JP2000113610A - Information record regenerator and its head arm - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a mixture of noises and restrict occurrence of a deflection due to heat generation of a semiconductor device by a method wherein there is provided the semiconductor device for processing an information signal communicated between a record regenerating medium and a head part, and the semiconductor device is involved at a position where it is not influenced by a heat deflection and deformation. SOLUTION: An IC chip 6 which is a semiconductor device for processing an output signal from a magnetic bead slider 3 is involved in a head arm 5 made of ceramics in which there are little deformations and deflections due to heat. The IC chip 6 is involved in the vicinity of a frontal end of the head arm 5 for reducing a distance from the magnetic head slider 3. A position to be involved is a central part in an in-plane direction in the vicinity of the frontal end of the head arm 5 a central part in a face thickening direction, and a position where a deformation due to thermal deflection of the head arm 5 is hard to occur. Thus, it is possible to attain the head arm 5 which restricts occurrence of noises and is hard to deflect due to heat generation of the IC chip 6, and a HDD (information record regenerator) 1 provided with the head arm 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an information recording / reproducing apparatus, and more particularly, to a structure of a head arm of an information recording / reproducing apparatus and a position of a semiconductor device for information recording / reproducing processing.

[0002]

2. Description of the Related Art In recent years, there has been a remarkable increase in storage capacity and storage density of storage devices such as magnetic disk devices and optical disk devices. On the other hand, such high-density recording and high-speed data transfer technologies are sensitive to noise, and noise must be reduced to achieve higher-density recording and high-speed data transfer. When reading data from disk,
Noise may be mixed from wiring between a magnetic head provided on the slider and an IC chip (head IC) for processing a signal from the magnetic head. This noise causes a reduction in the speed of data transfer and an error in data transfer. Ensuring the quality of the signal from the magnetic head is important in further high-density recording and high-speed data transfer. In order to prevent the above-mentioned noise, it is desirable to bring the chip of the head IC as close as possible to the magnetic head and shorten the length of the wiring itself. One technique for shortening the length of the wiring itself is disclosed in Japanese Patent Application Laid-Open No. Hei 9-128912.

FIG. 5 is a perspective view showing the structure of a head actuator disclosed in Japanese Patent Application Laid-Open No. 9-128912. Reference numeral 101 denotes an actuator, which includes an arm unit 111 for mounting the head at the tip, and an actuator body 11.
3 is provided. A flexible circuit board (hereinafter referred to as FP) described later is provided on a part of the side surface of the actuator 101.
C) A plane 115 is provided for mounting 102. The FPC 102 attached to the flat surface 115 of the actuator body 113 is a double-sided board,
A plurality of chip components such as resistors and capacitors are mounted on the mounting surface of the flat surface 115 of the second actuator body 113. The FPC 102 is placed on the flat surface 115.
Housing groove 11 for receiving chip component mounted thereon
6 are provided corresponding to the mounting positions of the chip components on the FPC 102.

On the other hand, the surface of the FPC 102 opposite to the surface on which the actuator body 113 is mounted on the plane 115 is
A head IC 121 for demodulating a signal from the head, and the like;
A servo IC 122 for controlling the position of the head is mounted. In the FPC 102 in which the chip component is mounted on the mounting surface side of the actuator 101 and the head IC 121 and the servo IC 122 are mounted on the front surface side, the tip portion is housed in the flat surface 115 of the actuator body 113 and the chip component is housed in the housing groove 116 After being mounted in a state, the actuator body 113 is
Is fixed on the plane 115. With this configuration, the head IC can be mounted close to the position of the magnetic head, and noise can be suppressed. But,
As the density increases, the FPC 1 from the magnetic head to the head IC 121 on the side of the actuator 101 is increased.
02 cannot be ignored.

In general, when a current is applied to an IC chip for use, the IC chip generates heat. When the IC chip is mounted on one side of the head arm as in the prior art,
Due to this heat, the temperature of one side of the head arm rises.
When one side of the head arm expands due to the temperature rise, the head arm and the actuator may be distorted. If the head arm or actuator is distorted and the attitude of the head is lost, data cannot be read or written normally. Further, as the storage density on the disk increases, the influence of a slight distortion on data exchange increases. If the distortion becomes severe, data exchange may not be possible.

[0006]

The above-mentioned prior art has a problem of noise mixed into the wiring and a problem that the head arm is distorted due to heat generated by the IC chip unevenly distributed in the head arm. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has a head arm which is resistant to heat generation of a semiconductor device (IC chip) while reducing the mixing of noise, and an information recording / reproducing apparatus having the head arm. It is intended to provide a device.

[0007]

SUMMARY OF THE INVENTION The present invention relates to a head arm of an information recording / reproducing apparatus, comprising a semiconductor device for processing an information signal to be recorded / reproduced, wherein the semiconductor device is included in the head arm. Features. According to such a configuration, it is possible to provide a head arm that is resistant to heat generation of the semiconductor device while reducing noise mixing. The present invention also provides a recording / reproducing medium, a head for exchanging information with the recording / reproducing medium, a head arm having the head, and an information signal for exchanging the recording / reproducing medium with the head. A semiconductor device is provided, and the semiconductor device is included in the head arm. According to such a configuration, it is possible to provide an information recording / reproducing apparatus having a head arm that is resistant to heat generation of the semiconductor device while reducing the mixing of noise.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows H according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a state in which a cover of the DD (hard disk drive) is opened. 1 is an HDD. Reference numeral 2 denotes a magnetic disk medium on which information is recorded. A magnetic head 3 exchanges information with the magnetic disk medium 2. 4
Is a suspension for holding the magnetic head 3,
The magnetic head 3 is formed of a thin metal piece having a spring force to press the magnetic head 3 against the surface of the magnetic disk medium 2. 5 is a head arm for holding the suspension 4,
The suspension 4 is connected to a pivot bearing 7 described later. The head arm 5 rotates to move the magnetic head 3 to a predetermined position on the magnetic disk medium 2 to exchange information. The head arm 5 is made of ceramics that are less deformed and distorted by heat. It is also possible to use a type of resin that is less deformed and distorted by heat. Reference numeral 6 indicated by a dotted line denotes an IC chip which is a semiconductor device for processing an output signal from the magnetic head 3, and is included in the head arm 5. This IC chip 6 includes a magnetic head 3
Includes an amplifier circuit that amplifies analog signals from It is possible to include an IC chip having the function of a servo IC in the head arm 5, but an IC chip not directly related to data amplification is not inside the head arm 5,
It is desirable to dispose it on the base portion of the HDD device. This is to reduce the weight of the head arm and reduce the load on the power source required for rotating the head arm. The IC chip 6 is included near the tip of the head arm 5 to shorten the distance from the magnetic head 3. It is desirable that the head arm 5 is included at a central portion in the in-plane direction near the tip of the head arm 5 and a central portion in the surface thickness direction, and is located at a position where deformation of the head arm 5 due to thermal distortion hardly occurs. Reference numeral 7 denotes a pivot bearing for rotating the head arm 5. Reference numeral 8 denotes a base on which mechanical parts such as the pivot bearing 7 are mounted. The line HH ′ in the figure is the center line of the head arm 5 in the in-plane direction. As shown in FIGS. 1 to 3, the IC chip 6 is arranged at the center of the head arm 5 in the in-plane direction.

FIG. 2 is a view showing the inside of the head arm 5 from the upper surface in which the vicinity of the IC chip 6 is enlarged.
The IC chip 6 and the lead frame 9 included in the head arm 5 are indicated by dotted lines. Note that the gold wire 12 is shown by a solid line to make the drawing easier to see. The lead frame 9 is connected to the IC chip 6 by wire bonding with gold wire 12. In the present embodiment, the IC chip 6 is mounted in a bare chip state, but the hollow portion of the head arm 5 can be molded with resin or the like. Of the terminals of the lead frame 9, the terminal opposite to the terminal connected to the IC chip 6 is drawn out to the surface such as the bottom surface, the side surface, or the top surface of the head arm 5 in order to connect to a flexible circuit board described later. . Reference numeral 10 denotes a flexible circuit board (hereinafter, head FPC) for exchanging signals between the magnetic head 3 and the IC chip 6. Reference numeral 11 denotes a flexible circuit board (hereinafter, main FPC) for exchanging signals between the IC chip 6 and a control board (not shown). Since the FPCs 10 and 11 are exposed on the surface of the head arm 5, they are indicated by solid lines in the figure.

FIG. 3 is a sectional view showing an internal structure when the head arm according to the embodiment of the present invention is cut in the direction of HH 'in FIG. In FIG. 3, the line VV ′ represents the center of the head arm 5 in the surface thickness direction. IC chip 6 as shown in FIG.
Is arranged at the center in the surface thickness direction. This position is a position where the head arm 5 is not easily deformed due to thermal strain. 5
a and 5b are parts forming the head arm 5. The head arm 5 is divided into two parts 5a and 5b along the line VV '. 5a is an upper part of the head arm 5, and 5b is a lower part of the head arm 5. The head arm 5 is formed such that the two parts sandwich the IC chip 6. The periphery of the IC chip 6 has a hollow structure. 9 is a lead frame. Reference numeral 10 denotes a head FPC for exchanging signals between the magnetic head 3 and the IC chip 6. Reference numeral 11 denotes a main FP for exchanging signals between the IC chip 6 and a control board (not shown).
C. In the present embodiment, the terminals of the lead frame 9 are drawn to the lower surface of the head arm 5 and connected to the FPCs 10 and 11, but the terminals may be drawn to the side and upper surfaces of the head arm 5 and connected to the FPC.

As described above, by mounting the IC chip 6 at a position closer to the magnetic head 3 than before, it is possible to shorten the wiring between the magnetic head 3 and the IC chip 6,
It is possible to reduce noise mixed in the wiring. Even if the IC chip 6 mounted on the head arm 5 generates heat, thermal expansion is suppressed by using ceramics for the material of the head arm 5. Furthermore, even a small amount of thermal expansion,
Since the IC chip 6 is disposed at a position where the head arm 5 is unlikely to be deformed by thermal distortion, that is, at the center in both the in-plane direction and the surface thickness direction of the head arm 5, the IC chip 6 is deformed. External force can be minimized. Also, in order to increase the heat radiation efficiency, it is also possible to provide an appropriate gap or hole as a ventilation hole in the head arm 5.

In addition to the present embodiment, the head arm 5 can be integrally formed so as not to have a hollow structure without being divided into a plurality of parts as shown in FIG. By doing so, the strength of the head arm increases. In the embodiments described so far, the magnetic head and the IC chip are singular. However, when there are a plurality of magnetic disk media, a plurality of magnetic heads are required to exchange data with each magnetic disk medium. Accordingly, it is of course possible to increase the number of IC chips. In the embodiments of the present invention, the semiconductor device is assumed to be an IC chip in order to reduce the weight, and the IC chip is assumed to be mounted on a bare chip. However, the present invention is also applicable to a miniaturized package type semiconductor device. Is possible.

[0013]

As described above, according to the present invention, it is possible to provide a head arm and an information recording / reproducing apparatus provided with the head arm, which suppress generation of noise and are hardly distorted by heat generation of the semiconductor device. it can.

[Brief description of the drawings]

FIG. 1 is a perspective view of a hard disk drive according to an embodiment of the present invention.

FIG. 2 shows an I of a head arm according to an embodiment of the present invention.
FIG. 3 is a diagram showing a peripheral portion of a C chip.

FIG. 3 is a sectional view showing an internal structure of a head arm according to the embodiment of the present invention.

FIG. 4 is a sectional view showing an internal structure of a head arm according to the embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional head arm structure.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... HDD, 2 ... Magnetic disk medium, 3 ... Magnetic head slider, 4 ... Suspension, 5 ... Head arm, 5a
... Head arm parts, 5b ... Head arm parts, 6 ... IC chip, 7 ... Pivot bearing, 8 ... Base, 9 ... Lead frame, 10 ... Head FPC, 11
... Main FPC, 12 ... Gold wire, 101 ... Actuator, 102 ... Flexible circuit board, 103 ... Fixing plate, 111 ... Arm part, 113 ... Actuator body,
115 ... plane, 116 ... accommodation groove, 121 ... head IC,
122: Servo IC

Claims (20)

[Claims] 1. A head arm of an information recording / reproducing device, comprising: a semiconductor device for processing an information signal to be recorded / reproduced, wherein the semiconductor device is included in the head arm. . 2. The head arm of an information recording / reproducing apparatus according to claim 1, wherein said semiconductor device is arranged at a position not affected by thermal deformation of said head arm. 3. The head arm of the information recording / reproducing apparatus according to claim 1, wherein the semiconductor device is included near a tip of the head arm. 4. The head arm of an information recording / reproducing apparatus according to claim 1, wherein the semiconductor device is included near the center of the mounting portion in the width direction of the head arm. 5. The head arm of an information recording / reproducing apparatus according to claim 1, wherein the semiconductor device is included near the center in the thickness direction of the head arm at the mounting portion. 6. The head arm of an information recording / reproducing apparatus according to claim 1, wherein said head arm comprises a plurality of parts, and said plurality of parts sandwich said semiconductor device. . 7. The head arm of an information recording / reproducing apparatus according to claim 1, wherein the head arm is integrally formed so as to include the semiconductor device. 8. A head arm according to claim 1, wherein said head arm is made of a ceramic material. 9. The head arm according to claim 1, wherein the head arm is made of a synthetic resin material. 10. The head arm includes a lead frame electrically connected to the semiconductor device, and one of terminals of the lead frame is connected to a flexible printed wiring board on a surface of the head arm. The head arm of the information recording / reproducing apparatus according to claim 1, wherein: 11. A recording / reproducing medium, a head unit for exchanging information with the recording / reproducing medium, a head arm having the head unit, and a semiconductor for processing an information signal exchanged between the recording / reproducing medium and the head unit. An information recording / reproducing apparatus, comprising: a device; and the semiconductor device is included in the head arm. 12. The information recording / reproducing apparatus according to claim 11, wherein the semiconductor device is arranged at a position that is not affected by thermal deformation of the head arm. 13. The information recording / reproducing apparatus according to claim 11, wherein the semiconductor device is included near the tip of the head arm. 14. The information recording / reproducing apparatus according to claim 11, wherein the semiconductor device is included near the center of the mounting portion in the width direction of the head arm. 15. The information recording / reproducing apparatus according to claim 11, wherein the semiconductor device is included near the center in the thickness direction of the head arm of the mounting portion. 16. The information recording / reproducing apparatus according to claim 11, wherein the head arm is composed of a plurality of parts, and the head arm is configured such that the plurality of parts sandwich the semiconductor device. 17. The information recording / reproducing apparatus according to claim 11, wherein the head arm is integrally formed so as to include the semiconductor device. 18. An information recording / reproducing apparatus according to claim 11, wherein said head arm is made of a ceramic material. 19. An information recording / reproducing apparatus according to claim 11, wherein said head arm is made of a synthetic resin material. 20. The head arm includes a lead frame electrically connected to the semiconductor device, and one of terminals of the lead frame is connected to a flexible printed wiring board on a surface of the head arm. The information recording / reproducing apparatus according to claim 11, wherein: