JP2000101254A - Sealed structure of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high moisture-proof sealing structure of an electronic component with an adhesive strength in its junction between a resin sealing material and a case reinforced. SOLUTION: A sealing structure comprises an external box case 10 with its one side opened and the other side bottomed, and an internal case 15 made of a material adhesive to a resin sealing material 28 and with its opening approximately equaled to an inner shape of the opening of the external box case 10. The internal case 15 is inserted into the external box case 10 and the electronic component is enclosed in the positioned internal case 15 and the external box case 10 with their gap filled by the resin sealing material 28.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing structure for an electronic component in which an electronic component positioned in a case is filled and sealed with a resin sealing member.

[0002]

2. Description of the Related Art In order to improve the moisture resistance (waterproofness) and earthquake resistance of an electronic device housed in a case, the case is filled with a resin sealing member such as a urethane resin or an epoxy resin to fill the electronic device. The method of sealing was used. Hereinafter, a conventional electronic device sealing structure will be described with reference to FIG.

FIGS. 10 (a) and 10 (b) are schematic structural views showing a conventional electronic device sealing structure. FIG. 10 (a) is a plan view (before filling with a resin sealing member), and FIG. After).

[0006] Reference numeral 60 denotes an outer case, which has a rectangular shape with a bottom and one surface constituting an opening. Outer case 60
Material is metal (aluminum die-cast) or ABS,
A resin member such as PBT (polybutylene terephthalate) or PP (polypropylene) is used and formed by molding.

[0005] Reference numeral 70 denotes an electronic device which is installed in a place where use conditions are severe, for example, an engine room or the like, and an electronic component 72 is mounted on a substrate 71. The electronic device 70 requires measures such as moisture proof (waterproof) and earthquake proof to prevent the quality of the electronic component 72 from being deteriorated. For this purpose, the electronic device 70 positioned at a predetermined position in the outer case 60 is filled with a resin sealing member 75 such as a urethane resin or an epoxy resin, and is sealed in the outer case 60 for use.

[0006]

However, in the above-described sealing structure of the electronic device 70, the resin sealing member 75 is subjected to thermal stress, external impact, chemical change (oxidation), etc., and the resin sealing member 75 is deteriorated. . Then, the bonding strength is reduced, and the resin sealing member 75 is separated from the bonding surface of the case 60. When the resin sealing member 75 is peeled off from the bonding surface of the case 60, the moisture resistance deteriorates, and the moisture is
Results in adverse effects.

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a sealing structure for an electronic component in which the bonding strength between a resin sealing member and a case is enhanced and which has high moisture resistance.

[0008]

SUMMARY OF THE INVENTION The present invention achieves the above-mentioned object, and has good adhesion between a bottomed outer casing case having an opening at one surface and a resin sealing member. The inner case is made of a material and is formed in a cylindrical shape with an opening substantially equal to the inner shape of the opening of the outer case, and the electronic component is positioned by inserting the inner case into the outer case. The resin sealing member is filled inside the inner case and the outer case.

[0009] Further, a convex wall is formed at the bottom of the outer casing case so as to conform to the inner shape of the opening of the inner case.

Further, a plurality of holes filled with the resin sealing member are formed in the inner case.

[0011] Further, the outer casing case is made of a material having good adhesion to a bottomed outer casing case having an opening in one surface and a resin sealing member, and has a U-shaped cross section. A mounting member formed in the opening of the outer housing case, wherein the mounting member is mounted in the opening of the outer housing case, and the electronic component is positioned inside the outer housing case and the inside of the mounting member. Is filled with the resin sealing member.

[0012] A material having good adhesion between a bottomed outer casing case having an opening on one surface and a resin sealing member, and having an inner shape inside the opening of the outer casing case. Substantially the same, comprising a rectangular-shaped partition member partitioned into a plurality of small areas by wall surfaces, the partition member is provided above the electronic component positioned in the outer casing case, and inside the outer casing case. The resin sealing member is filled.

Further, a material having good adhesion between the bottomed outer casing case having an opening on one surface and a resin sealing member, and having an inner shape inside the opening of the outer casing case. An inner case formed in a cylindrical shape having substantially the same opening, and a material having good adhesiveness with the resin sealing member, substantially equal to the inner shape of the opening of the outer casing case, and partitioned into a plurality of small areas by wall surfaces. It consists of a partition member of the shape of a sled, inserts the inner case into the outer case, provides the partition member above the electronic components positioned in the inner case, and provides the outer case and the inner case. The resin sealing member is filled inside.

Further, a convex wall is formed at the bottom of the outer case so as to conform to the inner shape of the opening of the inner case.

Further, a plurality of holes filled with the resin sealing member are formed in the inner case.

Further, the outer casing case is made of a material having good adhesion to a bottomed outer casing case having an opening at one surface and a resin sealing member, and has a U-shaped cross section. It is a material having good adhesiveness between the crown member formed so as to be attached to the opening and the resin sealing member, and is substantially equal to the inner shape of the opening of the outer casing case, and is partitioned into a plurality of small areas by wall surfaces. A mounting member attached to an opening of the outer casing case, and the partition member is provided above an electronic component positioned in the outer casing case; The resin sealing member is filled inside the case and the crown member.

Also, in the electronic component sealing structure for filling and sealing a resin sealing member in a case where the electronic component is positioned, it is preferable that the case has a filling hole for the resin sealing member. It is a feature.

[0018] Further, the filling hole is provided with a gradient so as to widen outwardly from the inside of the case.

The filling hole is a long hole, and the long hole is formed in a plurality of stages substantially parallel to the opening surface of the case, and ends of the long hole overlap each other to form an outer periphery of the case. Is made around once.

Further, a material having good adhesiveness between the case having an opening formed on one surface and having a bottom and a filling hole for a resin sealing member formed therein, and the resin sealing member having good adhesion, It consists of a slender-shaped partition member divided into a plurality of small areas by a wall surface substantially equal to the inner shape of the opening, and the partition member is provided above the electronic component positioned in the case,
The resin sealing member is filled in the case.

[0021] Further, the filling hole is provided with a gradient so as to widen outward from the inside of the case.

The filling hole is a long hole, and the long hole is formed in a plurality of stages substantially parallel to the opening surface of the case, and ends of the long hole overlap each other to form an outer periphery of the case. Is made around once.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. 1, 2, 3 and 4. FIG.

FIGS. 1A and 1B are schematic structural views showing a sealing structure of an electronic device according to a first embodiment of the present invention, wherein FIG. 1A is a plan view (before filling a resin sealing member), and FIG. (After filling the resin sealing member). 2A and 2B are schematic views showing the outer case of the first embodiment, wherein FIG. 2A is a plan view, and FIG. 2B is a sectional view taken along line BB. FIG. 3 is a schematic diagram showing the inner case of the first embodiment,
(A) is a plan view, and (b) is a CC sectional view. 4A and 4B are schematic views showing the partition member of the first embodiment, wherein FIG. 4A is a plan view and FIG. 4B is a front view.

Reference numeral 10 denotes an outer case, which has a rectangular shape with a bottom and one surface forming an opening. Outer case 10
A convex wall 12 is formed on the bottom 11 along the inner shape of the opening of the inner case 15. The material of the outer case 10 is metal (aluminum die-cast) or ABS, PBT,
It is formed by molding using a resin member such as PP.

The inner case 15 is a case that is inserted into the outer case 10 when the adhesion between the outer case 10 and the resin sealing member 28 is not very good. Inner case 1
Reference numeral 5 denotes a rectangular cylindrical shape having substantially the same shape as the inside of the opening of the outer casing case 10, and a filling hole (through hole) 16 filled with a resin sealing member is formed on the outer periphery. Inner case 15
Is formed of, for example, a material of the same type as the resin sealing member 28, which has good adhesion to a resin sealing member (urethane resin or epoxy resin).

Reference numeral 20 denotes a partition member, which divides the filled resin sealing member 28 into small sections. Partition member 20
Has substantially the same shape as the inside shape of the opening of the inner case 15, and is divided into a plurality of small areas 22 by a wall surface 21.
The material of the partition member 20 has good adhesiveness to the resin sealing member 28, and is formed of, for example, a material of the same type as the resin sealing member 28.

Reference numeral 25 denotes an electronic device installed in a place where use conditions are severe, for example, an engine room, etc., and an electronic component 27 is mounted on a substrate 26. The electronic device 25 requires measures such as moisture proof (waterproof) and earthquake proof to prevent the quality of the electronic component 27 from being deteriorated. For this purpose, the electronic device 25 positioned at a predetermined position in the outer case 10 is filled with a resin sealing member 28 such as urethane resin or epoxy resin, and is used by being sealed in the outer case 10.

Next, the outline of resin sealing of an electronic device will be described.

The inner case 15 is inserted between the inner side 15 of the outer case 10 and the convex wall 12 formed on the bottom. Next, the electronic device 25 is positioned and fixed inside the inner case 15.
Then, the partition member 20 is placed above the fixed electronic device 25.
And the electronic device 25 is sealed by filling the resin sealing member 28.

As described above, according to this embodiment, the inner case 15 is formed of a material having good adhesiveness to the resin sealing member, and the outer peripheral portion is formed with the filling hole 16 filled with the resin sealing member 28. Therefore, the resin sealing member 28 and the inner case 15
The bonding force of the bonding surface with the bonding surface is enhanced, and peeling of the bonding surface hardly occurs. Also, by inserting the partition member 20,
Since the open surface (opening surface) of the inner case 15 is divided and the apparent area can be reduced, the resin sealing member 28
The force due to the shrinkage of the particles is dispersed, and the separation can be suppressed. In addition, by forming the convex wall 12 on the bottom 11 of the outer casing case 10, the path through which moisture (moisture) can enter becomes longer. Therefore, a sealed structure of the electronic device 25 having high moisture resistance and high earthquake resistance can be obtained. In this embodiment, both the partition member 20 and the inner case 15 are used. However, the present invention is not limited to this, and either one may be used.

Next, a second embodiment of the present invention will be described with reference to FIGS.

FIGS. 5A and 5B are schematic structural views showing a sealing structure of an electronic device according to a second embodiment of the present invention, wherein FIG. 5A is a plan view (before a resin sealing member is filled), and FIG. (After filling the resin sealing member). FIGS. 6A and 6B are schematic views showing a crown member according to the second embodiment, wherein FIG. 6A is a plan view and FIG.
In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

Reference numeral 30 denotes a crown member which is attached to the opening edge of the outer case 10 when the adhesiveness between the outer case 10 and the resin sealing member 28 is not very good. The crown member 30 is formed in an annular shape having a U-shaped cross section. The crown member 30 is formed of a material of the same type as the resin sealing member 28, for example, having good adhesion to the resin sealing member 28.

Next, an outline of resin sealing of an electronic device will be described.

At the opening edge of the outer casing case 10, a crown member 30 is provided.
Attach. Next, the electronic device 2 is placed inside the outer casing case 10.
5 is positioned and fixed. And the fixed electronic device 2
The electronic device 25 is sealed by inserting the partition member 20 above the space 5 and filling the resin sealing member 28.

As described above, in this embodiment,
By attaching the crown member 30 formed of a material having good adhesiveness with the resin sealing member 28 to the opening edge of the outer casing case 10, the adhesive force of the joint surface with the resin sealing member 28 is enhanced. Separation of the bonding surface is less likely to occur. Therefore, a sealed structure of the electronic device 25 having high moisture resistance and high earthquake resistance can be obtained. still,
In the present embodiment, the crown member 30 is formed in a ring shape, but may be formed into a linear shape and cut into an appropriate length. Also,
In this embodiment, both the partition member 20 and the crown member 30 are used, but the present invention is not limited to this, and either one may be used.

Next, a third embodiment of the present invention will be described with reference to FIGS.

FIGS. 7A and 7B are schematic structural views showing a sealing structure of an electronic device according to a third embodiment of the present invention, wherein FIG. 7A is a plan view showing a plan view (before filling a resin sealing member), and FIG. It is -F sectional drawing (after resin sealing member filling). 8A and 8B are schematic views showing a case of the third embodiment, in which FIG. 8A is a plan view and FIG. 8B is a sectional view taken along line GG. In the third embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

Reference numeral 40 denotes a case, which has a rectangular shape with one bottom and one surface constituting an opening. A filling hole (through-hole) 41 for the resin sealing member 28 is formed on the outer periphery of the case 40. The filling hole 41 is provided with a taper 44 such that the filling hole 41 is larger than the inside of the case 40 toward the outside. A convex wall 43 is formed on the bottom 42 of the case 40. When the case 40 is filled with the resin sealing member 28, the outside of the case 40 is surrounded by a removable flat plate or an adhesive tape so that the resin sealing member 28 does not leak from the filling hole 41. The filling hole 41 is closed beforehand, and is removed after the filled resin sealing member 28 is solidified. The material of the case 40 is metal (aluminum die-cast) or A
A resin member such as BS, PBT, or PP is used and is formed by molding.

Next, the outline of resin sealing of an electronic device will be described.

The electronic device 25 is positioned and fixed inside the case 40. Then, the outside of the case 40 is surrounded by a flat plate (not shown), and the filling hole 41 is closed, or the filling hole 41 of the case 40 is closed with an adhesive tape or the like. Next, the partition member 20 is inserted above the fixed electronic device 25 and the resin sealing member 28 is filled to seal the electronic device 25.

As described above, in this embodiment,
Filling hole 4 provided with taper 44 on the outer periphery of case 40
1 is formed, the resin sealing member 28 is
Is filled, a part of the resin sealing member 28 is filled in the filling hole 41. Therefore, the case 40 and the resin sealing member 28
Since the adhesive strength of the bonding surface with the substrate can be enhanced and separation of the bonding surface can be prevented, a sealed structure of the electronic device 25 having high moisture resistance and high earthquake resistance can be obtained. In this embodiment, the filling hole 41 is a round hole. However, the filling hole 41 may have another shape, and the number of the filling holes 41 may be increased or decreased as necessary. Also, the resin sealing member 28
Although the partition member 20 was used inside the case 40 when filling, the use of the partition member 20 may not be required in some cases because the filling hole 41 is formed in the case 40 and the adhesive strength is increased. In particular, when the partition member 20 is used in a place where use conditions are severe, it is more effective to use the partition member 20.

Next, a fourth embodiment of the present invention will be described with reference to FIG.

FIGS. 9A and 9B are schematic views showing another case of the fourth embodiment of the present invention, wherein FIG. 9A is a plan view and FIG. 9B is a sectional view taken along line HH. Since the fourth embodiment is substantially the same as the third embodiment except for a part, the same components are denoted by the same reference numerals and description thereof is omitted.

Reference numeral 50 denotes a case, which has a rectangular shape with a bottom and one surface constituting an opening. A long hole (through hole) 51 filled with the resin sealing member 28 is formed in the outer peripheral portion of the case 50. The long holes 51 are parallel to the opening surface of the case 50, and are formed so that the ends of the plurality of long holes 51 overlap with each other around the outer periphery of the case 50 in a plurality of stages (second embodiment). . The long hole 51 is provided with a taper 54 so as to be greatly expanded outward from the inside of the case 50. The material of the case 50 is a metal (aluminum die-cast) or a resin member such as ABS, PBT, or PP, and is formed by molding.

As described above, in this embodiment,
A long hole 51 provided with a taper 54 on the outer periphery of the case 50
Is formed, the resin sealing member 28 is
Is filled, a part of the resin sealing member 28 is filled in the filling hole 51. Therefore, the case 50 and the resin sealing member 28
The bonding strength of the bonding surface with the metal is enhanced, and the separation of the bonding surface can be prevented, and the ends of the plurality of long holes 51 overlap each other and surround the outer periphery of the case 50, so that moisture (moisture) can enter. The path becomes long, and a sealed structure of the electronic device 25 having high moisture resistance and high earthquake resistance can be obtained.

[0048]

As described above, according to the present invention, the adhesive strength of the joint surface between the resin sealing member and the case is enhanced, and a sealing structure for electronic components having high moisture resistance can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating a sealing structure of an electronic device according to a first embodiment of the present invention.

FIG. 2 is a schematic view showing an outer case of the first embodiment.

FIG. 3 is a schematic view showing an inner case of the first embodiment.

FIG. 4 is a schematic view showing a partition member of the first embodiment.

FIG. 5 is a schematic configuration diagram illustrating a sealing structure of an electronic device according to a second embodiment of the present invention.

FIG. 6 is a schematic view showing a crown member according to a second embodiment.

FIG. 7 is a schematic configuration diagram illustrating a sealing structure of an electronic device according to a third embodiment of the present invention.

FIG. 8 is a schematic diagram showing a case of the third embodiment.

FIG. 9 is a schematic view showing a case of a fourth embodiment of the present invention.

FIG. 10 is a schematic configuration diagram showing a conventional electronic device sealing structure.

[Explanation of symbols]

 10, outer case 11, 42, 52, bottom 12, 43, 53, convex wall 15, inner case 16, 41, filling hole Reference numeral 20: Partition member 21: Wall surface 22: Small area 25: Electronic device 26:・ ・ Substrate 27 ・ ・ ・ ・ ・ ・ ・ ・ ・ Electronic parts 28 ・ ・ ・ ・ ・ ・ ・ ・ ・ Resin sealing member 30 ・ ・ ・ ・ ・ ・ ・ ・ ・ Covering members 40, 50 ・ ・ ・ ・ ・ Case 44 ・..... Taper 51 ......... Elongated hole

Continued on the front page F term (reference) 4E360 AB02 AB14 AB55 AB59 CA02 CA05 EA03 EA12 EA27 EB04 ED07 ED22 EE02 EE07 FA02 GA13 GA14 GA24 GA28 GA29 GA33 GB91 GC02 GC08 GC13 GC15

Claims (15)

[Claims] 1. A material having good adhesion between a bottomed outer casing case having an opening on one surface and a resin sealing member, and having an inner shape inside the opening of the outer casing case. An inner case formed in a cylindrical shape with substantially the same opening, wherein the inner case is inserted into the outer case, and the resin sealing member is provided inside the inner case and the outer case where electronic components are positioned. A sealing structure for an electronic component, characterized by being filled with a resin. 2. The electronic component sealing structure according to claim 1, wherein a convex wall is formed at a bottom of the outer case so as to conform to an inner shape of an opening of the inner case. 3. The electronic component sealing structure according to claim 1, wherein a plurality of holes filled with the resin sealing member are formed in the inner case. 4. A material having good adhesion between a bottomed outer casing case having an opening in one surface and a resin sealing member, and having a cross section of U
And a mounting member formed in a shape of a letter so as to be mountable in the opening of the outer housing case, wherein the mounting member is mounted in the opening of the outer housing case, and the electronic component is positioned. A sealing structure for an electronic component, wherein the resin sealing member is filled inside a case and the crown member. 5. A material having good adhesion between a bottomed outer casing case having an opening formed on one surface and a resin sealing member, and having a shape inside the opening of the outer casing case. Substantially the same, comprising a saw-shaped partition member partitioned into a plurality of small areas by a wall surface, the partition member is provided above the electronic component positioned in the outer case, and inside the outer case. A sealing structure for an electronic component, wherein the sealing structure is filled with the resin sealing member. 6. A material having good adhesion between a bottomed outer casing case having an opening on one surface and a resin sealing member, and having an inner shape inside the opening of the outer casing case. An inner case formed in a cylindrical shape having substantially the same opening; and a material having good adhesiveness to the resin sealing member, substantially equal to the inner shape of the opening of the outer casing case, and partitioned into a plurality of small areas by wall surfaces. A partition member in the shape of a slender saw, wherein the inner case is inserted into the outer case, and the partition member is provided above the electronic component positioned in the inner case, and the outer case and the inner case are provided. A sealing structure for an electronic component, wherein the resin sealing member is filled inside. 7. A sealing structure for an electronic component according to claim 6, wherein a convex wall is formed at a bottom portion of said outer case so as to conform to an inner shape of an opening of said inner case. 8. The electronic component sealing structure according to claim 6, wherein a plurality of holes filled with the resin sealing member are formed in the inner case. 9. A material having good adhesion between a bottomed outer casing case having an opening on one surface and a resin sealing member, and having a cross section of U
A crown member formed in a character shape and attachable to the opening of the outer casing case, a material having good adhesiveness to a resin sealing member, and substantially equal to the inner shape of the opening of the outer casing case; A rectangular-shaped partition member partitioned into a plurality of small areas by a wall surface, wherein the mounting member is attached to an opening of the outer casing case, and the electronic component positioned in the outer casing case is disposed above the electronic component. A sealing structure for an electronic component, wherein a partition member is provided, and the inside of the outer casing case and the mounting member is filled with the resin sealing member. 10. A sealing structure for an electronic component in which a resin sealing member is filled and sealed in a case in which an electronic component is positioned, wherein a filling hole for the resin sealing member is formed in the case. Features a sealed structure for electronic components. 11. The electronic component sealing structure according to claim 10, wherein the filling hole is provided with a gradient so as to be greatly widened from the inside to the outside of the case. 12. The case according to claim 1, wherein the filling hole is a long hole, and the long hole is formed in a plurality of steps substantially parallel to an opening surface of the case, and ends of the long hole overlap each other to form an outer periphery of the case. 12. The circuit of claim 10 or claim 11, wherein
The sealing structure of the electronic component described. 13. A case having an opening formed on one surface and having a bottom and a filling hole for a resin sealing member, and a material having good adhesiveness to the resin sealing member, A rectangular-shaped partition member divided into a plurality of small areas by a wall surface substantially equal to the inner shape of the opening, wherein the partition member is provided above the electronic component positioned in the case, and the resin is provided in the case. A sealing structure for electronic parts, characterized by being filled with a sealing member. 14. The sealing structure for an electronic component according to claim 13, wherein the filling hole is provided with a gradient so as to greatly expand from the inside to the outside of the case. 15. The filling hole is a long hole, and the long hole is substantially parallel to an opening surface of the case, and ends of the long holes formed in a plurality of steps overlap each other to form an outer periphery of the case. 15. The circuit according to claim 13, wherein
Sealing structure for electronic components.