JP2000124230A5 - - Google Patents
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- Publication number
- JP2000124230A5 JP2000124230A5 JP1998293364A JP29336498A JP2000124230A5 JP 2000124230 A5 JP2000124230 A5 JP 2000124230A5 JP 1998293364 A JP1998293364 A JP 1998293364A JP 29336498 A JP29336498 A JP 29336498A JP 2000124230 A5 JP2000124230 A5 JP 2000124230A5
- Authority
- JP
- Japan
- Prior art keywords
- frame
- motor
- feed
- guide
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001429 stepping Effects 0.000 description 1
Description
そこで特開平１−２３９９４４号公報に開示されているように、半導体フレームをチャックで狭持してマガジン外方に引き出し、ガイドレールに移載する方法が案出されている。これによれば半導体フレームの品種変更時、特にその長手方向での変化に対し即座に対応できる。 Therefore, as disclosed in Japanese Patent Application Laid- Open No. 1-239444, a method has been devised in which the semiconductor frame is narrowly held by a chuck, pulled out of the magazine, and transferred to a guide rail. According to this, when the type of semiconductor frame is changed, it is possible to immediately respond to the change in the longitudinal direction.
前述の識別した長さに応じたリードフレーム１４の送り量、即ちフレーム送りガイド１０の送り量を回転角に換算した駆動信号をフレーム送り用モーター２１に与えて回転させ、同時にモーターの回動軸に連動したボールネジ等の移動用ネジ２１ａを回転させ、リードフレーム１４を矢印４の方向へ供給する。リードフレーム１４を次工程に流した後、フレーム送り用モーター２１を逆回転させてフレーム送りガイド１０を元の位置に戻し、なおかつチャック１５も元の位置に戻す。なお、センサー１３は、光電センサーを利用することができ、フリップフロップと連動した状態保持動作をするスイッチングをさせて好適である。また、フレーム送り用モーター２１は、例えばエンコーダ付きのステッピングモーター若しくはサーボモータを使用し、フレーム送りガイド１０はボールネジ等の送りネジ２１ａに螺合する雌ねじ部と一体となり、少なくともリードフレーム１４のクレードル部に形成された透孔の一つに係合する凸片等の係合部を有するものが採用できる。 A drive signal obtained by converting the feed amount of the lead frame 14 according to the identified length, that is, the feed amount of the frame feed guide 10 into a rotation angle is given to the frame feed motor 21 to rotate the frame feed motor 21, and at the same time, the rotation shaft of the motor. A moving screw 21a such as a ball screw linked to the above is rotated to supply the lead frame 14 in the direction of the arrow 4. After the lead frame 14 is sent to the next step, the frame feed motor 21 is rotated in the reverse direction to return the frame feed guide 10 to the original position, and the chuck 15 is also returned to the original position. A photoelectric sensor can be used as the sensor 13, and it is suitable to switch the state holding operation in conjunction with the flip-flop. Further, the frame feed motor 21 uses, for example, a stepping motor or a servo motor with an encoder, and the frame feed guide 10 is integrated with a female screw portion screwed into a feed screw 21a such as a ball screw, and at least the cradle portion of the lead frame 14 is used. Those having an engaging portion such as a convex piece that engages with one of the through holes formed in the above can be adopted.
【符号の説明】
１ マガジン
２、９ モーター
２ａ、９ａ 移動用ネジ
３ マガジン押さえ
４、１３ センサー
５、６ リミットセンサー
７、１１ ガイドシャフト
１０ ガイド
１２ａ ガイドレール（可動）
１２ｂ ガイドレール（固定）
[Explanation of symbols]
1 Magazine 2, 9 Motor 2a, 9a Moving screw 3 Magazine retainer 4, 13 Sensor 5, 6 Limit sensor 7, 11 Guide shaft 10 Guide 12a Guide rail (movable)
12b guide rail (fixed)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29336498A JP4004153B2 (en) | 1998-10-15 | 1998-10-15 | Semiconductor frame supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29336498A JP4004153B2 (en) | 1998-10-15 | 1998-10-15 | Semiconductor frame supply device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000124230A JP2000124230A (en) | 2000-04-28 |
| JP2000124230A5 true JP2000124230A5 (en) | 2007-08-23 |
| JP4004153B2 JP4004153B2 (en) | 2007-11-07 |
Family
ID=17793840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29336498A Expired - Fee Related JP4004153B2 (en) | 1998-10-15 | 1998-10-15 | Semiconductor frame supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4004153B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4585496B2 (en) * | 2006-08-25 | 2010-11-24 | 芝浦メカトロニクス株式会社 | Semiconductor chip mounting equipment |
| CN116072581B (en) * | 2023-04-03 | 2023-05-30 | 四川旭茂微科技有限公司 | Chip die bonding device |
-
1998
- 1998-10-15 JP JP29336498A patent/JP4004153B2/en not_active Expired - Fee Related
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