JP2000147053A - Ic testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC testing device comprising a configuration for preventing dewing. SOLUTION: A test handler 10 comprising a constant-temperature chamber 20 for testing/measuring an IC in high/low temperature atmosphere is provided, a form exchange part 63 is provided, an IC socket is eventually connected electrically/mechanically to a main body of an IC test device through a cable 69 penetrating the type exchange part 63 or the type exchange part 63 itself, and the inside wall of a test chamber 21 is combined to an outside peripheral wall a form exchange part base 631 each other through an elastic O-ring 80 fitted to either the inside wall of the test chamber 21 of the constant- temperature chamber 20 or the outside peripheral wall of the form exchange part base 631. Here, an external atmosphere isolating member 90 is inserted between the lower surface of the test chamber 21 of the constant-temperature chamber 20 and the upper surface of a mother board 66, while the lower surface of the test chamber 21 is enclosed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC test apparatus, and more particularly, to an IC test apparatus having a configuration for preventing the occurrence of dew condensation during a low-temperature test of an IC at an interconnecting portion between a test handler and a test head.

[0002]

2. Description of the Related Art An outline of a flow of a measurement test by an IC test apparatus will be described with reference to FIG. The IC to be tested is transferred into the constant temperature chamber 20 in the test handler 10, and the IC test is performed in a high / low temperature atmosphere in the constant temperature chamber 20. At this time, the IC placed on the user tray 13 is placed again on the test tray 14 that can withstand high / low temperature inside the constant temperature chamber 20 in the loader unit 11 of the test handler 10. The test tray 14 on which the IC is placed is transferred to the soak chamber 22 of the constant temperature chamber 20, from which the test tray 21 is further transferred to perform the high / low temperature test of the IC. After the high / low temperature test is performed, the test tray 14 on which the IC is mounted is sent out from the test chamber 21 to the unloader section 12 via the exit chamber 23, and then the test tray 14 is transferred from the test tray 14 to the user tray 13 in the unloader section 12. I
The C package is mounted again.

Referring to FIG. 3, when performing a measurement test on an IC, the IC is transported while being mounted on a test tray 14 as shown in FIG. 3A, and a measurement test is performed in this state. Then, the IC is placed on the test tray 14 with the tray insert 141 interposed. FIG. 3 (b)
FIG. 3 is a diagram showing a type exchange unit on the test head side. Here, the IC socket 60, the socket board 61, the connect board 62, the type exchange base 631, and the type exchange performance board 64 are collectively referred to as the type exchange 63. The product exchange section 63 has an IC socket 60 on its upper surface.
Are arranged in a matrix. Test tray 1
The IC terminal of the IC mounted on the IC 4 comes into contact with the IC socket 60, and is finally connected to the main body of the IC test apparatus via the measuring section board in which the multilayer wiring is formed. Will be. Incidentally, in the actual measurement test, the IC is placed on the test tray 14 as described above and transferred to the test chamber 21 in the constant temperature chamber 20, and the variety exchange unit 63 is airtightly connected to the constant temperature chamber 20. The IC socket 60 of the kind exchange unit 63 in a state of being airtightly connected to the room 20 is pushed by the pusher into the IC socket 6.
It is carried out by pressing toward zero and making contact. In this case, the variety exchange unit 63 is pushed up by a lifting device (not shown).

[0004] The mutual coupling between the constant temperature chamber 20 of the test handler 10 and the type exchange section 63 and the connection between the IC and the IC socket will be described more specifically with reference to FIG. I
As described with reference to FIG. 2, the C1 is transferred to the test chamber 21 of the constant temperature chamber 20 while being placed on the test tray 14, and the IC socket of the type changing unit 63 coupled to the constant temperature chamber 20. Tested in contact with 60. In FIG. 4A, only one IC1 and one IC socket 60 are conceptually illustrated. Then, the IC socket 60 is electromechanically connected to the main body of the IC test apparatus via the socket board 61, the connect board 62, the type exchange section performance board 64, the connector 65, the motherboard 66, the motherboard performance board 67, and the connector 68. Is done.

Referring to FIG. 4 (b), there is a case where the socket board 61 is directly connected to a performance board 67 of a motherboard via a cable 69 passing through the type exchange section 63. By the way, in a state where the type changing section 63 on the test head 70 side is connected to the test chamber 21 of the constant temperature chamber 20 on the test handler 10 side, the inside of the test chamber 21 and the external atmosphere must be cut off.
An elastic O-ring 80 as shown in FIG. 1 is attached to and fixed to one of the inner wall of the constant temperature chamber 20 or the outer peripheral wall of the variety exchange base 631 and is interposed therebetween to achieve the shut-off purpose.

In recent years, the conditions for low-temperature tests in IC tests have become severe, and the low-temperature side of the test temperature range is −30.
C to -55C. Accordingly, it is important to take measures against dew condensation in the vicinity of the interconnection between the test handler 10 and the test head 70, and it is becoming impossible to guarantee an appropriate test result without the dew condensation measures.

The location where dew condensation occurs in the vicinity of the mutual connection portion is on the lower surface of the product exchange unit performance board 64, particularly, at the connection between the connect board 62 and the product exchange unit performance board 64, or the cable 69 is connected to the product exchange unit performance board. It is about to be led out to the outside air through the board 64. These dew condensation points are located in the test room 21
Is exposed to an atmosphere of −30 ° C. to −55 ° C., cooled, and comes into contact with an external atmosphere.

[0008]

Dry air is blown to the vicinity of the interconnecting portion between the test handler 10 and the test head 70, that is, the region where the lower surface of the product exchange unit performance board 64 and the upper surface of the motherboard 66 face each other. The occurrence of is prevented. However, this countermeasure against dew condensation simply blows dry air onto the interconnected parts without isolating the area near the interconnected parts where dew condensation occurs from the external atmosphere. In addition, the effect of preventing the occurrence of dew condensation is affected by the temperature and humidity conditions of the external atmosphere, making it difficult to set the spray amount.

According to the present invention, there is provided an isolating member for isolating an interconnect between a test handler and a test head from outside air to prevent the occurrence of condensation at the interconnect during a low-temperature test of an IC. It is intended to provide an IC test apparatus which has solved the above.

[0010]

A test handler having a constant temperature chamber for testing and measuring an IC in a high / low temperature atmosphere is provided, and an IC socket, a socket board, a connect board, and a type changing section are provided. Base 6
31, a product exchange unit 63 comprising a product exchange unit performance board 64;
Finally, it is electromechanically connected to the main body of the IC test apparatus through a cable 69 or a type changing unit 63 penetrating the inside of the test chamber 21 of the constant temperature chamber 20 or an outer peripheral wall of the type changing unit base 631. In an IC test apparatus for interconnecting the inner wall of the test chamber 21 and the outer peripheral wall of the variety exchange base 631 via an elastic O-ring 80 attached to any one of them, the external atmosphere isolating member 90 is connected to the constant temperature chamber 20. An external atmosphere isolation region was formed between the lower surface of the test chamber 21 and the upper surface of the motherboard 66 so as to surround and interpose the lower surface of the test chamber 21 therebetween. An IC test apparatus was configured.

A second aspect of the present invention is an IC test apparatus according to the first aspect, wherein the external atmosphere isolating member comprises an elastic member such as a silicon rubber ring. Further, in the IC test apparatus according to any one of claims 1 and 2,
An IC test apparatus was constructed in which an external atmosphere isolating member was mounted on the upper surface of the motherboard.

Further, claim 4: claims 1 to 3
Wherein the dry air supply pipe 92 is formed inside the motherboard in a ring shape along the periphery thereof and communicates with the external atmosphere isolation region. An IC test apparatus having a dry air source 93 connected to the IC 92 was constructed.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the embodiment shown in FIG. In the embodiment of FIG. 1, the same reference numerals as those in the conventional example indicate the same members. Referring to FIG. 1A, only one IC1 and one IC socket 60 are conceptually illustrated. The IC 1 includes the IC socket 60 and the socket board 6
1. Via the connect board 62, the product exchange section performance board 64, the connector 65, the motherboard 66, the motherboard performance board 67, and the connector 68, they are eventually electrically connected to the main body of the IC test apparatus.
The embodiment shown in FIG. 1B is an example in which the socket board 61 is directly connected to the performance board 67 of the motherboard via a cable 69 penetrating the type exchange section 63. In a state in which the type changing unit 63 is connected to the test chamber 21 on the test handler 10 side, the inside of the test chamber 21 and the external atmosphere must be cut off. This is achieved by using an elastic O-ring 80 as shown in FIG. It is performed by attaching and fixing to one of the inner wall of the constant temperature chamber 20 or the outer peripheral wall of the variety exchange base 631 and interposing it between them.

Here, in the present invention, an annular external atmosphere isolating member 90 having elasticity such as a ring of silicon rubber is interposed between the product exchange section performance board 64, which is the lower surface of the constant temperature chamber 20, and the upper surface of the motherboard 66. Then, the lower surface of the constant temperature chamber 20 where dew condensation occurs is surrounded. That is,
An annular external atmosphere isolating member 90 is mounted and fixed on the upper surface of the motherboard 66 so as to surround the lower surface of the constant temperature chamber 20 where dew condensation occurs, and between the lower surface of the constant temperature chamber 20, the upper surface of the motherboard 66 and the external atmosphere isolating member 90. Then, an external atmosphere isolation region 91 is formed. Then, the dry air supply pipe 9 is formed in a ring shape inside the motherboard 66 along the periphery thereof.
2. The ring-shaped dry air supply pipe 92 has a branch portion 921 extending upward at substantially equal intervals, and the upper end of the branch portion 921 is opened to the upper surface of the motherboard 66 to open to the external atmosphere isolation region 91. 9
Reference numeral 3 denotes a dry air source connected to the dry air supply pipe 92.

When dry air having a low dew point is sent from a dry air source 93 to a dry air supply pipe 92, the dry air is supplied to an external atmosphere isolation region 91 through a branch portion 921, and is connected to the dry air source 93 and the external atmosphere isolation region 91.
Communicates with By the way, the external atmosphere isolation region 91 is
As described above, although the configuration is such that the elastic external atmosphere isolating member 90 is interposed between the lower surface of the constant temperature chamber 20 and the upper surface of the motherboard 66, a completely sealed area is not formed. Naturally, there are very few leak paths. Therefore, the air in the external atmosphere isolation region 91 can be replaced by the dry air supplied from the dry air source 93 by the supply pressure of the air from the dry air source 93.

[0016]

As described above, according to the present invention, the external atmosphere isolating member is interposed between the lower surface of the thermostatic chamber and the upper surface of the motherboard so as to surround the dew condensation area on the lower surface of the thermostatic chamber. Forming an external atmosphere isolation region between the lower surface of the constant temperature chamber, the upper surface of the motherboard, and the external atmosphere isolation member, and forming dew condensation in the vicinity of an interconnecting portion between the constant temperature chamber of the test handler and the type changing unit of the test head. The occurrence of dew condensation can be substantially eliminated by setting the location of the bad condition that causes the occurrence as the external atmosphere isolation region.

By attaching an external atmosphere isolating member made of an elastic member such as a ring of silicon rubber to the upper surface of the motherboard, the external atmosphere isolating region can be formed relatively simply. Also, a dry air supply pipe is formed inside the motherboard along the peripheral edge thereof in a ring shape and communicates with the external atmosphere isolation area, and sends dry air with a low dew point to the external atmosphere isolation area to send it to the low dew point area. By doing so, it is possible to completely eliminate the occurrence of condensation. And by setting the place where dew condensation might occur to the outside atmosphere isolation area,
When the external atmosphere is in a dry state with a low dew point, there is no need to intentionally send dry air, and even if it is sent, the amount of dry air is small compared to the conventional example.

[Brief description of the drawings]

FIG. 1 illustrates an embodiment.

FIG. 2 is a view for explaining an outline of a flow of a measurement test.

FIG. 3 is a diagram illustrating a test tray and an IC socket.

FIG. 4 is a diagram illustrating a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC 10 Test handler 11 Loader part 12 Unloader part 13 User tray 14 Test tray 141 Tray insert 20 Constant temperature room 21 Test room 22 Soak room 23 Exit room 60 IC socket 61 Socket board 62 Connect board 63 Type exchange part 631 Type exchange part base 64 Performance change board performance board 65 Connector 66 Motherboard 67 Motherboard performance board 68 Connector 69 Cable 70 Test head 80 Elastic O-ring 90 External atmosphere isolation member 91 External atmosphere isolation area 92 Dry air supply pipe 921 Branch section 93 Dry air source

Claims (4)

[Claims] 1. A product exchange unit comprising a test handler having a constant temperature chamber for testing and measuring an IC in a high / low temperature atmosphere, and comprising an IC socket, a socket board, a connect board, a product exchange unit base, and a product exchange unit performance board. The IC socket is finally connected to the IC through a cable that passes through the
An electro-mechanical connection to the main body of the test apparatus, the product type and the inner wall of the test room via an elastic O-ring attached to either the inner wall of the test room of the constant temperature room or the outer peripheral wall of the product type exchange part base In an IC test apparatus for interconnecting an outer peripheral wall of an exchange base, an external atmosphere isolating member is interposed between a lower surface of a test chamber of a constant temperature chamber and an upper surface of a motherboard so as to surround and surround a lower surface of the test chamber. An IC test apparatus, wherein an external atmosphere isolation region is formed between the external atmosphere isolation member and the upper surface of the motherboard and the external atmosphere isolation member. 2. The IC test apparatus according to claim 1, wherein the external atmosphere isolating member comprises an elastic member such as a ring of silicon rubber. 3. The IC test apparatus according to claim 1, wherein an external atmosphere isolating member is mounted on an upper surface of the motherboard. 4. An IC test apparatus according to claim 1, wherein the dry air is formed in a ring shape inside the motherboard along a peripheral edge thereof and communicates with the external atmosphere isolation region. An IC test apparatus comprising: a supply pipe; and a dry air source connected to the dry air supply pipe.