JP2000080178A - Copolyimide film, preparation thereof and metallic wiring board using same as substrate material - Google Patents

Copolyimide film, preparation thereof and metallic wiring board using same as substrate material

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Publication number
JP2000080178A
JP2000080178A JP10327558A JP32755898A JP2000080178A JP 2000080178 A JP2000080178 A JP 2000080178A JP 10327558 A JP10327558 A JP 10327558A JP 32755898 A JP32755898 A JP 32755898A JP 2000080178 A JP2000080178 A JP 2000080178A
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Japan
Prior art keywords
mol
dianhydride
phenylenediamine
polyimide film
component
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP10327558A
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Japanese (ja)
Inventor
Hideki Moriyama
Kenji Uhara
英樹 森山
賢治 鵜原
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Du Pont Toray Co Ltd
東レ・デュポン株式会社
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Application filed by Du Pont Toray Co Ltd, 東レ・デュポン株式会社 filed Critical Du Pont Toray Co Ltd
Priority to JP10327558A priority Critical patent/JP2000080178A/en
Publication of JP2000080178A publication Critical patent/JP2000080178A/en
Application status is Pending legal-status Critical

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Abstract

PROBLEM TO BE SOLVED: To provide copolyimide films which equally meet a high modulus, a low coefficient of thermal expansion, a low coefficient of hygroscopic expansion and a low water absorption and excel in alkali etching resistance when applied to flexible printed circuits provided with a metallic wiring in its surface or tape automated bonding tape(TAB tape) metallic wiring board substrate materials. SOLUTION: Copolyimide films are prepared from a random and/or block four-component copolyamic acid composed of 10-90 mol% 3,3',4,4'- benzophenonetetracarboxylic dianhydride and 10-90 mol% pyromellitic dianhydride on the basis of the dianhydrides, and 10-90 mol% phenylenediamine and 10-90 mol% bisaminophenoxyphenylpropane on the basis of the diamines.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used as a metal wiring board base material for a flexible printed circuit or a tape automated bonding tape (TAB tape) having a metal wiring on its surface. High elastic modulus,
A copolymerized polyimide film having a low coefficient of thermal expansion, a low coefficient of hygroscopic expansion, and a low water absorption, and further having excellent alkali etching resistance, a method for producing the same, and a flexible printed circuit having the copolymerized polyimide film as a base material or The present invention relates to a metal wiring board for a tape automated bonding tape.

[0002]

2. Description of the Related Art A TAB tape is provided with a very thin metal wiring on the surface of a heat-resistant film as a base material, and has a "window" for mounting an integrated circuit chip (IC) on the base material. Further, sprockets for precisely feeding the TAB tape are provided near both ends of the TAB tape.

In the above TAB tape, an IC is inserted into a "window" opened in the TAB tape, joined to metal wiring provided on the surface of the TAB tape, and then mounted on the TAB tape.
By joining the tape to the printed circuit for wiring electronic devices, the process of mounting the IC on the electronic circuit is automated, the process is simplified, the productivity is improved, and the electrical characteristics of the electronic device on which the IC is mounted are improved. Has been used to improve.

[0004] The TAB tape has a three-layer structure in which a conductive metal foil is laminated on the surface of a heat-resistant base film via an adhesive such as a polyester base, an acrylic base, an epoxy base or a polyimide base. When,
One having a two-layer structure in which a conductive metal layer is directly laminated on the surface of a heat-resistant base film without using an adhesive is used.

[0005] Therefore, the base film of the TAB tape is required to have heat resistance. In particular, the bonding between the IC and the metal wiring on the TAB tape and the connection between the TAB tape mounting the IC and the printed circuit for electronic equipment wiring are required. Conventionally, a polyimide film has been used so as to withstand high temperatures such as solder welding applied to a base film at the time of joining.

However, when a polyimide film and a metal foil or a metal layer are laminated and a metal wiring is formed by chemical etching of the metal foil or the metal layer, the difference in dimensional change between the polyimide film and the metal due to the heat received. If the deformation of the TAB tape is large, the workability is significantly impaired or sometimes impossible when mounting the IC or joining the TAB tape mounting the IC to the printed circuit for wiring the electronic device. Because it will be
It is required that the thermal expansion coefficient of the polyimide film be approximated to that of metal to reduce the deformation of the TAB tape.

Also, by reducing the water absorption and the coefficient of humidity expansion of the polyimide film to reduce the dimensional change of the TAB tape due to the change in the humidity of the working environment, the metal wiring can be made finer and the strain load on the metal wiring can be reduced. In addition, there is a strong demand for reducing the distortion load of the mounted IC.

Further, it is possible to reduce a dimensional change due to a tensile force or a compressive force applied to a TAB tape mounted on an IC and bonded to a printed circuit for electronic device wiring, to reduce the size of the metal wiring and to reduce the distortion to the metal wiring. Load reduction and mounted IC
This is important for reducing the strain load on the substrate, and a higher elastic modulus is required for the polyimide film as the base material.

In addition, when bonding with an IC, there is a case where "gold plating" is formed on the wiring on the polyimide film as a base material and connected, and a strong alkali solution is used as the gold plating solution in some cases. In many cases, when the polyimide film is attacked by a plating solution at that time, the wiring on the polyimide film is easily peeled off. Therefore, a demand for a polyimide film excellent in alkali-resistant etching is increasing.

Conventional methods aimed at obtaining a copolymerized polyimide film satisfying these required properties include:
JP-A-4-299885 discloses 3,3 ', 4,4'
-A benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, a copolymerized polyimide film produced from a copolymerized polyamic acid composed of phenylenediamine and diaminodiphenyl ether has been proposed, and the copolymerized polyamic acid film is further subjected to a chemical conversion method. There has been proposed a method of forming a copolymerized polyimide film having excellent chemical etching properties.

JP-A-5-148458 discloses a copolymerized polyamide comprising 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, phenylenediamine and diaminodiphenyl ether. TAB tapes have been proposed in which an adhesive layer and a protective layer are provided on a copolymerized polyimide film produced from an acid.

However, in the above-mentioned conventional method, when used as a metal wiring board substrate, a high elastic modulus, a low coefficient of thermal expansion, a low coefficient of hygroscopic expansion, a low coefficient of water absorption, and a resistance to alkali etching are highly balanced. A satisfactory copolymerized polyimide film could not be obtained, and further improvement was required.

[0013]

SUMMARY OF THE INVENTION The present invention has been achieved as a result of studying the above-mentioned problems in the prior art as a problem. A flexible printed circuit having metal wiring on the surface thereof has been achieved. Or Tape Auto Join
When applied to metal wiring board base material for mated bonding tape (TAB tape), it satisfies high elastic modulus, low coefficient of thermal expansion, low coefficient of hygroscopic expansion, and low coefficient of water absorption, and has excellent alkali etching resistance. Copolymerized polyimide film,
It is an object of the present invention to provide a method of manufacturing the same and a metal wiring circuit board using the same as a base material.

[0014]

In order to achieve the above-mentioned object, the copolymerized polyimide film of the present invention comprises 10 to 90 mol% of 3,3 ', 4,4'-based on dianhydride.
A benzophenonetetracarboxylic dianhydride and 10 to 90 mol% of pyromellitic dianhydride, and 10 to 90 mol% of phenylenediamine and 10 to 90 mol% of bisaminophenoxyphenylpropane based on diamine; It is characterized by being manufactured from copolymerized polyamic acid.

Further, the copolymerized polyimide film of the present invention may contain 10 to 90 mol% of 3,3 based on dianhydride.
', 4,4'-benzophenonetetracarboxylic dianhydride and 10 to 90 mol% of pyromellitic dianhydride, and 10 to 90 mol% of phenylenediamine and 10 to 90 mol% of bisamino based on diamine Characterized in that it is made from a four-component copolymeric polyamic acid having a block copolymerization component consisting of phenoxyphenylpropane, in which case 20
To 90 mol% of 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride and 10 to 80 mol%
1 based on pyromellitic dianhydride and diamine
More preferably, it was prepared from a quaternary copolyamic acid having a block copolymerization component consisting of 0 to 70 mol% phenylenediamine and 30 to 90 mol% bisaminophenoxyphenylpropane.

In the copolymerized polyimide film of the present invention, the bisaminophenoxyphenylpropane is 2,2-bis [4- (4-aminophenoxy) phenyl] propane, and the phenylenediamine is p-phenylenediamine. -Phenylenediamine, wherein the bisaminophenoxyphenylpropane is 2,2-bis [4-
(4-aminophenoxy) phenyl] propane is a preferable condition, and by applying these conditions, it is possible to expect to obtain a more excellent effect.

Although the method for producing a copolymerized polyimide film of the present invention can be obtained by combining general methods for producing polyimide, preferred production steps which can easily achieve the present invention are as follows. Steps (A) to (D) are sequentially performed.

(A) 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, phenylenediamine and bisaminophenoxyphenylpropane in an inert solvent in phenylenediamine And at least two times to form a four-component copolymeric polyamic acid having a block component with pyromellitic dianhydride, or phenylenediamine and 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride. (B) 4 from step (A)
Mixing a component copolyamide acid solution with a conversion agent capable of converting copolyamide acid to copolyimide; (C) casting or extruding the mixture from step (B) onto a smooth surface; Forming a copolyamide-copolyimide gel film, and (D) forming the gel film from step (C) in 200
A step of converting the copolymeric polyamic acid to a copolymerized polyimide by heating at a temperature of about 500 ° C.

In the method for producing a copolymerized polyimide film according to the present invention, the quaternary copolymerized polyamic acid is used in an amount of 10 to 90 mol% of 3,3 based on dianhydride.
', 4,4'-benzophenonetetracarboxylic dianhydride and 10 to 90 mol% of pyromellitic dianhydride, and 10 to 90 mol% of phenylenediamine and 10 to 90 mol% of bisamino based on diamine A copolymerized polyamic acid having a block copolymerization component composed of phenoxyphenylpropane, wherein the quaternary copolymerized polyamic acid contains 20 to 90 mol% of 3,3 ', 4,4'- Benzophenone tetracarboxylic dianhydride and 10 to 80 mol% of pyromellitic dianhydride, and 10 to 70 mol% of phenylenediamine and 30 to 90 mol% based on diamine.
A copolymerized polyamic acid having a block copolymer component consisting of mol% of bisaminophenoxyphenylpropane, wherein the phenylenediamine is p-phenylenediamine, and bisaminophenoxyphenylpropane is 2,2-bis [4- (4-aminophenoxy) phenyl] propane is a preferable condition, and by applying these conditions, it is possible to expect to obtain a more excellent effect.

Further, the metal wiring board for a flexible printed circuit or tape automation bonding tape of the present invention is characterized in that the above-mentioned copolymerized polyimide film is used as a base material and metal wiring is applied to the surface thereof. I do.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration and effects of the present invention will be described below in detail.

The copolymerized polyimide constituting the film of the present invention may be either a block polymer or a random polymer, but is preferably a copolymerized polyimide having a block copolymer component.

The preferred block copolymer component in this case is a polyamic acid comprising phenylenediamine and pyromellitic dianhydride, or a phenylenediamine and 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride. It is a polyamic acid, and after forming a copolymerized polyamic acid containing these block components, it is imide-converted to a copolymerized polyimide containing a block component.

The reaction for forming the four-component copolymerized polyamic acid is carried out at least in two parts, and the copolymerized polyamic acid containing a block component is formed and imidized to be incorporated into the copolymerized polyimide polymer.

The four-component copolymerized polyimide polymer of the present invention allows flexible printed circuit or tape automated joining (Tape).
Automated Bonding) When applied to metal wiring board base material for TAB tapes, high elastic modulus, low thermal expansion coefficient,
It is possible to realize a copolymerized polyimide film that satisfies a high level by balancing the low coefficient of moisture absorption expansion, the low water absorption and the alkali etching property.

By incorporating a copolymerization block component into the copolymerized polyimide polymer, the above properties can be set in more preferable ranges. Particularly preferred blocking components in this case are those obtained by reaction with phenylenediamine and pyromellitic dianhydride.

The diamine used in the present invention includes:
An inflexible diamine such as phenylenediamine,
Flexible diamines such as bisaminophenoxyphenylpropane. The copolymerized polyimide is used in an amount of about 10 to 90 mol%, preferably 10 to 90 mol%, based on the total molar amount of the diamine.
It is prepared by imid conversion of a copolyamide obtained using phenylenediamine in an amount of from 70 to 70 mol%.

As the phenylenediamine used in the present invention, in addition to p-phenylenediamine, m-phenylenediamine, o-phenylenediamine and the like, phenylenediamine having a substituent in part can be used, and particularly preferred. Is p-phenylenediamine. The phenylenediamine in the present invention acts to increase the modulus of the film.

Examples of bisaminophenoxyphenylpropane include 2,2-bis [4- (4-aminophenoxy)
In addition to phenyl] propane and 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane, bisaminophenoxyphenylpropane having a partial substituent is used, and 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane is particularly preferred. Bis [4- (4-aminophenoxy) phenyl] propane is used. The bisaminophenoxyphenylpropane in the present invention acts to lower the water absorption of the film.

The tetracarboxylic dianhydride used in the present invention includes a non-flexible tetracarboxylic dianhydride such as pyromellitic dianhydride, and 3,3 ', 4.
Flexible tetracarboxylic dianhydrides, such as 4'-benzophenone tetracarboxylic dianhydride. The copolymerized polyimide is about 10 to 9 based on the total molar amount of dianhydride.
0 mol%, preferably 20 to 90 mol% of 3,3
It is produced by imide conversion of a quaternary polyamic acid obtained using ', 4,4'-benzophenonetetracarboxylic dianhydride.

The performance of the copolymerized polyimide film depends on the ratio of the phenylenediamine component in the diamine component used in the production of the copolymerized polyamic acid and the 3,3 ′, 4,4 ′ in the tetracarboxylic dianhydride component. -It can be adjusted by the use ratio of benzophenonetetracarboxylic dianhydride. When a large amount of phenylenediamine component is used, high elastic modulus and dimensional stability are improved, but there is a drawback that water absorption is increased. In order to lower water absorption, 3,3 ′, 4,4′-benzophenonetetrane is used. Although a large amount of carboxylic dianhydride can be used, in this case, the elastic modulus and dimensional stability are reduced. Therefore, it is necessary to carefully adjust the molar ratio of each component in order to balance each characteristic value. In the present invention, preferably, by employing a copolymerized polyimide containing a block copolymer component, low water absorption,
High elastic modulus and dimensional stability can be easily achieved in a well-balanced manner.

The four-component copolymeric polyamic acid of the present invention comprises 1
At a temperature of 75 ° C. or lower, preferably 90 ° C. or lower, the molar ratio of the tetracarboxylic dianhydride component and the diamine component is about 0.90 to 1.10, preferably 0.95 to 1.
05, more preferably from 0.98 to 1.02, and produced by reacting each component with a non-reactive organic solvent.

Each of the above-mentioned components may be independently and sequentially supplied to the organic solvent, may be simultaneously supplied, or the organic solvent may be supplied to the mixed components. In order to achieve this, it is preferable to sequentially add each component to the organic solvent.

In the case of sequentially supplying each component, it is preferable to supply the diamine component and the tetracarboxylic dianhydride component, which are to be copolymerized block components, with priority. That is, in order to produce a copolymerized polyamic acid containing a copolymerized block component, the reaction is carried out at least twice, and firstly, a copolymerized polyamic acid containing a copolymerized block component is obtained. Is converted into an imide, whereby a copolymerized block component is incorporated into the obtained copolymerized polyimide.

The time required to form the copolymerized polyamic acid block component may be determined by the reaction temperature and the ratio of the block component in the copolymerized polyamic acid. About 20 hours is appropriate.

Specifically, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride (BTDA), pyromellitic dianhydride (PMDA), and diamine components as tetracarboxylic dianhydride components , P-phenylenediamine (PDA) and 2,2-bis [4- (4-aminophenoxy) phenyl] propane (BAPP), containing a copolymerized block component composed of PMDA and PDA An example of the production will be described below.

First, PDA is dissolved in dimethylacetamide (DMAc) as an organic solvent, and PMDA is added to complete the reaction of the block component. Next, BAPP is added and dissolved in the solution, and BTDA is added to the solution to cause a reaction, whereby a four-component copolymer polyamic acid solution containing a copolymer block component of PDA and PMDA is obtained.

In this case, a small amount of BAPP may be added to the PDA supplied first, or PDA and P
It is also possible to control the size of the copolymer block component by making the molar ratio with MDA unequal, but in order to make the effect of the copolymer block component effective, PDA
It is preferred that the molar ratio between PMDA and PMDA be approximately equal.

The end point of the production of the four-component copolymeric polyamic acid is determined by the polyamic acid concentration of the solution and the viscosity of the solution. In order to accurately determine the viscosity of the solution at the end point, it is effective to add a part of the finally supplied component as a solution of an organic solvent used in the reaction, but it does not significantly reduce the polyamic acid concentration. Such adjustment is necessary.

If the amount of BTDA added is greater than the amount of PMDA added, gelation may occur during the polymerization reaction or during imidization. For the purpose of preventing the gelation by BTDA, it is also preferable to add a terminal blocking agent such as dicarboxylic anhydride and silylating agent in the range of 0.001 to 2% based on the solid content (polymer concentration). I can do it. Acetic anhydride is used as the dicarboxylic anhydride, non-halogen hexamethyldisilazane is used as the silylating agent, N, O-
(Bistrimethylsilyl) acetamide and N, N-bis (trimethylsilyl) urea are particularly preferably used.

The concentration of the copolymerized polyamic acid in the solution is 5 to 40% by weight, preferably 10 to 30% by weight.

The organic solvent is selected from those which are non-reactive with the respective components and the copolymerized polyamic acid as a polymerization product, are capable of dissolving all of the components and dissolve the copolymerized polyamic acid. Is preferred.

Preferred organic solvents include N, N-dimethylacetamide, N, N-diethylacetamide,
N, N-dimethylformamide, N, N-diethylformamide, N-methyl-2-pyrrolidone, and the like,
These can be used alone or as a mixture, and in some cases, can be used in combination with a poor solvent such as benzene.

In producing the copolymerized polyimide film of the present invention, the four-component copolymerized polyamic acid solution thus obtained is pressurized by an extruder or a gear pump and sent to a process for producing a copolymerized polyamic acid film.

The four-component copolymerized polyamic acid solution is filtered to remove foreign substances, solids, high-viscosity impurities, and the like mixed in the raw materials or generated in the polymerization step, and is used for a film forming die or a coating head. Is formed into a film, extruded onto a rotating or moving support, and heated from the support to produce a copolyamide acid-copolyimide gel film in which the copolyamide is partially imidized, When the gel film becomes self-supporting and can be peeled off from the support, it is peeled off from the support, introduced into a drier, heated in a drier, and the solvent is dried to complete the imide conversion. A polymerized polyimide film is produced.

The imide conversion of the copolymerized polyamic acid can be carried out by a thermal conversion method using only heating, a copolyamide acid mixed with an imide conversion agent, or a heat treatment of the copolyamide acid, or a copolyamide acid added to a bath of the imide conversion agent. Although any of the chemical conversion methods of immersion can be adopted, in the present invention, the chemical conversion method is more flexible than the thermal conversion method, and is a flexible printed circuit or Tape Automated Bonding tape (TAB tape). When applied to a metal wiring board substrate for (1), it is suitable for achieving a high degree of elasticity, a low coefficient of thermal expansion, a low coefficient of hygroscopic expansion, a low coefficient of water absorption, and alkali etching resistance.

In addition, the method of mixing the imide conversion agent with the four-component copolymer polyamic acid by a chemical conversion method, forming a film, and then performing a heat treatment, has a short time required for the imide conversion and enables uniform imide conversion. In addition to the advantages, it is easy to peel off from the support, furthermore, it has an advantage such as strong odor and the ability to handle the imide conversion agent requiring isolation in a closed system, etc., after forming the copolymeric polyamic acid film. The method is preferably employed as compared with a method of immersing in a bath of a conversion agent or a dehydrating agent.

In the present invention, a tertiary amine which promotes imide conversion and a dehydrating agent which absorbs water generated by imide conversion are used in combination as the imide conversion agent. The tertiary amines are added and mixed in an approximately equimolar to slightly excessive amount with the copolymerized polyamic acid, and the dehydrating agent is added in an amount about 2 times the molar amount or slightly in excess of the copolymerized polyamic acid. Adjusted appropriately to adjust the points.

The imide conversion agent may be added at any time after the completion of the polymerization of the copolymerized polyamic acid, at which point the copolymerized polyamic acid solution reaches the die for film formation or the coating head. In order to prevent the imide conversion in the above, it is preferable to add the mixture shortly before reaching the die for forming a film or the coating head and mix the mixture with a mixer.

As the tertiary amine, pyridine or β-
Although picoline is preferred, α-picoline, 4-methylpyridine, isoquinoline, triethylamine and the like can also be used. The amount used is adjusted according to the respective activity.

As the dehydrating agent, acetic anhydride is most generally used, but propionic anhydride, butyric anhydride, benzoic acid, formic anhydride and the like can also be used.

The copolymerized polyamic acid film containing the imidization agent is converted into an imidized by the heat received from the support and the space on the opposite side of the support, and a partially imidized copolyamide-copolyimide gel is obtained. It becomes a film and is peeled from the support.

In this case, the larger the amount of heat applied from the support and the space on the opposite surface, the more the imide conversion is promoted and the faster the exfoliation occurs, but if the amount of heat is too large, the gas of the organic solvent between the support and the gel film becomes gel. Since the film is deformed and becomes a defect of the film, it is desirable to determine the amount of heat in consideration of the position of the peeling point and the defect of the film.

The gel film peeled off from the support is introduced into a dryer, where the solvent is dried and the imidization is completed.

This gel film contains a large amount of an organic solvent, and its volume is greatly reduced during the drying process. Therefore, in order to concentrate the dimensional shrinkage due to the volume reduction in the thickness direction, both ends of the gel film are gripped with a tenter clip, and the gel film is introduced into a dryer (tenter) by the movement of the tenter clip. It is common practice to heat and consistently perform solvent drying and imidization.

The drying and the imidization are carried out at a temperature of from 200 to 500 ° C. The drying temperature and the imide conversion temperature may be the same temperature or different temperatures, but in the stage of drying a large amount of the solvent, prevent the bumping of the solvent as a lower temperature, and when there is no possibility of bumping of the solvent, raise the temperature to a higher temperature. Preferably, the temperature is increased stepwise so as to promote imide conversion.

In the tenter, the distance between the tenter clips at both ends of the film can be expanded or reduced to perform stretching or relaxation.

It preferably contains a copolymer block component,
A cut sheet-shaped copolymerized polyimide film obtained by imide conversion by a chemical conversion method can be produced by cutting from a continuous film produced as described above. As shown in the examples, in a resin or glass flask,
Preferably, a copolymerized polyamic acid containing a copolymerized block component is produced, and a mixed solution obtained by mixing a chemical conversion agent with the copolymerized polyamic acid solution is cast on a support such as a glass plate and heated. As a partially imidized self-supporting copolyamide-copolyimide gel film, peeled from the support, fixed to a metal fixing frame or the like and heated while preventing dimensional change, solvent Can be produced by a method of drying and imide conversion.

Thus, the copolymerized polyimide film of the present invention obtained by the imide conversion by the chemical conversion method is more flexible than the copolymerized polyimide film obtained by the thermal conversion method. Automated tape joining
(Tape Automated Bonding) When applied to a metal wiring board base material for tape (TAB tape), it is suitable for achieving a high degree of elasticity, a low coefficient of thermal expansion, a low coefficient of hygroscopic expansion, and a low coefficient of water absorption in a balanced and high degree. And has excellent alkali etching resistance.

Accordingly, a metal wiring board for a flexible printed circuit or a tape automated bonding tape having a metal wiring on the surface using the copolymerized polyimide film of the present invention as a base material has a high elastic modulus and low thermal expansion. It exhibits high-performance characteristics in which the coefficient, low coefficient of hygroscopic expansion, low water absorption and alkali etching resistance are balanced and highly satisfied.

Incidentally, in the copolymerized polyimide film of the present invention, the elastic modulus is preferably 500 kg / cm 2 or more, and the thermal expansion coefficient is 10 to 20 ppm / ° C.
The water absorption is preferably 2% or less, particularly preferably 1% or less. As for the alkali etching resistance, it is a preferable condition that the surface is not attacked. The evaluation method is described below, but the evaluation can be performed under alkaline conditions stronger than the plating solution used, and the erosion rate of the surface can be evaluated.

[0062]

EXAMPLES The present invention will now be described in detail with reference to examples, but the present invention is not limited to these examples. In addition, each film characteristic value is measured by the following method.

In the following examples, the abbreviations DMAc are dimethylacetamide, and BTDA is 3,3 ', 4,4
'-Benzophenonetetracarboxylic dianhydride was converted to PM
DA is pyromellitic dianhydride, PDA is p-phenylenediamine, and BAPP is 2,2-bis [4-
(4-aminophenoxy) phenyl] propane.

(1) Elastic Modulus Elastic modulus was measured at room temperature according to JIS K7113 at room temperature.
It was determined from the slope of the initial rising portion of the tension-strain curve obtained at a tensile speed of 300 mm / min using a Tensilon type tensile tester manufactured by NREC.

(2) Coefficient of thermal expansion The coefficient of thermal expansion was determined using a TMA-50 thermomechanical analyzer manufactured by Shimadzu Corporation at a temperature rising rate of 10 ° C./min and a temperature decreasing rate of 5 ° C./min for the second time. From 50 ° C to 200 ° C when the temperature rises (falls)
It was determined from the dimensional change during.

(3) Hygroscopic Expansion Coefficient The hygroscopic expansion coefficient was determined by using a TM-7000 type thermomechanical analyzer manufactured by Vacuum Riko Co., Ltd. at 25 ° C. at a humidification rate of 0.3% RH / min. From 5% RH to 90% RH.

(4) Water Absorption Rate The moisture absorption rate was set at 25 ° C. and 95% RH in a thermo-hygrostat (STPH101, manufactured by Tabai Espec Corp.) for 48 hours. Was determined as a percentage.

(5) Alkali etching resistance Alkali etching resistance is obtained by coating one surface of a polyimide film in an ethanol / water mixed solution having a volume ratio of 80/20.
The thickness of the film before and after contacting with a potassium hydroxide solution of N at 40 ° C. for 120 minutes was measured using a LITE manufactured by Mitutoyo Corporation.
It was determined by measuring with a MATIC thickness gauge. Evaluation criteria were determined as follows according to the thickness change rate. The X level is a level at which the film surface is eroded when immersed in the plating solution, which affects the adhesion to the wiring. ○ Thickness change rate less than 1% △ Thickness change rate 1% or more and less than 5% × Thickness change rate 5% or more.

(6) Evaluation of the amount of warpage of the metal laminate A polyimide-based adhesive was applied to the polyimide film, and a copper foil was bonded thereon at a temperature of 250 ° C. Thereafter, the temperature was raised to a maximum temperature of 300 ° C. to cure the adhesive, and the obtained metal laminate was cut into a sample size of 35 mm × 120 mm, left at 25 ° C. and 60% RH in an atmosphere for 24 hours. Warpage was measured.
For the warpage, the sample was placed on a glass plate, and the heights of the four corners were measured and averaged. The evaluation criteria were determined as follows according to the amount of warpage. The X level is a level at which handling becomes difficult when transporting in a later step when used as a metal wiring circuit board.

○ The amount of warpage is less than 1 mm △ The amount of warpage is 1 mm or more and less than 3 mm × The amount of warpage is 3 mm or more (7) Blister generation at the time of solder float The metal laminate prepared in the above (6) is subjected to a thermo-hygrostat (STP)
H101, manufactured by Tabai Espec Corp.), and the state of blistering of the metal laminate was observed. The temperature of the solder bath was raised from 240 ° C. in steps of 20 ° C. and investigated up to 280 ° C. The sample after humidity control was floated on a solder bath. The sample surface was visually observed and determined as follows according to the lowest temperature at which blisters were generated. The X level is a level that requires a drying step because blisters are likely to occur during solder float when used as a metal wiring circuit board.

A: No blister is generated at 280 ° C.

Blistering begins at 280 ° C.

Δ At 260 ° C., blisters begin to form.

B: Blisters are generated at 240 ° C.

Example 1 A 500 cc glass flask was charged with 150 ml of DMAc, and PDA was supplied and dissolved in DMAc, followed by BAPP, BTDA and PDA.
MDA was sequentially supplied, and the mixture was stirred at room temperature for about 1 hour. Then, 1 mol% of acetic anhydride based on the diamine component was added, and the product was further expanded for about 1 hour, so that the tetracarboxylic dianhydride component and the diamine component were reduced to about 100 hours. A solution having a copolyamide acid concentration of 20% by weight was prepared from components having the composition shown in Table 1 in terms of mol% stoichiometry.

30 g of this copolymerized polyamic acid solution was added to 1
2.7 ml of DMAc, 3.6 ml of acetic anhydride and 3.
A mixed solution prepared by mixing with 6 ml of β-picoline was prepared, and the mixed solution was cast on a glass plate, and then heated on a hot plate heated to 150 ° C. for about 4 minutes to form a self-supporting copolymer polyamic acid. -A copolymerized polyimide gel film was formed and peeled from the glass plate.

This gel film was fixed on a metal fixing frame provided with a large number of pins, and heated at a temperature of 250 ° C. to 330 ° C. for 30 minutes, and then heated at 400 ° C. for about 5 minutes.
A copolymerized polyimide film having a thickness of about 25 μm was obtained.

Table 1 shows the characteristic value evaluation results of the obtained copolymerized polyimide film.

[Examples 2 to 4] In a 500 cc glass flask, 150 ml of DMAc was placed, and PDA was added to DMA.
c) to dissolve, followed by PMDA and stirred at room temperature for about 1 hour. BAP is added to this polyamic acid solution.
After supplying P and completely dissolving, supplying BTDA,
Stirred at room temperature for about 1 hour. Subsequently, 0.5 mol% of acetic anhydride was added to the diamine component, and sales were further expanded for about 1 hour. The tetracarboxylic dianhydride component and the diamine component were components having a composition shown in Table 1 with a stoichiometry of about 100 mol%. A solution of a copolymerized polyamic acid having a concentration of 20% by weight was prepared.

This solution having a polyamic acid concentration of 20% by weight was treated in the same manner as in Example 1 to a thickness of about 25 μm.
Was obtained.

The results of evaluation of the characteristic values of the obtained copolymerized polyimide film are also shown in Table 1.

Example 5 A 500 cc glass flask was charged with 150 ml of DMAc, and PDA was supplied and dissolved in DMAc. Subsequently, PMDA was supplied, followed by stirring at room temperature for about 1 hour. Subsequently, 0.5 mol% of acetic anhydride was added to the diamine component, and sales were further expanded for about one hour.
After BAPP was supplied to this polyamic acid solution and completely dissolved, BTDA and PMDA were supplied, and at room temperature, about 1
The mixture was stirred for a period of time to prepare a solution having a polyamic acid concentration of 23% by weight in which the tetracarboxylic dianhydride component and the diamine component were composed of components having a composition shown in Table 1 with a stoichiometry of about 100 mol%.

This copolymer polyamic acid solution was prepared in Example 1
To obtain a copolymerized polyimide film having a thickness of about 50 μm.

The results of evaluating the characteristic values of the obtained copolymerized polyimide film are also shown in Table 1.

[0085]

[Table 1] [Comparative Example 1] DMA was placed in a 500 cc glass flask.
c, 150 ml of BAPP was supplied and dissolved in DMAc, followed by supply of BTDA, and the mixture was stirred at room temperature for about 1 hour. The tetracarboxylic dianhydride component and the diamine component were converted to about 100 mol% stoichiometry. A solution having a polyamic acid concentration of 20% by weight comprising components having the compositions shown in Table 1 was prepared.

This polyamic acid solution was treated in the same manner as in Example 1 to obtain a copolymerized polyimide film having a thickness of about 25 μm.

Table 2 shows the characteristic value evaluation results of the obtained copolymerized polyimide film.

[Comparative Examples 2 to 8] In a 500 cc glass flask, 150 ml of DMAc was placed, and the raw materials and the compositions shown in Table 2 were sequentially supplied and dissolved in DMAc, and the mixture was stirred at room temperature for about 1 hour. A solution having a carboxylic acid dianhydride component and a diamine component having a stoichiometry of about 100 mol% and having a composition shown in Table 1 and having a polyamic acid concentration or a copolymerized polyamic acid concentration of 20% by weight was prepared.

This polyamic acid solution or copolymerized polyamic acid solution was treated in the same manner as in Example 1 to obtain a copolymerized polyimide film having a thickness of about 25 μm.

Table 2 also shows the results of evaluation of the characteristic values of the obtained copolymerized polyimide film.

[Table 2] As is clear from the results described in Tables 1 and 2,
The four-component random copolymer polyimide film and the four-component block copolymer polyimide film of the present invention obtained by the chemical conversion method comprising BTDA, PMDA, PPD and BAPP are compared with the two-component polyimide film or the three-component random copolymer polyimide film. It has a balanced and high balance of high elasticity, low coefficient of thermal expansion, low coefficient of moisture expansion, low water absorption and excellent alkali etching resistance, and can be used for flexible printed circuits or tape automated bonding (Tape Au
It has a suitable performance as a metal wiring board base material for tomated bonding tape (TAB tape).

[0091]

As described above, the copolymerized polyimide film of the present invention is more flexible than a copolymerized polyimide film obtained by a thermal conversion method. ) Tape (T
When applied to a metal wiring board substrate for AB tape), it is suitable for achieving a high and high elasticity, a low coefficient of thermal expansion, a low coefficient of moisture expansion and a low coefficient of water absorption in a balanced manner and at a high level. It has an etching property.

Therefore, a metal wiring board for a flexible printed circuit or a tape automation joining tape having a metal wiring provided on the surface thereof using the copolymerized polyimide film of the present invention as a base material has a high elastic modulus and low thermal expansion. It exhibits high-performance characteristics that balance the coefficient, the low coefficient of hygroscopic expansion, the low water absorption and the resistance to alkali etching to a high degree.

Claims (10)

[Claims]
1. 10 to 90 mol% based on dianhydride
3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride and 10 to 90 mol% of pyromellitic dianhydride, and 10 to 90 mol% of phenylenediamine and 10 to 90 mol based on diamine % Of bisaminophenoxyphenylpropane in a four-component copolymerized polyamic acid.
2. 10 to 90 mol% based on dianhydride
3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride and 10 to 90 mol% of pyromellitic dianhydride, and 10 to 90 mol% of phenylenediamine and 10 to 90 mol based on diamine A copolymerized polyimide film produced from a four-component copolymeric polyamic acid having a block copolymerization component comprising 2% bisaminophenoxyphenylpropane.
3. 20 to 90 mol% based on dianhydride
3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride and 10 to 80 mol% of pyromellitic dianhydride, and 10 to 70 mol% of phenylenediamine and 30 to 90 mol based on diamine The copolymerized polyimide film of claim 2, wherein the copolymerized polyimide film is made from a quaternary copolyamic acid having a block copolymerization component consisting of 2% bisaminophenoxyphenylpropane.
4. The method according to claim 1, wherein the bisaminophenoxyphenylpropane is 2,2-bis [4- (4-aminophenoxy)
Phenyl] propane
4. The copolymerized polyimide film according to any one of 3.
5. The method according to claim 1, wherein the phenylenediamine is p-phenylenediamine, and the bisaminophenoxyphenylpropane is 2,2-bis [4- (4-aminophenoxy) phenyl] propane. 5. The copolymerized polyimide film according to any one of items 4 to 4.
6. A method for producing a copolymer polyimide film having a block copolymer component, which comprises sequentially performing the following steps (A) to (D). (A) 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, phenylenediamine and bisaminophenoxyphenylpropane in an inert solvent, phenylenediamine and pyromellitic Acid dianhydride or phenylenediamine and 3,
(B) the step (B) of reacting at least two times to form a four-component copolymeric polyamic acid having a block component with 3 ′, 4,4′-benzophenonetetracarboxylic dianhydride; Mixing the four-component copolyamic acid solution from A) with a conversion agent capable of converting copolyamide acid to copolyimide; and (C) mixing the mixture from step (B) on a smooth surface. Casting or extruding to form a copolyamide-copolymer polyimide gel film, and (D) forming the gel film from step (C) in
Converting the copolyamide to copolyimide by heating at a temperature of 500 ° C.
7. The quaternary polyamic acid is used in an amount of 10 to 90 mol%, based on dianhydride, of 3,3 ′, 4,4.
'-Benzophenonetetracarboxylic dianhydride and 10
From 90 to 90 mol% of pyromellitic dianhydride and from 10 to 90 mol% of phenylenediamine and 10 to 90 mol% of bisaminophenoxyphenylpropane, based on the diamine. The method for producing a copolymerized polyimide film according to claim 6, wherein:
8. The quaternary polyamic acid is used in an amount of from 20 to 90 mol% of 3,3 ', 4,4 based on dianhydride.
'-Benzophenonetetracarboxylic dianhydride and 10
From 80 to 80 mol% of pyromellitic dianhydride, and from 10 to 70 mol% of phenylenediamine and 30 to 90 mol% of bisaminophenoxyphenylpropane, based on diamine. The method for producing a copolymerized polyimide film according to claim 6, wherein:
9. The method according to claim 6, wherein the phenylenediamine is p-phenylenediamine and the bisaminophenoxybenzene is 2,2-bis [4- (4-aminophenoxy) phenyl] propane. The method for producing a copolymerized polyimide film according to any one of the above.
10. A flexible printed circuit or tape automation comprising the copolymer polyimide film according to any one of claims 1 to 5 as a base material and metal wiring provided on the surface thereof. Metal wiring board for joining tape.
JP10327558A 1998-09-02 1998-09-02 Copolyimide film, preparation thereof and metallic wiring board using same as substrate material Pending JP2000080178A (en)

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