region 100B and the lower region 100C could be polished to about 1.7 μmRa.

In this embodiment, the inside of the washing tank 3 is partitioned by a partition plate 31. In FIG. 1, titanium (Ti) powder and oxidized titanium supplied to the tank from the left end ceiling are shown in FIG. The water containing the titanium (TiO ₂ ) powder is purified by settling the powder in the tank while flowing to the right.
The purified water is again supplied to the brush roller supporting frame 6A by the pump P driven by the motor M via the supply line 32,
6B is supplied to the injection nozzle 20 and the cleaning nozzle.
The powder that has settled at the bottom of the tank is appropriately collected through a pipe 33, and fresh water corresponding to the consumed water amount is supplied into the tank 3 through a pipe 34.

The titanium base material 10 produced as described above
Although the seed plate was actually electrodeposited using 0, the electrodeposited seed plate was not undesirably peeled off from the mother plate, and
Only the upper part of the seed plate could be easily peeled off from the mother plate by hammering in the mouthing device and suction by the suction cup in the mouth opening device. Also, the seed plate was fed into the peeling device, a peeling arm was inserted above the peeled seed plate, and the arm was lowered, whereby the seed plate could be peeled off from the mother plate very efficiently. Also, there was no danger of ignition during polishing.

[0040]

As described above, the titanium base plate for copper electrolysis according to the present invention divides the region where the seed plate is electrodeposited into three regions vertically, an upper region, a middle region and a lower region. The surface roughness of the upper region is made finer, and the surface roughness of the middle region and the lower region is made rough. Typically, the surface roughness of the upper region is about 0.8 μmRa, and the surface of the middle region and the lower region Roughness is about 1.
Since it is 7 μmRa, the occurrence of an accident that the electrodeposited seed plate is undesirably peeled off from the mother plate is eliminated, and
The seed plate can be easily peeled off from the mother plate during the operation of peeling off the mother plate.

The apparatus for polishing a titanium base plate for copper electrolysis according to the present invention comprises first, second, and second parts arranged vertically on both sides of the titanium base plate and spaced apart from each other. A third brush roller, means for rotating and driving the first, second, and third brush rollers, and means for moving the first, second, and third brush rollers in the vertical direction with respect to the titanium base plate. And means for injecting water around the polishing area where the first, second, and third brush rollers are located, so that the copper can be efficiently produced without danger of ignition during polishing. A titanium base plate for electrolysis can be manufactured.

[Brief description of the drawings]

FIG. 1 is a view showing a schematic configuration of an embodiment of a polishing apparatus for a titanium base plate for copper electrolysis according to the present invention.

FIG. 2 is a front view of one embodiment of a polishing apparatus for a titanium base plate for copper electrolysis according to the present invention.

FIG. 3 shows a line of the apparatus for polishing a titanium base plate for copper electrolysis shown in FIG. 2;
It is a figure taken on II-II.

FIG. 4 is a front view of one embodiment of a titanium base plate for copper electrolysis according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Polishing apparatus 2 Base 3 Cleaning tank 4A, 4B Moving table 5A, 5B, 8A, 8B Slider means 6A, 6B Brush roller support frame 7A, 7B, 9 rail 11A, 12A, 13A Brush roller 11B, 12B, 13B Brush Rollers 24A, 24B Inclined plates 26A, 26B Injection nozzles 27A, 27B Cleaning nozzles 100 Titanium base plate 101 Edgewise protector 102 Crossbar

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshitaka Himeno 3382-3, Seki, Saganoseki-cho, Sakaseki-cho, North Sea District, Oita Prefecture F-term in the Saganoseki Smelter & Refinery (reference) 3C058 AA06 AA09 AA13 AA14 AA16 AA18 AB03 AC04 CA01 CA04 CB02 CB04 CB06 CB10 4K058 AA30 BA21 BB02 EB02 EB16 FA09

Claims (8)

[Claims] 1. A titanium base plate for copper electrolysis for electrodepositing a seed plate, wherein the titanium base plate has three regions in which a seed plate is electrodeposited in an up-down direction, an upper region, a middle region, A titanium base plate for copper electrolysis, which is divided into a lower region, the surface roughness of an upper region is made finer, and the surface roughness of a middle region and a lower region is made rough. 2. The titanium base plate for copper electrolysis according to claim 1, wherein the upper region is approximately one third above the entire region where the seed plate is electrodeposited. 3. The surface roughness of the upper region is 0.4 to 1.0.
μmRa, preferably 0.6 to 1.0 μmRa, and the surface roughness of the middle region and the lower region is 1.0 to 2.0
3. The titanium base plate for copper electrolysis according to claim 1, wherein the titanium base plate has a μmRa of 1.5 to 2.0 μmRa. 4. 4. The surface roughness of the upper region is about 0.8 μmR.
a, and the surface roughness of the middle region and the lower region is about 1.7.
4. The titanium base plate for copper electrolysis according to claim 3, wherein the thickness is μmRa. 5. A polishing apparatus for polishing both surfaces of a titanium base plate for copper electrolysis for electrodepositing a seed plate, the polishing device being vertically aligned on both sides of the titanium base plate,
A first, a second, and a third brush roller that are spaced apart from each other; a unit that rotationally drives the first, second, and third brush rollers; and a first, a second, and a third brush roller. Means for vertically moving a brush roller with respect to the titanium base plate; and means for injecting water around a polishing area where the first, second, and third brush rollers are located. An apparatus for polishing a titanium base plate for copper electrolysis, comprising: 6. The first brush roller has a surface roughness of the upper region of 0.4 to 1.0 μmRa, preferably,
0.6 to 1.0 μm Ra, and the second and third brush rollers have a surface roughness of the middle region and the lower region of 1.0 to 1.0 μm Ra.
２．０2.0 μmRa, preferably 1.5-2.0 μmR
7. The apparatus for polishing a titanium base plate for copper electrolysis according to claim 6, wherein: a. 7. The surface roughness of the upper region is about 0.8 μmR.
and the surface roughness of the middle and lower regions is about 1.7
The polishing apparatus for a titanium base plate for copper electrolysis according to claim 6, wherein the polishing speed is set to μmRa. 8. The apparatus for polishing a titanium base plate for copper electrolysis according to claim 5, wherein the brush roller is a roller in which a nonwoven fabric mixed with a carbon abrasive is fixed to a core roll.