JP2000150119A - Thin film heater and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin film heater having a heater pattern divided into plural zones, capable of supplying an uniform quantity of heat. SOLUTION: A heating resistance wire body 12 is etched on an insulating material 11 of polyimide film, a wiring pattern is disposed under the heating resistance wire body 12 insulated with a polyimide coat, and a heating layer and a wiring layer of a thin film heater 10 are separated so that the current from an electric energy control part 14 is outputted to the heating resistance wire body 12 through this wiring pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film having a plurality of heating regions in which heating resistance linear bodies are separately laid, and in which each heating region generates heat by energizing the heating resistance linear bodies in each heating region. The present invention relates to a heater and a method of manufacturing the same, and more particularly, to a thin film heater including a plurality of heating regions capable of achieving a target temperature distribution while securing a degree of freedom of wiring, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a heating process such as baking for heating a substrate in order to remove a solvent remaining in a coated resist film, and a cooling process such as cooling for cooling the heated substrate to a room temperature level. Steps are included.

[0003] Therefore, when manufacturing such a semiconductor, a hollow plate formed of a highly heat conductive material, a thin film heater provided on the upper surface of the plate, and a cooling fluid circulating to the hollow portion of the plate are supplied. A temperature control device for heating and cooling the substrate by selectively operating the thin film heater and the fluid circulation supply system in a state where the substrate is placed on the upper surface of the plate. Is often used.

Here, this thin film heater is a film made of an insulating resin such as polyimide (hereinafter referred to as an "insulating film").
Say The heating element pattern is formed by etching the metal foil attached to ()).

The thin-film heater used in the heat-generating step usually needs to be able to independently control the amount of heat generated at each location in order to achieve uniform heating. The body pattern is often divided into a plurality of zones.

For example, in a thin film heater for supplying heat to a circular substrate, a circular first zone for directly supplying heat to the substrate, and a hollow circular second zone for preventing diffusion of the heat supplied by the first zone. There is known a technique in which the heat is supplied from the second zone, and the distribution of the heat applied to the base is made uniform, by supplying a slightly higher amount of heat than the first zone. Further, in consideration of the cooling fluid circulating and supplied to the hollow portion of the plate, the plate may be divided into a larger number of zones.

[0007]

However, since it is necessary to supply power to the heating resistor linear body forming the heating element pattern of the thin-film heater by using a wiring pattern formed by pattern etching or the like, this wiring pattern is used. How to arrange it becomes a problem.

For example, when the second zone is provided so as to completely surround the first zone, power can be easily supplied to the outer second zone, but cannot be supplied to the first zone.

Conventionally, a cutout portion is provided in a part of the second zone, and power must be supplied to the first zone via a wiring pattern passing through the cutout portion. In the notched portion of the two zones, the amount of heat generated from the wiring pattern cannot be controlled independently of the first zone.
The desired heating cannot be achieved.

If a distribution of the amount of heat applied to such a substrate occurs, the distribution of the amount of heat affects the chemical reaction of semiconductor manufacturing welding, resulting in a problem that a desired semiconductor cannot be manufactured.

In view of the above, the present invention has been made to solve the above problems, and to provide a thin film heater comprising a plurality of heating regions capable of supplying a uniform amount of heat while maintaining the degree of freedom of wiring, and a method of manufacturing the same. With the goal.

[0012]

In order to achieve the above object, the invention according to claim 1 has a plurality of heating areas in which heating resistance linear bodies are separately laid, respectively. In the thin-film heater in which each heating region generates heat by energizing the heating resistor linear body, a heating layer in which the heating resistor linear bodies are respectively laid in the plurality of heating regions and a heating resistor linear body in each heating region are energized. Since the wiring layer on which the wiring is laid is a separate layer, the following effects can be obtained.

1) The degree of freedom in wiring can be maintained.

2) A uniform amount of heat can be easily supplied.

According to the second aspect of the present invention, since the temperature sensors for detecting the temperatures of the plurality of heating regions are laid on the wiring layer, it is possible to easily detect the heat generation temperature of the heating regions.

Further, the invention according to claim 3 has a plurality of heating regions in which heating resistance linear bodies are separately laid, respectively.
In a method of manufacturing a thin film heater in which each heating region generates heat by energizing a heating resistor linear body in each heating region, a heating layer in which the heating resistor linear body is laid on each heating region on a predetermined insulator is formed. A second step of forming an insulating layer that insulates other than the current-carrying hole of the heating resistor linear body formed in the first step; and a step of forming the insulating layer formed in the second step. A third step of laying wiring on the top to form a wiring layer and coupling each wiring to the heating resistor linear body is included, so that the following effects can be obtained.

1) The wiring can be easily routed.

2) A uniform amount of heat can be supplied to the entire surface.

3) The heating resistor linear body and the wiring pattern can be formed of different materials.

According to a fourth aspect of the present invention, in the third step, a step of forming a first metal layer having a high temperature resistance coefficient on the insulating layer formed in the second step, A second metal layer having a lower resistance value than the first metal layer formed in the step and having a lower resistance than a region other than the conductive hole and the temperature sensor;
Forming the temperature sensor together with the wiring pattern, since the method further includes a step of further forming the metal layer and a step of forming the wiring pattern and the temperature sensor by etching the formed first and second metal layers. Can be.

Further, the invention according to claim 5 has a plurality of heating regions in which heating resistance linear bodies are separately laid, respectively.
In a method for manufacturing a thin film heater in which each heating region generates heat by energizing a heating resistor linear body in each heating region, a first metal foil forming the heating resistor linear member and a wire forming the heating resistor linear member are formed. A first step of forming a multi-layer sheet by bonding the second metal foil and an insulating film having a current-carrying hole, and etching the multi-layer sheet formed in the first step to form a heating resistor linear shape. Since the method includes the second step of producing a thin film heater in which the body and the wiring are bonded via an insulating film, the thin film heater can be produced more reliably and the thin film heater can be mass-produced.

According to a sixth aspect of the present invention, the second metal foil is made of a first metal material having a high temperature resistance coefficient, and the second step is a multi-layered structure formed in the first step. Forming a metal layer having a low resistance value in an area other than the current-carrying hole portion and the temperature sensor portion above the first metal foil side of the sheet; and forming the metal layer formed in this step and the first And the step of forming a wiring pattern and a temperature sensor by etching the metal foil of the above. Therefore, the temperature sensor can be built together with the wiring pattern.

Further, the invention according to claim 7 is characterized in that at least one of the plurality of heating regions is surrounded by another heating region.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, a case where the present invention is applied to a semiconductor temperature control device will be described.

(First Embodiment) FIG. 1 is a block diagram showing the overall configuration of a temperature control device used in this embodiment.

The temperature control device shown in FIG. 1 is used in (3) or (4) in a semiconductor manufacturing process for forming a resist film through the following processes (1) to (8).

(1) Wafer cleaning (2) Resist coating (3) Pre-baking (110-130 ° C.) + Cooling (20 ° C.) (4) Exposure (5) Development (6) Rinsing (7) Post-baking (120-130) (150 ° C.) + Cooling (20 ° C.) (8) Etching In the processes (3) and (4), first, the wafer W to be controlled is heated to a high temperature (baking), and then the wafer W is cooled to room temperature. Control for repeating a cycle of cooling (cooling) at intervals of several tens of seconds for each wafer is performed.

That is, this temperature control device has two target temperatures, a target temperature for heating and a target temperature for cooling, and performs control to alternately repeat heating and cooling.

As shown in FIG. 1, this temperature control device
A base plate (base) 1 is formed in a hollow cylindrical shape from a material having high thermal conductivity such as aluminum, an aluminum alloy, or alumina (Al2 O3).

The base plate 1 is installed with its upper surface being horizontal, and has a discharge port 1a and an inflow port 1b on its bottom wall.

The outlet 1a of the base plate 1 is connected to the heat storage tank 3 through the discharge passage 2, and the inlet 1b of the base plate 1 is connected to the heat storage tank 3 through the supply passage 4.
It is connected to the.

The heat storage tank 3 stores therein a temperature fluid such as a fluorocarbon liquid (= Fluorinert (registered trademark)), ethylene glycol, oil, water, nitrogen, air, helium, and the like. By circulating this temperature fluid, the temperature fluid is adjusted and maintained at a temperature near 20 ° C.

The temperature control device has a thin film heater 10 as a heating means on the upper surface of the base plate 1. The thin film heater 10 has a disk shape having the same outer diameter as the upper surface of the base plate 1, and includes a heating resistor linear body 12 and a temperature sensor 13 inside an insulating layer 11.

The heating resistance linear body 12 is made of a metal having a high electric resistance per unit length, such as a nickel chromium alloy or an iron chromium alloy, or an alloy thereof.
When the heating power is supplied from the power supply control unit 14, heat is generated to heat the wafer W.

FIG. 2 is a diagram showing an example of a heating element pattern formed by the heating resistance linear body 12 of the thin film heater 10.
As shown in the drawing, the heating element pattern includes a zone 21 located at the outermost side, a zone 23 located at the innermost side,
It consists of three concentric zones called zone 22 sandwiched between these zones. The heating resistance linear bodies 12 existing in each zone are arranged in a single layer so that the entire area has the same heat generation density.

As described above, if the heating element pattern of the thin-film heater 10 is divided into three zones, and no cutout portions are provided in the zones 21 and 22, the power supply to the zones 22 and 23 becomes a problem. Because
In the thin-film heater 10 according to the present invention, power is supplied to the zones 22 and 23 by providing a wiring layer for supplying power to the zones 22 and 23 separately from the heating layer.

FIG. 3 is an enlarged perspective view of a part of the thin-film heater 10. The thin-film heater 10 includes heat-generating resistor wires 31 and 32 on an insulator 11 such as a polyimide film.
And 33 are etched and these heating resistance linear bodies 31 are etched.
33 are insulated by a polyimide coat to form an insulating layer 34, on which wiring patterns 35 and 36 are provided.

For example, in a case where the heating resistance linear body 31 forms the zone 21 and the heating resistance linear body 33 forms the zone 22, power is supplied to the heating resistance linear body 31 using the wiring pattern 35. At the same time, power can be supplied to the heating resistance linear body 33 in the zone 22 using the wiring pattern 36.

Therefore, when the thin film heater 10 is used, power can be supplied to the zones 22 and 23 included in the zone 21 without providing a cutout in the zone 21.

It is to be noted that these heating resistance linear bodies can be formed at about 40 microns, and the insulator 11, the insulating layer 34 and the wiring pattern 35 can be formed at about 25 microns each. Heater 10
Can be formed.

For the wiring patterns 35 and 36, a metal material having high electric conductivity such as silver or copper can be used.

The temperature sensor 13 measures the temperature of the thin-film heater 10 and outputs the measurement result to the power supply controller 14. In a second embodiment described later,
The case where the temperature sensor 13 is formed together with the wiring pattern will be described. Here, it is assumed that the temperature sensor 13 is embedded separately from the wiring pattern.

Next, a method of manufacturing the thin film heater 10 shown in FIG. 1 will be described with reference to FIGS. FIG. 4 is a view showing a manufacturing process of the thin-film heater 10 shown in FIG. 1, wherein the left column in the figure is a perspective view of the thin-film heater 10 during the manufacturing process, and the right column in the figure is a corresponding enlarged side view. Is shown.

As shown in FIG. 4A, first, a heating resistor linear body is etched on the insulator 11, and FIG.
The heating element pattern shown in FIG. Since a material in which a metal layer having a high electric resistance such as a nickel chromium alloy or an iron chromium alloy is laminated on an insulator such as a polyimide film is commercially available, heat is easily generated by etching this metal layer. Body patterns can be created.

Next, as shown in FIG. 4B, a printing pattern for forming an insulating film shown in FIG. 5B is applied on the heating element pattern by screen printing. However, when this screen printing is performed, the heat-generating pattern is not applied to the current-carrying holes by masking the current-carrying holes with a silk screen or the like.

Thereafter, as shown in FIG. 4 (c), the entire surface is electrolessly copper-plated thickly, and an unnecessary portion is melted to leave an interconnect pattern, thereby performing an etching to leave the wiring pattern. A wiring pattern as shown in FIG.

As described above, in this embodiment,
The heating resistance linear body is etched on an insulator such as a polyimide film, and a wiring pattern is disposed on the heating resistance linear body layers 31 to 33 insulated by polyimide coating. Thin film heater 10 from which
The following effects can be obtained because the configuration is adopted.

(1) A uniform amount of heat can be supplied to the entire surface of the substrate.

(2) The wiring pattern can be easily routed.

(3) The heating resistor linear body and the wiring pattern can be formed of different materials.

Further, the thin-film heater 10 is provided with the insulator 1
1. A heating element pattern was prepared by etching the heating resistance linear body, and an insulating film was applied on the heating element pattern by screen printing while masking the current-carrying holes, and electroless copper plating was applied over the entire surface. It can be easily manufactured by a procedure of forming a wiring pattern by etching.

(Second Embodiment) By the way, the first embodiment
In the embodiment, the case where the temperature sensor 13 of the thin film heater 10 is provided separately from the wiring pattern has been described. However, such a temperature sensor can be formed together with the wiring pattern.

Therefore, in the second embodiment, a case will be described in which the temperature sensor of the thin-film heater 10 is formed together with the wiring pattern. In this case, since the overall configuration of the temperature control device is the same as that shown in FIG. 1, the description of the overall configuration of the temperature control device will be omitted.

FIG. 6 is an enlarged perspective view of a part of a thin-film heater 60 used in the second embodiment. This thin-film heater 60 has a heating resistor linear member 62 on an insulator 61 such as a polyimide film. , 63 and 64 are etched to insulate these heating resistance linear members 62 to 64 with a polyimide coat, and wiring patterns 65 and 66 and a temperature sensor 67 are disposed thereon.

When the heating resistor linear body 62 forms the zone 21 shown in FIG. 2 and the heating resistor linear body 64 forms the zone 22 shown in FIG.
5 is used to supply power to the heating resistor linear body 62 and the wiring pattern 66 is used to supply heat to the heating resistor linear body 6 in the zone 22.
4 can be powered.

For this reason, when the thin film heater 60 is used, the zone 2 is used similarly to the thin film heater 10 shown in FIG.
It is possible to supply power to the zones 22 and 23 included in the zone 21 without providing a cutout in 1.

The wiring patterns 65 and 66 provided on the thin film heater 60 are formed by laminating a metal material having a high temperature resistance coefficient such as nickel and a metal material such as copper having a low resistance value. The sensor 66 is made of only a metal material having a high temperature resistance coefficient such as nickel. Hereinafter, a case where nickel and copper are used will be described.

As described above, if the wiring patterns 65 and 66 are formed by further performing copper plating on the nickel plating, a portion where the copper plating is not performed is performed by the temperature sensor 67.
Therefore, the structure of the thin-film heater 60 can be simplified, and the temperature sensor 67 can be easily formed.

That is, since nickel has a correlation between temperature and resistance value, it can be used as a temperature sensor 67 like platinum, and since nickel alone has a large resistance value, it can be used in the wiring patterns 65 and 66. Is further plated with copper.

Next, a method of manufacturing the thin film heater 60 shown in FIG. 6 will be described with reference to FIGS. FIG. 7 is a view showing a manufacturing process of the thin film heater 60 shown in FIG. 6, wherein the left column in the figure is a perspective view of the thin film heater 60 in the manufacturing process, and the right column in the figure is a corresponding enlarged side view. Is shown.

As shown in FIG. 7A, first, a heating resistor linear body is etched on an insulator to form a heating element pattern as shown in FIG. 8A. Since a material in which a metal layer having a high electric resistance such as a nickel chromium alloy or an iron chromium alloy is laminated on an insulator such as a polyimide film is commercially available, heat is easily generated by etching this metal layer. Body patterns can be created.

Next, as shown in FIG. 7B, a printing pattern for forming an insulating film shown in FIG. 8B is applied on the heating element pattern by screen printing. However, when this screen printing is performed, the heat-generating pattern is not applied to the current-carrying holes by masking the current-carrying holes with a silk screen or the like.

Thereafter, nickel plating is performed on the entire surface as shown in FIG. 7 (c), and copper plating is further performed using the copper plating mask pattern shown in FIG. 8 (c) as shown in FIG. 7 (d). Do. The copper plating mask pattern shown in FIG. 8 has a shape that masks the copper plating of the temperature sensor portion so that the copper plating process is not performed on the mask portion, so that this mask portion functions as a temperature sensor.

Then, the unnecessary portions of the nickel plating and the copper plating are melted and etched to leave the wiring pattern and the temperature sensor.
A wiring pattern and a temperature sensor as shown in FIG.

By manufacturing the thin film heater 60 based on the above series of procedures, a temperature sensor can be easily formed together with a wiring pattern.

Next, another method of manufacturing the thin film heater 60 shown in FIG. 6 will be described with reference to FIG. FIG. 9 is a view showing another manufacturing process of the thin film heater 60 shown in FIG. 6, in which the left column is a perspective view of the thin film heater 60 during the manufacturing process, and the right column in the figure is the corresponding side surface. It shows an enlarged view.

As shown in FIG. 9 (a), a SUS foil and a nickel foil forming a heating resistance linear body are sandwiched via a polyimide film having a current-carrying hole, which is hot-pressed in a vacuum, and It is made into a sheet by performing spot welding at the section.

Thereafter, as shown in FIG. 7B, copper plating is further performed on the nickel foil side, the copper plating side is etched to form a wiring pattern and a temperature sensor, and the SUS foil side is etched. The thin film heater 60 shown in FIG.

When such a procedure is used, the technique of plating on the resin as shown in FIGS. 7 and 8 becomes unnecessary, and thus the steps of hot pressing and spot welding of SUS foil, polyimide film and nickel foil are required. The thin-film heater 60 can be reliably manufactured.

As described above, in the present embodiment,
As in the first embodiment, in addition to separating the heating layer and the wiring layer, wiring patterns 65 and 66 in which a metal material having a high temperature resistance coefficient such as nickel and a metal material such as copper having a low resistance value are laminated. In addition, since the thin-film heater 60 in which the temperature sensor 66 is formed using a metal material having a high temperature resistance coefficient is used, the following effects can be obtained.

(1) A uniform amount of heat can be supplied to the entire surface of the substrate.

(2) The wiring pattern can be easily arranged.

(3) The heating resistor linear body and the wiring pattern can be formed of different materials.

(4) The temperature sensor can be formed together with the wiring pattern.

(5) The thin-film heater can be easily mass-produced.

Further, the thin film heater 60 forms a heating element pattern by etching a heating resistance linear body on an insulator, and applies an insulating film on the heating element pattern by screen printing while masking a current-carrying hole. After nickel plating is performed over the entire surface, copper plating is performed while masking the temperature sensor portion, and etching is performed to form a wiring pattern and a temperature sensor.

Further, a SUS foil and a nickel foil forming a heating resistance linear body are sandwiched between polyimide films having a current-carrying hole, hot-pressed in a vacuum, and spot-welded at the current-carrying hole. Sheeting, further copper plating on the nickel foil side, etching this copper plating side to form a wiring pattern and temperature sensor,
Since the thin-film heater 60 is manufactured by etching the SUS foil side, the technique of plating on the resin is not required, and the thin-film heater 60 can be reliably manufactured.

In the second embodiment, the case where the temperature sensor is formed together with the wiring pattern has been described. However, the present invention is not limited to this, and may be applied to the case where only the temperature sensor is formed. it can.

In the first and second embodiments, the case where each heat generating zone is concentrically surrounded by other heat generating zones has been described. However, the present invention is not limited to this. Alternatively, the present invention can be applied to a case where the heat generating zone is not surrounded by other heat generating zones.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating an overall configuration of a temperature control device used in a first embodiment.

FIG. 2 is a view showing an example of a heating element pattern formed by a heating resistance linear body of the thin film heater shown in FIG.

FIG. 3 is an enlarged perspective view of a part of the thin film heater shown in FIG.

FIG. 4 is a diagram showing a manufacturing process of the thin-film heater shown in FIG.

5 is a diagram showing an example of a plating mask pattern and the like used in the manufacturing process shown in FIG.

FIG. 6 is an enlarged perspective view of a part of a thin film heater used in a second embodiment.

FIG. 7 is a diagram showing a manufacturing process of the thin film heater shown in FIG.

8 is a diagram showing an example of a plating mask pattern and the like used in the manufacturing process shown in FIG.

9 is a diagram showing another manufacturing process of the thin film heater shown in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Base plate, 1a ... Outlet, 1b ... Inlet, 2 ... Discharge passage, 3 ... Heat storage tank, 4 ... Supply passage, 5 ... Chiller tank, 10 ... Thin film heater, 11 ...
Insulating layer, 12: heating resistance wire, 13: temperature sensor,
14 ... energization control section, 21, 22, 23 ... zone, 3
1, 32, 33 ... heating resistance linear body, 34 ... insulating layer, 3
5, 36: wiring pattern, 60: thin film heater, 61:
Insulator, 62, 63, 64 ... heating resistance linear body, 65,
66: wiring pattern, 67: temperature sensor

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Masato Suwa 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture F-term in the Komatsu Ltd. Research Laboratory 3K034 AA02 AA15 AA16 AA21 AA22 AA23 AA33 AA34 BA13 BA15 BB08 BB13 BB14 BC12 BC15 BC17 CA02 CA14 CA17 DA05 DA08 FA13 JA01 JA09 3K058 AA86 BA01 BA11 CA02 CA22 CA52 CA57 CA93 CE02 CE13 CE19 CE31 GA03 GA05 GA06

Claims (7)

[Claims] 1. A thin-film heater comprising: a plurality of heating regions in which heating resistance linear bodies are separately laid, wherein each heating region generates heat by energizing the heating resistance linear bodies in each heating region; A thin-film heater comprising: a heating layer in which a heating resistor linear body is laid in each heating area; and a wiring layer in which wiring for energizing the heating resistor linear body in each heating area is separate layers. 2. The thin-film heater according to claim 1, wherein a temperature sensor for detecting a temperature of the plurality of heating regions is laid on the wiring layer. 3. A method of manufacturing a thin-film heater, comprising: a plurality of heating regions in which heating resistance linear bodies are separately laid, wherein each heating region generates heat by energizing the heating resistance linear bodies in each heating region. A first step of forming a heating layer in which each of the heating resistor linear bodies is laid in each heating region on a predetermined insulator; and a step other than a conduction hole of the heating resistor linear body formed in the first step. A second step of forming an insulated insulating layer; laying a wiring on the insulating layer formed in the second step to form a wiring layer; and coupling each wiring to the heating resistor linear body. And a third step. 4. The third step includes: forming a first metal layer having a high temperature resistance coefficient on the insulating layer formed in the second step; and forming the first metal layer in this step. A step of further forming a second metal layer having a low resistance value in a region above the layer and other than the current-carrying hole portion and the temperature sensor portion; and etching the formed first and second metal layers. 4. The method according to claim 3, further comprising: forming a wiring pattern and a temperature sensor. 5. A method of manufacturing a thin-film heater, comprising: a plurality of heating regions in which heating resistance linear bodies are separately laid, wherein each heating region generates heat by energizing the heating resistance linear bodies in each heating region. The first metal foil forming the heating resistance linear body and the second metal foil forming the wiring of the heating resistance linear body are connected via an insulating film having a conductive hole to form a multilayer sheet. And a second step of etching the multilayer sheet formed in the first step to form a thin-film heater in which the heating resistance linear body and the wiring are bonded via an insulating film. A method for manufacturing a thin film heater. 6. The second metal foil is made of a first metal material having a high temperature coefficient of resistance, and the second step is a first metal foil side of the multilayer sheet formed in the first step. Forming a metal layer having a low resistance value in a region other than the current-carrying hole portion and the temperature sensor portion, and etching the metal layer formed in this step and the first metal foil. 6. The method for manufacturing a thin film heater according to claim 5, comprising a step of forming a wiring pattern and a temperature sensor. 7. The thin film heater according to claim 1, wherein at least one of the plurality of heating regions is surrounded by another heating region.