JP2000089184A - Structure for fixing optical waveguide element - Google Patents

Structure for fixing optical waveguide element

Info

Publication number
JP2000089184A
JP2000089184A JP25478698A JP25478698A JP2000089184A JP 2000089184 A JP2000089184 A JP 2000089184A JP 25478698 A JP25478698 A JP 25478698A JP 25478698 A JP25478698 A JP 25478698A JP 2000089184 A JP2000089184 A JP 2000089184A
Authority
JP
Japan
Prior art keywords
optical waveguide
waveguide element
substrate
adhesive
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP25478698A
Other languages
Japanese (ja)
Inventor
Jungo Kondo
順悟 近藤
Akira Hamashima
章 浜島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP25478698A priority Critical patent/JP2000089184A/en
Publication of JP2000089184A publication Critical patent/JP2000089184A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a new structure for fixing an optical waveguide element to reduce optical loss during an operation for the optical waveguide device using an optical waveguide element which is relatively small in the thickness of at least a portion where electrodes are formed and enables high speed modulation. SOLUTION: An optical waveguide element 10 is provided with a substrate 1 which is provided with a pair of main surfaces that are opposed to each other and has an electrooptical effect, an optical waveguide 2 which is formed on one of main surfaces 1A of the substrate 1, electrodes 3 which apply modulation signals to light waves that propagate in the waveguide 2, and a thin thickness portion 5 which is formed at least at the position where the electrodes 3 are located on the substrate 1 and has a relatively thin thickness. The element 10 is fixed to a plate shaped member 12 by first fixing adhesive 13. The member 12 is fixed to a base 11 by second fixing adhesive 15 so that the member 12 is placed between the element 10 and a casing 11.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、光導波路素子の固
定構造に関し、特に、高速変調が可能な進行波型光導波
路デバイスとして好適に使用することのできる光導波路
素子の固定構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical waveguide device fixing structure, and more particularly to an optical waveguide device fixing structure that can be suitably used as a traveling wave type optical waveguide device capable of high-speed modulation.

【0002】[0002]

【従来の技術】近年、高速・大容量の光ファイバ通信シ
ステムの進歩に伴う外部変調器として光導波路デバイス
が用いられている。このような外部変調器は高速スイッ
チの条件下において使用されるため、前記のような外部
変調器に使用する光導波路デバイスには高速変調特性が
要求される。このため、光導波路デバイスを構成する光
導波路素子の変調信号印加用の電極の形状を特殊な形状
としたり、前記電極と光導波路素子を構成する基板との
間に二酸化ケイ素などのバッファ層を形成したりする試
みがなされていた。
2. Description of the Related Art In recent years, optical waveguide devices have been used as external modulators with the progress of high-speed, large-capacity optical fiber communication systems. Since such an external modulator is used under the condition of a high-speed switch, a high-speed modulation characteristic is required for an optical waveguide device used for the above-mentioned external modulator. For this reason, the shape of the modulation signal application electrode of the optical waveguide device constituting the optical waveguide device is made to have a special shape, or a buffer layer such as silicon dioxide is formed between the electrode and the substrate constituting the optical waveguide device. Or attempts were made to do so.

【0003】しかしながら、前記電極の作製工程の複雑
さに伴うコスト高や、バッファ層を形成した際の電極の
位置合わせ精度が劣化するという理由から、本出願人は
特願平9−85579号において、光導波路素子を構成
する基板の少なくとも電極が形成されている部分の厚さ
を相対的に小さくすることによって、上記のような問題
を伴わない高速変調が可能な光導波路素子が発明された
ことに基づき、この光導波路素子について出願を行って
いる。
However, the applicant of the present application has disclosed in Japanese Patent Application No. 9-85579 because of the high cost associated with the complexity of the electrode manufacturing process and the deterioration of the electrode alignment accuracy when the buffer layer is formed. An optical waveguide device capable of high-speed modulation without the above-described problem has been invented by relatively reducing the thickness of at least the portion of the substrate constituting the optical waveguide device where the electrodes are formed. Based on the above, an application has been filed for this optical waveguide element.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、このよ
うな光導波路素子を台座、さらには筺体に固定して実装
し、上記のような光導波路デバイスとして使用すると、
相対的に厚さが小さい部分を設けない従来の光導波路素
子を実装して光導波路デバイスとして使用した場合に比
べ、動作時の光損失が著しく増大して十分な信号強度を
得ることができないという問題があった。
However, when such an optical waveguide device is fixedly mounted on a pedestal or a housing and used as an optical waveguide device as described above,
Compared to a case where a conventional optical waveguide element having no relatively small thickness is provided and used as an optical waveguide device, light loss during operation is significantly increased and sufficient signal strength cannot be obtained. There was a problem.

【0005】本発明は、少なくとも電極が形成されてい
る部分の厚さを相対的に小さくして、高速変調を可能に
した光導波路素子を用いた光導波路デバイスにおいて、
動作時の光損失を低減するための、新たな光導波路素子
の固定構造を提供することを目的とする。
The present invention relates to an optical waveguide device using an optical waveguide element capable of high-speed modulation by reducing the thickness of at least a portion where an electrode is formed.
An object of the present invention is to provide a new optical waveguide element fixing structure for reducing optical loss during operation.

【0006】[0006]

【課題を解決するための手段】本発明は、相対向する一
対の主面を具え、電気光学効果を有する基板と、この基
板の一方の主面に形成された光導波路と、この光導波路
を導波する光波に変調信号を印加するための電極と、前
記基板の少なくとも前記電極が位置する部分に形成され
た、相対的に厚さが小さい薄肉部分とを具えた光導波路
素子を台座に固定して、前記光導波路素子を実装するた
めの光導波路素子の固定構造であって、前記光導波路素
子を所定の部材に接着固定するとともに、前記所定の部
材を前記台座に接着固定し、前記光導波路素子を前記所
定の部材を介在させて前記台座に固定したことを特徴と
する、光導波路素子の固定構造である。
SUMMARY OF THE INVENTION The present invention provides a substrate having a pair of opposing main surfaces and having an electro-optic effect, an optical waveguide formed on one main surface of the substrate, and an optical waveguide formed on one of the main surfaces. An optical waveguide device having an electrode for applying a modulation signal to a guided light wave and a thin portion having a relatively small thickness formed at least in a portion where the electrode is located on the substrate is fixed to a pedestal. A fixing structure of the optical waveguide element for mounting the optical waveguide element, wherein the optical waveguide element is bonded and fixed to a predetermined member, and the predetermined member is bonded and fixed to the pedestal; A fixing structure of an optical waveguide element, wherein a waveguide element is fixed to the base with the predetermined member interposed therebetween.

【0007】本発明者は、高速変調を可能にした、少な
くとも電極が形成されている部分の厚さを相対的に小さ
くした光導波路素子を、台座に固定して実装した場合に
おける光損失の原因を突き止めるべく研究を重ねた結
果、以下の事実を発見した。
The present inventor has found that an optical waveguide element which enables high-speed modulation and has at least a relatively thin portion at which an electrode is formed is fixed to a pedestal and causes a light loss. As a result of repeated research to find out, we found the following facts.

【0008】すなわち、光導波路素子を実装して光導波
路デバイスとし、この光導波路デバイスを、例えば、光
変調器として使用した場合、動作時においては、このデ
バイスの環境温度が約ー40〜80℃の間で変化する。
すると、光導波路素子と台座との間には、前記環境温度
の変化に伴う熱収縮に起因した熱応力が発生し、前記光
導波路素子は前記台座から熱応力を受ける。一般に、光
導波路素子が一様な板状の基板から構成されている場合
においては、前記熱応力は基板に対して均一に分散する
傾向が強いが、上記のように基板に薄肉部分を形成した
光導波路素子では、前記基板の薄肉部分に応力が集中す
る傾向が強くなる。したがって、薄肉部分の周辺におけ
る基板の屈折率が変化し、これによって、光導波路を導
波する光波が影響を受け、光損失が増大するものであ
る。本発明は、発明者らの上記発見に基づいてなされた
ものである。
That is, when an optical waveguide device is mounted on an optical waveguide device, and this optical waveguide device is used, for example, as an optical modulator, the ambient temperature of the device during operation is about -40 to 80 ° C. Vary between.
Then, a thermal stress is generated between the optical waveguide element and the pedestal due to the thermal shrinkage accompanying the change in the environmental temperature, and the optical waveguide element receives the thermal stress from the pedestal. In general, when the optical waveguide element is formed of a uniform plate-shaped substrate, the thermal stress tends to be uniformly dispersed in the substrate, but a thin portion is formed on the substrate as described above. In the optical waveguide element, stress tends to concentrate on a thin portion of the substrate. Therefore, the refractive index of the substrate in the vicinity of the thin portion changes, which affects the light wave guided through the optical waveguide, and increases the light loss. The present invention has been made based on the above findings of the inventors.

【0009】図1は本発明の光導波路素子の固定構造に
おいて使用する光導波路素子の一例を示す斜視図であ
り、図2及び3は図1に示す光導波路素子を台座に固定
して形成した、本発明の光導波路素子の固定構造の一例
を示した部分断面図である。図2及び3は、図1のIー
I線に沿って切った断面を矢印方向に見た場合について
示している。
FIG. 1 is a perspective view showing an example of an optical waveguide element used in the fixing structure of the optical waveguide element of the present invention. FIGS. 2 and 3 show the optical waveguide element shown in FIG. 1 fixed to a pedestal. FIG. 2 is a partial cross-sectional view showing an example of a fixing structure of the optical waveguide element of the present invention. 2 and 3 show a cross section taken along line II of FIG. 1 when viewed in the direction of the arrow.

【0010】図1に示す光導波路素子10は、電気光学
効果を有する基板1の主面1Aにマッハツエンダー型の
光導波路2と、この光導波路2中を導波する光波に変調
信号を印加するための電極3とが形成されている。さら
に、光導波路2及び電極3が形成された基板1の主面1
Aと反対側の主面1Bに、前記電極3が位置する部分に
おいて凹部4が形成され、図2に示すような基板1の薄
肉部分5を構成している。
In an optical waveguide device 10 shown in FIG. 1, a Mach-Zehnder optical waveguide 2 is applied to a main surface 1A of a substrate 1 having an electro-optic effect, and a modulation signal is applied to a light wave guided through the optical waveguide 2. Electrodes 3 are formed. Further, the main surface 1 of the substrate 1 on which the optical waveguide 2 and the electrode 3 are formed
A concave portion 4 is formed in a portion of the main surface 1B opposite to the portion A where the electrode 3 is located, thereby forming a thin portion 5 of the substrate 1 as shown in FIG.

【0011】図2及び3に示す光導波路素子の固定構造
は、図1に示す光導波路素子10を構成する基板1の主
面1Bを板状の部材12と第1の固定用接着剤13で固
定するとともに、この板状の部材12を台座11と第2
の固定用接着剤15で固定し、台座11と光導波路素子
10との間に板状の部材12を介在させている。
In the fixing structure of the optical waveguide device shown in FIGS. 2 and 3, the main surface 1B of the substrate 1 constituting the optical waveguide device 10 shown in FIG. 1 is covered with a plate-shaped member 12 and a first fixing adhesive 13. The plate-like member 12 is fixed to the pedestal 11 and the second
And a plate-like member 12 is interposed between the pedestal 11 and the optical waveguide element 10.

【0012】このように、光導波路素子10を板状の部
材12を介して台座11に固定することにより、上記動
作時の環境温度変化によって光導波路素子10に生じる
台座11からの応力が、板状の部材12によって緩和さ
れ、上記のように基板の薄肉部分に応力が集中すること
がなくなる。したがって、このような光導波路素子から
光導波路デバイスを構成した場合において、光損失の増
大を防止することができる。
As described above, by fixing the optical waveguide element 10 to the pedestal 11 via the plate-shaped member 12, the stress from the pedestal 11 generated in the optical waveguide element 10 due to the environmental temperature change during the operation described above is reduced. The stress is relaxed by the member 12 and the stress is not concentrated on the thin portion of the substrate as described above. Therefore, when an optical waveguide device is formed from such an optical waveguide element, an increase in optical loss can be prevented.

【0013】[0013]

【発明の実施の形態】以下、本発明の光導波路素子の固
定構造を、図面と関連させながら発明の実施の形態に基
づいて詳細に説明する。図2は上述したように、本発明
の光導波路素子の固定構造の一例を示す図である。図2
では、光導波路素子10の基板1の主面1B側に形成さ
れた、薄肉部分5を構成する凹部4を充填用接着剤14
で充填させるとともに、第1の固定用接着剤13を板状
の部材12の主面12Aと基板1の主面1Bとに塗布
し、板状の部材12と光導波路素子10とを固定してい
る。このように充填用接着剤14で凹部4内を充填す
る、すなわち、光導波路素子10の薄肉部分5と板状の
部材12とのすき間を埋めるように接着剤を塗布するこ
とにより、薄肉部分5への台座11からの応力集中をさ
らに低減でき、本発明の目的をより良く達成することが
できる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a fixing structure of an optical waveguide device according to the present invention will be described in detail based on an embodiment of the present invention with reference to the drawings. FIG. 2 is a view showing an example of the fixing structure of the optical waveguide element of the present invention as described above. FIG.
Then, the concave portion 4 forming the thin portion 5 formed on the main surface 1B side of the substrate 1 of the optical waveguide element 10 is filled with the filling adhesive 14.
And the first fixing adhesive 13 is applied to the main surface 12A of the plate-shaped member 12 and the main surface 1B of the substrate 1, and the plate-shaped member 12 and the optical waveguide element 10 are fixed. I have. As described above, the inside of the concave portion 4 is filled with the filling adhesive 14, that is, the adhesive is applied so as to fill the gap between the thin portion 5 of the optical waveguide element 10 and the plate-shaped member 12, thereby forming the thin portion 5. The stress concentration from the pedestal 11 can be further reduced, and the object of the present invention can be better achieved.

【0014】図3は、本発明の光導波路素子の固定構造
の他の例を示す部分断面図である。図3では、凹部4内
に充填用接着剤14を充填することなく、第1の固定用
接着剤13を板状の部材12の主面12Aと基板1の主
面1Bとに塗布し、板状の部材12と光導波路素子10
とを固定している。すなわち、光導波路素子10の薄肉
部分5と板状の部材12との間に接着剤が存在しないよ
うにして接着剤を塗布し、光導波路素子10と板状の部
材12とを接着固定している。図3に示すような固定構
造をとると、凹部4内に空気層が存在するため高速変調
が可能となるとともに、接着剤自体に生じる熱応力が小
さくなることに起因して、上述したような薄肉部分5へ
の応力集中をさらに低減することができ、本発明の目的
をさらに効果的に達成することができる。
FIG. 3 is a partial sectional view showing another example of the fixing structure of the optical waveguide element of the present invention. In FIG. 3, the first fixing adhesive 13 is applied to the main surface 12A of the plate-like member 12 and the main surface 1B of the substrate 1 without filling the filling adhesive 14 in the concave portion 4. Member 12 and optical waveguide element 10
And fixed. That is, an adhesive is applied so that no adhesive is present between the thin portion 5 of the optical waveguide element 10 and the plate-shaped member 12, and the optical waveguide element 10 and the plate-shaped member 12 are bonded and fixed. I have. When the fixing structure shown in FIG. 3 is adopted, high-speed modulation is possible due to the presence of the air layer in the concave portion 4, and the thermal stress generated in the adhesive itself is reduced, as described above. Stress concentration on the thin portion 5 can be further reduced, and the object of the present invention can be achieved more effectively.

【0015】図2及び3の光導波路素子の固定構造で
は、光導波路素子10と台座11との間に、板状の部材
12を介在させているが、光導波路素子と台座との間に
介在させる部材は、必ずしも板状である必要はなく、本
発明の目的を達成できるものであれば、光導波路デバイ
スとして使用する形態に応じて、任意の形態のものを使
用することができる。
In the fixing structure of the optical waveguide element shown in FIGS. 2 and 3, a plate-like member 12 is interposed between the optical waveguide element 10 and the pedestal 11, but is interposed between the optical waveguide element and the pedestal. The member to be formed does not necessarily have to be plate-shaped, and any member can be used as long as the object of the present invention can be achieved, depending on the form used as the optical waveguide device.

【0016】但し、対称性かつ加工性の理由から光導波
路素子と台座との間に介在させる部材は板状であること
が好ましく、このように板状の部材12を使用した場
合、本発明の目的をよりよく達成すべく、その厚さtは
0.2〜2mmであることが好ましい。
However, the member interposed between the optical waveguide element and the pedestal is preferably plate-shaped for reasons of symmetry and workability. When such a plate-shaped member 12 is used, the present invention is applied. In order to better achieve the object, the thickness t is preferably 0.2 to 2 mm.

【0017】また、板状の部材12に使用する材料につ
いても、本発明の目的を達成できるものであれば特に限
定されないが、板状の部材12と光導波路素子10との
間で発生する熱応力を小さくして、台座11からの熱応
力を緩和する効果を向上させるという観点からは、光導
波路素子10を構成する基板1と同じ材料から形成する
ことが好ましい。
The material used for the plate-shaped member 12 is not particularly limited as long as the object of the present invention can be achieved, but the heat generated between the plate-shaped member 12 and the optical waveguide element 10 is not limited. From the viewpoint of reducing the stress and improving the effect of relaxing the thermal stress from the pedestal 11, it is preferable to form the optical waveguide element 10 from the same material as the substrate 1.

【0018】基板1として使用できる材料は、電気光学
効果を有することが必要であるため、板状の部材12と
して使用できる材料の具体例としては、ニオブ酸リチウ
ム、ニオブ酸カリウムリチウム、タンタル酸リチウム、
KTP、ガラス、シリコン、GaAs及び水晶などを例
示することができる。
Since the material that can be used as the substrate 1 needs to have an electro-optical effect, specific examples of the material that can be used as the plate-like member 12 include lithium niobate, potassium lithium niobate, and lithium tantalate. ,
Examples include KTP, glass, silicon, GaAs, and quartz.

【0019】第1及び第2の固定用接着剤13及び15
としては、エポキシ系接着剤や紫外線硬化性接着剤の
外、ニオブ酸リチウムなどの電気光学効果を有する材料
と比較的近い熱膨張係数を有するアロンセラミックスC
(商品名、東亜合成社製)(熱膨張係数13×10-6
など、公知の接着剤を使用することができる。また、第
1の固定用接着剤13及び第2の固定用接着剤15は、
同一であってもよいし、異なっていてもよい。
First and second fixing adhesives 13 and 15
Examples include epoxy-based adhesives and UV-curable adhesives, as well as Alon ceramics C having a coefficient of thermal expansion relatively close to materials having an electro-optical effect such as lithium niobate.
(Product name, manufactured by Toa Gosei Co., Ltd.) (Coefficient of thermal expansion 13 × 10 -6 )
For example, a known adhesive can be used. In addition, the first fixing adhesive 13 and the second fixing adhesive 15
They may be the same or different.

【0020】充填用接着剤14としては、上記第1及び
第2の固定用接着剤13及び15と同じ接着剤あるいは
低誘電率を有するポリイミドが使用できる。実際の使用
においては、上記第1及び第2の固定用接着剤13と同
じ種類の接着剤が好ましいが、異なるポリイミドなどの
樹脂を用いてもよい。
As the filling adhesive 14, the same adhesive as the first and second fixing adhesives 13 and 15 or a polyimide having a low dielectric constant can be used. In actual use, the same type of adhesive as the first and second fixing adhesives 13 is preferable, but a different resin such as polyimide may be used.

【0021】第1の固定用接着剤13の塗布厚は、基板
1の主面1B及び板状の部材12の主面12Aにおい
て、2〜10μmであることが好ましく、第2の固定用
接着剤15の塗布厚は、台座11の主面11A及び板状
の部材12Bにおいて、20〜100μmであることが
好ましい。
The coating thickness of the first fixing adhesive 13 is preferably 2 to 10 μm on the main surface 1B of the substrate 1 and the main surface 12A of the plate-shaped member 12, and the second fixing adhesive is preferably used. The coating thickness of 15 is preferably 20 to 100 μm on the main surface 11A of the pedestal 11 and the plate-shaped member 12B.

【0022】図2及び3に示す本発明の光導波路素子の
固定構造は、特願平9−85579号中にも記載されて
いるように、所定の大きさを有する基板1にTi拡散法
などによって光導波路2を形成し、蒸着及びメッキ法を
併用することによってAuなどからなる電極3を形成す
る。次いで、基板1の電極3部分にレジストを塗布した
後、基板1を定盤に接着剤などで固定し、機械加工又は
レーザアブレーションによって基板1の主面1B側に凹
部4を形成し、基板1の端面を研磨した後、ダイシング
などによって基板1をチップ切断して、図1に示すよう
な光導波路素子10を得る。
The fixing structure of the optical waveguide device of the present invention shown in FIGS. 2 and 3 is, as described in Japanese Patent Application No. 9-85579, applied to a substrate 1 having a predetermined size by a Ti diffusion method or the like. Thus, the optical waveguide 2 is formed, and the electrode 3 made of Au or the like is formed by using both the vapor deposition and plating methods. Next, after a resist is applied to the electrode 3 portion of the substrate 1, the substrate 1 is fixed to a surface plate with an adhesive or the like, and a recess 4 is formed on the main surface 1B side of the substrate 1 by machining or laser ablation. After polishing the end surface of the substrate 1, the substrate 1 is cut into chips by dicing or the like to obtain an optical waveguide device 10 as shown in FIG.

【0023】機械加工としては、ダイシングやマイクロ
グラインドなどの方法を用いて行うことができる。ま
た、レーザアブレーションによって凹部4を形成する場
合は、発振レーザの単位面積当たりの強度が高いArF
及びKrFなどのエキシマレーザを使用する。
The machining can be performed by a method such as dicing or micro grinding. In the case where the recess 4 is formed by laser ablation, ArF having a high intensity per unit area of the oscillation laser is used.
And an excimer laser such as KrF.

【0024】次いで、図3に示す固定構造を得る場合
は、基板1の主面1Bの、貼り合わせする部分に第1の
固定用接着剤13を塗布し、これを板状の部材12の主
面12Aと貼り合わせて固定する。一方、図2に示す固
定構造を得る場合は、基板1の凹部4内に充填用接着剤
14を充填し、基板1の主面1Bに第1の固定用接着剤
13を塗布し、これを板状の部材12の主面Aと貼り合
わせて固定する。
Next, in order to obtain the fixing structure shown in FIG. 3, a first fixing adhesive 13 is applied to a portion of the main surface 1B of the substrate 1 to be bonded, and this is applied to the main member 1 of the plate-like member 12. It is fixed by bonding to the surface 12A. On the other hand, when obtaining the fixing structure shown in FIG. 2, the filling adhesive 14 is filled in the concave portion 4 of the substrate 1, the first fixing adhesive 13 is applied to the main surface 1B of the substrate 1, and It is bonded and fixed to the main surface A of the plate-shaped member 12.

【0025】なお、図2及び3に示す固定構造を作製す
る場合は、作業効率の観点から、上記のように基板1と
板状の部材12とを貼り合わせ、このアセンブリの端面
を研磨した後、チップ切断を行って光導波路素子10を
形成することもできる。
When manufacturing the fixing structure shown in FIGS. 2 and 3, from the viewpoint of working efficiency, the substrate 1 and the plate-like member 12 are bonded as described above, and the end face of the assembly is polished. Alternatively, the optical waveguide element 10 can be formed by cutting the chip.

【0026】次いで、板状の部材12の主面12B及び
台座11の主面11Aに第2の固定用接着剤15を塗布
して両者を貼り合わせ、図2及び3に示す光導波路素子
の固定構造を得る。
Next, a second fixing adhesive 15 is applied to the main surface 12B of the plate-shaped member 12 and the main surface 11A of the pedestal 11, and the two are adhered to each other, thereby fixing the optical waveguide element shown in FIGS. Get the structure.

【0027】[0027]

【実施例】以下、実施例により本発明を具体的に説明す
る。 実施例1 厚さ1mmのニオブ酸リチウムのxカット板を基板1と
して用い、この基板1の主面1A側にTi拡散法によっ
て光導波路2を形成し、さらに、蒸着法とメッキ法とを
併用することによって厚さ10μmのAuからなる電極
3を形成した。次いで、電極3の表面にレジストを塗布
した後、幅0.2mm、#400の砥石(砥石)を用
い、回転数30000rpm、送り速度120mm/m
inの条件で数回研磨し、さらに、幅0.1mm、#1
000の(砥石)を用いて同様に研磨を行ない、深さ
dが0.8mm、幅wが0.2mmの凹部4を形成し
た。
The present invention will be described below in detail with reference to examples. Example 1 An x-cut plate of lithium niobate having a thickness of 1 mm was used as a substrate 1, an optical waveguide 2 was formed on the main surface 1A side of the substrate 1 by a Ti diffusion method, and a vapor deposition method and a plating method were used in combination. Thus, an electrode 3 made of Au having a thickness of 10 μm was formed. Next, after applying a resist on the surface of the electrode 3, using a whetstone (grinding stone) having a width of 0.2 mm and a # 400, the number of rotations is 30,000 rpm, and the feeding speed is 120 mm / m.
polished several times under the condition of “in”, and further, 0.1 mm in width, # 1
Polishing was performed in the same manner using 000 (grinding stone) to form a concave portion 4 having a depth d of 0.8 mm and a width w of 0.2 mm.

【0028】次いで、第1の固定用接着剤13及び充填
用接着剤14としてアロンセラミックスC(商品名、東
亜合成社製)を用い、これを前記凹部4内に充填した
後、基板1の主面1Bに10μm厚さに塗布し、さらに
ニオブ酸リチウムからなる厚さ1mmの板状の部材12
の主面12Aを貼り合わせ、室温で24時間放置して第
1の固定用接着剤13及び充填用接着剤14を硬化さ
せ、基板1と板状の部材12とを固定した。次いで、こ
のようにして形成されたアセンブリの端面を研磨した
後、ダイシングによって2×10にチップ切断を行い、
次いでチップ洗浄を行って光導波路素子10を得た。
Next, Aron Ceramics C (trade name, manufactured by Toa Gosei Co., Ltd.) was used as the first fixing adhesive 13 and the filling adhesive 14, and was filled in the recess 4. A 1 μm thick plate-like member 12 made of lithium niobate is applied to the surface 1B to a thickness of 10 μm.
Then, the first fixing adhesive 13 and the filling adhesive 14 were cured by being left at room temperature for 24 hours to fix the substrate 1 and the plate-shaped member 12. Next, after polishing the end face of the assembly formed in this way, the chip is cut into 2 × 10 chips by dicing,
Next, the chip was washed to obtain an optical waveguide device 10.

【0029】次いで、第2の固定用接着剤15としてエ
ポキシ系接着剤を用い、これを板状の部材12の主面1
2Bと台座11の主面11Aに厚さ30μmに塗布し、
これらを張り合わせて固定して、図2に示す光導波路素
子の固定構造を得た。次いで、UV硬化性樹脂を用い
て、光導波路素子10の光導波路2に光ファイバ(図示
せず)を光学調芯して結合し、−40〜80℃の温度サ
イクル試験を1300回行った後の光損失を調べた。そ
の結果、本実施例における固定構造の光損失は0.2d
Bであることが判明した。
Next, an epoxy-based adhesive is used as the second fixing adhesive 15, and the epoxy-based adhesive is used as the second fixing adhesive 15.
2B and a thickness of 30 μm on the main surface 11A of the base 11,
These were adhered and fixed to obtain an optical waveguide element fixing structure shown in FIG. Next, using a UV-curable resin, an optical fiber (not shown) is optically aligned with and coupled to the optical waveguide 2 of the optical waveguide element 10, and after a temperature cycle test at -40 to 80 ° C is performed 1,300 times. Was examined for light loss. As a result, the light loss of the fixed structure in this embodiment is 0.2 d.
B was found.

【0030】実施例2 実施例1に示すように、凹部4に充填用接着剤14を充
填しなかった以外は、実施例1と同様にして図3に示す
固定構造を作製した。実施例1と同様にしてこの固定構
造の光損失を調べたところ、0.3dBであることが判
明した。
Example 2 As shown in Example 1, a fixing structure shown in FIG. 3 was produced in the same manner as in Example 1 except that the recessed portion 4 was not filled with the filling adhesive 14. When the light loss of this fixed structure was examined in the same manner as in Example 1, it was found to be 0.3 dB.

【0031】比較例 上記実施例において、板状の部材12を光導波路素子1
0と台座11の間に介在させず、台座11の主面11A
におけるエポキシ系接着剤を厚さ30μmに塗布した以
外は、上記実施例と同様にして実施した。上記実施例と
同様にしてこの固定構造の光損失を調べたところ、1.
5dBであることが判明した。
COMPARATIVE EXAMPLE In the above embodiment, the plate-like member 12 was replaced with the optical waveguide element 1.
0 and the main surface 11A of the base 11 without being interposed between the base 11 and the base 11
Was carried out in the same manner as in the above example, except that the epoxy adhesive was applied to a thickness of 30 μm. When the light loss of this fixed structure was examined in the same manner as in the above embodiment,
It turned out to be 5 dB.

【0032】以上、実施例1〜4及び比較例から明らか
なように、本発明の光導波路素子の固定構造によれば、
高速変調を可能とするために薄肉部分を形成した光導波
路素子を実装して、実際の光導波路デバイスとして使用
した場合においても、光損失の増大を防止できることが
分かる。
As apparent from Examples 1 to 4 and Comparative Example, according to the fixing structure of the optical waveguide device of the present invention,
It can be seen that an increase in optical loss can be prevented even when an optical waveguide device having a thin portion formed to enable high-speed modulation is mounted and used as an actual optical waveguide device.

【0033】以上、発明の実施の形態において、具体例
を上げて本発明を具体的説明したが、本発明の範疇を脱
しない範囲において如何なる変形及び変更をも行うこと
ができる。
As described above, the present invention has been described in detail with reference to specific examples in the embodiments of the present invention. However, various modifications and changes can be made without departing from the scope of the present invention.

【0034】[0034]

【発明の効果】以上説明したように、本発明の光導波路
素子の固定構造によれば、基板の少なくとも電極が位置
する部分に薄肉部分が形成された高速変調が可能な光導
波路素子を実装して、光導波路デバイスとして使用した
場合においても、光損失の増大を防止することができ、
実用的な高速変調光導波路デバイスの提供が可能とな
る。
As described above, according to the structure for fixing an optical waveguide element of the present invention, an optical waveguide element capable of high-speed modulation in which a thin portion is formed at least in a portion where an electrode is located on a substrate is mounted. Therefore, even when used as an optical waveguide device, an increase in optical loss can be prevented,
A practical high-speed modulated optical waveguide device can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の光導波路素子の固定構造に使用する光
導波路素子の一例を示す斜視図である。
FIG. 1 is a perspective view showing an example of an optical waveguide element used for a fixing structure of an optical waveguide element of the present invention.

【図2】本発明の光導波路素子の固定構造の一例を示す
部分断面図である。
FIG. 2 is a partial cross-sectional view showing an example of a fixing structure of the optical waveguide element of the present invention.

【図3】本発明の光導波路素子の固定構造の他の例を示
す部分断面図である。
FIG. 3 is a partial cross-sectional view showing another example of the fixing structure of the optical waveguide element of the present invention.

【符号の説明】[Explanation of symbols]

1 基板、2 光導波路、3 電極、4 凹部、5 薄
肉部分、10 光導波路素子、11 台座、12 板状
の部材、13 第1の固定用接着剤、14 充填用接着
剤、15 第2の固定用接着剤、1A,1B 基板の主
面、11A 筺体の主面、12A,12B 板状の部材
の主面、t 板状の部材の厚さ、d 凹部の深さ、w
凹部の幅
DESCRIPTION OF SYMBOLS 1 Substrate, 2 optical waveguides, 3 electrodes, 4 concave portions, 5 thin portions, 10 optical waveguide elements, 11 pedestals, 12 plate-like members, 13 first fixing adhesive, 14 filling adhesive, 15 second Fixing adhesive, 1A, 1B Main surface of substrate, 11A Main surface of housing, 12A, 12B Main surface of plate-shaped member, t Plate-shaped member thickness, d Depth of recess, w
Recess width

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】相対向する一対の主面を具え、電気光学効
果を有する基板と、この基板の一方の主面に形成された
光導波路と、この光導波路を導波する光波に変調信号を
印加するための電極と、前記基板の少なくとも前記電極
が位置する部分に形成された、相対的に厚さが小さい薄
肉部分とを具えた光導波路素子を台座に固定して、前記
光導波路素子を実装するための光導波路素子の固定構造
であって、前記光導波路素子を所定の部材に接着固定す
るとともに、前記所定の部材を前記台座に接着固定し、
前記光導波路素子を前記所定の部材を介在させて前記台
座に固定したことを特徴とする、光導波路素子の固定構
造。
1. A substrate having a pair of main surfaces opposed to each other and having an electro-optic effect, an optical waveguide formed on one main surface of the substrate, and a modulation signal applied to a light wave guided through the optical waveguide. An electrode for applying, and an optical waveguide element provided with a thin portion having a relatively small thickness, formed at least in a portion of the substrate where the electrode is located, is fixed to a base, and the optical waveguide element is fixed. A fixing structure of the optical waveguide element for mounting, wherein the optical waveguide element is adhesively fixed to a predetermined member, and the predetermined member is adhesively fixed to the pedestal,
The fixing structure of the optical waveguide element, wherein the optical waveguide element is fixed to the pedestal with the predetermined member interposed therebetween.
【請求項2】前記所定の部材は、前記基板と同じ材料か
らなることを特徴とする、請求項1に記載の光導波路素
子の固定構造。
2. The fixing structure for an optical waveguide element according to claim 1, wherein said predetermined member is made of the same material as said substrate.
【請求項3】前記所定の部材は板状であることを特徴と
する、請求項1又は2に記載の光導波路素子の固定構
造。
3. The fixing structure for an optical waveguide element according to claim 1, wherein said predetermined member is plate-shaped.
【請求項4】前記光導波路素子と前記所定の部材との接
着固定は、前記光導波路素子の前記薄肉部分と前記所定
の部材とのすき間を埋めるようにして接着剤を塗布する
ことによって行うことを特徴とする、請求項1〜3のい
ずれか一に記載の光導波路素子の固定構造。
4. An adhesive fixing between the optical waveguide element and the predetermined member is performed by applying an adhesive so as to fill a gap between the thin portion of the optical waveguide element and the predetermined member. The fixing structure for an optical waveguide element according to claim 1, wherein
【請求項5】前記光導波路素子と前記所定の部材との接
着固定は、前記光導波路素子の前記薄肉部分と前記所定
の部材とで形成されるすき間に接着剤が存在しないよう
にして行うことを特徴とする、請求項1〜3のいずれか
一に記載の光導波路素子の固定構造。
5. An adhesive fixing between the optical waveguide element and the predetermined member, in such a manner that an adhesive does not exist in a gap formed between the thin portion of the optical waveguide element and the predetermined member. The fixing structure for an optical waveguide element according to claim 1, wherein
JP25478698A 1998-09-09 1998-09-09 Structure for fixing optical waveguide element Withdrawn JP2000089184A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25478698A JP2000089184A (en) 1998-09-09 1998-09-09 Structure for fixing optical waveguide element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25478698A JP2000089184A (en) 1998-09-09 1998-09-09 Structure for fixing optical waveguide element

Publications (1)

Publication Number Publication Date
JP2000089184A true JP2000089184A (en) 2000-03-31

Family

ID=17269873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25478698A Withdrawn JP2000089184A (en) 1998-09-09 1998-09-09 Structure for fixing optical waveguide element

Country Status (1)

Country Link
JP (1) JP2000089184A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003012533A1 (en) * 2001-08-01 2003-02-13 Sumitomo Osaka Cement Co., Ltd. Optical modulator
WO2004001489A1 (en) * 2002-06-19 2003-12-31 Mitsubishi Denki Kabushiki Kaisha Light modulator
JP2015197616A (en) * 2014-04-02 2015-11-09 日本電信電話株式会社 Optical module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003012533A1 (en) * 2001-08-01 2003-02-13 Sumitomo Osaka Cement Co., Ltd. Optical modulator
WO2004001489A1 (en) * 2002-06-19 2003-12-31 Mitsubishi Denki Kabushiki Kaisha Light modulator
JP2015197616A (en) * 2014-04-02 2015-11-09 日本電信電話株式会社 Optical module

Similar Documents

Publication Publication Date Title
JP4375597B2 (en) Optical waveguide device and traveling wave optical modulator
JP5278986B2 (en) Light modulator
US20020159738A1 (en) Optical waveguide device and a travelling-wave optical modulator
JP4471520B2 (en) Traveling waveform light modulator
US20090274408A1 (en) Optical modulator component and optical modulator
US5471545A (en) Optical external modulator for optical telecommunications
WO2005019913A1 (en) Optical waveguide device and traveling wave type opticalmodulator
JP4907574B2 (en) Light modulator
US6571026B2 (en) Traveling wave optical modulators and a method for the production thereof
JP4408558B2 (en) Traveling waveform optical modulator and method of manufacturing the same
US6950580B2 (en) Optical waveguide devices and travelling wave type optical modulators
JP5254855B2 (en) Traveling wave type optical modulator
JP2000089184A (en) Structure for fixing optical waveguide element
JP5262186B2 (en) Optical waveguide device
JP2004341147A (en) Optical waveguide device and traveling waveform optical modulator
US20100247024A1 (en) Optical waveguide type device
JP2004219600A (en) Electrode for optical modulation and optical modulator
WO2003079103A1 (en) Method for manufacturing optical modulator
JP4671335B2 (en) Waveguide type optical device
JP4875918B2 (en) Optical waveguide device and manufacturing method thereof
JPH10319264A (en) Production of optical waveguide element
JP2001124952A (en) Optical waveguide substrate
CN118575124A (en) Optical waveguide element, optical modulation device using the same, and optical transmission device
JPH11174346A (en) Modulator for polarization plane of light
JPH11149048A (en) Optical polarization plane modulation device

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20060110