JP2000164405A - Organic thermistor device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact and economically efficient organic thermistor device whose cold resistance value is small, and a method for manufacturing this device. SOLUTION: A plurality of tabular inner conductors 2 whose thickness is ranging from 10 to 200 μm are arranged inside a thermistor element assembly 1 formed of organic thermistor materials 1a almost in parallel with a direction in which a pair of outer electrodes 3a and 3b are faced to each other so that the main surfaces can be faced through the organic thermistor materials 1a to each other, and one edge parts can be conducted with the outer electrodes 3a and 3b at mutually different sides. Also, the exposed surface of the thermistor element assembly 1 and the exposed faces of the inner conductors 2 from the thermistor element assembly 1 are covered with insulating members 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type thermistor device used for overcurrent protection and the like, and more particularly, to an organic thermistor device using an organic thermistor material to form a thermistor body and a method of manufacturing the same. About.

[0002]

2. Description of the Related Art As a circuit protection component for suppressing an excessive current,
Recently, organic PTC using organic thermistor material
Thermistors have been used.

[0003] This organic PTC thermistor device is, for example, a thermistor device using an organic thermistor material having a PTC characteristic by dispersing carbon or the like in a resin such as polyethylene. Generally, as shown in FIG. Then, a metal foil made of nickel, copper, or the like is pressed on both upper and lower surfaces of a thermistor body 51 formed of an organic thermistor material in a plate shape to form surface electrodes 52a and 52b.
The external electrodes 53a, 53 are formed by plating or sputtering.
b.

In addition, as an organic PTC thermistor device, as shown in FIG. 12, exposed portions such as a thermistor body 51 and surface electrodes 52a and 52b are covered with an insulating material 54 such as an insulating resin. External electrodes 53a, 5
A structure in which only 3b is exposed is used.

When mounting the above-mentioned organic thermistor device of the surface mount type (organic thermistor device shown in FIG. 11), as shown in FIG. 13, usually, as shown in FIG. Mounting is performed by electrically and mechanically connecting 53b to a wiring electrode (land) 56 of a printed circuit board 55 via a solder fillet 57.

Incidentally, in a PTC thermistor device for suppressing excessive current, it is desired that the resistance value at room temperature be 0.1 Ω or less in order to avoid a voltage drop in the PTC thermistor device when an electric circuit is used. . The resistance value of the PTC thermistor device is obtained by the following equation (1). ρ × T / S (1) ρ: Specific resistance of PTC element T: Thickness of PTC element S: Cross-sectional area of PTC element

On the other hand, in the case of an organic PTC thermistor material, it is difficult to reduce the specific resistance to 0.5 Ωcm or less in order to satisfy various electric characteristics required for the PTC thermistor material when the resistance value changes suddenly at a high temperature. There is a fact. Therefore, using such an organic PTC thermistor material, an organic PTC having a room temperature resistance of 0.1Ω or less is used.
When a TC thermistor device is to be constructed, as shown in FIG. 11, a metal foil made of nickel, copper, or the like is crimped on upper and lower surfaces of a thermistor body 51 formed of an organic thermistor material in a plate shape, and a surface electrode 52a is formed. , 52b are generally used.

However, even if the upper and lower surface electrode structure as shown in FIG. 11 is used, if the room temperature resistance value is set to 0.1 Ω or less, the requirement that the thickness of the thermistor body 51 is small and the cross-sectional area is large. Need to be met. Therefore, in the conventional organic PTC thermistor device, the dimensions of the thermistor body 51 are, for example, 4.5 mm (L) ×
The size is 3.2 mm (W) × 0.3 mm (T).

[0009]

As described above, the PTC
It is an essential requirement for the thermistor device to have a low resistance at room temperature. However, in the case of an organic PTC thermistor device, the current technology reduces the thickness of the thermistor body and increases the cross-sectional area ( In other words, it is a fact that this demand can only be met by increasing the plane area).

Therefore, the planar dimensions of the product are increased, the space required for mounting on the substrate is increased, the occupancy of the substrate is increased, and the amount of the organic thermistor material constituting the thermistor body is increased. The thickness of the thermistor body is thin, which causes an increase in cost. Therefore, defects such as twisting and bending are likely to occur after mounting. A large amount of material (organic material constituting the thermistor body) between a pair of external electrodes Therefore, there is a problem that the operation time of the PTC thermistor device becomes longer and sufficient overcurrent protection characteristics cannot be obtained (elements in a circuit are destroyed before the PTC thermistor device operates). .

A sheet made of an organic material having an electrode to be an internal conductor provided on the surface (organic PTC sheet)
By laminating the PTC thermistor element, it is conceivable that the PTC thermistor body has a laminated structure in which an internal conductor is provided between organic PTC sheets.
The laminating method that requires processes such as formation of internal conductors and lamination of sheets has a problem that the cost is increased, a product price is significantly increased, and the practicability is poor.

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide an organic thermistor device which is small in size, has a small resistance at room temperature, and is excellent in economical efficiency, and a method of manufacturing the same.

[0013]

In order to achieve the above object, an organic thermistor device according to the present invention (claim 1) comprises a thermistor element formed using an organic thermistor material, and both ends of the thermistor element. A pair of external electrodes disposed on the inside of the thermistor body, substantially parallel to the direction in which the pair of external electrodes face each other, and with their main surfaces facing each other via an organic thermistor material, It is characterized in that it comprises a plurality of flat inner conductors having a thickness in the range of 10 to 200 μm, one end of which is alternately arranged so as to be electrically connected to different external electrodes.

In a thermistor body formed using an organic thermistor material, the main surfaces thereof are substantially parallel to the direction in which the pair of external electrodes oppose each other, and the main surfaces thereof face each other via the organic thermistor material. The thickness is 1 so that the ends alternately conduct with different external electrodes.
By arranging a plurality of flat inner conductors in the range of 0 to 200 μm, the resistance value of the thermistor body is set to be equal to the distance between the inner conductors (the inner conductors) arranged to face each other via the organic thermistor material. And the resistance value of the organic thermistor material. Therefore, by reducing the distance between the internal conductors, it becomes possible to realize an organic thermistor device having a sufficiently small room temperature resistance value.

In the organic thermistor device of the present invention, the thickness of the internal conductor 2 is set in the range of 10 to 200 μm when the thickness of the internal conductor is less than 10 μm because the rigidity of the internal conductor is reduced and the cost is reduced. When the thickness of the inner conductor exceeds 200 μm, the wraparound of the organic PTC material at the time of molding is rapidly deteriorated, and bubbles are generated between the inner conductors. This is because the probability of formation is high. Air bubbles existing between the internal conductors are extremely undesirable because they cause element deterioration such as cracks when the product is used.

In the present invention, there is no particular limitation on the type of the organic thermistor material constituting the thermistor body. For example, an organic thermistor material having a PTC characteristic by dispersing carbon or the like in a resin such as polyethylene. For example, various organic thermistor materials can be used.

Further, in the present invention, there is no particular limitation on the material constituting the inner conductor, and various good conductor materials can be used.
Preferred examples include tin, aluminum, copper, and alloys containing at least one of these as a main component. Further, by plating the inner conductor with nickel, tin or copper, the adhesion between the inner conductor and the organic thermistor material can be improved, and the reliability can be improved.

The organic thermistor device according to claim 2 is characterized in that a corner (ridge) of the end of the inner conductor that is not electrically connected to the external electrode is chamfered.

Further, by chamfering the corners (ridges) of the end of the internal conductor that is not conductive with the external electrode, it is possible to prevent bubbles from being formed near the tip of the internal electrode that is not conductive with the external electrode. This makes it possible to obtain a more reliable organic thermistor device with less occurrence of cracks and peeling. In addition, as a mode of chamfering, rounded R chamfering, C chamfering obliquely chamfering, etc. are illustrated.

Further, the organic thermistor device according to claim 3 is characterized in that the exposed surface of the thermistor element and the exposed surface of the internal conductor from the thermistor element are covered with an insulating member.

By insulating the exposed surface of the thermistor body and the exposed surface of the internal conductor from the thermistor body,
It is possible to prevent the thermistor element and the internal conductor from conducting to other components and lines on the mounting board, thereby ensuring sufficient reliability.

According to a fourth aspect of the present invention, there is provided a method for manufacturing an organic thermistor device according to the first or second aspect, wherein the organic thermistor material constituting the thermistor body is softened. By molding the organic thermistor material so as to cover the plurality of flat inner conductors, the plurality of inner conductors are buried in the organic thermistor material, and one of the end portions of the inner conductor is Forming buried bodies (linear buried bodies) that are alternately exposed on one side of the buried body on opposite sides of the buried body, and both sides of the linear buried bodies where the internal conductors are exposed. Forming a pair of continuous electrodes (electrodes for external electrodes) on the surface, and dividing the linear buried body into individual elements by cutting at predetermined intervals in a direction perpendicular to the longitudinal direction You It is characterized by comprising a step.

[0023] By softening the organic thermistor material and molding the organic thermistor material so as to cover the plurality of flat inner conductors, the plurality of inner conductors are embedded in the organic thermistor material, and the longitudinal direction of the inner conductors is reduced. One of the two side ends parallel to each other forms a buried body (linear buried body) having a structure in which the buried body is alternately arranged for each layer and is exposed to different side surfaces of the opposite side surfaces parallel to each other in the longitudinal direction. Then, after forming electrodes (electrodes for external electrodes) on both side surfaces of the linear buried body with the inner conductor exposed, the linear buried body is cut at predetermined intervals in a direction orthogonal to the longitudinal direction. By dividing the organic thermistor into individual elements, the basic structure of the organic thermistor device of the present invention can be efficiently obtained.

According to a fifth aspect of the present invention, there is provided a method for manufacturing an organic thermistor device according to the third aspect, wherein the organic thermistor material constituting the thermistor element is softened, and By shaping the organic thermistor material so as to cover the plurality of internal conductors, a plurality of inner conductors are buried in the organic thermistor material, and one of the ends of the inner conductor is further Forming a buried body (linear buried body) that is exposed on different side surfaces of the buried body that are opposite to each other on each side, covering the linear buried body with an insulating material, Removing the insulating material covering both sides parallel to the longitudinal direction of the linear buried body to expose the organic thermistor material and the inner conductor; and exposing the linear buried body to both side faces of the linear buried body. Forming electrodes (electrodes for external electrodes) on both side surfaces of the linear buried body so as to be bonded to the material thermistor material and the internal conductor; and forming the linear buried body on which the electrodes for external electrodes are formed. At a predetermined interval, a step of cutting in a direction orthogonal to the longitudinal direction to divide into individual elements, and covering a cut end face of the divided individual element with an insulating material. Features.

The organic thermistor material is softened, and the organic thermistor material is molded so as to cover the plurality of flat internal conductors, thereby forming a linear embedded body in which the plurality of internal conductors are embedded in the organic thermistor material. After the linear buried body is covered with an insulating material, the insulating material on both sides parallel to the longitudinal direction of the linear buried body is removed to expose the organic thermistor material and the internal conductor, and to expose the organic thermistor material and the internal After forming electrodes (electrodes for external electrodes) on both side surfaces of the linear buried body so as to join with the conductor, the linear buried body is cut at a predetermined interval in a direction perpendicular to the longitudinal direction. The inner conductor is arranged in the thermistor body, and the exposed surface of the thermistor body and the inner conductor are covered by covering the cut end face of each element with an insulating material. Exposed surface of the Misuta element body becomes possible to efficiently produce organic thermistor device of the present invention which are insulated covered with an insulating member.

Further, the organic thermistor device of the present invention (claim 6) comprises a thermistor element formed by using an organic thermistor material, a pair of external electrodes disposed on both ends of the thermistor element, Inside the thermistor body,
Substantially parallel to the direction in which the pair of external electrodes face each other,
And, a plurality of inner conductors that are adjacent to each other via the organic thermistor material and are arranged so that one end thereof is alternately connected to external electrodes different from each other and have a substantially circular or substantially square cross-sectional shape. It is characterized by having.

In the present invention, it is possible to use a conductor having a substantially circular or substantially square cross section as the internal conductor, as in the organic thermistor device according to claim 6. Since the resistance is negligible compared to the specific resistance of the organic thermistor material, it is possible to obtain the same effect as reducing the distance between the pair of external electrodes equivalently, and the room temperature resistance value of the thermistor body Can be lowered.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described, and features thereof will be described in more detail. FIG.
1A is a perspective view showing an organic thermistor device according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view of the organic thermistor device shown in FIG. It is.

As shown in FIGS. 1 (a) and 1 (b), this organic thermistor device is, for example, a thermistor body made of an organic thermistor material having a PTC characteristic by dispersing carbon or the like in a resin such as polyethylene. External electrodes 3a and 3b are arranged on both ends of the first electrode 1 and a pair of external electrodes 3a and 3b are opposed to each other inside the thermistor body 1 (direction indicated by arrow A in FIG. 1B). ) Has a structure in which a plurality of flat inner conductors 2 (FIG. 1B) are disposed in a direction substantially parallel to the exposed surface of the thermistor body 1 and the thermistor body of the inner conductor 2. The exposed surface from 1
The insulating member (insulating resin) 4 is insulated and covered. Note that the thickness of the internal conductor 2 is desirably in the range of 10 to 200 μm.

In the organic thermistor device of this embodiment, a metal conductor obtained by applying a nickel plating to a thin copper plate is used as the internal conductor 2. By applying nickel plating to the internal conductor 2, it is possible to improve the adhesion between the internal conductor 2 and the organic thermistor material 1a. In addition, the surface of the internal conductor is Ra = 0.1 to 10.0.
By roughening the surface to about μm, the adhesion can be further improved.

In the organic thermistor device of this embodiment, the inner conductor 2 is horizontally placed inside the thermistor body 1 via the organic thermistor material 1a (FIG. 1).
(In the position of (b), the upper and lower surfaces of the thermistor body 1 are parallel)
The three sheets are arranged such that the distance D between the adjacent inner conductors (distance between the inner conductors) is 0.1 to 0.3 mm. Further, the inner conductor 2 is alternately connected to the outer electrodes 3a and 3b on a different side for each layer. The inner conductor 2a of the uppermost layer and the inner conductor 2c of the lowermost layer are connected to the outer electrode 3a. The inner conductor 2b between the lowermost layers is connected to the outer electrode 3b.

In the organic thermistor device of this embodiment, three internal conductors 2 are buried in the thermistor body 1. In the present invention, however, the number of the internal conductors 2 to be arranged is not particularly limited. Instead, four or more internal conductors may be provided.

Although not shown, the external electrodes 3a and 3b include a nickel layer formed on the surface of the thermistor body 1 by a sputtering method and a tin layer or a tin layer formed by electroplating the nickel layer. It has a laminated structure composed of an alloy layer.

Next, a method of manufacturing the organic thermistor device of this embodiment will be described. As shown in FIG. 2A, the thickness is 0.2 mm and the width is 2.5
3 reels 11 (1
1a, 11b, 11c), and three thin and long tape-shaped inner conductors 2 (2a, 2b, 2b in order from the top) drawn out from each reel 11 are put into a three-hole die nipple 12 of a molding machine. The organic thermistor material 1a, which has been softened by heating through heating, is extruded while pouring, and FIG. 2 (b)
A buried body (linear buried body) 21 in which the internal conductor 2 is buried in the organic thermistor material 1a is formed as shown in a sectional view in a direction orthogonal to the longitudinal direction. The three tape-shaped internal conductors 2 are connected to the uppermost and lowermost internal conductors 2a,
2c is located on the left side, and the inner conductors 2a, 2a,
As shown in FIG. 2 (b), the horizontal position is alternately shifted to different sides so that the inner conductor 2b between 2c is located on the right side and supplied to the three-hole die nipple 12 of the molding machine. The uppermost and lowermost inner conductors 2a and 2c are buried in the organic thermistor material 1a with the inner conductor 2b between the uppermost and lowermost inner conductors 2a and 2c being on the right. The linear embedded body 21 can be obtained. Then, the formed linear buried body 21 is transferred to another reel 1.
3 (FIG. 3A) to prepare for a subsequent step. Next, as shown in FIG. 3A, the linear embedded body 21 is led out from the reel 13 on which the linear embedded body 21 has been wound up, passed through a one-hole die nipple 14 of a molding machine, and heated and softened. Extrusion molding while pouring in the insulating material (insulating resin) 4 and covering the linear embedded body 21 with the insulating resin 4, as shown in FIG. 3B, a cross-sectional view in a direction orthogonal to the longitudinal direction. A linear insulating coating 22 is formed. Then, the insulating resin 4 of the insulating covering 22 is continuously removed in the longitudinal direction at a predetermined pair of positions where the external electrodes are to be formed. In this embodiment, as shown in FIG.
Grinders 15a and 15b are provided on both sides of the insulating cover 22, and the insulating cover 22 covered with the insulating resin 4 is passed between the two grinders 15a and 15b to thereby form the insulating resin 4 (4a (FIGS. 3 (b) and 4) are removed to expose the organic thermistor material 1a and the side portions of the inner conductor 2 at both ends as shown in FIG. In addition,
The surface roughness of the grinders 15a and 15b is # 100
By using a material of about 0 to 2000, the adhesion of the external electrodes 3a and 3b formed in a later step can be improved. Next, a nickel layer is formed by sputtering nickel on the surfaces of the organic thermistor material 1a and the inner conductor 2 exposed at both ends of the linear embedded body 21 (insulating coating body 22), and the solderability is improved. In order to
The external electrodes 3a and 3b are formed by electroplating solder or tin to form a solder layer or tin layer on the nickel layer.
Is formed (FIG. 6). Then, the linear embedded body 21 on which the external electrodes 3a and 3b are formed is placed at a predetermined interval (here, 1.6 mm) in the longitudinal direction.
At intervals), and cut out individual elements. Then, an insulating resin 4 (4b) (FIG. 1 (a)) is applied to the cut surface of each cut element where the internal conductor 2 is exposed, and the insulating resin is cured by applying ultraviolet rays.
An organic thermistor device as shown in FIG.

In the organic thermistor device of this embodiment, at least one of the front surface and the back surface of the internal conductor 2 is placed inside the thermistor body 1 as described above. Since the elements are arranged so as to face each other with the thermistor material 1a interposed therebetween, it is possible to realize an element having a low resistance value. In the organic thermistor device having the above-described conventional configuration (FIG. 11),
What was required to have a size of 4.5 mm (L) x 3.2 mm (W) x 0.3 mm (T) was changed to 3.2 mm (L) x
1.6 mm (W) × 1.0 to 1.6 mm (T) can be achieved, and the plane area can be reduced to reduce the mounting space.

In the above-described embodiment, a case has been described in which an electrode serving as an external electrode is formed on the linear buried body and then cut to be divided into individual elements. After cutting and dividing into individual elements, an external electrode can be formed.

As shown in FIG. 7, the corners (ridges) of the tip 2p that is not electrically connected to the external electrodes 3a and 3b of the internal conductor 2 are chamfered and R-shaped, so that the external electrodes of the internal electrodes are formed. It is possible to prevent the formation of air bubbles in the vicinity of the distal end portion 2p that does not conduct with the 3a and 3b, to prevent cracks and peeling, and to obtain a more reliable organic thermistor device. In FIG. 7,
The parts denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding parts as the parts denoted by the same reference numerals in FIG.

Further, in the above embodiment, the case where the inner conductor has a flat plate shape has been described as an example. However, as shown in FIGS.
For example, a round bar-shaped metal wire 4 having a circular cross section
It is also possible to constitute the organic thermistor device of the present invention by using 2. Note that in FIG. 8, FIG.
Parts denoted by the same reference numerals as those in (b) indicate the same or corresponding parts.

In the organic thermistor device having the structure shown in FIG. 8, the metal wire (inner conductor) 42 is connected to the pair of external electrodes 3.
a, 3b are substantially parallel to the direction in which they face each other, are adjacent to each other via the organic thermistor material 1a, and have their ends alternately electrically connected to external electrodes 3a, 3b on different sides. It is arranged inside. Also in the organic thermistor device of this embodiment, the resistance value of the thermistor body 1 is defined by the distance (distance between internal conductors) D between the metal wires (inner conductors) 42 and the resistance value of the organic thermistor material 1a. Therefore, even if there is a restriction in lowering the resistance value of the organic thermistor material 1a, it is possible to realize an organic thermistor device having a sufficiently small room temperature resistance value by reducing the distance D between the internal conductors.

The organic thermistor device can be manufactured, for example, by using an extrusion molding method according to the above embodiment. In this case, as shown in FIG. 9, the organic thermistor material 1a To form a flat buried body 21 in the form of a flat electric wire on which a metal wire 42 as an internal conductor is disposed, and as shown in FIG. 10, the buried body 21 is oriented in a direction orthogonal to the longitudinal direction (the direction of arrow A). Each metal wire (inner conductor) 4
2 is alternately cut one by one at a position receding from the end surface by about 0.2 mm, and thereafter, the concave portion X is filled with an organic thermistor material to form a rectangular parallelepiped shape without any irregularities. 3a and 3b (FIGS. 8A and 8B).

The metal wires constituting the internal conductor are not limited to those having a circular cross-sectional shape, and various shapes such as those having a rectangular cross-sectional shape can be used.

The present invention provides, in still other respects,
The present invention is not limited to the above embodiment, and various applications and modifications can be made within the scope of the invention. For example, the specific shape and arrangement of the internal conductor,
It is also possible to change the resistance value of the thermistor body by adjusting the cutting mode or the like of the linear buried body, thereby achieving a series of resistance values.

[0043]

As described above, the organic thermistor device of the present invention (Claim 1) is provided in the thermistor body formed using the organic thermistor material in a direction substantially parallel to the direction in which the pair of external electrodes face each other. And, with the main surfaces facing each other via the organic thermistor material, one end is alternately connected to different external electrodes,
Since a plurality of flat inner conductors having a thickness in the range of 10 to 200 μm are arranged, the inner conductors arranged so that the resistance value of the thermistor body faces through the organic thermistor material Distance (distance between internal conductors)
Because it is determined by the resistance of the organic thermistor material, by reducing the distance between the internal conductors,
An organic thermistor device having a sufficiently small room temperature resistance can be realized.

Further, as in the organic thermistor device according to the second aspect, by chamfering a corner (ridge line) of an end portion of the internal conductor that is not electrically connected to the external electrode, the other end of the internal electrode that is not electrically connected to the external electrode can be chamfered. It is possible to prevent the formation of air bubbles in the vicinity of the tip portion, to prevent cracks and peeling, and to obtain a more reliable organic thermistor device.

Further, the exposed surface of the thermistor element and the exposed surface of the internal conductor from the thermistor element are insulated and coated as in the organic thermistor device according to claim 3, so that other parts and lines on the mounting board are formed. Thus, it is possible to prevent the thermistor body and the internal conductor from conducting, and to ensure sufficient reliability.

In the method of manufacturing an organic thermistor device according to the present invention (claim 4), the organic thermistor material is softened, and the organic thermistor material is formed so as to cover a plurality of flat internal conductors. The inner conductor is embedded in the organic thermistor material, and one of both side ends parallel to the longitudinal direction of the inner conductor is alternately layered one by one on both sides parallel to the longitudinal direction and opposed to each other. After forming a buried body (linear buried body) having an exposed structure on the side surfaces different from each other, forming electrodes (electrodes for external electrodes) on both side surfaces of the buried body having the inner conductor exposed, and then forming a linear structure. Since the buried body is cut at predetermined intervals in a direction perpendicular to the longitudinal direction and divided into individual elements, it is possible to efficiently obtain the basic structure of the organic thermistor device of the present invention. Possible Ri, can be Arashimeru more effective the present invention.

In the method for manufacturing an organic thermistor device according to the present invention (claim 5), the organic thermistor material is softened, and the organic thermistor material is extruded so as to cover a plurality of flat internal conductors. Forming a linear buried body in which the inner conductor is buried in an organic thermistor material, covering the linear buried body with an insulating material, and removing the insulating material on both sides parallel to the longitudinal direction of the linear buried body. The electrodes (electrodes for external electrodes) are formed on both side surfaces of the linear buried body so that the organic thermistor material and the internal conductor are exposed and joined to the exposed organic thermistor material and the internal conductor. The body is cut at predetermined intervals in the direction perpendicular to the longitudinal direction and divided into individual elements, and the cut end faces of the individual elements are covered with an insulating material. Efficient production of the organic thermistor device of the present invention in which the internal conductor is disposed in the element body, and the exposed surface of the thermistor element and the exposed surface of the internal conductor from the thermistor element are insulated by an insulating member. Becomes possible.

In the present invention, a conductor having a substantially circular or substantially square cross section can be used as the internal conductor as in the organic thermistor device according to claim 6. Is negligible compared to the specific resistance of organic thermistor materials.
Equivalently, it is possible to obtain the same effect as reducing the distance between the pair of external electrodes, and it is possible to reduce the room temperature resistance of the thermistor body.

[Brief description of the drawings]

FIG. 1A is a perspective view showing an external configuration of an organic thermistor device according to an embodiment of the present invention, and FIG.
FIG. 2 is a perspective view of the organic thermistor device taken along the line a-a in FIG.

FIG. 2A is a view showing a state in which a linear embedded body is formed in one step of a method of manufacturing an organic thermistor device according to an embodiment of the present invention, and FIG. It is sectional drawing which cut | disconnected the body in the direction orthogonal to a longitudinal direction.

FIG. 3A is a view showing a state in which a linear buried body is covered with an insulating resin in one step of a method of manufacturing an organic thermistor device according to an embodiment of the present invention, and FIG. It is sectional drawing which cut | disconnected the linear embedding body covered with the insulating resin in the direction orthogonal to a longitudinal direction.

FIG. 4 is a perspective view showing a method of removing the insulating resin on both side surfaces of the insulating coating covered with the insulating resin in one step of the method of manufacturing the organic thermistor device according to one embodiment of the present invention.

FIG. 5 is a perspective view showing a linear buried body from which insulating resins on both side surfaces have been removed;

FIG. 6 is a perspective view showing a state in which external electrodes are formed on both sides of a linear embedded body.

FIG. 7 is a perspective view showing a modification of the shape of the internal conductor of the organic thermistor device.

FIG. 8 is a view showing an organic thermistor device according to still another embodiment of the present invention, wherein (a) is a plan view, (b) is a front sectional view, and (c) is a side sectional view.

FIG. 9 is a view showing one step of a method of manufacturing the organic thermistor device of FIG. 8;

FIG. 10 is a plan sectional view showing a state where individual elements are cut out by cutting a linear buried body in one step of a method of manufacturing the organic thermistor device of FIG. 8;

FIG. 11 is a cross-sectional view showing a conventional organic thermistor device.

FIG. 12 is a sectional view showing another conventional organic thermistor device.

FIG. 13 is a cross-sectional view showing a state where a conventional organic thermistor device is mounted on a mounting substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thermistor body 1a Organic thermistor material 2 (2a, 2b, 2c) Internal conductor 2p Tip of internal conductor 3a, 3b External electrode 4 (4a, 4b) Insulating member (insulating resin) 11 (11a, 11b, 11c) Reel 12 Three-hole die nipple 13 Reel 14 One-hole die nipple 15a, 15b Grinder 21 Linear buried body 22 Insulating coating 42 Metal wire (inner conductor) D Distance between inner conductors

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yuichi Takaoka 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Inside Murata Manufacturing Co., Ltd. (72) Inventor Takashi Kama 2-26-10 Tenjin, Nagaokakyo-shi Kyoto F term in Murata Manufacturing (reference) 5E034 AA07 AB01 AC10 DA07 DB01 DB12 DC03 DC10 DE05 DE17

Claims (6)

[Claims] 1. A thermistor element formed using an organic thermistor material, a pair of external electrodes disposed on both ends of the thermistor element, and the pair of external electrodes inside the thermistor element. The main body has a thickness of 10 which is substantially parallel to the direction in which they face each other, and whose main surfaces face each other via an organic thermistor material, and whose one end is alternately connected to a different external electrode. An organic thermistor device comprising: a plurality of flat inner conductors in a range of from about 200 μm to about 200 μm. 2. The organic thermistor device according to claim 1, wherein a corner (ridge line) of an end of the inner conductor that is not electrically connected to the external electrode is chamfered. 3. The organic thermistor device according to claim 1, wherein an exposed surface of the thermistor body and an exposed surface of the internal conductor from the thermistor body are covered with an insulating member. 4. The method for manufacturing an organic thermistor device according to claim 1, wherein the organic thermistor material constituting the thermistor body is softened and the organic thermistor material is covered so as to cover a plurality of plate-like inner conductors. By molding, a plurality of inner conductors are buried in the organic thermistor material, and one of the ends of the inner conductors is alternately buried one by one on both sides of the buried body facing each other. Forming a buried body (linear buried body) exposed on different side surfaces; and, on both side surfaces of the linear buried body where the internal conductor is exposed,
A step of forming a pair of continuous electrodes (electrodes for external electrodes); and a step of cutting the linear buried body at predetermined intervals in a direction orthogonal to the longitudinal direction to divide the linear buried body into individual elements. A method for manufacturing an organic thermistor device, comprising: 5. The method for manufacturing an organic thermistor device according to claim 3, wherein the organic thermistor material constituting the thermistor element is softened and the organic thermistor material is formed so as to cover a plurality of flat internal conductors. Thereby, a plurality of internal conductors are buried in the organic thermistor material, and one of the ends of the internal conductors is different from one another on both sides of the buried body alternately for each layer. Forming a buried body (linear buried body) exposed on the side surface, covering the linear buried body with an insulating material, covering both side surfaces of the linear buried body parallel to a longitudinal direction. Removing the insulating material, thereby exposing the organic thermistor material and the internal conductor; and linearly burying the linear thermistor material and the internal conductor exposed on both side surfaces of the linear buried body. Forming electrodes (electrodes for external electrodes) on both side surfaces of the body, and cutting the linear embedded body on which the electrodes for external electrodes are formed at predetermined intervals in a direction orthogonal to the longitudinal direction. And a step of coating the cut end face of each of the divided elements with an insulating material. 6. A thermistor element formed using an organic thermistor material, a pair of external electrodes disposed at both ends of the thermistor element, and the pair of external electrodes inside the thermistor element. Substantially parallel to the direction facing each other, and adjacent to each other via the organic thermistor material, one end is alternately arranged to conduct to different external electrodes. An organic thermistor device comprising a plurality of substantially square inner conductors.