JP2000138279A - Stage device and aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device, capable of controlling the position and attitude of a stage in a non-air environment and of reducing the size and weight of the stage. SOLUTION: A stage WST is driven along a moving plane 36a with an electromagnetic force by first drive units (6211 to 62nn, 36) and is driven at least in the direction of a Z-axis which is perpendicular to the movement plane 36a or in the direction of leveling with a magnetic force by second drive units (60A TO 60D, 32). Accordingly, it is possible to drive a stage in the directions of 3 degrees of freedom in the movement plane with the electromagnetic force by the first drive units and in the directions of remaining 3 degrees of freedom with the magnetic force. This enables the position and attitude of the stage to be controlled without hindrances hitch, even in a non-air environment and also eliminates a leveling table and an air bearing to reduce the size and weight of the stage, and as a result, the controllability of the position of the stage is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a stage device and an exposure apparatus, and more particularly, of course in the air atmosphere, nitrogen gas (N _2), helium gas (the He), or a non-air environment such as vacuum The present invention also relates to a tage device for controlling the position and orientation of a control target object with high accuracy, and an exposure apparatus including the stage device.

[0002]

2. Description of the Related Art Conventionally, in a lithography process for manufacturing a semiconductor device, a liquid crystal display device, or the like, a pattern formed on a mask or a reticle (hereinafter, collectively referred to as a “reticle”) is resisted through a projection optical system. There is used an exposure apparatus that transfers the image onto a substrate such as a wafer or a glass plate coated with a substrate.

In this type of exposure apparatus, in order to position a wafer at an exposure position with high precision, the position and attitude of a wafer holder holding the wafer in the directions of six degrees of freedom of X, Y, Z, θx, θy, and θz are controlled. A stage device is used. Conventionally, as this type of stage device, an XY stage driven in two-dimensional directions XY by two X-axis driving linear motors, two Y-axis driving linear motors, and a stage driving guide, and mounted on the XY stage And a three-degree-of-freedom drive table (Z-leveling table) mounted on the θz table and driving a wafer holder for holding a wafer in three degrees of freedom of Z, θx, and θy. Things were used. In this stage device, the weight of the movable part is large, and a high thrust motor is required as a linear motor to obtain the required acceleration. In addition, since the size of the movable part is large, the degree of freedom in design has been limited.

In recent years, in order to position the wafer at a higher speed with higher accuracy without being affected by the accuracy of the mechanical guide surface, etc., and to avoid mechanical friction and extend the life of the wafer, the wafer is mounted. X, Y, θz of the placed wafer table
There has been developed a positioning device provided with a planar motor capable of non-contact positioning in the three degrees of freedom (for example, see Japanese Patent Application Laid-Open No. 58-175020).

[0005]

According to the planar motor as described above, X thrust, Y thrust, and Z torque (rotational force in the θz direction) can be generated by one motor.
A small and lightweight stage device capable of controlling the position and orientation in three degrees of freedom of X, Y, and θz can be realized.

However, in such a stage device using a planar motor, the remaining three degrees of freedom of driving force, namely, X torque (rotational force around the X axis), Y torque (rotational force around the Y axis), It is difficult to generate the Z thrust by the same motor and to control the position and orientation of the stage with high accuracy. The reason is as follows.

That is, in the above-described planar motor, the driving principle is based on Lorentz electromagnetic force, and currents having different phases are sequentially input to the armature coil having a current path substantially parallel to the XY plane in a sine wave shape. , The stage is driven in a direction along the XY plane. When a current is applied to the armature coil in such planar driving, a magnetic flux is generated in a direction orthogonal to the planar driving direction, that is, in the ± Z direction. Therefore, if an iron core is inserted in the armature coil, it is possible to efficiently generate a force in a direction perpendicular to the plane driving force, that is, a magnetic levitation force, by supplying a current to the armature coil. It is believed that there is.

However, since the relative positional relationship between the magnetic pole unit to be driven and the armature coil changes every moment, a current for planar drive control and a current for magnetic levitation control are eventually applied to all armature coils. Although it is necessary to flow the current, it is apparent that this causes a considerable problem of interference, and it is necessary to perform very complicated current control for each armature coil.

Therefore, in order to avoid the complicated current control as described above, a stage driven by a plane motor that generates driving forces in three degrees of freedom of X, Y and θz, and a stage mounted on this stage At present, it is intended to realize position / posture control of a wafer in six degrees of freedom using the remaining Z / leveling table capable of position / posture control in three degrees of freedom.

[0010] By the way, the data accompanying the high integration of the semiconductor element.
As vise rules (minimum practical line width) become finer,
Higher resolution is required as the performance of
I came. For this reason, the exposure wavelength has been shortened, and
For the subsequent exposure equipment, a vacuum with a wavelength of 200 nm or less is used.
Ultraviolet (VUV) light, or shorter wavelength X-rays,
Is a charged particle beam such as an electron beam as the energy beam for exposure.
It has become necessary to use it. Such an exposure apparatus
In the case of air in the path of the energy beam,
Cloudy substances and ozone O due to the reaction_ThreeEnergy beam
Absorbed substances are generated or air molecules directly
Since the energy beam is absorbed, nitrogen N _TwoAnd helium H
It is necessary to replace the air with e or create a vacuum environment
There is.

However, in the stage apparatus using the above-described flat motor, the stage is floated and supported in a non-contact manner by using a static pressure air bearing (air bearing) or the like. Can not be used.

The present invention has been made under such circumstances, and a first object of the present invention is to control the position and attitude of a stage without any trouble even in a non-air environment and to simplify the structure of the stage. It is an object of the present invention to provide a stage device that can be made smaller and smaller and lighter.

It is a second object of the present invention to provide an exposure apparatus capable of improving the throughput.

[0014]

According to a first aspect of the present invention, there is provided a stage device, comprising: a mounting surface (3) on which an object (W) is mounted;
4a) and stage (WST) having; a first driving device for driving an electromagnetic force along the moving surface (36a) of the stage and _{(62 11 ~62 nn, 36)} ; intersect with the stage the moving surface A second driving device (60A to 60D, 32) that is driven by a magnetic force in a direction in which the driving force is applied.

According to this, the stage is driven by the first driving device by the electromagnetic force along the moving surface, and is driven by the second driving device by the magnetic force in a direction intersecting the moving surface.

Here, "driving along the moving surface" means that the stage is moved in a predetermined uniaxial direction, orthogonal biaxial direction, or orthogonal biaxial direction in a plane parallel to the moving surface, and a rotational direction in the plane. Including the case of driving to
"Driving in the direction intersecting with the moving surface" means not only changing the position along the direction intersecting with the moving surface while maintaining the posture of the stage, but also moving the stage so as to change the posture. And the case of driving in a direction intersecting with.

Therefore, according to the present invention, the stage can be driven by the first driving device with the electromagnetic force in the three degrees of freedom in the moving plane, and can be driven with the magnetic force in the remaining three directions of freedom. Accordingly, the position and orientation of the stage can be controlled without any trouble even in a non-air environment. In addition, a leveling table, air bearings, etc. are not required, making the stage smaller and lighter.
Thereby, the position controllability of the stage can be improved.

Here, the electromagnetic force is synonymous with the Lorentz force and is defined by the following equation. F = BIL (B: magnetic flux density, I: current, L: length of coil) The magnetic force refers to a force of two objects having magnetic poles to pull or repel.

In this case, as in the second aspect of the present invention, the first driving device includes the moving surface (36a).
Movers (62 _{11 to} 62 _nn ) provided on the stage (WST) so as to face the stage, and stators (48, 5) that drive the stage by electromagnetic interaction between the movers.
1), and the second driving device includes a magnet (60A to 60A) disposed on the mounting surface (34a) side of the stage.
0D) and an adjusting unit (32) for adjusting the magnetic force generated between the magnet and the magnet. In such a case, the stage is driven together with the mover along the moving surface by electromagnetic interaction between the stator and the mover.
When the adjusting unit adjusts the magnetic force generated between the stage and the magnet disposed on the mounting surface side (opposite to the moving surface), the axial direction orthogonal to the moving surface and the tilt direction with respect to the moving surface are adjusted. The stage is driven in at least one of the directions (pitching direction, rolling direction).

In this case, at least three magnets (60A to 60D) are arranged on the mounting surface (34a) side of the stage (WST), and the adjustment is performed. The unit (32) includes at least three magnetic pole portions (38f to 38f) individually facing each of the magnets.
It is desirable to have i). In such a case, the magnetic force between each magnet and the opposing magnetic pole part is adjusted by the adjusting unit, so that the axial direction orthogonal to the moving surface and the rotational direction around two orthogonal axes in the moving surface are adjusted. The stage can be driven in any direction.

In this case, at least three magnets and at least three magnetic poles are sufficient. However, as in the invention according to claim 4, the magnet is provided on the mounting surface (34a) side of the stage (WST). An even number may be arranged at different positions, and one of the magnetic pole portions may be arranged to face each of the magnets. In such a case, the configuration of the magnetic circuit for controlling the position / posture of the stage becomes easier as compared with the case where the number of magnets and magnetic poles is an odd number.

In the stage apparatus according to the third aspect, the stage may be triangular or polygonal with a pentagon or more, but as in the invention according to the fifth aspect, the stage (WST) is square. In the case of having a shape, one of the magnets (60A to 60D) is disposed at each of the four corners on the mounting surface side of the stage, and the magnetic pole portions (38f to 38i) face each of the magnets. ) Are desirably arranged one by one. In such cases,
The magnetic force between two adjacent magnets and the magnetic pole part facing each magnet and the magnetic force between the remaining two adjacent magnets and the magnetic pole part facing each magnet are simultaneously increased and decreased. Thus, the stage can be driven only in the tilt direction without substantially changing the position of the stage.
In this case, as in the invention described in claim 6, the magnet (6
0A to 60D) are preferably arranged in a matrix of 2 rows and 2 columns, and arranged so that the magnetic poles of mutually adjacent magnets have opposite polarities in the row and column directions. In such a case, 4 including each adjacent magnet
One magnetic circuit is easily configured.

In the stage apparatus according to each of the third to sixth aspects of the present invention, the moving surface may be a vertical surface, but the moving surface (36) may be, as in the seventh aspect of the invention.
When a) is a horizontal plane, when the distance between the magnet and each of the magnetic pole portions is a predetermined value, the stage (WS)
T), the mover (62 _{11 to} 62 _nn ) and the magnet (6
Preferably, the steady state magnetic force of the magnet is set so that the total weight of the magnets (0A to 60D) and the total magnetic force between the magnet and each of the magnetic poles are balanced. In such a case, for example, when each magnet is a permanent magnet, the stage can be held at a steady state position while adjusting its own weight by the magnetic force without adjusting the magnetic force. Therefore, in this case, it is possible to adjust the position and orientation of the stage from a steady state with a small amount of energy.

In the stage device according to each of the third to seventh aspects of the present invention, as in the eighth aspect of the present invention, the at least three magnetic pole portions may be connected to each other by a magnetic material. .

According to a ninth aspect of the present invention, there is provided an exposure apparatus for exposing a substrate (W) by an energy beam via an optical system (PL or PL1) and transferring a predetermined pattern to the substrate. A stage device (30) according to any one of claims 1 to 8, wherein the stage (WST) constituting the stage device is provided as a substrate stage for holding the substrate.

According to this, the position and attitude of the stage can be controlled without any trouble even in a non-air environment by the stage device, and the stage can be simplified and the size and weight can be reduced. Accordingly, it is possible to increase the speed and acceleration of the stage, and it is possible to improve the throughput by shortening the positioning settling time and the like accompanying the improvement of the position control performance.

According to a tenth aspect of the present invention, an optical system (PL)
Or the substrate (W) by the energy beam via PL1)
An exposure apparatus for exposing a predetermined pattern onto the substrate by exposing the stage, and comprising the stage device (30) according to any one of claims 2 to 8, wherein the stage (WST) constituting the stage device is provided. ) As a substrate stage for holding the substrate, and the first device constituting the stage device.
Is characterized in that the stator of the driving device is independent of the holding portion (20) holding the optical system with respect to vibration.

According to this, the position and attitude of the stage can be controlled without any trouble even in a non-air environment by the stage device, and the stage can be simplified and reduced in size and weight. In addition to the fact that the throughput can be improved in the same manner as described above, the stator of the first drive device is independent of the holding portion holding the optical system with respect to vibration, so that the The force does not become a factor of vibration of the optical system, and it is possible to prevent the occurrence of a pattern transfer position shift or the like due to the vibration of the optical system, so that highly accurate exposure can be performed.

In the exposure apparatus according to the ninth and tenth aspects of the present invention, as in the eleventh aspect,
When the optical system is a charged particle beam optical system (PL1) including a charged particle beam column (82), a portion excluding the exit of the exit end of the charged particle beam from the charged particle beam column is covered. It is desirable to further include a cylindrical magnetic shield (90). In such a case, the charged particle beam column (8) is influenced by the magnetic force generated in the second drive device by the magnetic shield.
The charged particle beam emitted from 2) can be prevented from being deflected in an unexpected direction, and highly accurate exposure using a charged particle beam, for example, an electron beam or an ion beam can be performed.

In this case, as in the twelfth aspect of the present invention, the magnetic shield (90) includes the inner cylinder (92).
And an outer cylinder (94) arranged around the inner cylinder with a predetermined clearance therebetween. The outer cylinder is formed of a material having a lower magnetic permeability than the inner cylinder. May be.

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A first embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows an exposure apparatus 10 according to the first embodiment.
0 is schematically shown in cross section. The exposure apparatus 100 is a step-and-scan type scanning exposure apparatus, that is, a so-called scanning stepper. As will be described later, in the present embodiment, since the projection optical system PL is provided, the optical axis AX direction of the projection optical system PL will be hereinafter referred to as the Z-axis direction, and the reticle R will be in a plane orthogonal to the Z-axis direction. The direction in which the wafer W is relatively scanned will be described as a Y-axis direction, and a direction orthogonal to these Z-axis and Y-axis will be described as an X-axis direction.

The exposure apparatus 100 includes an illumination optical system 12,
A reticle stage RST that holds a reticle R as a mask, a projection optical system PL as an optical system, a main body column 20 as a holding unit that holds the projection optical system PL, and a wafer W that holds a substrate (and an object) X, Y, Z,
A six-degree-of-freedom drive device 30 or the like is provided as a stage device that is driven in six degrees of freedom in the θx, θy, and θz directions.

The exposure apparatus 100 is actually housed in an unillustrated environmental chamber whose temperature and humidity are adjusted with high precision and is highly dust-proof. N ₂ is filled. As an exposure light source of this exposure apparatus, an ArF excimer laser light source (not shown) that generates pulsed ultraviolet light having a wavelength of 193 nm is used. This ArF excimer laser light source
Actually, the exposure apparatus 100 is installed in a service room having a lower degree of cleanliness than the ultra-clean room in which the exposure apparatus 100 is installed. This excimer laser light source is connected to the illumination optical system 12 via a beam matching unit (not shown).

The illumination optical system 12 is, for example, disclosed in
As disclosed in US Pat. No. 2,214,783, a shutter, a beam expander, a secondary light source forming optical system (fly-eye lens system), a vibrating mirror, a condenser lens system, a reticle blind, an image forming lens system, etc. Illuminate a rectangular (or arc-shaped) illumination area IAR on the reticle R with uniform illumination by exposure illumination light (pulse ultraviolet light) IL.

A reticle R is fixed on the reticle stage RST by, for example, electrostatic attraction. Also,
The reticle stage RST performs a predetermined scan on a reticle base 14 by a reticle drive unit 15 (not shown in FIG. 1; see FIG. 5) composed of a magnetic levitation type linear motor using Lorentz force or reactance force. It is possible to move at a designated scanning speed in the direction (here, the Y-axis direction). Also, this reticle stage RST
It is configured so that it can be finely driven in the Y-axis direction, the X-axis direction, and the θz direction (the rotation direction around the Z-axis) in the XY plane. The reticle base 14 constitutes a top plate of a gantry 18 constituting a main body column 20 described later.

The position of the reticle stage RST in the moving plane is determined by a reticle laser interferometer (hereinafter, “reticle interferometer”) which is a position detecting device fixed on the reticle base 14.
) Is always detected with a resolution of, for example, about 0.5 to 1 nm.

The position information of the reticle stage RST from the reticle interferometer 16 is sent to a controller 50 (not shown in FIG. 1, see FIG. 5), and the controller 50 controls the reticle driving unit based on the position information of the reticle stage RST. Fifteen
Drives the reticle stage RST via the.

The projection optical system PL is disposed below the reticle stage RST in FIG. 1, and the direction of the optical axis AX is the Z-axis direction. In this case, the optical axis AX is set so that the optical arrangement is telecentric on both sides. A refracting optical system composed of a plurality of lens elements arranged at predetermined intervals along is used. The projection optical system PL is a reduction optical system having a predetermined projection magnification, for example, 1/5 (or 1/4). Therefore, when the illumination area IAR of the reticle R is illuminated by the illumination light IL from the illumination optical system 12, the illumination light passing through the reticle R causes the illumination area IAR of the reticle R to pass through the projection optical system PL. A reduced image (partially inverted image) of the circuit pattern is formed in an exposure area IA conjugate to an illumination area IAR on a wafer W having a surface coated with a photoresist.

The main body column 20 is horizontally supported by a plurality (four in this case) of vibration isolating tables 22 provided on the upper surface of an electromagnet unit 32 constituting a six-degree-of-freedom driving device 30 described later. It comprises a barrel base 24 and a gantry 18 fixed to the upper surface of the lens barrel base 24. The lens barrel base 24 has a circular opening 24a formed in a central portion thereof in plan view, and the projection optical system PL is inserted into the opening 24a from above. A flange 26 is provided at a portion slightly below the center in the height direction of the projection optical system PL, and the projection optical system PL is supported by the lens barrel base 24 from below through the flange 26.

The gantry 18 has four legs 28 arranged vertically on the upper surface of the lens barrel base 24 so as to surround the projection optical system PL, and upper ends of these four legs 28. A reticle base 14 is provided, which is a top plate portion that connects between them.

In the present embodiment, the micro vibration transmitted from the floor FD to the main body column 20 is insulated at the micro G level by the four vibration isolating tables 22.

The six-degree-of-freedom driving device 30 includes an electromagnet unit 32 as an adjustment unit constituting a base portion of the vibration isolating table 22 and the main body column 20, a movable body 34 holding the wafer W, and a movable body 34 It is composed of three parts, a base part 36 on which a surface 36a is formed.

The electromagnet unit 32 comprises a core member and an armature coil. To elaborate this further,
As shown in the perspective view of FIG. 2, the core member 38 has a substantially square frame-shaped base portion 38a, and four pillar portions 38 extending vertically upward from four corners of the base portion 38a.
b, 38c, 38d, and 38e (in FIG. 2, the column 38c on the far side of the drawing is not shown; see FIG. 1), and each of the columns 38b, 38c, 38d, and 38e is used to form the base 38a. Four arms 3 extending horizontally toward the center
8f, 38g, 38h, and 38i, each of which is integrally formed of a magnetic material such as iron. Armature coils 40B, 40C, 40D, and 40E are wound around the pillar portions 38b, 38c, 38d, and 38e (however, the armature coil 40C on the back side of the drawing is not shown in FIG. 2; see FIG. 1). Have been. Armature coil 40B,
40C, 40D, and 40E are connected to the control device 50 via the current drive circuit 70 (see FIG. 5).

FIG. 3 is a plan view of the electromagnet unit 32 as viewed along the line AA in FIG. In FIG. 3, a hatched portion of a square indicates a place where the anti-vibration table 22 is placed. As shown in FIG. 3, between adjacent arms (between 38f and 38g, between 38g and 38h, between 38h and 38i, between 38i and 38f).
Are respectively filled with non-magnetic members 42 such as ceramics. In FIG. 2, the non-magnetic member 42 is shown by imaginary lines in order to easily understand the shapes of the arm portions 38f to 38i. Also, FIG.
3 schematically shows a cross section taken along the line BB of FIG. 3, with the non-magnetic member 42 omitted except for a portion indicated by a virtual line.

As can be seen from FIGS. 1 and 2, the lower surfaces of the arm portions 38f to 38i have a concave portion with a predetermined depth formed on the surface except for a part of the tip portion, and fill the concave portion. As described above, the non-magnetic member 42 goes around the lower surface. The main reason why the recesses are formed on the lower surfaces of the arms 38f to 38i is that the magnetic poles (magnetic pole surfaces) are formed only at the tips of the arms 38f to 38i.

As described above, the four arm portions 38
f-38i and the non-magnetic member 42 form a substantially square plate-shaped structure, and the lower surface of this structure is substantially coplanar. Further, as shown in FIG. 3, a truncated cone-shaped recess is formed at the center of the above-mentioned square plate-shaped structure, and a circular opening serving as a passage of the illumination light IL is formed at the center of the recess. (See FIGS. 1 and 2). In addition,
The reason why the concave portion is filled with the non-magnetic member 42 on the lower surface side of the arm portions 38f to 38i and the surface thereof is made to be the same plane is for convenience in transporting the movable body 34 described later.

In the following description, the arm portions 38f, 38g, 38h, and 38i will be referred to as "magnetic pole portions 38f, 38g, 38h, and 38i" as appropriate, unless otherwise required.

As shown in FIG. 2, the base portion 36 can be disposed in the internal space of the base portion 38a of the core member 38, and has a rectangular parallelepiped shape having a substantially square shape in plan view and a predetermined height. The base 36 is directly fixed to the floor FD as shown in FIG.

The base portion 36 is a bottomed quadrangular prism-shaped base body 46 made of a non-magnetic material having a two-step stepped square-shaped recess formed in a plan view on the upper surface side fixed to the floor surface FD.
And a yoke 4 made of a plate-shaped magnetic material (for example, iron) fitted into the lower step portion of the base body 46 from above.
8 and m × m (m = m in FIG. 1) arranged in a square matrix on the upper surface of the yoke 48 along the XY two-dimensional direction.
8) The armature coil 51 _{11 to} 51 _mm and the base body 46
A ceramic plate 5 made of a non-magnetic material, which is fitted into the upper step portion from above and has a moving surface 36a formed on the upper surface thereof.
2 is provided. In the present embodiment, each armature coil 5
As 1, a hollow square coil is used. In the following description, the armature coils 51 _{11 to} 51 _mm will be collectively referred to as “armature coil group 51” as appropriate. In the present embodiment, the yoke 48 and the armature coil group 51 constitute a so-called planar motor stator.

As shown in FIG. 4, the moving body 34 includes a wafer stage WST as a stage made of a square plate-shaped magnetic member having a predetermined thickness, and an upper surface of the wafer stage WST (opposite to the moving surface 36a). Magnetic force driving magnets 60A, 60B, 60C as permanent magnets magnetized in the Z-axis direction and arranged in a matrix of two rows and two columns, one at each of the four corners (side surface). 60D and electromagnetic force driving magnets 62 ₁₁ to n × n (here, n = 5) permanent magnets arranged in a square matrix on the lower surface side of wafer stage WST and magnetized in the Z-axis direction. 62
_nn .

The four magnetic force driving magnets 60A, 60
In B, 60C, and 60D, the magnetic poles of the magnets adjacent to each other have opposite polarities in the row direction and the column direction. Specifically, the magnetic pole faces of the magnetic force driving magnets 60A and 60C are S
The magnetic pole faces of the magnetic force driving magnets 60B and 60D are N poles. In addition, these magnetic force driving magnets 60A, 60A
Balls 64 are rotatably mounted on the upper surfaces of B, 60C, and 60D, respectively. 64 for each ball
Are magnetic force driving magnets 60A, 60B, 60C, 60D
Is partially exposed above the upper surface of the.

The magnet for driving electromagnetic force 62₁₁~ 62_nnIs
For the planar motor corresponding to the stator (48, 51) described above,
It constitutes a mover.
Permanent magnets of different polarities to produce an alternating magnetic field
They are placed on each other. These electromagnetic force driving magnets 62₁₁
~ 62_nnThe arrangement interval of the
It has a predetermined relationship with the arrangement interval of the child coil groups 51. In addition,
In the present embodiment, a plate-like magnetic
Stricter due to the use of body members (eg iron)
In other words, the mover of the planar motor is
Stone 62₁₁~ 62 _nnAnd one of the lower side of wafer stage WST.
It is composed of a part.

In this way, the six-degree-of-freedom driving device 30
The driving principle and the like will be described later.

The upper surface 34a of the wafer stage WST is used as a wafer mounting surface, and the wafer W is attracted and fixed on the wafer mounting surface 34a via an electrostatic chuck (not shown). The position of wafer stage WST in the XY plane (that is, the position of wafer W) is set to, for example, 0.5 by a wafer laser interferometer (hereinafter, referred to as “wafer interferometer”) 68 which is the position detecting device shown in FIG. It is always detected with a resolution of about 1 nm. This wafer interferometer 68
Is fixed near the lower end of the lens barrel of the projection optical system PL. Here, in actuality, as shown in FIG. 5, the wafer interferometer 68
A wafer Y interferometer 68Y for axial position measurement and a wafer X interferometer 68X for position measurement in the X-axis direction, which is a non-scanning direction, are provided. In FIG. It is shown as At least one of the wafer X interferometer 68X and the wafer Y interferometer 68Y uses a multi-axis interferometer capable of measuring yawing (θz rotation), and interferometer beams from these wafer interferometers 68X and 68Y are used. The side surface of the wafer stage WST to be irradiated is mirror-finished, and is used as a reflection surface.

In this case, as can be easily imagined from FIG. 1, each of the wafer interferometers 68 moves the above-described square plate-shaped structure including the arm portions 38f to 38i and the nonmagnetic member 42 in the vertical direction. The lens barrel surface plate 24
It is suspended and supported. As shown in FIG. 3, through holes 42 a and 42 b are formed in the non-magnetic member 42 near the −X direction end and the −Y direction end, respectively, so that such a configuration is possible. ing.

The position information (or speed information) of the wafer stage WST from the wafer interferometer 68 is sent to the control device 50, and the control device 50 controls the XY plane of the movable body 34 based on the position information (or speed information). Is controlled as described later.

Further, in this exposure apparatus 100, as shown in FIG. 1, an image forming light beam (detection beam FB) for forming a plurality of slit images toward the best image forming plane of the projection optical system PL is emitted. an irradiation optical system AF ₁ supplies from an oblique direction with respect to the axis AX direction, oblique incidence consisting respective reflected light beams respectively received through the slit light receiving optical system AF ₂ Metropolitan on the surface of the wafer W of the imaging light beam A multi-point focal position detection system AF is provided as a focus / leveling sensor. As the multi-point focal position detection system AF (AF ₁ , AF ₂ ), for example, one having the same configuration as that disclosed in Japanese Patent Application Laid-Open No. Hei 5-190423 is used. Is used to drive the wafer stage WST in the Z direction and the tilt direction so that the wafer W and the projection optical system PL maintain a predetermined distance from each other.

[0059] In practice, irradiates the detection beam FB is the wafer surface from the X-direction, Y irradiation optical system AF from 45 degrees inclined to the direction _1, the optical receiving reflected light from the wafer surface as system AF ₂ can be received, the irradiation optical system AF _1, receiving but optical system AF ₂ are disposed respectively, for convenience the X axis direction of the irradiation optical system AF on both sides of the projection optical system PL of the drawing in FIG. 1 ₁ , the state of arranging the light-receiving optical system AF ₂ is shown. The irradiation optical system AF ₁ is provided with an aperture 3 shown in FIG.
The light receiving optical system AF ₂ is suspended from and supported by the lens barrel base 24 via a support member (not shown) through the light receiving optical system AF ₂ through the opening 3 in FIG.
The lens is suspended from the lens barrel base 24 by a support member (not shown) via 8k.

The wafer position information from the multi-point focal position detection system AF is sent to the controller 50, and the controller 50 determines the Z position and the tilt amount (Δθx, Δθy) of the surface of the wafer W based on the wafer position information. Then, based on this, the wafer stage WST is driven in the Z direction and the tilt direction so as to have a desired position and posture.

FIG. 5 schematically shows a configuration of a stage control system of exposure apparatus 100. The stage control system shown in FIG. 5 is mainly composed of a control device 50 mainly composed of a microcomputer, and the reticle interferometer 16 and the wafer interferometer 68 (68
X, 68Y), a multi-point focal position detection system AF and the like are connected. The current drive circuit 70, the reticle drive unit 15, and the like are connected to the output side of the control device 50. The current driving circuit 70 includes the above-described armature coils 40B to 40B.
E, the armature coil group 51 and the like are connected.

Next, the driving principle of the above-described six-degree-of-freedom drive device 30 and the position of wafer stage WST in the six-degree-of-freedom direction are described.
The attitude control will be described.

As a premise, before the start of driving, the magnets for driving magnetic force 60A, 60B, 60C, and 60D face the magnetic pole portions 38f, 38g, 38h, and 38i on a one-to-one basis. In the initial state in which no current flows through any of the magnets 40B to 40E,
A, 60B, 60C, 60D and magnetic pole parts 38f, 38g,
The distance between the movable bodies 38h and 38i is maintained at a predetermined value L, and the movable body 34 is held parallel to the moving surface 36a, that is, horizontally (see FIG. 1). That is, in the present embodiment,
The weight of the movable body 34 and the magnets for driving magnetic force 60A, 60A
B, 60C, 60D and magnetic poles 38f, 38g, 38h,
Each of the magnetic force driving magnets 60A, 60B, 60 is so adjusted as to balance the total magnetic force (magnetic attraction force) between the magnets 60A, 60B, and 60i.
C, the magnetic force of 60D is set. In other words, the magnetic force driving magnets 60A, 60B,
The magnetic pole portions 38f, 38g, 3
The magnetic force acting between 8h and 38i is set to the same size as 1/4 of the weight of the movable body 34. In the following description, the magnetic force driving magnets 60A, 60B, 60C,
Each of the magnetic pole portions 38f, 38g, 38h,
The state in which the distance from the position 8i is maintained at the predetermined value L is appropriately referred to as a “steady state”.

Here, a brief description will be given of a transport method for transporting the movable body 34 to the position before the start of driving. The movable body 34 is held substantially horizontally by an arm of a transfer robot (not shown), and is transferred to a position below a structure formed by the arm portions 38f to 38i and the nonmagnetic member 42. Next, the arm of the transfer robot rises to a position where the four balls 64 contact the lower surface of the structure, and in this state, the arms extend in the horizontal plane toward the optical axis of the projection optical system PL. Thus, while the four balls 64 rotate along the lower surface of the structure, the movable body 34 is moved to a position where the magnetic force driving magnets 60A, 60B, 60C, and 60D can face each of the magnetic pole surfaces of the magnetic pole portions. Move along a horizontal plane. In this state, when the arm of the transfer robot slowly descends, the magnetic force driving magnets 60A, 60A
B, 60C, 60D, and corresponding magnetic pole portions 38f, 38
g, 38h, and 38i become the above L, and at this time, the own weight of the movable body 34 and the magnets 60A, 60A for driving the magnetic force.
0B, 60C, 60D and the magnetic poles 38f, 38g, 38
h, 38i and the sum of the magnetic forces (magnetic attraction). Here, the restraint of the movable body 34 by the arm of the transfer robot is released, and when the arm is further lowered, the movable body 34 is floated to the position before the start of the driving.
After that, the arm of the transfer robot retreats,
The conveyance (loading) of the movable body 34 is completed.

In this way, the movable body 34 is set in a steady state (initial state). In this state, when driving wafer stage WST in the X-axis direction or the Y-axis direction,
Control device 50 supplies a current of a predetermined current pattern to each armature coil constituting armature coil group 51 via current drive circuit 70, so that wafer stage WST
The current value to be supplied to the armature coil 51 opposed to each of the electromagnetic force driving magnets 62 _{11 to} 62 _nn provided on the lower surface of the motor, and at least one of the current directions are controlled, and the Lorentz of a desired direction and size is controlled. An electromagnetic force may be generated.
Accordingly, wafer stage WST (ie, movable body 3)
4) is driven freely in the XY two-dimensional directions. Further, in order to rotate wafer stage WST in the θz direction, for example, electromagnetic force driving magnets 62 located on a diagonal line of wafer stage WST so that a rotation moment in the predetermined θz direction is generated around the center of gravity of movable body 34. Only the oppositely directed Lorentz electromagnetic force may be generated only in the facing armature coil 51. The driving principle in the XY plane is as follows.
Since it is known as a driving principle of a normal flat motor and is disclosed in, for example, Japanese Patent Application Laid-Open No. 58-175020, further detailed description will be omitted.

Next, a description will be given of the principle of driving the wafer stage WST in three directions of freedom, Z, θx, and θy, which is a feature of the present embodiment.

In the above-described steady state, the magnetic pole portions 38f, 38g, 38h, and 38i facing the magnetic force driving magnets 60A, 60B, 60C, and 60D are magnetized by magnetic polarization. Magnets 60A, 60
B, 60C and 60D, the magnetic pole portions 38f and 38g facing each other,
Magnetic poles of opposite polarity are generated on the surfaces of 38h and 38i. As a result, the magnetic pole surfaces of the magnetic pole portions 38f and 38h become N poles, and the magnetic pole surfaces of the magnetic pole portions 38g and 38i become S poles.

Accordingly, for example, the magnetic force driving magnet 60D
Focusing on the portion, as shown in FIG. 4, the magnetic pole portion 38f goes to the magnetic force driving magnet 60A, passes through the inside of the wafer stage WST, goes to the magnetic force driving magnet 60D, and A first magnetic circuit 80A that travels from the magnet 60D to the magnetic pole portion 38i, passes through the column portion 38e and the base portion 38a of the core member 38, returns to the magnetic pole portion 38f through the column portion 38b, and is driven by a magnetic force from the magnetic pole portion 38h. Magnet 60
C, through the interior of the wafer stage WST to the magnetic force driving magnet 60D, and the magnetic force driving magnet 60D
From the magnetic pole portion 38i to the column portion 38e of the core member 38.
And the base part 38a, and through the pillar part 38d, the magnetic pole part 3
A second magnetic circuit 80B returning to 8h is formed.

In this case, actually, the magnetic flux from the magnetic pole portion 38f toward the magnetic force driving magnet 60A passes through the magnetic force driving magnet 60A, and then to the magnetic force driving magnet 60D side and the magnetic force driving magnet 60D. To the magnetic flux heading toward the magnet 60B
The magnet 6 for magnetic force driving is similarly divided from the magnetic pole portion 38h.
After passing through the magnetic force driving magnet 60C, the magnetic flux toward 0C is divided into two parts: a magnetic flux toward the magnetic force driving magnet 60D and a magnetic flux toward the magnetic force driving magnet 60B. Accordingly, although not shown, the magnetic pole portion 38f goes to the magnetic force driving magnet 60A, passes through the inside of the wafer stage WST to the magnetic force driving magnet 60B, and goes from the magnetic force driving magnet 60B to the magnetic pole portion 38g. A third magnetic circuit that passes through the column 38c and the base 38a of the core member 38, returns to the magnetic pole 38f through the column 38b, and the magnetic pole 3
8h, the magnetic force driving magnet 60C, the inside of the wafer stage WST to the magnetic force driving magnet 60B, the magnetic force driving magnet 60B to the magnetic pole 38g, the column 38c of the core member 38 and the base. A fourth magnetic circuit that passes through the base portion 38a, passes through the column portion 38d, and returns to the magnetic pole portion 38h is also formed. Hereinafter, for convenience of explanation, the third magnetic circuit and the fourth magnetic circuit are referred to as magnetic circuits 80, respectively.
C, a magnetic circuit 80D.

The above four magnetic circuits 80A to 80D are
It is always formed between wafer stage WST and electromagnet unit 32 (core member 38). Therefore, assuming that the magnetic flux densities in the magnetic circuits 80A, 80B, 80C, and 80D are A, B, C, and D, respectively, the magnetic flux density of the magnetic flux passing through the column portion 38b, that is, the magnetic force driving magnet The magnetic flux density of the magnetic flux heading for 60A is (A +
C) The magnetic flux density of the magnetic flux passing through the inside of the column 38e, that is, the magnetic flux density of the magnetic flux from the magnetic force driving magnet 60D toward the magnetic pole 38i is (A + B), and the magnetic flux density of the magnetic flux passing through the inside of the column 38d, The magnetic flux density of the magnetic flux from the magnetic pole portion 38h toward the magnetic force driving magnet 60C is (B + D), that is, the magnetic flux density of the magnetic flux passing through the inside of the column portion 38c, that is, the magnetic flux density of the magnetic flux from the magnetic force driving magnet 60B to the magnetic pole portion 38g. Becomes (C + D). In the steady state described above, A + C
= A + B = B + D = C + D, that is, A = B = C = D.

Accordingly, each of the pillars 38b, 38c, 38d,
By changing the magnetic flux density passing through 38e, the magnetic force (magnetic attraction force) between the magnetic force driving magnets 60A, 60B, 60C, and 60D and the opposing magnetic pole portions 38f, 38g, 38h, and 38i is increased. It can be seen that the Z position and the leveling of the wafer stage WST can be adjusted by increasing or decreasing.

Therefore, in this embodiment, the control device 50
However, in order to change the magnetic flux density of the magnetic flux passing through each column part 38b, 38c, 38d, 38e, the armature coils 40B to 4B
The Z position and leveling of wafer stage WST are adjusted by adjusting the magnitude and direction of the current supplied to each of 0E. In this case, the position of wafer stage WST in the direction of three degrees of freedom around the center of gravity is
Since the four magnetic forces are increased or decreased to control the attitude, a decoupling arithmetic circuit that outputs four command values with the positional deviation in the direction of three degrees of freedom as an input is provided in the control device 50. .

The principle of the specific control method will be briefly described. The magnets for driving magnetic force 60A, 60B, 60C,
When any part of 60D is lifted by a predetermined amount, current I flowing through corresponding armature coils 40B to 40E is
Is temporally changed as shown by a solid line in FIG. 6, for example. Thus, the magnetic flux density of the target magnetic flux once increases, then temporarily decreases from the steady state, and then returns to the same value as the steady state. At this time, wafer stage WST returns to zero after the upward acceleration once increases. Here, the current value I in FIG. 6 is finally negative because the magnetic flux density becomes larger than the steady state as the distance between the magnetic pole portion and the magnet for driving the magnetic force becomes smaller. If it is zero or plus, the permanent magnet will be attracted to the magnetic pole part,
This is to maintain the balance between the magnetic flux density and the own weight by setting the magnetic flux density to the same value as in the steady state.

Magnetic force driving magnets 60A, 60B, 60
When lowering any part of C and 60D by a predetermined amount, the current I flowing through the corresponding armature coils 40B to 40E may be changed with time, for example, as shown by a dotted line in FIG. good.

Therefore, for example, when driving wafer stage WST upward by a predetermined amount in the Z direction, control device 5
At 0, the current I flowing through the armature coils 40B to 40E may be simultaneously changed over time, for example, as shown by the solid line in FIG.

For example, when rotating wafer stage WST around the X axis by a predetermined angle, control device 5
At 0, the currents I flowing through the armature coils 40B, 40E (or the armature coils 40C, 40D) are both temporally changed as shown by the solid line in FIG. 6, and the remaining armature coils 40C, 40D ( Or armature coil 40B,
40E) may be changed as shown by the dotted line in FIG. Further, for example, when rotating wafer stage WST by a predetermined angle around the Y axis, control device 50 controls both currents I flowing through armature coils 40E and 40D (or armature coils 40B and 40C) in FIG. At the same time as the time is changed as shown by the solid line, the remaining armature coils 40B and 40C (or the armature coils 40B and 40C) are changed.
E, 40D) may be changed as shown by the dotted line in FIG. By doing so, it is possible to drive wafer stage WST in the θx (rotation around the X-axis) direction and in the θy (rotation around the Y-axis) direction without substantially changing the position of wafer stage WST.

Any change in Z position / posture is obtained by combining the above control methods. However, in order to make the moment around the center of gravity of wafer stage WST after the Z position / posture adjustment substantially zero, magnets for driving magnetic force 60A, 60B, 6
0C, 60D and the magnetic pole portions 38f, 38 facing each other.
It is important that the magnetic force (magnetic attraction) between g, 38h and 38i be the same as in the steady state.

As is clear from the above description, in the first embodiment, the electromagnetic force driving magnets 62 _{11 to} 62 are used.
_nn and the base portion 36 (more specifically, a stator composed of the yoke 48 and the armature coil group 51) constitute a first driving device, and the magnetic force driving magnets 60A to 60A
The second driving device is configured by the 0D and the electromagnet unit 32.

Next, the flow of the exposure operation in exposure apparatus 100 will be briefly described.

First, reticle loading and wafer loading are performed by a reticle loader and wafer loader (not shown) under the control of a main controller (not shown), and a reticle microscope (not shown) and a reference (not shown) on wafer stage WST. Preparation work such as reticle alignment and baseline measurement is performed according to a predetermined procedure using a mark plate and an alignment detection system (not shown).

Thereafter, alignment measurement such as EGA (Enhanced Global Alignment) disclosed in JP-A-61-44429 is performed by the main controller using an alignment detection system (not shown). In such an operation, when the movement in the XY plane of wafer W is required, the main control device via a control unit 50, the armature coil group faces the electromagnetic force driving magnet 62 ₁₁ through 62 _nn 51 By controlling at least one of the current value supplied to each armature coil and the current direction, wafer stage WST holding wafer W is moved in a desired direction. After the completion of the alignment measurement, the exposure operation of the step-and-scan method is performed as follows.

In this exposure operation, first, the wafer W
The wafer stage WST is moved so that the XY position of the wafer stage becomes the scanning start position for exposing the first shot area (first shot) on the wafer W. at the same time,
The XY position of the reticle R becomes the scanning start position,
Reticle stage RST is moved. Then, based on an instruction from the main control device, control device 50 transmits XY position information of reticle R measured by reticle interferometer 16 and X-ray information of wafer W measured by wafer interferometer 68.
Scanning exposure is performed by synchronously moving the reticle R and the wafer W via the reticle driving unit 15 and the six-degree-of-freedom driving device 30 based on the Y position information. The movement of the wafer W is performed by the main controller via the controller 50.
This is performed by controlling at least one of a current value supplied to each armature coil of the armature coil group 51 facing the electromagnetic force driving magnets 62 _{11 to} 62 _nn and a current direction.

When the transfer of the reticle pattern to one shot area is completed, wafer stage WST is stepped by one shot area, and scanning exposure is performed for the next shot area. In this way, the stepping and the scanning exposure are sequentially repeated, and the required number of shot patterns are transferred onto the wafer W.

Here, at the time of the above-mentioned scanning exposure, each armature coil 4 constituting the 6-degree-of-freedom driving device 30 is based on the wafer position information from the multipoint focal position detection system AF.
The current flowing from 0B to 40E is controlled as described above, and focus / leveling control of wafer stage WST, that is, adjustment of Z, θx, and θy positions is performed.

As described in detail above, the six-degree-of-freedom driving device 30 constituting the exposure apparatus 100 of the first embodiment
According to the above, even in a non-air environment, the position and orientation of the wafer stage WST in six directions of freedom can be controlled without any trouble, and a Z-leveling table, an air bearing, etc. are not required, and the stage is small and lightweight. This makes it possible to improve the position controllability of the stage.

Therefore, according to the exposure apparatus 100 of the present embodiment, it is possible to increase the speed and acceleration of the wafer stage, and to improve the throughput by shortening the positioning settling time and the like accompanying the improvement of the position control system. It becomes possible to plan. In addition to this, the stator (4
8, 51) are main body columns 2 holding the projection optical system PL.
0, that is, the stator (48, 51) is independent of the main body column 20 with respect to vibration, so that the reaction force generated on the stator when the wafer stage WST is driven is reduced. It is not transmitted to the main body column 20, and the reaction force does not become a factor of vibration of the projection optical system PL. Accordingly, it is possible to prevent the occurrence of a pattern transfer position shift or the like due to the vibration of the projection optical system PL, and to perform highly accurate exposure.

In the present embodiment, permanent magnets are used as the magnetic force driving magnets 60A to 60D, and no current is supplied to any of the armature coils 40B to 40E constituting the electromagnet unit 32. Magnets 60A-60
When the magnetic force between D and magnetic pole portions 38f to 38i is not adjusted, movable body 34 including wafer stage WST
Can be held at a steady state position while supporting its own weight by the magnetic force. Therefore, in this case, it is possible to adjust the position and orientation of the stage from a steady state with a small supply current (energy).

In the first embodiment, the magnets for driving magnetic force 60A to 60D are arranged in a matrix of 2 rows and 2 columns, and the magnetic poles of adjacent magnets are opposite in the row direction and the column direction. Although a case has been described in which four magnetic circuits 80A to 80D are arranged so as to have polarities and include adjacent magnets, the present invention is not limited to this.

That is, at least three magnets for driving a magnetic force are disposed on the mounting surface side of the wafer stage WST on which the wafer W is mounted, and the electromagnet unit 32 has at least three magnetic poles individually facing the magnets. It is only necessary to have a unit. In such a case, the Z position and leveling of wafer stage WST can be adjusted by adjusting the magnetic force between each magnet and the opposing magnetic pole portion. However, if the number of the magnetic force driving magnets and the number of magnetic poles are odd, the configuration of the magnetic circuit involves some difficulty. Therefore, the magnetic force driving magnets are located at different positions on the substrate mounting surface side of the wafer stage. It is preferable that an even number of magnetic poles are arranged, and one magnetic pole portion is arranged to face each of the magnets.

Further, in the above embodiment, the case where wafer stage WST has a square shape has been described. However, the present invention is not limited to this, and may be a quadrangle such as a rectangle, or a polygonal shape such as a triangle or a pentagon or more.

Further, in the above embodiment, the moving surface 36a
Is a horizontal plane, and the wafer stage W
Although the case where ST is supported by a magnetic force (attraction force) has been described, conversely, by supporting the own weight of wafer stage WST from below by a magnetic force (repulsive force), wafer stage WST can be positioned below the moving surface. A configuration that supports the stage may be adopted. Or, make the moving surface a vertical surface,
A configuration in which the stage moves along this moving surface is also possible.

<< Second Embodiment >> Hereinafter, a second embodiment of the present invention will be described with reference to FIGS. here,
Constituent portions that are the same as or equivalent to those of the first embodiment described above are denoted by the same reference numerals, and description thereof is simplified or omitted.

FIG. 7 is a sectional view showing a schematic configuration of an exposure apparatus 200 according to the second embodiment. Exposure apparatus 200 is an electron beam exposure apparatus that exposes a resist on wafer W with an electron beam.

The exposure apparatus 200 of this embodiment is housed in a vacuum chamber (not shown) installed in an ultra high-pressure clean room (not shown), unlike the above-described first embodiment. The exposure apparatus 200 includes the projection optical system P described above.
A point that an electron optical system PL1, which is a kind of charged particle beam optical system, is provided as an optical system instead of L,
8. Reticle stage RST and reticle interferometer 16
And the like are different from the exposure apparatus 100 in that they are not provided.

As shown in FIG. 8, the electron optical system PL1 includes an electron tube 82 as a charged particle beam tube, an electron gun 84, a first electromagnetic lens 86, a second electromagnetic lens 88, and the like. A pencil beam type (Gaussian beam type) electron optical system provided is used. In the electron optical system PL1 shown in FIG. 8, the electron beam emitted from the electron gun 84 is accelerated and narrowed by an electromagnetic lens system including a first electromagnetic lens 86 and a second electromagnetic lens 88 to which a predetermined voltage is applied, and focused on a spot. An electron beam is formed, and the resist on the wafer W is exposed by raster-scanning or vector-scanning the spot beam, and a desired pattern is transferred onto the resist. Although the internal configuration of the electron optical system PL1 is simplified in FIG. 8, in actuality, an objective aperture, a deflection electrode, a backscattered electron detection element, an astigmatism correction coil, and the like are provided.

Further, in this exposure apparatus 200, as shown in FIG. 7, a cylindrical magnetic shield 90 for covering a portion of the electron optical column PL1 excluding the exit of the exit end of the electron beam of the electron lens column 82 is provided. Is provided. FIG. 9 is a cross-sectional view of the magnetic shield 90. The magnetic shield 90 includes an inner cylinder 92 having a funnel-like shape, and the inner cylinder 92.
And an outer cylinder 94 having substantially the same shape and arranged around a predetermined clearance therebetween. The inner cylinder 92 is supported by a plurality of protrusions 94a, 94b,... Provided at predetermined intervals on the inner peripheral surface of the outer cylinder 94 so as to maintain a substantially constant clearance over the entire periphery between the inner cylinder 92 and the outer cylinder 94. Have been. The inner cylinder 92 is formed of a material having a high magnetic permeability, for example, permalloy.
2, a material having a lower magnetic permeability than carbon steel (Steel
Carbon).

The reason for this is that the electronic lens barrel 8 is externally provided.
The purpose of this is to minimize the magnetic flux density of the magnetic flux that penetrates into the path 2 and crosses the path of the electron beam. That is, the outer cylinder 94
Since a material having a low magnetic permeability is used, a certain amount of magnetic flux penetrates into the inner cylinder 92 through the outer cylinder 94. 92 flows through the interior of itself, thereby
It is possible to make the magnetic flux of the inside of the electron beam 2 traveling toward the path of the electron beam substantially zero. Therefore, it is possible to minimize the possibility that the electron beam is deflected in an unexpected direction due to the magnetic influence.

On the other hand, when the outer cylinder is formed of a material having a high magnetic permeability and the inner cylinder is formed of a material having a low magnetic permeability, the magnetic flux from the outside flows through the inside of the outer cylinder. The magnetic flux penetrates into the inner cylinder side, and most of the penetrated magnetic flux penetrates into the electron lens barrel 82 through the inner cylinder made of a material having low magnetic permeability, which is not preferable.

The reason why the outer cylinder 94 is formed of a material having a low magnetic permeability and the inner cylinder 92 is formed of a material having a high magnetic permeability is as follows.
For the following reasons:

That is, in FIGS. 10A and 10B, the horizontal axis represents the magnetic field strength H, and the vertical axis represents the magnetic flux density B.
The magnetization characteristics of the outer cylinder 94 formed of a material having a small magnetic permeability (μ) and the magnetization characteristics of an outer cylinder formed of a material having a high magnetic permeability in a similar magnetic field are shown. 10 (C) and 10 (D), the horizontal axis indicates the magnetic field strength H, and the vertical axis indicates the magnetic flux density B, indicating that the magnetic material is formed of a material having a high magnetic permeability in the same magnetic field. The magnetization characteristics of the cylinder 94 and the magnetization characteristics of the inner cylinder formed of a material having a small magnetic permeability are shown. These FIGS. 10A to 1
At 0 (D), the shaded area indicates the loss of magnetic energy.

As the combination of the constituent materials of the outer cylinder and the inner cylinder, the combination corresponding to FIG. 10 (A) + FIG. 10 (C) which is the same as that of the present embodiment and the combination corresponding to FIG. 10 (A) + FIG. 10B, a combination corresponding to FIG. 10B + FIG. 10C, and a combination corresponding to FIG. 10B + FIG. 10D are considered. Is (Loss1 + Lo
ss4), which is the smallest, but it is clear that the original function of the magnetic shield cannot be sufficiently exhibited. So, looking at the rest, for the purpose of magnetic shielding, it seems to be the best,
The magnetic energy loss is (Loss2 + Loss3), which is the largest and undesirably generates large heat. From this, one of the remaining will be selected, but comparing the magnetic energy loss of both,
Since Loss1 + Loss3 <Loss2 + Loss4, the above-mentioned, that is, in the case of the present embodiment, the surface of magnetic energy loss is smaller than the case where the outer cylinder is formed of a material having a high magnetic permeability and the inner cylinder is formed of a material having a low magnetic permeability. That is, it is also advantageous in that the generated heat can be kept low.

In particular, in a vacuum, heat is mainly transmitted by radiation between objects, so that the magnetic energy loss in the member forming the outer cylinder 94 is reduced to reduce the heat generation in the outer cylinder 94. It is more desirable in terms of the influence of heat than when the magnetic energy loss of the inner cylinder 92 is reduced. In this sense, it is desirable that the outer cylinder 94 be thin.

For the reasons described above, in the present embodiment, the outer cylinder 94 is formed of a material having a low magnetic permeability,
Is formed of a material having a large magnetic permeability.

The structure of the other parts is the same as that of the first embodiment.

Exposure apparatus 200 thus configured
According to the above, at the time of exposure, each of the plurality of partitioned areas on the wafer W is sequentially positioned by the control device 50 via the six-degree-of-freedom driving device 30 at the exposure position, that is, directly below the electron optical system PL1. Although a predetermined circuit pattern is sequentially transferred into the exposure apparatus 100, the same effect can be obtained as a whole. Further, according to the exposure apparatus 200, the electron beam emitted from the electron optical system PL1 to the wafer W due to the magnetic influence of the magnetic circuit constituting the six-degree-of-freedom drive device 30 by the magnetic shield 90 having the double structure described above. Is also minimized from being deflected in unexpected directions. Of course, according to the exposure apparatus 200, since the electron beam is used, the exposure apparatus 10 using light is used.
Finer exposure can be performed as compared with 0.

In the above-described second embodiment, the case where a pencil beam type (Gaussian beam type) electron optical system is used as the electron optical system has been described. However, the present invention is not limited to this, and a mask (aperture) may be formed in advance. One side is 5
A cell projection type electron optical system that projects a simple pattern such as a square or parallelogram of about μm, or a mask (aperture) in which a pattern that is slightly more complicated than the cell projection type is created in advance has a certain size ( A variable shaped beam type electron optical system for projecting a pattern corresponding to the cross-sectional shape of an electron beam transmitted through the mask by irradiating a beam having a square of 5 μm on each side, or a plurality of shutters (usually a dielectric mask) on the mask The electrodes are formed in a matrix, and a voltage is applied or not applied to each electrode position, so that each electrode portion functions as a kind of capacitor to form a shutter.) 250 μm square using a stencil mask as well as an EBDW (EB direct writing system) such as an aperture array system It may of course be employed any configuration of EBPS exposing the area of the degree at a time (EB projection system). Alternatively, the electron lens barrel may be configured by any combination of the above-described pencil beam system and each of the above-described systems.

Further, in the second embodiment, the case where the magnetic shield 90 has a double structure has been described. However, the present invention is not limited to this, and the magnetic shield may be single. . Even in such a case, the magnetic shield can prevent the electron beam emitted from the electron lens barrel 82 from being deflected in an unexpected direction due to the influence of the magnetic force generated by the second driving device. In addition, highly accurate exposure using an electron beam can be performed. In this case, the material of the magnetic shield is desirably formed of a material having a high magnetic permeability such as permalloy.

In each of the above embodiments, the present invention employs Ar
The case where the present invention is applied to each of the F exposure apparatus and the electron beam exposure apparatus has been described. However, the application range of the present invention is not limited to this, and exposure to vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm) is performed. Exposure equipment using charged particle beams, such as X-ray exposure equipment and ion beam exposure equipment, as well as other VUV exposure equipment used as illumination light for exposure and EUV exposure equipment using light having a wavelength of 5 to 15 nm as illumination light for exposure. The present invention is also applicable to the present invention. In addition, it goes without saying that the present invention may be suitably applied to a DUV exposure apparatus using a KrF excimer laser beam, g-line or i-line as exposure illumination light, even if the inside of the chamber may be an air atmosphere.

Further, an illumination optical system and a projection optical system (or an electronic optical system) composed of a plurality of lenses are incorporated in the main body of the exposure apparatus to perform optical adjustment, and the reticle stage and the stage apparatus (or the stage according to the present invention) Equipment) to the exposure equipment body, connect wiring and piping,
Further, by performing overall adjustment (electrical adjustment, operation confirmation, and the like), the exposure apparatus of each of the above embodiments can be manufactured.
It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature, cleanliness, and the like are controlled.

The semiconductor device has a step of designing the function and performance of the device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, and a predetermined step by the exposure apparatus of each embodiment described above. Is manufactured through a step of transferring the pattern to a wafer, a step of assembling a device (including a dicing step, a bonding step, and a package step), an inspection step, and the like.

[0111]

As described above, according to the first to eighth aspects of the present invention, the position and attitude of the stage can be controlled without any trouble even in a non-air environment, and the configuration of the stage can be achieved. This has the effect that simplification and reduction in size and weight can be achieved.

According to each of the ninth to twelfth aspects, there is an effect that the throughput can be improved. In particular, according to the tenth aspect, the exposure accuracy can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view schematically showing a configuration of an exposure apparatus according to a first embodiment.

FIG. 2 is a schematic perspective view showing the six-degree-of-freedom drive device of FIG.

FIG. 3 is a plan view of the electromagnet unit as viewed along line AA in FIG. 1;

FIG. 4 is an explanatory exploded perspective view in which a part of the six-degree-of-freedom drive device of FIG. 2 is cut away.

FIG. 5 is a block diagram schematically showing a configuration of a stage control system of the exposure apparatus of FIG.

FIG. 6 is a diagram for explaining a Z-leveling control method of the wafer stage, and is a diagram illustrating an example of a control current flowing through each armature coil included in the electromagnet unit, with the horizontal axis representing time. .

FIG. 7 is a cross-sectional view illustrating a schematic configuration of an exposure apparatus according to a second embodiment.

8 is a diagram showing a configuration example of the electron optical system of FIG. 7;

FIG. 9 is a sectional view showing an internal configuration of the magnetic shield of FIG. 7;

10 is a diagram for explaining the reason why the outer cylinder constituting the magnetic shield of FIG. 9 is formed of a material having a low magnetic permeability and the inner cylinder is formed of a material having a high magnetic permeability ((A) to (A)).
(D)).

[Explanation of symbols]

Reference numeral 20: Main body column (holding portion), 30: 6-degree-of-freedom drive device (stage device), 32: Electromagnet unit (adjustment unit, part of the second drive device), 36: Base portion (of the first drive device) A), moving surface, 38f-38i ...
Magnetic pole part, 48 ... Yoke (part of stator), 51 ... Armature coil group (part of stator), 6211 to 62nn ... Electromagnetic force driving magnet (movable element, part of first driving device) , 60A ~
60D: magnet for driving magnetic force (magnet, part of the second driving device), 82: electron column (charged particle beam column), 90: magnetic shield, 92: inner tube, 94: outer tube, 100 ... Exposure apparatus, 200: Exposure apparatus, W: Wafer (object, substrate), W
ST: wafer stage (stage), PL: projection optical system (optical system), PL1: electron optical system (charged particle beam optical system,
Optical system).

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H01L 21/30 541A B23Q 1/18 A F term (Reference) 2H097 BA02 CA16 KA03 KA28 LA10 LA12 3C048 BB12 DD06 DD26 5F031 CA07 LA02 LA08 MA27 5F046 AA05 AA09 AA22 AA23 CC01 CC02 CC03 CC05 CC06 ED01 5F056 AA22 AA27 AA29 CB22 CB24 CB25 DA15 EA14 EA16 FA06

Claims (12)

[Claims] A stage having a mounting surface on which an object is mounted; a first driving device for driving the stage by an electromagnetic force along a moving surface; and a magnetic field in a direction intersecting the stage with the moving surface. A second driving device driven by force. 2. The apparatus according to claim 1, wherein the first driving device includes a mover provided on the stage so as to face the moving surface, and a stator driving the stage by electromagnetic interaction between the mover and the mover. Wherein the second driving device includes a magnet disposed on the mounting surface side of the stage and an adjustment unit that adjusts the magnetic force generated between the magnet and the second driving device. The stage device according to claim 1. 3. The at least three magnets are disposed on the mounting surface side of the stage, and the adjustment unit includes at least three magnetic pole portions individually facing each of the magnets. Claim 2
A stage device according to item 1. 4. The apparatus according to claim 1, wherein an even number of the magnets are arranged at different positions on the mounting surface side of the stage, and one magnetic pole portion is arranged to face each of the magnets. Item 4. The stage device according to item 3. 5. The stage has a quadrangular shape, and one magnet is disposed at each of the four corners on the mounting surface side of the stage, and each of the magnetic pole portions is opposed to each magnet. The stage device according to claim 3, wherein one stage device is arranged. 6. The magnets are arranged in a matrix of two rows and two columns, and are arranged such that magnetic poles of mutually adjacent magnets have opposite polarities in a row direction and a column direction. The stage device according to claim 5. 7. The moving surface is a horizontal surface, and when the distance between the magnet and each of the magnetic pole portions is a predetermined value, the total weight of the stage, the mover, and the magnet, The stage device according to any one of claims 3 to 6, wherein the steady-state magnetic force of the magnet is set so that the total magnetic force between the magnetic poles and the magnetic poles is balanced. 8. Between the at least three magnetic pole parts,
The stage device according to any one of claims 3 to 7, wherein the stage device is connected by a magnetic material. 9. An exposure apparatus for exposing a substrate with an energy beam through an optical system and transferring a predetermined pattern to the substrate, comprising: the stage device according to claim 1. An exposure apparatus, comprising: the stage constituting the stage device as a substrate stage for holding the substrate. 10. An exposure apparatus for exposing a substrate with an energy beam via an optical system and transferring a predetermined pattern to the substrate, comprising: the stage device according to claim 2. Description: A stage that constitutes the stage device is provided as a substrate stage that holds the substrate, and a stator of the first drive device that constitutes the stage device is independent of a holder that holds the optical system with respect to vibration. An exposure apparatus, comprising: 11. The optical system is a charged particle beam optical system including a charged particle beam column, and a cylindrical shape covering a portion of the charged particle beam from the charged particle beam column excluding the exit of the exit end. The exposure apparatus according to claim 9, further comprising a magnetic shield. 12. The magnetic shield has a double structure having an inner cylinder and an outer cylinder disposed around the inner cylinder with a predetermined clearance therebetween, wherein the outer cylinder is compared with the inner cylinder. The exposure apparatus according to claim 11, wherein the exposure apparatus is formed of a material having a small magnetic permeability.