JP2000101009A - Lead bender and lead bending method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead bending method which can mold a lead terminal into T shape with less processes, using a lead bender simple of structure and excellent in wide utility, in a lead bending method which bends a plurality of lead terminals planted on the package of a lead relay into J shape from the bases. SOLUTION: For a lead bender, the die 51 for bearing a lead terminal 12 has a terminal bearing part 53 to bear the lead terminal 12, and a winding part 54 semicircular in cross section projected from the terminal bearing part 53. Further, the die has a fixed pad 56 and a molding punch 52 where a molding punch 52 to mold the free end side of the lead terminal 12 into circular form is retained slidably by the punch body 55 shifting in the direction crossing the lead terminal 12. The fixed pad 56 shifts in the direction crossing the lead terminal 12 and energizes the lead terminal 12 capable of catch by a spring, and the molding pad 57 shifts in parallel with the lead terminal 12, and it is energized capably of abutment on the winding part 54 by a spring 58.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead bending method for bending a plurality of lead terminals implanted in a reed relay package into a J-shape from the base. The present invention relates to a lead bending apparatus and a lead bending method that can be formed into a J-shape in a process.

2. Description of the Related Art In general, surface-mounted electronic components such as reed relays have lead terminals bent in a J shape from the vicinity of the base. A method has been developed.

However, unlike an IC package whose external shape is almost standardized, the external shape of an electronic component such as a reed relay is irregular, and the lead terminal of each electronic component is bent in a J-shape. It is necessary to prepare a lead bending device suitable for the external shape.

[0004] Therefore, there is a demand for a lead bending method which has a simple structure, is excellent in versatility, and can be formed into a J-shape in a small number of steps of lead terminals.

[0005]

FIG. 3 is a perspective view showing an example of a reed relay, and FIG. 4 is a side sectional view showing a conventional reed bending method.

As shown in FIG. 3A, a reed relay 1 to which the present invention is applied has a relay body (not shown) packaged.
A package in which a plurality (eight in the figure) of lead terminals 12 sealed in the relay body 11 are formed of resin.
11 are planted on both sides.

The reed relay 1 mounted on a relatively large printed circuit board may have the lead terminals 12 on both sides offset and bent, but the reed relay 1 surface-mounted in a limited space is shown in FIG. 3 (b). As shown, the lead terminal 12 is bent into a J-shape.

In the case of an IC package containing a highly integrated circuit element or the like, surface mounting on a printed circuit board is a general method, and a method of bending lead terminals of the IC package into a J-shape to enable surface mounting. Has already been put to practical use.

For example, in the case of the lead terminal forming method of the IC package shown in FIG. 4, the lead terminal is formed in three steps of diagonal bending, vertical bending and curling, and is implanted in the IC package 13 by using a dedicated mold in each step. The plurality of lead terminals 14 are simultaneously formed.

The oblique bending die 2 comprises an oblique bending die 21 for supporting the back side of the lead terminal 14 and a forming punch 22, as shown in FIG. A pad 23 for holding the lead terminal 14 and a tip forming punch 24 for forming the terminal.

The oblique bending die 21 and the tip forming punch 24 have a slope 25 which bends the lead terminal 14 obliquely from the root and forms an arc at the tip. The lead terminal 14 of the IC package 13 formed in the oblique bending process is It is bent obliquely and a small arc is formed at the tip.

The vertical bending mold 3 is an IC as shown in FIG.
It is composed of a vertical bending die 31 for supporting the back surface of the package 13 and a forming punch 32. The forming punch 32 has a pad 33 for holding the IC package 13 with the vertical bending die 31, and a vertical bending punch for vertical bending.

A vertical bending punch 34 provided at a position facing the lead terminal 14 has a corner 35 in contact with the lead terminal 14 having an R
The lead terminal 14 which has been processed into a shape and is obliquely bent in the oblique bending step is vertically bent by the vertical bending punch 34 as the forming punch 32 descends.

The curling mold 4 has a curling die 41 for forming the lead terminal 14 into an arc shape and a pressing pad 42 as shown in FIG. 4C, and the curling die 41 is bent vertically in a vertical bending step. It has a curling groove 43 for forming the lead terminal 14 into an arc shape.

The IC package 13 having the lead terminals 14 bent vertically is placed on the curling die 41 and pressed by a pressing pad.
When the lead 42 is lowered, the tip of the lead terminal 14 having a small arc moves along the cylindrical surface of the curling groove 43 and curves inward to be formed into an arc.

[0016]

The conventional lead bending method shown in the figure is an IC whose outer shape is almost standardized and which is processed in a large amount.
The lead terminals implanted in the IC package can be molded simultaneously for the package lead bending, and the molding process is 3
Even if it is divided into steps, the increase in manufacturing cost is small.

However, in the case of an electronic component such as a reed relay, the external shape of the package is indefinite and may vary from one model to another. It is necessary to prepare a mold corresponding to each process for each case.

In addition, in the case of a reed relay, when the production volume is divided for each model, the number of each model is extremely smaller than that of an IC package. There is a problem that a mold is required and the production cost rises.

An object of the present invention is to provide a lead bending method which has a simple structure, is excellent in versatility, and can be formed into a J-shape in a small number of steps for lead terminals.

[0020]

FIG. 1 is a side sectional view showing a lead bending method according to the present invention. The same object is denoted by the same symbol throughout the drawings.

The above problem has at least a die 51 for supporting the lead terminal 12 of the electronic component, and a forming punch 52 for forming the free end side of the lead terminal 12 into an arc shape. Terminal bearing part 53 for supporting
A cross-section projecting from 53 to the free end side of the lead terminal 12 has a semicircular winding portion 54, and the forming punch 52 has a lead terminal.
The punch body 55 has a fixed pad 56 and a forming pad 57 slidably held by a punch body 55 that moves in a direction intersecting with the lead terminal 12. The molding pad 57 is moved in a direction parallel to the lead terminal 12 so that the leading end having a semicircular cross section hits the winding part 54. When the forming punch 52 is lowered during molding by the spring 58 so that it can be contacted, the root side of the lead terminal 12 is sandwiched between the fixed pad 56 and the terminal support portion 53, and when the forming punch 52 further lowers, the lead terminal is lowered.
This is achieved by the lead bending apparatus of the present invention in which the free end side of the lead terminal 12 is sandwiched between the winding portion 54 and the forming pad 57, and the free end side of the lead terminal 12 is wound around the winding portion 54.

When the forming punch descends during molding in this manner, the root side of the lead terminal is sandwiched between the fixing pad and the terminal support portion, and when the forming punch further descends, the free end side of the lead terminal is formed with the winding portion. By using the lead bending apparatus of the present invention in which the free end side of the lead terminal is wound around the winding portion and formed between the pad and the pad, the arc portion of the lead terminal can be formed in one step. Become.

Therefore, for example, by applying the L-shaped bending step of bending the root of the lead terminal into an L-shape after the arc bending step, the lead terminal of the electronic component can be bent into the J-shape in two steps. Moreover, by bending the lead terminals implanted in the package twice and processing them separately on the left and right, it is possible to process them with the same mold even if the external shape is slightly different for each model. Soaring can be prevented. It is also possible to use a dedicated mold as in the conventional example, and to simultaneously perform bending of all lead terminals implanted in the package.

That is, it is possible to realize a lead bending method which has a simple structure, is excellent in versatility, and can be formed into a J-shape with a small number of steps for lead terminals.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 2 is a side sectional view showing the arc bending method according to the present invention.

The lead bending apparatus according to the present invention comprises an arc bending mold 5 for forming a lead terminal in an arc shape and an L-shaped L-shaped bending terminal.
As shown in FIG. 1 (a), the arc bending die 5 has a die 51 for supporting the package 11 and a forming punch 52 which moves up and down during forming.

The die 51 has a terminal supporting portion 53 for holding the package 11 in a predetermined position and abutting against and supporting the lower surface of the lead terminal 12 at the base side. The semicircular winding part 54 is the lead terminal 12
Project to the free end side of the.

On the other hand, the forming punch 52 includes a punch body 55 which is located above the die 51 and moves in a direction orthogonal to the lead terminals 12 at the time of forming, and has a fixed pad 56 and a forming end having a semicircular shape. The forming pad 57 is slidably held by the punch body 55.

The fixing pad 56 disposed at a position facing the terminal support 53 is movably held in a direction orthogonal to the lead terminal 12, and holds the lead terminal 12 between the terminal support 53 and the terminal pad 53 during molding. It is urged by a spring (not shown) so as to be able to do so.

A forming pad 57 whose tip is opposed to the winding portion 54 is held so as to be movable in a direction parallel to the lead terminal 12, and the free end of the lead terminal 12 is moved as the forming punch 52 descends. It is urged by a spring 58 so as to be pressed and formed on the winding portion 54.

At the time of molding, when the package 11 is placed at a predetermined position on the die 51 and the forming punch 52 is lowered, first, as shown in FIG. 2A, the end face of the fixing pad 56 comes into contact with the lead terminal 12, and The base side of the terminal 12 is sandwiched between the terminal support portion 53 and the fixing pad 56.

By further lowering the forming punch 52, the fixing pad 56 is pushed into the punch body 55 as shown in FIG. 2 (b), and the free ends of the lead terminals 12 are formed so that their opposing ends are semicircular. It is wound between the formed winding portion 54 and the formed pad 57.

The tip of the molding pad 57, which is formed in a semicircular shape as the molding punch 52 descends, moves while squeezing the surface of the lead terminal 12, and as shown in FIG. Are pressed against the winding portion 54 by the forming pad 57 and are sequentially formed into an arc shape.

The L-shaped bending mold 6 has an L-shaped bending die 61 for supporting the package 11 and an L-shaped bending punch 62 which moves up and down, as shown in FIG. The package 11 formed into an arc shape is formed by an L-shaped bending die 61 at the time of forming.
At a predetermined position.

The L-shaped bending punch 62 moves up and down and bends the lead terminal 12 whose free end is formed into an arc shape from the base into an L-shape. The forming punch 63 is slidably held in the vertical direction by the forming punch 63. A pad 64 for holding the package 11 between the L-shaped bending die 61 is provided.

When the package 11 is placed on the L-shaped bending die 61 and the L-shaped bending punch 62 is lowered, first, the pad 64 holds the package 11, and then the L-shaped bending punch 62 is connected to the lead terminal.
As the corner portion moves while squeezing the surface in contact with 12, it is bent into an L-shape.

When the forming punch descends during the molding as described above, the root side of the lead terminal is sandwiched between the fixing pad and the terminal supporting portion. When the forming punch further descends, the free end side of the lead terminal forms the winding portion. By using the lead bending apparatus of the present invention in which the free end side of the lead terminal is wound around the winding portion and formed between the pad and the pad, the arc portion of the lead terminal can be formed in one step. Become.

Therefore, for example, by applying an L-shaped bending step of bending the base of the lead terminal into an L shape after the arc bending step, the lead terminal of the electronic component can be bent into a J shape in two steps. Moreover, by bending the lead terminals implanted in the package twice and processing them separately on the left and right, it is possible to process them with the same mold even if the external shape is slightly different for each model. Soaring can be prevented. It is also possible to use a dedicated mold as in the conventional example, and to simultaneously perform bending of all lead terminals implanted in the package.

That is, it is possible to realize a lead bending method which has a simple structure, is excellent in versatility, and is capable of forming a lead terminal into a J-shape in a small number of steps.

[0040]

As described above, according to the present invention, it is possible to provide a lead bending method which has a simple structure, is excellent in versatility, and can form a lead terminal into a J-shape in a small number of steps.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a lead bending method according to the present invention.

FIG. 2 is a side sectional view showing an arc bending method according to the present invention.

FIG. 3 is a perspective view showing an example of a reed relay.

FIG. 4 is a side sectional view showing a conventional lead bending method.

[Explanation of symbols]

 5 Arc bending die 6 L-shaped bending die 11 Package 12 Lead terminal 51 Die 52 Molded punch 53 Terminal support 54 Winding part 55 Punch body 56 Fixed pad 57 Molded pad 58 Spring 61 L-shaped bending die 62 L-shaped bending punch 63 Forming punch 64 Pad

Claims (2)

[Claims] 1. A die for supporting at least a lead terminal of an electronic component, and a forming punch for forming a free end side of the lead terminal into an arc shape, wherein the die supports a lower surface of the lead terminal. A punch having a semicircular cross section projecting from the terminal support to the free end of the lead terminal from the terminal support, wherein the forming punch moves in a direction intersecting the lead terminal; A fixing pad and a molding pad slidably held by the main body, the fixing pad moving in a direction intersecting with the lead terminal, and being capable of holding the lead terminal between the terminal supporting portion and the fixing pad; The forming pad moves in a direction parallel to the lead terminal, and is urged by a spring so that a tip having a semicircular cross section can contact the winding portion. The forming punch descends The root side of the lead terminal is sandwiched between the fixing pad and the terminal supporting portion, and when the forming punch further descends, the free end side of the lead terminal is sandwiched between the winding portion and the forming pad. And a free end side of the lead terminal is wound around the winding portion. 2. A method for bending a lead terminal of an electronic component into a J-shape, wherein the free end side of the lead terminal is formed into an arc shape, and a root of the lead terminal is bent into an L shape. An L-shaped bending step, wherein in the arc bending step, the free end side of the lead terminal is formed into an arc shape by the lead bending device.