JP2000137924A - Optical pickup device and optical recording medium driving device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical pickup device that prevents positional deviation to be caused between the light source and the light receiving element or optical parts arranged in the light path in-between even in the presence of environmental change such as temperature or moisture. SOLUTION: In the optical pickup device in which a lower frame 11A and an upper frame 11B made of a molded resin are provided, in which the lower frame 11A is attachably equipped with a semiconductor laser device 5 and a wiring part 13 for the electrical connection with the laser device 5, and in which the upper frame 11B is constituted of a photodiode 4 for making return light from the optical disk incident and a wiring part 14 for the electrical connection with the photodiode 4; the semiconductor laser device 5 is installed on the wiring part 13, while the photodiode 4 is installed on the wiring part 14, and they are fixedly positioned between both wiring parts 13, 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an optical pickup device and an optical recording medium driving device.

[0002]

2. Description of the Related Art In recent years, research and development of an optical pickup device using a hologram element has been carried out in accordance with a demand for reduction in size, weight, and price of the optical pickup device. This type of optical pickup device is disclosed.

FIG. 17, FIG. 18, FIG. 19, FIG. 20, FIG.
FIGS. 1, 22, 23, 24 and 25 are views showing the schematic configuration of an optical pickup device disclosed by the present applicant in Japanese Patent Application Laid-Open No. 10-241195, FIG. 17 is a perspective view, and FIG. 19 is an exploded perspective view, FIG. 19 is a side cross-sectional view at a semiconductor laser element portion, FIG. 20 is a side cross-sectional view at a reflection mirror portion, FIG. 21 is a longitudinal cross-sectional view taken along a broken line CC ′ in FIG.
2 is a longitudinal sectional view taken along a broken line DD ′ in FIG. 19, FIG. 23 is a plan view of the lower frame portion viewed from above, FIG. 24 is a plan view of the upper frame portion viewed from below, and FIG. It is the figure which looked at from the front.

In this optical pickup device, a lower frame portion (first frame portion) 11A, an upper frame portion (second frame portion) 11B, and a hologram holding portion 11C made of a resin mold are bonded and fixed to form a light emitting / receiving unit. Have been. The upper surface (inner surface) of the bottom plate of the lower frame 11A and the lower surface (inner surface) of the upper frame 11B face each other. On the upper surface of the lower frame portion 11A, a conductive heat sink 3, a transmission type three-division grating 6, a transmission type hologram element 7, and a return beam from an optical disk (optical recording medium) are reflected upward. A reflection mirror 12 is mounted, a photodiode 8 for beam power monitoring is provided on the upper surface of the conductive heat sink 3, and a semiconductor laser element 5 is mounted. On the other hand, a photodiode 4 that receives and detects the return beam reflected by the reflection mirror 12 is mounted in the resin mold of the upper frame portion 11B. The upper frame 11B is made of a transparent resin mold so that the light reaches the photodiode 4.

The direction of emission of the laser beam from the semiconductor laser element 5 is parallel to the bottom plate of the lower frame 11A. The detection area of the photodiode 4 is the lower frame 11
It is formed substantially parallel to a plane orthogonal to the direction in which A and the upper frame 11B face each other.

On the upper surface of the lower frame portion 11A, an elongated wiring portion 131 for supplying power to the semiconductor laser element 5, a wiring portion 132 for outputting a signal from the monitoring photodiode 8, and a monitoring photodiode 8 are provided. A large wiring portion (first wiring portion) 13 that is connected to the semiconductor laser element 5 in common (for example, for grounding) is provided. The wiring portion 13 has an elongated portion 133.
Project together with the lead frames 131 and 132 from the light emitting and receiving unit to the outside. The wiring portion 13 also functions as a heat radiating member that emits heat generated by the semiconductor laser element 5 to the outside, and has protrusions 13a that protrude laterally from both side surfaces of the lower frame portion 11A. The lead frames 13, 131, 132 are made of metal such as copper and iron.

The wiring portion 13 has a cut-out portion of the reflection mirror 12, and the reflection mirror 12 is directly mounted on the lower frame portion 11A without passing through the wiring portion 13.
Further, the heat sink 3 is mounted on the lower frame portion 11A via the wiring portion 13.

In the resin mold of the upper frame portion 11B, elongated wiring portions 141, 141,... For outputting signals from the divided detection areas of the photodiode 4 are provided.
And common to each detection area of the photodiode 4 (for example,
A large wiring portion (second wiring portion) 14 to be grounded (for grounding) is provided. The wiring portion 14 has elongated portions 142, 142, and the elongated portions 142, 142
And 141 project outside from the light emitting / receiving unit. The photodiode 4 is mounted on the lower surface of the wiring section 14.

The wiring sections 13, 131, 132, 14,
141 and 142 are made of metal such as copper and iron.

The hologram element 7 has a three-division diffraction grating 6
Can transmit the three main beams from the 0th order,
The three return beams reflected from the optical disk are diffracted leftward or rightward (first-order or -1st-order) so as to avoid the grating surface 6a of the diffraction grating 6.

Further, the optical pickup device has a housing (not shown) connected to the light emitting / receiving unit. The housing is provided with a start-up reflection mirror for changing the optical axis direction of the laser light upward between the hologram element 7 and the optical disk, and an objective lens for condensing the laser light on the surface of the optical disk.

In such an optical pickup device, the laser beam output from the front end face side of the semiconductor laser element 5 is split by the three-division diffraction grating 6 into three beams of a zero-order beam and ± first-order diffraction beams. After that, the light enters the hologram element 7. The three beams transmitted through the transmission type hologram element 7 are reflected upward by the rising reflecting mirror, and then condensed on the optical disk as a main spot and a sub spot by the condensing action of the objective lens.

The three main beams converged on the optical disk as main spots and sub spots are reflected by the optical disk as three return beams containing information signals having information recorded on the disk. Through the lens,
After being reflected by the reflecting mirror for rising, the hologram element 7
Incident on.

The three reflected beams transmitted through the hologram element 7 by the first-order (or −1st-order) diffraction pass through the right or left side of the diffraction grating surface 6 a of the three-division diffraction grating 6, and then are reflected by the reflection mirror 12. The light is reflected upward and enters the photodiode 4.

The feedback beam incident on the photodiode 4 is converted into an electric signal and output from the wiring sections 141, 141..., And reproduction of information recorded on the optical disk, tracking servo, and focusing servo are performed as is well known. .

In the above-described conventional optical pickup device,
The lower frame portion 11A and the upper frame portion 11B are fixed in a state where the end faces of both frame portions are in contact with each other, and the wiring portion 14 is formed in a resin mold for forming the upper frame portion 11B.
Are arranged, and the photodiode 4 is attached to a lower surface of the wiring portion 14.

However, in the optical pickup device having such a configuration, the positional relationship between the semiconductor laser element 5 and the photodiode 4 is determined via the lower frame portion 11A and the upper frame portion 11B made of resin mold. Therefore, when the resin mold forming the lower frame portion 11A and the upper frame portion 11B expands or deforms due to a change in temperature, moisture absorption, or the like, a displacement occurs between the semiconductor laser element 5 and the photodiode 4, and signal reproduction and There is a problem that the focus adjustment, the tracking adjustment, and the like are adversely affected, and good recording and reproduction cannot be performed on the optical disc.

In the conventional optical pickup device, 3
Since optical components such as the hologram holder 11C to which the divided diffraction grating 6, the hologram element 7 is mounted, and the reflection mirror 12 are mounted on the lower frame 11A made of a resin mold, the lower frame 11A is formed as described above. If the resin mold forming the lens expands or deforms due to temperature change, moisture absorption, etc., a positional shift occurs between the optical components, adversely affecting signal reproduction, focus adjustment, tracking adjustment, and the like, resulting in good recording on the optical disc. And playback cannot be performed.

[0019]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of the prior art, and has been described in connection with a light source, a light receiving element, or a frame portion to which an optical component disposed in an optical path therebetween is attached. Provided is an optical pickup device that prevents a positional relationship between them from being displaced even when the shape is changed due to environmental changes such as humidity and humidity, and an optical recording medium driving device including such an optical pickup device. The purpose is to do so.

[0020]

According to a first aspect of the present invention, there is provided an optical pickup device comprising: a first frame portion on which a light source for emitting light to an optical recording medium is attached; and a return light from the optical recording medium. And a second frame portion to which a light receiving element to be incident is attached, wherein the light source is attached to a first mounting portion that is less likely to be deformed than the first frame portion, and the light receiving element is more attached than the second frame portion. It is characterized by being attached to a second placement part where deformation is unlikely to occur, and wherein the first placement part and the second placement part are positioned and fixed.

In the optical pickup device of the first invention having such a configuration, the first frame portion and the second frame portion are changed due to an environmental change or the like.
Even in the case where the shape of the frame portion changes, the light source and the light receiving element are attached to the first mounting portion and the second mounting portion where deformation is unlikely to occur. Since the positioning and fixing are performed, a positional shift between the light source and the light receiving element hardly occurs.

Further, in the optical pickup device according to the first invention, the first mounting portion is electrically connected to the light source.
It is a wiring part.

Thus, the wiring part electrically connected to the light source can be effectively used.

Further, in the optical pickup device of the first invention, the second mounting portion is a second wiring portion electrically connected to the light receiving element.

Thus, the wiring portion electrically connected to the light receiving element can be effectively used.

Also, in the optical pickup device of the first invention, one of the first and second mounting portions extends toward the other mounting portion, and the other mounting portion extends. A contact portion for contacting the contact portion is formed.

Thus, the first mounting portion and the second mounting portion can be firmly positioned and fixed.

In the optical pickup device according to the first aspect of the invention, if the first frame portion and the second frame portion are not in contact with each other, the first and second frame portions are slightly changed in shape. However, the first and second frame portions do not contact each other, and are prevented from affecting the positional relationship between the first mounting portion and the second mounting portion.

Further, in the optical pickup device according to the first aspect of the present invention, even if the first frame portion and the second frame portion are partially in contact with each other, the positional shift between the light source and the light receiving element is maintained. Is suppressed.

According to a second aspect of the present invention, there is provided an optical pickup device, comprising: a light source for emitting light to the optical recording medium side; and a light receiving element for receiving feedback light from the optical recording medium. In an optical pickup device in which an element is mounted on a frame portion, an optical component disposed in an optical path between the light source and the light receiving element is provided with a mounting portion made of a material that is less likely to deform than the frame portion. And holding it on the frame part.

In the optical pickup device according to the second aspect of the present invention, even when the shape of the frame portion changes due to an environmental change or the like, the optical component is mounted on the mounting portion where deformation is unlikely. It is unlikely that a positional shift between the optical component and the other optical component mounted on the placement section will occur.

Further, in the optical pickup device of the second invention, the mounting portion is a wiring portion electrically connected to the light source or the light receiving element.

Thus, the wiring portion electrically connected to the light source or the light receiving element can be effectively used.

Further, in the optical pickup device of the second invention, the optical component is a block body on which a diffraction element for dividing light from a light source into a plurality of lights and / or a hologram element for diffracting the return light are formed. There is a feature.

In this case, the displacement between the diffraction element and / or the hologram element for diffracting the return light and other optical components such as the light source and the light receiving element is prevented.

Further, in the optical pickup device of the second invention, the optical component is a reflection mirror that reflects the return light toward the light receiving element.

In this case, displacement between the reflecting mirror and other optical components such as a light source and a light receiving element is prevented.

In the optical pickup device according to the second aspect of the present invention, if the frame and the optical component are not in contact with each other, the position of the optical component on the mounting portion can be maintained even if the shape of the frame changes. Is constant.

In the optical pickup device according to the second aspect of the present invention, even when the frame part and the optical part are partially in contact with each other, the optical part on the mounting part when the shape of the frame part changes is obtained. Is suppressed.

Further, in the first and second optical pickup devices, the first and second frame portions or the frame portion are made of a resin mold.

In this case, since the shape of the resin mold easily changes, the positioning and fixing according to the present invention is more effective.

In the optical pickup device according to the first and second aspects of the present invention, the first and second mounting portions or the mounting portion are made of a conductive metal.

In this case, since the shape of the conductive metal hardly changes, the position of the first and second mounting portions or the optical components on the mounting portions is stabilized.

An optical recording medium driving device according to the present invention is an optical recording medium driving device for reading information optically from an optical recording medium, wherein the optical recording medium is driven by a rotation driving section, and the optical recording medium is rotated. And an optical pickup device according to the first or second aspect of the present invention, which emits a light beam and inputs a return light beam from the optical recording medium.

In this case, since the position of the optical component in the optical pickup device is stable, recording and / or reproduction on the optical recording medium can be performed satisfactorily.

[0046]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1, FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, and FIG. 7 are views showing the configuration of an optical pickup device of a first embodiment which is an embodiment of the present invention. Is a perspective view, FIG.
3 is an exploded perspective view, FIG. 3 is a cross-sectional view, and FIG.
FIG. 5 is a plan view of the lower frame portion viewed from above, FIG. 6 is a plan view of the upper frame portion viewed from below, and FIG. 7 is a view of the upper frame portion viewed from the front. The same parts as those of the conventional optical pickup device shown in FIGS. 17 to 25 are denoted by the same reference numerals, and description thereof will be omitted.

In the optical pickup device of the first embodiment, cutouts 15, 15 opening upward are provided on both side surfaces of the lower frame portion 11A, respectively, so that the wiring portion (first mounting portion) is provided. The projections 13a, 13a of 13) project laterally through the notches 15, 15, as shown in FIG.

The wiring portion (second mounting portion) 14 attached to the upper frame portion 11B has first side portions extending on both sides of the lower frame portion 11B so as to penetrate the both side surfaces thereof. Parts 14a, 14a, and the wiring part 13
The second side portions 14b, 1 which are bent and extended toward
4b, and from the third side portions 14c, 14c, which are bent outward from the distal end thereof, from both sides (contact portions) 14
A and 14A are formed.

The third side portion 14c of both side portions 14A, 14A,
14c contacts the protruding portions 13a, 13a of the wiring portion 13,
Adhesive material such as UV resin or fusion material 16, 16 such as solder material
It is fixed by. The lower frame portion 11A and the upper frame portion 11B are fixed by this adhesive fixing, and the semiconductor laser element 5 and the photodiode 4 are positioned.
At this time, a gap 17 is provided between the upper end surface of the lower frame portion 11A and the lower end surface of the upper frame portion 11B, and they are not in contact with each other.

Semiconductor laser element 5 and photodiode 4
Is positioned on the third side portions 14c, 14c of the wiring portion 14.
Is mounted on the protruding portions 13a of the wiring portions 13 and 13, the upper frame portion 11B is finely moved on the lower frame portion 11A and the hologram element 7 is finely moved in the laser light emission direction. Positioning both while monitoring the signal detected by the diode 4,
The fixing is performed by the above-mentioned adhesive or the fusing material 16.

In the optical pickup device of the first embodiment, the lower frame portion 11A and the upper frame portion 11B are not in direct contact, and the semiconductor laser element 5 and the photodiode 4 are connected to the wiring portions 13 and 14. , The positional relationship between the two is determined. Therefore, even when the resin mold forming the lower frame portion 11A and the upper frame portion 11B expands or deforms due to temperature change or moisture absorption, the semiconductor laser element 5 and the It is possible to prevent a displacement from occurring with the diode 4. In addition, since the gap 17 exists between the lower frame portion 11A and the upper frame portion 11B, and both are in a non-contact state, even if the lower frame portion 11A and the upper frame portion 11B are slightly expanded, the two frame portions are not affected. Do not touch and affect each other. Further, in the optical pickup device having this configuration, the heat generated by the photodiode 4 is not
Since the heat is radiated to the outside through the elements 4 and 13, the life of the photodiode 4 is prolonged and the reliability is improved.

In the first embodiment, the wiring portion 13
The position of the semiconductor laser element 5 and the photodiode 4 is prevented from being shifted by fixing the positioning of the semiconductor laser device 5 and the photodiode 4.
A, provided on the upper frame 11B, the semiconductor laser element 5 and the photodiode 4 are mounted on this set of mounting portions,
The pair of mounting portions may be configured to be positioned and fixed.

Next, an optical pickup device according to a second embodiment of the present invention will be described.

FIGS. 8, 9, 10, 11, and 12 show the structure of the optical pickup device of the second embodiment. FIG. 8 is a perspective view, FIG. 9 is an exploded perspective view, and FIG. FIG. 11 is a cross-sectional view taken along a broken line BB ′ of FIG. 10, and FIG. 12 is a plan view of the lower frame portion as viewed from above, and is the same as that of the optical pickup device of the first embodiment. Are denoted by the same reference numerals, and description thereof is omitted.

In the optical pickup device of the second embodiment, a grating surface 6a of a three-divided diffraction grating is formed on one surface of the transparent block 18, and a hologram element is formed on the other surface of the transparent block 18. An element surface 7a is formed. Support portions 181 and 181 projecting from both sides are formed on the upper portion of the transparent block body 18. Support part 1
81 and 181 have convex parts 181a and 181a below.

As shown in FIG. 11, the transparent block body 18 has the one surface on which the lattice surface 6a is formed facing the semiconductor laser element 5 side.
The lower surfaces of 81a and 181a are brought into contact with the upper surface of the wiring portion 13, and are adhered and fixed on the lower frame portion 11A. At this time, a gap 19 is provided between the lower frame portion 11A and the transparent block body 18, and both are in a non-contact state. In addition, the wiring part 13 is a support part 18 of the transparent block body 18.
1, 181 has an extending portion 13b extending forward so that lower surfaces 181a, 181a of the 181 and 181 abut securely.

In the optical pickup device of the second embodiment, the transparent block body 18 is not in direct contact with the lower frame portion 11A, but is mounted on the wiring portion 13 and is positioned and fixed. Even when the resin mold forming the portion 11A expands or deforms due to temperature change, moisture absorption, or the like, the semiconductor laser device in which the grating surface 6a of the three-divided diffraction grating and the device surface 7a of the hologram device are mounted on the wiring portion 13 The occurrence of a positional shift with other optical components such as 5 is prevented.

Next, an optical pickup device according to a third embodiment of the present invention will be described.

FIG. 13 is a sectional view of a main part of an optical pickup device according to the third embodiment, in which the same parts as those in the first or second embodiment are denoted by the same reference numerals.

In the optical pickup device of the third embodiment, the wiring portion 13 provided on the upper surface of the lower frame portion 11A
Is a lower frame portion 11 to which the reflection mirror 12 is attached.
The reflective mirror 12 extends on the inclined surface of the upper surface A, on which the reflection mirror 12 is mounted and adhered and fixed to the lower frame portion 11A.

In the optical pickup device of the third embodiment, the reflection mirror 12 is not in direct contact with the lower frame portion 11A, but is mounted on the wiring portion 13, and the lower mirror portion is interposed with the wiring portion 13. The reflection mirror 12 is mounted on the wiring portion 13 even when the resin mold forming the lower frame portion 11A expands or deforms due to temperature change or moisture absorption. It is possible to prevent a positional deviation from occurring between the optical component and other optical components such as the transparent block 18.

In the above embodiment, the lower frame 11
A and the upper frame portion 11B, the lower frame portion 11A and the transparent block body 18, and the lower frame portion 11A and the reflection mirror 12 are in a non-contact state. Even if the parts are interposed to reduce the contact area with each other, there is an effect of preventing displacement.

For example, in the case of the second embodiment, the lower frame 11A and the transparent block 18 are in contact with each other, but as shown in FIG.
By contacting the lower surfaces of the support portions 181, 181, the contact area between the lower frame portion 11 </ b> A and the transparent block body 18 may be reduced.

In the case of the third embodiment, the lower frame 11
Even if A and the reflection mirror 12 are partially in contact with each other, FIG.
As shown in (1), the wiring area 13 may be interposed between the lower frame 11A and the reflection mirror 12 to reduce the contact area between them.

In the second and third embodiments, optical components such as the transparent block 18 and the reflection mirror 12 are connected to the wiring section 1.
3 is attached to the lower frame part 11A with the interposition of the mounting part, but the mounting part is attached to the lower frame part separately from the wiring part.
Optical components such as the transparent block body 18 and the reflection mirror 12 may be attached to the lower frame 11A with the mounting portion interposed.

Next, an optical recording medium driving device using the optical pickup device of the above embodiment will be described. FIG.
As shown in FIG. 6, the optical recording medium driving device 50 includes a motor 55 for driving the optical disc 1 to rotate,
Has a rotation control system 56 for controlling the operation of the control. An optical pickup device 40 is arranged on the lower surface side of the optical disk 1. The optical pickup device 40 includes a feed motor 5
1, the detection position is moved in the radial direction of the optical disk 1. The operation of the feed motor is controlled by a feed motor control system 5.
2 is controlled. Further, the optical pickup device 4
The operation of “0” is controlled by an optical pickup control system 53, and the detection signal from the optical pickup device 40 is controlled by a signal processing system 54. The operation of each processing system of the optical recording medium driving device 50 is controlled by a drive controller 57.

The optical recording medium driving device 50 is connected to a recording / reproducing device via a drive interface 58, and performs an information reproducing process or the like based on a detection signal.

In the optical recording medium driving device 50, between the semiconductor laser element 5 and the photodiode 4 in the optical pickup device, the grating surface 6 a of the three-divided diffraction grating, the element surface 7 a of the hologram element, or the reflection mirror 12 Since the occurrence of displacement between other optical components is prevented, a good laser beam is emitted from the optical pickup device 40, and the return beam reflected by the optical disk 1 is used as a photo-beam in the optical pickup device. Since the light enters the diode 4 well, good recording and / or reproduction can be performed.

[0070]

According to the present invention, a light source for emitting light toward an optical recording medium and a light receiving element for receiving return light from the optical recording medium even when environmental changes such as temperature and humidity occur. It is possible to provide an optical pickup device that prevents a shift in the positional relationship between the optical recording media and contributes to excellent recording and / or reproduction on an optical recording medium.

Further, according to the present invention, even if environmental changes such as temperature and humidity occur, it is possible to prevent a positional relationship between optical components disposed in an optical path between a light source and a light receiving element from being shifted. In addition, it is possible to provide an optical pickup device that contributes to excellent recording and / or reproduction on an optical recording medium.

Further, according to the present invention, it is possible to prevent the occurrence of positional deviation between optical components in the optical pickup device, and to perform optical recording capable of performing good recording and / or reproduction on an optical recording medium. A media drive may be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of an optical pickup device according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of the optical pickup device according to the first embodiment of the present invention.

FIG. 3 is a side sectional view of the optical pickup device according to the first embodiment of the present invention.

FIG. 4 is a longitudinal sectional view of the optical pickup device according to the first embodiment of the present invention.

FIG. 5 is a plan view of the lower frame portion of the optical pickup device according to the first embodiment of the present invention as viewed from above.

FIG. 6 is a plan view of the upper frame portion of the optical pickup device according to the first embodiment of the present invention as viewed from below.

FIG. 7 is a view of the upper frame portion of the optical pickup device according to the first embodiment of the present invention as viewed from the front.

FIG. 8 is a perspective view of an optical pickup device according to a second embodiment of the present invention.

FIG. 9 is an exploded perspective view of an optical pickup device according to a second embodiment of the present invention.

FIG. 10 is a side sectional view of an optical pickup device according to a second embodiment of the present invention.

FIG. 11 is a longitudinal sectional view of an optical pickup device according to a second embodiment of the present invention.

FIG. 12 is a plan view of a lower frame portion of an optical pickup device according to a second embodiment of the present invention as viewed from above.

FIG. 13 is a side sectional view of an optical pickup device according to a third embodiment of the present invention.

FIG. 14 is a side sectional view of an optical pickup device having another configuration according to the second embodiment of the present invention.

FIG. 15 is a side sectional view of an optical pickup device having another configuration according to the third embodiment of the present invention.

FIG. 16 is a block diagram showing a configuration of an optical recording medium driving device using the optical pickup device of the present invention.

FIG. 17 is a perspective view of a conventional optical pickup device.

FIG. 18 is an exploded perspective view of a conventional optical pickup device.

FIG. 19 is a side sectional view of a conventional optical pickup device.

FIG. 20 is a side sectional view of a conventional optical pickup device.

FIG. 21 is a longitudinal sectional view of a conventional optical pickup device.

FIG. 22 is a longitudinal sectional view of a conventional optical pickup device.

FIG. 23 is a plan view of a lower frame portion of a conventional optical pickup device as viewed from above.

FIG. 24 is a plan view of an upper frame portion of a conventional optical pickup device viewed from below.

FIG. 25 is a front view of an upper frame portion of a conventional optical pickup device.

[Description of sign]

 DESCRIPTION OF SYMBOLS 1 Optical disk (optical recording medium) 4 Photodiode (light receiving element) 5 Semiconductor laser element (light source) 6a Element surface of three-segment diffraction grating 7a Element surface of hologram 11A Lower frame part (first frame part) 11B Upper frame part (first element) 2 frame part) 12 reflective mirror 13 wiring part (first mounting part) 14 wiring part (second mounting part) 18 transparent block body

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Soken Goto 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuaki Inoue 2-chome Keihanhondori, Moriguchi-shi, Osaka No. 5-5 Sanyo Electric Co., Ltd. (72) Inventor Masayuki Shono 2-5-5 Sanyo Electric Co., Ltd. (72) Inventor Akira Ibaraki Keihanhondori, Moriguchi, Osaka 2-5-5 Sanyo Electric Co., Ltd. F term (reference) 5D117 AA02 HH01 HH10 HH12 5D119 AA36 BA01 CA09 FA33 FA35 JA14 JA22 JA57 KA32 KA41 KA43 LB04 LB06

Claims (15)

[Claims] A first frame portion provided with a light source for emitting light to an optical recording medium; and a second frame portion provided with a light receiving element for receiving feedback light from the optical recording medium. The light source is mounted on a first mounting portion that is less likely to deform than the first frame portion, and the light receiving element is mounted on a second mounting portion that is less likely to deform than the second frame portion. An optical pickup device, wherein a mounting portion and the second mounting portion are positioned and fixed. 2. The optical pickup device according to claim 1, wherein the first mounting portion is a first wiring portion electrically connected to the light source. 3. The device according to claim 1, wherein the second mounting portion is a second wiring portion electrically connected to the light receiving element.
Or the optical pickup device according to 2. 4. A contact portion extending to one of the first and second placing portions toward the other placing portion and contacting the other placing portion. The optical pickup device according to claim 1, 2 or 3, wherein: 5. The device according to claim 1, wherein the first frame portion and the second frame portion are in a non-contact state.
The optical pickup device according to 2, 3, or 4. 6. The optical pickup device according to claim 1, wherein the first frame portion and the second frame portion are partially in contact with each other. 7. A light source for emitting light to an optical recording medium side;
A light receiving element for receiving return light from the optical recording medium, wherein the light source or the light receiving element is mounted on a frame portion, and is disposed in an optical path between the light source and the light receiving element. An optical pickup device, wherein an optical component to be formed is held on the frame portion with a mounting portion made of a material that is less likely to deform than the frame portion. 8. The optical pickup device according to claim 7, wherein the mounting portion is a wiring portion electrically connected to the light source or the light receiving element. 9. The optical device according to claim 7, wherein the optical component is a block formed with a diffraction element for dividing light from a light source into a plurality of lights and / or a hologram element for diffracting the return light. 9. The optical pickup device according to 8. 10. The optical pickup device according to claim 7, wherein the optical component is a reflection mirror that reflects the return light toward the light receiving element. 11. The optical pickup device according to claim 7, wherein said frame portion and said optical component are in a non-contact state. 12. The optical system according to claim 7, wherein the frame part and the optical component are partially in contact with each other.
Or the optical pickup device according to 10. 13. The method according to claim 1, wherein the first and second frame portions or the frame portion is made of a resin mold. Or the optical pickup device according to 12. 14. The device according to claim 1, wherein the first and second mounting portions or the mounting portion are made of a conductive metal.
The optical pickup device according to 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, or 13. 15. An optical recording medium driving device for optically reading information from an optical recording medium, comprising: a rotation drive section for rotating the optical recording medium; and a light beam emitted to the optical recording medium; 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 1
An optical recording medium driving device, comprising: the optical pickup device according to 1, 12, 13, or 14.