JP2000126748A - Method and apparatus for organic matter separation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To peel off and separate rubber from a rubber-metal bonded body such as rubber roll or the like by heating an organic matter-metal bonded body constituted of an organic matter and a metal bonded to each other by high frequency heating, splitting the organic matter so as to separate the organic matter from the metal. SOLUTION: In a rubber roll 1 as an organic matter-metal bonded body, a metal core 3 as a metal having an outer surface coated with a rubber 2 as an organic matter is heated by high frequency heating in each of induction heating furnaces 6A-6C. The rubber 2 and an adhesive layer 4, that are insulator, do not generate heat, and only metal core 3 as a conductor is heated by eddy currents. The adhesive layer 4 between the rubber 2 and the metal core 3 is thermally decomposed by this heat so that an adhesive force is temporarily weakened and the rubber 2 is easily separated from the metal core 3. When the high frequency heating is employed, the rubber 2 itself does not generate heat and physical properties are not changed so that the separated rubber 2 can be recycled for a wide range of applications.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic material peeling method for peeling an organic material from a metal, wherein the organic material and the metal are adhered and integrated, and an organic material peeling apparatus, particularly rubber such as a rubber roll, a rubber caterpillar, and a rubber solid. TECHNICAL FIELD The present invention relates to a rubber peeling method for peeling a coated rubber of a product in which a product and a metal are bonded and integrated, and a rubber peeling device.

[0002]

2. Description of the Related Art A rubber cylinder built in various OA equipments and the like is formed by integrating a hollow cylinder made of silicone rubber by being adhered around a metal core. In this bonding, since the metal is subjected to a primer treatment in advance and the two are firmly combined by a chemical bond, it is extremely difficult to peel off the silicone rubber layer by physical force.

[0003] Since silicone rubber is nonflammable, it cannot be incinerated. For this reason, some of the defective products are processed by manual and mechanical separation methods with much cost and labor, and most of the used rubber rolls and defective products collected from waste equipment are industrial waste. It has been disposed of as landfill.

The situation is the same for rubber tracks, solid wheels, and the like, and most of these used products are landfilled without being reused.

[0005]

However, with the increase in the number of OA equipment manufactured and the shortening of the service life thereof,
Defective and used rubber rolls are produced in large quantities, making it difficult to secure landfill sites.

On the other hand, the silicone rubber used for the rubber roll is a high-quality synthetic rubber with high added value.
It is desired to reuse such defective products or used products. For this reason, means for easily peeling the rubber layer from the rubber roll has been desired. Further, if the silicone rubber can be easily and completely removed, the metal core can be reused.

[0007] Further, regarding the rubber caterpillars, solid wheels, etc., if the deteriorated rubber can be removed,
The metal body can be reused.

The present invention has been made in view of the above circumstances, and has as its object to provide a method for separating rubber from a rubber-metal adhesive such as a rubber roll and separating the two, and an apparatus therefor. I have.

[0009]

In order to achieve the above object, an organic substance stripping method according to the present invention according to claim 1 is characterized in that an organic substance / metal bonded body in which an organic substance and a metal are bonded to each other is heated by high frequency, The organic material is cleaved, and the organic material is separated from the metal.

With this configuration, the organic / metal bonded body can be heated at a high frequency, and the temperature of the metal can be increased by this heating, so that the temperature of the organic substance cannot be substantially increased. And by the temperature rise of this metal,
Raises the temperature of the thin film layer in contact with the interface between the organic substance and the metal, causing a state change (softening, melting, thermal decomposition, etc.) in the thin film layer, and temporarily eliminating or weakening the adhesive force of the thin film layer. be able to. Then, when the organic substance is cleaved, the resistance to peeling of the organic substance from the metal is reduced, so that the organic substance can be easily peeled from the metal.

According to a second aspect of the present invention, there is provided the organic substance removing method according to the first aspect, wherein the organic substance is an elastic body having elasticity.

With this configuration, since the organic substance is an elastic substance, when the organic substance is stretched and adhered to the metal, the organic substance is balanced with the stretching force and the restoring force against the organic substance. Is bonded to the metal. When the organic material is cleaved, the stretching force is released, the restoring force assists the cleavage, and the restoring force overcomes the adhesive force of the thin film layer between the organic material and the metal, and the organic material peels off from the metal.

According to a third aspect of the present invention, in the method of removing an organic substance according to the first or second aspect, the bonding is performed by an adhesive.

With this configuration, an adhesive is applied to the surface of the metal that comes into contact with the organic substance, and the organic substance is bonded to the metal. Thus, an adhesive layer is formed between the organic substance and the metal by the adhesive,
The bonding of the organic matter to the metal is more reliably performed. In this case, high-frequency heating is performed so that the adhesive strength of the adhesive layer to metal temporarily disappears or is weakened. When the organic material is cleaved, the adhesive layer may also be cleaved.

In order to achieve the above object, a rubber peeling apparatus according to the present invention, as shown in FIG. 3, comprises an induction furnace (6A-C) through which a high-frequency current flows, an organic substance (2) and a metal (3). And cleaving means (5) for cleaving the organic matter (2) of the organic matter-metal bonded body (1), which is adhered to each other;
A moving means (7A, B) for moving the organic / metal bonded body (1) relative to the induction furnaces (6A-C) in the induction furnaces (6A-C) is provided.

With this configuration, when a high-frequency current is passed through the induction furnace, a high frequency is generated in the furnace, and the organic matter / metal bonded body is moved relative to the induction furnace in the induction furnace by the moving means. -High frequency heating of the metal part of the metal bonded body. By this heating, the temperature of the metal part increases, and the temperature of the organic matter does not substantially increase. By increasing the temperature of the metal part, the temperature of the thin film layer in contact with the bonding interface between the organic substance and the metal is increased, causing a change in the state of the thin film layer.
Temporarily eliminate or weaken the adhesive force of the thin film layer. In addition, as the moving means moves, the organic substance is cleaved by the opening means, and the organic substance can be easily separated from the metal part.

According to a fifth aspect of the present invention, there is provided the organic material peeling device according to the fourth aspect, wherein the organic material is an elastic body having elasticity.

According to a sixth aspect of the present invention, in the organic material peeling device according to the fourth or fifth aspect, the bonding is performed by an adhesive.

According to a seventh aspect of the present invention, in the organic material removing apparatus according to any one of the fourth to sixth aspects, the moving means performs the relative movement at a constant speed. It is characterized by having such a configuration.

Since the organic / metal bonded body is moved at a constant speed relative to the induction furnace in the induction furnace, the load on the cleavage means is constant, and the organic substance can be reliably cleaved. .

[0021]

Embodiments of the present invention will be described below with reference to the drawings.

The rubber peeling method as the organic matter peeling method according to the present invention is, for example, as shown in FIG. 1 as a cross-sectional view of a rubber roll (1) as an organic / metal adhesive body of the present invention.
One of the features is that a metal core (3) as a metal of the present invention, whose outside is coated with a rubber (2) as an organic substance, is subjected to high frequency heating in an induction furnace (6A to 6C). Rubber (2)
Is a cylindrical shape having a hollow portion, a cylindrical metal core (3) penetrates the hollow portion of the rubber (2), and the metal core (3) has an equal length from both cylindrical end surfaces of the rubber (2). Only sticking out. Here, the organic material is an organic material member prepared to constitute a product, and the metal is a metal member similarly.

The rubber (2) is an elastic body having elasticity.
The elastic body having elasticity refers to an elastic body in which a strain generated when a force having a practically large magnitude acts on the elastic body is such a magnitude as to perform some action as a practical strain. That is, for example, when an elastic force is applied to the rubber (2) which is an elastic body, the hollow portion of the rubber (2) is expanded and deformed to increase the diameter, so that the metal core (3) having a larger diameter Can be inserted. The organic substance having elasticity may be, for example, plastic having elasticity in addition to rubber such as synthetic rubber and natural rubber.

The surface of the metal core (3), which is in contact with the rubber (2), is primed and inserted into the hollow portion of the rubber (2). The contact portion on the inner surface of the portion is provided with an adhesive layer (4). The rubber (2) is made of silicone.

By the high frequency heating, substantially no heat is generated in the rubber (2) and the adhesive layer (4), which are insulators.
Heat is generated by the eddy current only in the metal core (3) which is a conductor. This heat causes a change in the state of the adhesive layer (4) existing between the rubber (2) and the metal core (3), thereby thermally decomposing the adhesive layer (4) and fluidizing a part of the adhesive layer. The adhesive force can be temporarily eliminated or the adhesive force in the adhesive layer (4) can be temporarily weakened, and the rubber (2) can be easily separated from the metal core (3).

It is particularly important that the high frequency heating described above does not substantially generate heat in the rubber (2) itself, and thus does not substantially change the physical properties of the rubber (2). This makes it possible to reuse the peeled rubber (2) for a wide range of uses.

The operating frequency of the high-frequency heating is 0.5 kHz
To several MHz, and each material limit temperature (for example, a temperature corresponding to a softening point and a melting point as well as a thermal decomposition point can be set) for an organic adhesive layer chemically bonded by various materials. The frequency that can be given can be appropriately selected, but preferably, a frequency that can heat the adhesive layer to about 300 ° C. ± 100 ° C. by heating the metal is used. The adhesive layer changes its state at this temperature, but the silicone rubber layer other than the adhesive layer does not change its state at this temperature.

In the case where not only the adhesive layer changes its state but also the rubber may change its state due to the heating temperature and heat capacity of the metal core, or the properties of the adhesive layer and the properties of the rubber, the high-frequency heating temperature is used. Is determined so that the heated metal causes a state change only in the adhesive layer, or even if the rubber causes a state change, only the rubber in a layer as thin as possible from the interface between the rubber and the adhesive layer changes the state. You may decide to wake them up.

Further, the present invention is characterized in that the method includes cutting the adhesive layer of the rubber-metal adhesive body heated by high frequency to peel off the rubber.

That is, since the rubber in the rubber-metal bonded body to which the present invention is applied is a viscoelastic rubber having a small permanent compression set, which is formed by adding a cross-linking agent or a vulcanizing agent, and heated and formed, for example, as shown in FIG. In the case of the rubber roll (1) as exemplified in 1, the outer rubber (2) generally has a contraction pressure for tightening the metal core (3). In other words, the volume of the hollow portion where no force is applied to the rubber (2) is expanded and expanded by inserting the metal core (3) having a larger volume, so that the rubber (2) is restored to the original shape. The force to be applied acts, but the restoring force is balanced against the extension force due to the extension and expansion, and the shape of the rubber (2) is maintained.

Then, as shown in FIG. 2, the rubber (2) is cleaved by the cutting blade (5), and the metal core (3) is heated by high frequency, whereby the adhesive force is substantially eliminated or weakened. When the adhesive layer (4) is cut by the cutting blade (5), the rubber (2), which has lost the shape maintaining condition due to the cutting, tends to contract in the direction of the arrow YY shown in FIG. By applying a shearing force exceeding the force, it can be instantaneously peeled from the metal core. In this case, the cleavage of the rubber (2) by the cutting blade (5) is performed simultaneously with and immediately after the high frequency heating. Adhesive layer (4)
This is because it is desirable to maintain the state change that has occurred and to terminate the rubber (2) cleavage before this state disappears.

As the cutting blade (5), a rigid metal blade or an analog thereof, a laser knife, a high-pressure water jet, or the like can be used. In the latter two cases, when the rubber is cleaved and the adhesive layer is cut, it is desirable to determine the laser intensity, the speed of the jet jet, and the like so as not to damage the metal core. Further, the adhesive layer (4) is cut by the cutting blade (5).
Is preferably cut, for example, rubber (2)
Is cleaved to an arbitrary depth, and the rubber that has been cleaved halfway contracts (restores) in the direction of the arrow, causing further cleavage, and this shrinkage also generates a shear force. To cut the adhesive layer (4).

When the metal core (3) is inserted into the hollow portion of the rubber (2), an adhesive such as a primer is not applied to the surface of the metal core (3), and the rubber (2) itself has an adhesive force. 2) may be bonded to the metal core (3). In this case, a thin film of rubber (2) in contact with the metal core (3) acts as an adhesive layer. The high-frequency heating of the metal core (3) is desirably performed so that only this thin film layer changes state.

Since the contraction pressure of the rubber (2) is small or almost non-existent, the restoring force of the rubber (2) is small or almost non-existent, and sufficient peeling of the rubber (2) does not occur. When the cutting depth of the cleavage is not large, after starting the cleavage of the rubber (2) with the cutting blade (5),
A force for forcibly causing the peeling of the rubber from the outside is applied to the cleaved portion of the rubber (2), or the rubber is forcibly released from the outside to the entire rubber (2) simultaneously with the completion of the cleavage of the rubber (2). The force to be generated may be applied.

FIG. 3 is a schematic sectional view showing one embodiment of a rubber peeling device as an organic material peeling device according to the present invention.

For example, as exemplified in FIG. 3, the rubber peeling device according to the present invention is configured to include a ring-shaped induction coil which is parallel to each other and arranged so that the center is on a straight line. And three induction furnaces (6A to 6C). The rubber roll (1) fixed at both ends of the metal core (3) protruding from the end face of the rubber (2) by the moving chucks (7A, B) as the moving means of the present invention includes the induction furnace (6A to 6A). C), moves at a constant speed in the horizontal direction, and passes through the induction furnaces (6A to 6C). The induction furnaces (6A to 6C) include an induction furnace (6A) and an induction furnace (6) according to the order in which the rubber roll passes first.
B) and an induction furnace (6C). The moving chucks (7A, B) are arranged in order of the moving chuck (7A) and the moving chuck (7B) in order from the one passing through the induction furnace first.

Further, a cutting blade (5) as a cleavage means of the present invention having a tip abutting on the surface of the metal core (3) is disposed at a position separated from the induction furnace (6C) by a predetermined distance in the moving direction. Has been established. The predetermined distance is a sufficient distance that the induction furnace (6C) does not interfere with the cutting blade (5).
This is a distance at which the portion of the adhesive layer that has passed through C) moves to the cutting blade (5), and can maintain the temporary disappearance or temporary weakening of the adhesive force until the cleavage by the cutting blade (5) is completed.

By moving the rubber roll (1) horizontally by a predetermined distance in the direction of the arrow XX while irradiating high frequency from the induction furnaces (6A to C), the cutting blade (5) is bonded to the rubber (2) and the adhesive. The layer (4) is cut.
The predetermined distance is equal to or longer than the distance at which the moving chuck (7A) passes through the induction furnaces (6A to C) from the movement start position (not shown) and ends the cleavage of the rubber (2) or the like by the cutting blade (5). Means the distance.

The cutting blade (5) includes a movable chuck (7A,
It is configured to enter and exit in a direction perpendicular to the moving direction of the rubber roll (1) so as not to interfere with B). The moving chuck (7A) and the moving chuck (7B) are interlocked with each other, and are configured to move by the same distance in the same direction when the rubber roll (1) is fixed.

In order to keep the effect of high-frequency heating of the metal core (3) by the induction furnaces (6A to C) constant with respect to the longitudinal direction of the metal core (3), heat is applied to the longitudinal direction of the metal core (3). When it is necessary to consider the transmitted effect, it is desirable to determine the arrangement of each induction furnace and the intensity of the high frequency generated in each induction furnace in consideration of this.

The frequency of the high frequency radiated from the induction furnaces (6A to 6C) is determined by the number of induction furnaces (6A to 6C) and the induction furnaces (6A to
C) 0.5 kHz to several MHz depending on the distance between the rubber roll (1) and the moving speed of the rubber roll (1).
Can be appropriately selected from the range. Also, a plurality of cutting blades can be provided. For example, two cutting blades may be provided at positions facing each other with the metal core (3) interposed therebetween.

Since the moving speed of the rubber (2) with respect to the cutting blade (5) is constant, the cutting load of the cutting blade (5) is constant, and the rubber (2) can be surely cleaved. Can be reliably separated from the metal core (3).

According to the present rubber peeling apparatus, the rubber (2) in the rubber roll (1), which is a rubber-metal adhesive, is easily peeled from the metal core (3), and the rubber (2) and the metal core (3) are separated. Can be easily separated. This opens up a way to effectively reuse defective products and used products that have been disposed of in landfills.

Of course, the present invention is not limited by the above-described embodiment, and it goes without saying that various aspects are possible in detail.

[0045]

As described above, according to the present invention, an organic substance
The organic matter in the metal bonded body can be easily separated from the metal, and the organic matter and the metal can be easily separated.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a rubber roll.

FIG. 2 is a schematic cross-sectional view illustrating an example of a state of being separated from a rubber roll.

FIG. 3 is a schematic sectional view showing an embodiment of the rubber peeling device according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Rubber roll 2 Rubber 3 Metal core 4 Adhesive layer 5 Cutting blade 6A, B, C Induction furnace 7A, B Moving chuck

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Masanori Ueki 7-1 Ogigaoka, Nonoichi-machi, Ishikawa-gun, Ishikawa Prefecture Inside Kanazawa Institute of Technology (72) Inventor Yukio Shimo 7-1 Ogigaoka, Nonoichi-machi, Ishikawa-gun, Ishikawa Prefecture Inside Kanazawa Institute of Technology ( 72) Inventor Yamada, 1-75, Fujie-minami, Kanazawa-shi, Ishikawa Prefecture F-term (reference) 4D004 AA11 BA07 BA10 CA02 CA12 CA23 CA24 CA29 CA43 CA44 CA50 CB01 CB12 4F301 AA05 AC15 AD03 BA01 BA02 BA12 BA15 BA17 BA29 BE10 BF04 BG04 BG05

Claims (7)

[Claims] 1. A method for peeling an organic substance, comprising heating an organic / metal bonded body in which an organic substance and a metal are bonded to each other by high-frequency heating to cleave the organic substance and peel the organic substance from the metal. 2. The method according to claim 1, wherein the organic substance is an elastic body having elasticity. 3. The method according to claim 1, wherein the bonding is performed by an adhesive. 4. An induction furnace through which a high-frequency current passes, a cleaving means for cleaving the organic substance of the organic substance / metal bonded body in which the organic substance and the metal are bonded to each other, and the organic substance / metal bonded body in the induction furnace. And a moving means for moving the organic substance relatively to the induction furnace. 5. The organic substance stripping apparatus according to claim 4, wherein the organic substance is an elastic body having elasticity. 6. The organic substance peeling device according to claim 4, wherein the bonding is performed by an adhesive. 7. The rubber peeling device according to claim 4, wherein the moving means is configured to perform the relative movement at a constant speed.