JP2000135668A - Wafer end part processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To process the end part of a wafer by a simplified device. SOLUTION: This device is provided with a table 2 to rotate by sucking and holding a wafer 3; a unit holding member 6 provided at the upper side of the table 2; a linear shaft 11 provided movable up and down to the unit holding member 6; a pad holder 14 provided at the lower end of the linear shaft 11 through a spherical bearing 13; a ring form pad 20 fixed to the pad holder 14 corresponding to the end of the wafer 3; a cylinder 31 provided to the unit holding member 6, to press the pad holder 14, and a specific pressure to press the wafer 3 by the pad 20 is applied; and a cylinder 33 to feed a slurry on the wafer 3 at the inner side of the pad 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a processing apparatus for polishing and cleaning a wafer edge.

[0002]

2. Description of the Related Art An abnormal pattern is apt to occur at the edge of a wafer due to a shift in exposure during patterning. This abnormal pattern is likely to fall off during a post-process and become a foreign substance. In addition, the abnormal pattern may fall off due to chucking or the like in a later process. The dropped foreign matter may adhere to a clean pattern portion. Therefore, a range of about 3 mm from the edge of the wafer is cleaned for each process.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer edge processing apparatus capable of performing a wafer edge processing with a simplified apparatus.

[0004]

According to a first aspect of the present invention, there is provided a table for rotating a table by holding a wafer by suction, a unit holding member disposed above the table, and A linear shaft provided vertically movable via a bearing in the center of the unit holding member, a pad holder provided via a spherical bearing at a lower end of the linear shaft, and a pad holder corresponding to an end of the wafer. A ring-shaped pad fixed to a pad holder, a cylinder provided on the unit holding member, pressing the pad holder, and pressing a constant pressure at which the pad presses the wafer, and a cylinder on the wafer inside the pad. And a syringe for supplying the slurry.

A second means of the present invention for solving the above-mentioned problems is that, in the above-mentioned first means, a drainage liquid inclined on the lower surface of the pad from the outer periphery to the inner periphery in the rotation direction of the table is provided. It is characterized in that a groove is formed.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, a table 2 is provided at the upper end of a rotating shaft 1 rotated by a motor (not shown).
Is fixed, and a suction hole 1a for vacuum suction from a vacuum source (not shown) is provided in the center of the rotating shaft 1 and the table 2.
2a is formed. The outer periphery of the upper surface of the table 2 is a ring portion 2b, and the wafer 3 is placed in the ring portion 2b. A ring-shaped groove 2c is formed on the upper surface of the table 2, and one end of a pipe 4 is connected so as to communicate with the ring-shaped groove 2c. The other end of the pipe 4 has an inlet for injecting water as needed. 4a.

Above the table 2, there is provided a disk-shaped unit holding member 6 which is positioned and fixed to the fixing portion 5 of the apparatus. The outer periphery of the unit holding member 6 is positioned in the radial direction by the inner periphery 5 a of the fixing portion 5. In order to position the rotation direction of the unit holding member 6, the fixing portion 5
Is formed with a positioning hole 5b, and a positioning pin 7 inserted into the positioning hole 5b is fixed to the unit holding member 6. Unit holding member 6 placed on fixing portion 5
Is fixed to the fixing portion 5 by tightening the holding claw 8 with the bolt 9. Although one holding claw 8 is shown in the figure, three holding claws 8 are provided on the fixed portion 5 at equal intervals.

The unit holding member 6 has a bearing 6 at the center.
a is formed, and the bearing 10 is fixed to the bearing portion 6a. A linear shaft 11 is provided on the bearing 10 so as to be vertically movable, and a stopper 12 is fixed above the linear shaft 11. A ball-mounted shaft 13a of a spherical bearing 13 is fixed to a lower end of the linear shaft 11, and a pad holder 14 is attached to an outer ring 13b of the spherical bearing 13.
Has been fixed.

On the lower surface of the pad holder 14, a ring-shaped protrusion 14a is
Are formed, and a urethane pad 20 shown in FIG. 2 is fixed to the outside of the ring-shaped projection 14a. Pad 20
Is composed of a lower pad 21 having high hardness and an upper pad 21 having flexibility. The lower pad 21 is formed with a drain groove 21a. The drain groove 21a is formed to be inclined in the rotation direction 23 of the table 2 from the outer periphery to the inner periphery.

The pad holder 14 has a hole 14 for preventing rotation.
b is formed, and a detent pin 30 fixed to the unit holding member 6 is loosely fitted in the detent hole 14b. The unit holding member 6 includes a pad holder 14.
Three air cylinders 31 are fixed at equal intervals corresponding to the outer peripheral upper surface of the air cylinder 31, and a pressing pin 32 is fixed to an operating rod of the air cylinder 31. Pad holder 14
Is formed with a slurry dropping hole 14c inside the ring-shaped projection 14a. A syringe 33 is fixed to the unit holding member 6 corresponding to the slurry dropping hole 14c, and a needle 34 with a check valve is fixed to the syringe 33. In addition, 35 shows a handle.

Next, the operation will be described. With the unit holding member 6 removed, the wafer 3 is placed on the table 2.
Is placed. When the vacuum to the suction holes 1a and 2a is turned on, the wafer 3 is suction-held on the table 2.
Next, the positioning pins 7 are inserted in alignment with the positioning holes 5 b of the fixing portion 5, and the unit holding member 6 is placed on the fixing portion 5. As a result, the pad 20 provided on the pad holder 14 is placed on the edge of the wafer 3. Next, the holding claws 8 are tightened with bolts 9 to fix the unit holding member 6 to the fixing portion 5.

Next, air is supplied to the air cylinder 31, and the pressing pin 32 descends to press the pad holder 14, and the pad 20 presses the wafer 3 at a constant pressure. Subsequently, the rotating shaft 1 rotates, and the wafer 3 rotates together with the table 2. Here, the pad holder 14 is pressurized by three air cylinders 31, and the pad holder 14 is supported by the spherical bearings 13 so as to float. Constant pressure is always applied.

At the same time, a certain amount of slurry in the syringe 33 is periodically dropped on the wafer 3 from the needle 34 with a check valve through the slurry dropping hole 14c. When a polishing liquid is used as the slurry, the pattern at the end of the wafer 3 is polished and removed by the pad 20. In the case where pure water is used as the slurry, foreign matter at the end of the wafer 3 is removed. The slurry dropped on the wafer 3 inside the pad 20 is discharged to the outside through the drain groove 21 a of the pad 20 by the rotation of the wafer 3.

After the end processing, the air supply to the air cylinder 31 is turned off, the pressing pin 32 rises, and the rotation of the rotary shaft 1 stops. Then, the bolt 9 is loosened to release the holding claw 8, and the handle 35 is lifted to remove the unit holding member 6 from the apparatus. Next, pipe 4
Is supplied to the ring-shaped groove 2 c of the table 2. Thereby, the state of close contact of the wafer 3 with the table 2 is reduced, and the wafer 3 is easily removed. When the wafer 3 is removed from the table 2, a series of steps is completed.

[0015]

According to the present invention, a table which rotates while sucking and holding a wafer, a unit holding member disposed above the table, and a vertically movable center of the unit holding member via a bearing. A linear shaft, a pad holder provided at the lower end of the linear shaft via a spherical bearing, a ring-shaped pad fixed to the pad holder corresponding to an end of the wafer, and the unit Provided on a holding member, the pad presses the pad holder, the pad is configured to include a cylinder that presses a constant pressure that presses a wafer and a syringe that supplies a slurry onto the wafer inside the pad, Wafer edge processing can be performed with a simplified apparatus.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a wafer edge processing apparatus according to the present invention.

FIGS. 2A and 2B show a pad, wherein FIG. 2A is a bottom view and FIG.

[Explanation of symbols]

 2 Table 3 Wafer 6 Unit holding member 10 Bearing 11 Linear shaft 13 Spherical bearing 14 Pad holder 20 Pad 21a Drainage groove 31 Air cylinder 33 Syringe

Claims (2)

[Claims] 1. A table which rotates by sucking and holding a wafer, a unit holding member disposed above the table, and a linear shaft which is vertically movable via a bearing at the center of the unit holding member. A pad holder provided at the lower end of the linear shaft via a spherical bearing, a ring-shaped pad fixed to the pad holder corresponding to the end of the wafer, and provided on the unit holding member, A wafer edge processing apparatus, comprising: a cylinder that presses the pad holder and pressurizes a constant pressure at which the pad presses a wafer; and a syringe that supplies slurry onto the wafer inside the pad. 2. The wafer edge processing apparatus according to claim 1, wherein a drain groove is formed on a lower surface of the pad, the drain groove being inclined in a rotation direction of the table from an outer periphery to an inner periphery. .