JP2000133331A - Conductor connecting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce an oxidation film area and increase a contact area in a simple work, by exposing and press fitting a metal piece arranged between facing surfaces of a first metal plate connected with a first conductor for power transmission and a second metal plate installed facing this and connected with a second conductor by pressing one or both of the metal plates. SOLUTION: A wire-shaped or particle-shaped metal piece 5 arranged between facing surfaces of first and second metal plates 2, 4 that are respectively connected with first and second conductors 1, 3 and serve as terminal portions is crushed by pressing to break an oxide film, and is connected with an un-oxidized metal piece 5a. As the metal piece 5, a flexible metal such as Ag or In is used to facilitate break of the oxide film and increase a contact area, and preferably the metal piece is press fitted by bolting to increase the contact area and facilitate the work. The press fitting is performed after removal of the oxide films on the surfaces of the first and second metal plates 2, 4 and the metal piece 5, the press fitting is useful in vacuum or non-oxidizing gas, and therefore, low resistant connection is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a conductor connection method in power transmission.

[0002]

2. Description of the Related Art When power is transmitted, a connection point always occurs between a device for supplying power and a device for receiving power. When power is transmitted from an electric device such as a power supply, the power supplied from the power supply is transmitted using a cable, and the power is connected to the cable from the power receiving device side or the device. In these connections, both conductors are subjected to terminal treatment using a metal plate such as copper, and the metal plates are connected to each other by a method such as soldering or bolting to perform electrical connection.

[0003]

According to the conventional conductor connection method, the connection of a large-sized metal plate requires soldering.
Heating by a burner or the like is necessary, but there is a problem that it cannot be used in a hydrogen tank having a possibility of explosion in the vicinity or a volatile material manufacturing apparatus having a possibility of easily igniting or igniting.

In addition, when a current of several KA or more is applied by simple bolting, the contact area between metal plates becomes a problem.
If the contact area is small, the contact resistance increases and there is a possibility of abnormal heat generation. Therefore, it is necessary to process the metal plate surface with high precision.

[0005] Even when the contact area is large, the connection resistance may be increased in a structure in which an oxide film causing resistance is formed on the metal surface. Currently, a method of securing a contact area by using a soft metal sheet such as indium between metal plates is also adopted, but indium is easily oxidized, so simply sandwiching the sheet leaves an oxide film,
There is a problem that connection resistance increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. In a method for connecting conductors, a conductor of a low-resistance terminal having a relatively small oxide film area and a large contact area by a simple operation is provided. To provide a connection method.

[0007]

According to a first aspect of the present invention, in a conductor connection method for connecting a first conductor and a second conductor in power transmission, a first metal plate is connected to the first conductor. Connecting a second metal plate to the second conductor,
And a second metal plate are opposed to each other, a metal piece is arranged between the opposed surfaces, and pressure is applied to one or both of the first and second metal plates to place the metal piece on the opposed surface. And the first and second metal plates are brought into contact with each other and pressure-bonded.

According to the invention corresponding to claim 1, in the first and second conductor connection methods in power transmission, a wire-shaped or granular metal piece is arranged between the first and second metal plates, The first and second metal surfaces, which are not oxidized, are more exposed on the joint surface by being pressed.
Between the metal plate surfaces. The oxide film formed on the surface is broken by the pressure-bonding of the metal pieces, so that a large non-oxidized contact area can be secured on the contact surface, and a low-resistance inter-conductor connection can be supplied. Also, compared to the soldering work, the work is performed only by crimping, and the work can be performed with a relatively simple work.

The invention according to claim 2 is characterized in that the metal piece is made of a flexible metal such as indium and silver. Next, according to the invention corresponding to claim 2, in the connection between the first and second metal plates, a flexible metal piece such as indium or silver is used for the metal piece, so that the oxide film formed on the surface of the metal piece is removed. By pressure bonding, the oxide film on the surface can be easily broken, and a larger contact area can be secured on the contact surface.

A third aspect of the present invention is characterized in that the surface of the first and second metal plates and / or the metal pieces is subjected to pressure bonding after removing an oxide film. Next, according to the invention corresponding to claim 3, the surface of the first and second metal plates and / or metal pieces is subjected to pressure bonding after removing an oxide film, so that the surface is not oxidized. With this, the metal plate and the metal piece can be joined, and a lower resistance connection between conductors can be supplied.

In order to improve the press-bonding property of the first and second metal plates and the metal piece joint, the press-bonding surfaces of the first and second metal plates are formed into a multi-planar or curved surface. Force can be reduced, and the contact area can be increased. In addition, the work can be performed by a relatively simple operation as compared with a pressing operation of one plane and one plane.

The invention according to a fourth aspect is characterized in that the means for crimping the first and second metal plates and the metal pieces is by bolting. According to the invention corresponding to claim 4, since the first and second metal plates and the metal pieces are bolted as a method of crimping the metal pieces, the contact area can be further increased. In addition, it is a relatively simple operation compared to soldering,
In addition, work can be performed in an area where fire cannot be used.

A fifth aspect of the present invention is characterized in that after the metal piece is pressed, the metal piece is pressed in a non-oxidizing gas such as a vacuum or an argon atmosphere. According to the invention corresponding to claim 5, in the connection between the first and second metal plates, the crimping portion is performed in a non-oxidizing gas such as a vacuum or an argon atmosphere. This can provide a lower resistance inter-conductor connection.

According to a sixth aspect of the present invention, an antioxidant coating layer is formed by applying an antioxidant coating to the gap and / or the surface of the first and second metal plates after the metal pieces are pressed. And

According to the invention corresponding to claim 6, in the connection between the first and second metal plates, after the metal plate is pressed,
Since the antioxidant coating is performed on the surface of the connection portion and / or the gap, both surfaces are not oxidized after the coating, so that the oxidation can be prevented from progressing.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a conductor connecting method according to the present invention will be described with reference to FIGS. 1 (a) to 1 (c). That is, in the present embodiment, as shown in FIG. 1A, a first metal plate 2 serving as a terminal portion is connected to a first conductor 1 for power transmission. Similarly, a second metal plate 4 serving as a terminal portion is connected to the second conductor 3. The first metal plate 2 and the second metal plate 4 are opposed to each other, and a wire-shaped or grain-shaped metal piece 5 is arranged on the opposed surface. As shown in FIG. Pressure is applied to the metal plates 2 and 4 by pressure.

As shown in FIG. 1 (c), the first
The metal piece 5 between the second metal plate 2 and the second metal plate 4 is crushed, the oxide film is broken, and the metal piece 5a and the first metal plate 2 are not oxidized.
And the second metal plate 4 are connected.

According to this embodiment, the contact area between the non-oxidized metal piece 5a and the non-oxidized surfaces between the first and second metal plates 2 and 4 can be made sufficiently large.
For currents of several kA or more, the current density can provide low-resistance connections similar to conductors.
It requires only crimping, and can be performed with relatively simple work.

Next, a second embodiment of the conductor connection method according to the present invention will be described with reference to FIGS. 2 (a) to 2 (c). 2A to 2C, the same parts as those in FIGS. 1A to 1C are denoted by the same reference numerals, and the description of the overlapping parts will be omitted.

This embodiment is different from the first embodiment in that a flexible metal piece 6 such as indium or silver is arranged between a first metal plate 2 and a second metal plate 4.
As shown in FIG. 2B, the first and second metal plates 2,
4. Pressure is applied to one or both of 4 and pressure bonding.

According to the present embodiment, the oxide film of the flexible metal piece 6 between the first metal plate 2 and the second metal plate 4 is easily broken by pressure bonding, and the crushed metal piece 6a A sufficiently large contact area on the less oxidized surface between the first and second metal plates 2 and 4 can be provided, and a low-resistance connection can be provided.

Next, a third embodiment of the conductor connection method according to the present invention will be described with reference to FIGS. 3 (a) to 3 (c). FIG.
1 (a) to 1 (c), the same reference numerals are given to the same parts, and the description of the overlapping parts will be omitted.

This embodiment is different from the first embodiment in that the first metal plate 2 and the second metal plate 4 or the metal piece 5
Alternatively, an oxide film is removed from both surfaces to form an oxide film-removed surface 7, and a metal piece 5 having the oxide film-removed surface 7 is arranged on the oxide film-removed surface 7 and then pressure-bonded. It is in.

According to the present embodiment, the metal pieces 5a crushed by applying pressure to the first and second metal plates 2 and 4 in a non-oxidized state can be more exposed on the bonding surface. As a result, a large contact area can be ensured and a lower resistance inter-conductor connection can be supplied.

FIGS. 4 (a) and 4 (b) show other examples of the metal plates 2 and 4 in the first to third embodiments shown in FIGS. 1 to 3. FIG. That is, while the first and second metal plates 2 and 4 in the first to third embodiments are formed of rectangular flat plates, in FIG.
4 (b), and is formed on a curved metal plate 9 in FIG.

As described above, by forming the crimping surfaces of the metal plates 8 and 9 not on one plane but on multiple planes or curved surfaces,
When the metal plates 8 and 9 are crimped, the crimpability of the metal pieces can be further improved, the force for crimping can be reduced, and the contact area can be increased. In addition, the work can be performed by a relatively simple operation as compared with a pressing operation of one plane and one plane.

Next, a fourth embodiment of the conductor connection method according to the present invention will be described with reference to FIGS. 5 (a) to 5 (c). FIG.
1 (a) to 1 (c), the same parts as those in FIGS. 1 (a) to 1 (c) are denoted by the same reference numerals and the description of the overlapping parts will be omitted.

The present embodiment is different from the first embodiment in that the first and second metal pieces 2 and 4 and the metal piece 5 are crimped by bolts 10 and nuts 11 to perform compression bonding. 5 is crimped. In addition, pressure bonding is performed on average by considering the number of metal pieces 5 and bolts 10.

According to the present embodiment, the contact area can be further increased. Further, the operation is relatively simple compared to the soldering operation, and the operation can be performed even in an area where fire cannot be used.

Next, a fifth embodiment of the conductor connection method according to the present invention will be described with reference to FIGS. 6 (a) and 6 (b). This embodiment is different from the first embodiment in that first and second
A metal piece 5 is arranged between the metal plates 2 and 4 and pressed. By crushing the metal piece 5 between the first and second metal plates 2 and 4 by crimping, the oxide film of the metal piece 5 is broken and connected.

Thereafter, the connection case 12 is placed over the connection portion having the crushed metal piece 5b having no oxide film, and the case 12 is provided with a non-oxidizing gas such as argon (Ar) as a non-oxidizing gas.
Gas 23 is sealed. According to the present embodiment, the first and second metal plate contact surfaces are not oxidized after the pressure bonding, so that the progress of oxidation can be prevented.

Next, a sixth embodiment of the conductor connection method according to the present invention will be described with reference to FIGS. 7 (a) to 7 (c). This embodiment is different from the first embodiment in that first and second
A metal piece 5 is disposed between the metal plates 2 and 4 of the first and second metal plates.
Pressure is applied to the metal plates 2 and 4 for mounting. By crushing the metal piece 5 between the first metal plate 2 and the second metal plate 4 by crimping, the oxide film of the metal piece 5 is broken and connected.

Thereafter, as shown in FIGS. 7B and 7C, an antioxidant coating is applied to the surface to form an antioxidant coating layer 14. According to the present embodiment, the oxidation can be prevented from progressing without oxidizing the contact surface between the first and second metal plates 2 and 4 and the crushed metal piece 5a after painting.

[0034]

According to the present invention, it is possible to provide a method for connecting a conductor of a low-resistance metal plate terminal with a simple operation, a simple process and a large non-oxidized contact area.

[Brief description of the drawings]

1A is a side view showing a state before construction in a first embodiment of a conductor connection method according to the present invention, FIG. 1B is a side view showing a state crimped from the state of FIG. (C) is a side view which expands and shows the principal part of (b).

FIG. 2 (a) is a side view showing a state before construction according to a second embodiment of the conductor connection method according to the present invention, FIG. 2 (b) is a side view showing a state crimped from the state of FIG. (C) is a side view which expands and shows the principal part of (b).

FIG. 3 (a) is a side view showing a state before construction in a third embodiment of the conductor connection method according to the present invention, FIG. 3 (b) is a side view showing a state crimped from the state of FIG. 3 (a), (C) is a side view which expands and shows the principal part of (b).

FIG. 4A is a perspective view showing another example of the metal plate connected to the conductor in FIGS. 1 to 3, and FIG. 4B is a perspective view showing still another example of FIG.

FIG. 5A is a side view showing a state before construction in a fourth embodiment of the conductor connection method according to the present invention, and FIG. 5B shows a state in which the conductor is crimped from the state of FIG. The side view, (c) is a side view which expands and shows the principal part of (b).

FIG. 6 (a) is a side view showing a state before construction in a fifth embodiment of the conductor connection method according to the present invention, and FIG. 6 (b) shows a crimped state in an argon gas atmosphere from the state of FIG. The side view shown by a partial cross section.

FIG. 7A is a side view showing a state before construction according to a sixth embodiment of the conductor connection method according to the present invention, FIG. 7B is a side view showing a state crimped from the state of FIG. (C) is a side view which expands and shows the principal part of (b).

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... 1st conductor, 2 ... 1st metal plate, 3 ... 2nd conductor,
Reference numeral 4: second metal plate, 5, 5a: metal piece, 6: flexible metal piece, 7: oxide film-removed surface, 8: L-shaped metal plate, 9: curved metal plate, 10: bolt, 11 ... Nut, 12… Enclosed case, 13
... Argon gas, 14 ... Antioxidant coating layer.

Claims (6)

[Claims] In a conductor connection method for connecting a first conductor and a second conductor in power transmission, a first metal plate is connected to the first conductor, and a second metal is connected to the second conductor. Connecting the plates, the first and second metal plates are opposed to each other, a metal piece is arranged between the opposed surfaces, and pressure is applied to one or both of the first and second metal plates. A method of connecting a conductor, comprising: exposing the metal piece on the facing surface; and bringing the surfaces of the first and second metal plates into contact with each other and crimping. 2. The conductor connecting method according to claim 1, wherein said metal piece is made of a flexible metal such as indium or silver. 3. The conductor connection method according to claim 1, wherein the surface of the first and second metal plates and / or the metal pieces is subjected to pressure bonding after removing an oxide film. 4. The conductor connecting method according to claim 1, wherein the means for crimping the first and second metal plates and the metal pieces is by bolting. 5. The conductor connecting method according to claim 1, wherein the pressing is performed in a non-oxidizing gas such as a vacuum or an argon atmosphere after the metal pieces are pressed. 6. An antioxidant coating layer is formed by applying an antioxidant coating to a gap and / or a surface of the first and second metal plates after the metal pieces are pressed. The conductor connection method described in the above.