JP2000072901A - Manufacture of polyimide film of low shrinkage - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a polyimide of low shrinkage and good productivity. SOLUTION: This film is manufactured by first obtaining a polyamide acidic solution by polymerizing pyromellitic acid dianhydride and 4,4'-diaminodiphenyl ether in an org. solvent, then the solution is casted extruded into a film, dried, and heat treated to obtain a polyimide film, then it is heat treated for a short time while keeping a tensile strength in length's direction not less than 1 kg/m but not greater than 10 kg/m by irradiation of a far-infrared ray, and finally cooled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a low shrinkage polyimide film having improved heat shrinkage.

[0002]

2. Description of the Related Art A polyimide obtained by polycondensing an aromatic tetracarboxylic dianhydride and an aromatic diamine is known as a polymer having extremely excellent heat resistance.

[0003] Although this polyimide is insoluble in a solvent, its precursor, polyamic acid, is soluble in a specific organic solvent. Therefore, this polyamic acid organic solvent solution is cast and dried at the same time as imidization. As a result, a heat-resistant film can be obtained.

Since this polyimide film has excellent heat resistance, insulation properties and mechanical properties, it has been conventionally used as a base film for flexible printed circuit boards.

[0005]

In order to make a flexible printed circuit board using a polyimide film as a base film, a metal foil such as copper is laminated or vacuum deposited.
It is necessary to attach a metal by sputtering or the like, but considerable heat is applied in this step, so dimensional stability against heat is required.

In particular, recently, a polyimide film which has a small shrinkage due to heat due to fine patterning of a flexible printed board has been desired.

As a means for meeting such a demand, Japanese Patent Application Laid-Open No. Sho 62-41024 discloses that a polyimide film is substantially used.
A method has been proposed in which a tension is reduced, heat treatment is performed in a heating oven, and then cooling is performed. The method of heat treatment under no tension is an effective method because the latent shrinkage stress is relaxed and the shrinkage is reduced by subsequent heating, but has the following disadvantages.

That is, in order to perform heat treatment under no tension, a method in which a roll wound with a film is left in a heating oven (Example of Japanese Patent Application Laid-Open No. 62-41024) or a continuous machine equipped with an unwinding and winding machine There is a method of continuously processing the film in a selective heating furnace, but in any case, it will be processed under no tension for a long time, so the film will be in a wavy state,
This causes a problem that the heat shrinkage ratio varies. In particular, in the case of continuous processing, there is a disadvantage that the film meanders and a complete product roll cannot be obtained.

Further, even in the case of a batch type in which the film is left in a dryer, it is impossible to prevent wrinkles from being generated on the film surface, so that it cannot be used as a base film for a precision printed circuit board. In addition, these methods have a problem in that the effect of the low shrinkage ratio varies, and for example, in the portion where wrinkles occur, the heat shrinkage ratio in the MD direction and the TD direction fluctuates greatly.

Furthermore, in order to improve the dimensional stability against heat, a polyimide film is prepared from a polyamic acid solution employing biphenyltetracarboxylic dianhydride as aromatic tetracarboxylic dianhydride and phenylenediamine as aromatic diamine. A special raw material production method was used.

An object of the present invention is to solve the above-mentioned drawbacks of the prior art and to provide a method for producing a polyimide film having low shrinkage and high production efficiency.

[0012]

In order to solve the above problems, the present invention employs the following means.

That is, in the present invention, a polyamic acid solution obtained by polymerizing pyromellitic dianhydride and 4,4′-diaminodiphenyl ether in an organic solvent is cast or extruded into a film, dried and heat-treated. A tension of 1 kg / m or more in the length direction of the obtained polyimide film,
A method for producing a low-shrinkage polyimide film obtained by subjecting to heat treatment in a short period of time by irradiating far-infrared rays with keeping it at 10 kg / m or less, and then subjecting the film to a cooling treatment. The method for producing a low heat shrinkable polyimide film described above, wherein the method is carried out in the presence of:

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The polyimide in the present invention mainly has a structure of the following formula (I).

[0015]

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The structure of the formula (I) is a ring-closed precursor of the following formula (II).

[0017]

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(Where R is a pyromellitic dianhydride residue, R 'is a 4,4'-diaminodiphenyl ether residue, and n is a natural number) The polyimide having the structure of formula (I) is pyromellitic Acid dianhydride and 4,4′-diaminodiphenyl ether,
It is obtained by condensation polymerization in an organic solvent in the presence of a catalyst and a dehydrating agent.

In the present invention, it is preferable to use pyromellitic dianhydride alone as the aromatic tetracarboxylic dianhydride, but if it is 40 mol% or less, another aromatic tetracarboxylic dianhydride may be used. Can be used together. Aromatic tetracarboxylic dianhydrides that can be used in combination with pyromellitic dianhydride include 2,3,6,7-naphthalenetetracarboxylic dianhydride and 3,3 ′, 4,4′-diphenyltetracarboxylic acid Dianhydride, 2,2'-bis (3,4-dicarboxyphenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, 3,4,9,10-perylenetetracarboxylic Acid dianhydride, bis (3,4-carboxyphenyl) ether dianhydride, naphthalene-1,2,4,5-tetracarboxylic dianhydride, naphthalene-1,4,5,8-tetracarboxylic dianhydride Anhydride, decahydro-naphthalene-1,4,5,8-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,3,5,7-hexahydronaphthalene-1,2,5,6- Tetracarboxylic dianhydride, 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1,4,5,
8-tetracarboxylic dianhydride, 2,3,6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic dianhydride,
Phenanthrene-1,8,9,10-tetracarboxylic dianhydride, 2,2-bis (2,3-dicarboxyphenyl) ethane dianhydride, 1,1-bis (3,4-dicarboxyphenyl) Ethane dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, Benzene-1,2,3,4-tetracarboxylic dianhydride, 3,4,3 ′, 4′-benzophenonetetracarboxylic dianhydride, or a mixture of two or more of these.

As the aromatic diamine, 4,4 ′
It is preferable to use -diaminodiphenyl ether alone, but other aromatic diamines can be used in combination as long as the content is 40 mol% or less. Aromatic diamines that can be used in combination with 4,4′-diaminodiphenyl ether include metaphenylenediamine, paraphenylenediamine, 4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenylmethane, benzidine, 4,4′-diaminodiphenyl Sulfide, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 2,6-diaminopyridine,
Bis- (4-aminophenyl) diethylsilane, bis- (4
-Aminophenyl) diphenylsilane, 3,3'-dichlorobenzidine, bis- (4-aminophenyl) ethylphosphine oxide, bis- (4-aminophenyl) phenylphosphine oxide, bis- (4-aminophenyl)-
N-phenylamine, bis- (4-aminophenyl) -N
-Methylamine, 1,5-diaminonaphthalene, 3,3'-dimethyl-4,4'-diaminobiphenyl, 3,4'-dimethyl-
3 ', 4-diaminobiphenyl, 3,3'-dimethoxybenzidine, 2,4-bis (beta-amino-t-butyl) toluene, bis (para-beta-amino-t-butyl-phenyl) ether, para -Bis- (2-methyl-4-amino-bentyl) benzene, para-bis- (1,1-dimethyl-5-amino-bentyl) benzene, m-xylylenediamine, p-xylylenediamine, 1,3 -Diaminoadamantane, 3,3'-diamino-1,1'-diadamantane, 3,
3'-diamino-1,1'-diadamantane, bis (para-amino-cyclohexyl) methane, hexamethylenediamine, peptamethylenediamine, octamethylenediamine, nonamethylenediamine, decamethylenediamine, 3
-Methylheptamethylenediamine, 4,4-dimethylheptamethylenediamine, 2,11-diamino-dodecane, 1,2
-Bis- (3-amino-propoxy) ethane, 2,2-dimethylpropylenediamine, 3-methoxy-hexamethylenediamine, 2,5-dimethylhexamethylenediamine, 5-methylnonamethylenediamine, 5-methylnonamethylenediamine , 1,4-diamino-cyclohexane,
1,12-diamino-octadecane, 2,5-diamino-1,3,
4-oxadiazole, 2,2-bis (4-aminophenyl) hexafluoropropane, N- (3-aminophenyl) -4-aminobenzamide, 4-aminophenyl-
3-aminobenzoate and the like.

Next, the organic solvent used for the condensation polymerization of the polyimide in the present invention includes N, N-dimethylformamide, N, N-dimethylacetamide, N, N-diethylformamide, N, N-diethylacetamide, -With dimethylmethoxyacetamide, N-methyl-caprolactam, dimethylsulfoxide, N-methyl-2-pyrrolidone, tetramethylurea, pyridine, dimethylsulfone, hexamethylphosphoramide, tetramethylenesulfone, formamide, N-methylformamide and butyrolactone is there. These organic solvents can be used alone or in combination of solvents, or in combination with a solvent having poor solvent properties such as benzene, benzonitrile, dioxane, butyrolactone, xylene, toluene and cyclohexane.

As the catalyst, tertiary amines are desirably used. Specific examples of these amines include trimethylamine, triethylamine, triethylenediamine, and the like.
Pyridine, isoquinoline, 2-ethylpyridine, 2-methylpyridine, N-ethylmorpholine, N-methylmorpholine, diethylcyclohexylamine, N-dimethylcyclohexylamine, 4-benzoylpyridine,
2,4-lutidine, 2,6-lutidine, 2,4,6-collidine,
3,4-lutidine, 3,5-lutidine, 4-methylpyridine, 3-methylpyridine, 4-isopropylpyridine,
N-dimethylbenzylamine, 4-benzylpyridine,
And N-dimethyldodecylamine.

Examples of the dehydrating agent include organic carboxylic acid anhydrides, N, N-dialkylcarbodiimides, lower fatty acid halides, halogenated lower fatty acid halides, halogenated lower fatty acid anhydrides, arylphosphonic dihalides and thionyl halides. Is mentioned.

The organic carboxylic acid anhydrides include acetic anhydride, propionic anhydride, butyric anhydride, valeric anhydride, anhydrides thereof mixed with each other, and aromatic monocarboxylic acids such as benzoic acid and naphthoic acid. And mixtures thereof with anhydrides of carbonic acid and formic acid and fatty acid ketene (ketene and dimethylketene). Among them, the use of acetic anhydride and ketene is preferable.

In addition to benzoic anhydride, other aromatic anhydrides which can be used include o-, m- and p-toluic acid, m-
-And p-ethylbenzoic acid, p-propylbenzoic acid, p
-Isopropylbenzoic acid, anisic acid, o-, m- and p
-Nitrobenzoic acid, o-, m- and p-halobenzoic acid,
Various dibromo and dichlorobenzoic acids, tribromo and trichlorobenzoic acids, isomers of dimethyl benzoic acid such as hemelicylic acid, 3,4-xylylic acid, isoxylylic acid and mesitylene acid, veratric acid, trimethoxybenzoic acid, alpha and beta naphthoic acid, Mixed anhydrides of the above anhydrides and mixed anhydrides of fatty acids and monocarboxylic acids such as acetic acid and propionic acid; and mixed anhydrides of carbonic acid and formic acid. Things.

The N, N'-dialkylcarbodiimides are represented by the formula: RN = C = NR, wherein R can be different alkyl groups, but are generally the same, Groups are 1 to 8
Is a lower alkyl group of carbon atoms.

Halogen-containing dehydrating agents include acetyl chloride, acetyl bromide, acetyl iodide and acetyl fluoride, propionyl chloride, collected propionyl, propionyl iodide, and propionyl fluoride, isobutyryl chloride, isobutyryl bromide, n-chloride -Butyryl, n-butyryl bromide, valeryl chloride, mono-chloride, di- and tri-chloroacetyl chloride, bromoacetyl bromide, chloroacetic anhydride,
Examples include phenylphosphonic dichloride, thionyl chloride, thionyl bromide, thionyl fluoride and thionyl chlorofluoride, and trifluoroacetic anhydride.

The resulting polyamic acid solution is extruded in a cast or film form, and dried and heat-treated.
The imidization proceeds and a polyimide film having the structure of the above formula (I) is obtained.

This drying and heat treatment is performed by subjecting the polyamic acid solution cast or extruded to a film shape to 200 to 550.
It can be achieved by passing through a dry heat treatment zone maintained in a high temperature atmosphere at 250C, preferably 250 to 500C.

In the present invention, the film thickness is 5 to 150.
It is necessary to adjust the thickness to be μm, preferably 7 to 125 μm.

In the present invention, the tension of the obtained polyimide film in the longitudinal direction of the film is set to 1 kg / m or more.
Heating is performed in a short time by irradiating far-infrared rays while maintaining the pressure at 0 kg / m or less.

Although a film having a low heat shrinkage can be obtained as the tension is smaller, a film having a tendency to meander under complete non-tension, particularly when continuous winding is performed, is preferably 1 kg / m or more. On the other hand, if it exceeds 10 kg / m, the film having low heat shrinkage, which is the object of the present invention, cannot be obtained.

As a heating means, far infrared rays are irradiated.
The polyimide film has an absorption peak in the far-infrared region, and is heated in a very short time by irradiating far-infrared rays including this absorption wavelength. The far-infrared heater is not particularly limited, but a ceramic heater is preferred. Further, in addition to far-infrared irradiation, hot air can be used in combination.

In the present invention, by using far-infrared rays, the heating time may be extremely short, preferably from 1 to 6 hours.
0 second, more preferably 2 to 30 seconds. The heat treatment temperature is not particularly limited, but is preferably from 180 to 470 ° C, and more preferably from 200 to 450 ° C.

[0035]

EXAMPLES Hereinafter, the effects of the present invention will be specifically described with reference to examples.

The term "heat shrinkage ratio" in Examples means the shrinkage ratio (%) in the film length direction (MD) and width direction (TD) after a film sample was treated at 350 ° C. for 30 minutes. If the value is 0.1% or less, the practicability is extremely increased. The measuring method was JPCA-BM01-198.
According to 8.

Example 1 A polyamic acid solution was obtained by placing pyromellitic dianhydride and 4,4'-diaminodiphenyl ether in an equimolar amount in N, N-dimethylacetamide and agitating the reaction while stirring.

Acetic anhydride and isoquinoline are added to this polyamic acid solution, and the mixture is stirred. The solution is extruded on a heated support, converted into a polyimide to form a self-supporting film, peeled from the support, and further removed to an imide. Was completed and dried and heat-treated by passing through a drying heat treatment zone at 250 to 450 ° C., and wound up on a roll as a 25 μm-thick polyimide film. This polyimide film was continuously fed into a tunnel-type infrared irradiation furnace at the temperature shown in Table 1, and heat-treated under the conditions shown in Table 1, and then cooled to room temperature while being wound outside the furnace. The film tension during the heat treatment was adjusted by the rotation speed difference between the feed roller and the winding roller, and the heat treatment time was adjusted by the relative rotation speed of each roller.

Table 1 shows the evaluation results of the heat shrinkage of the obtained film.

[0040]

[Table 1]

As a comparison, a similar experiment was conducted with a tension of 0.5 kg / m and a temperature of 260 ° C. However, it was difficult to wind the film continuously and wind it.

Example 2 In the same manner as in Example 1, a polyimide film having a thickness of 125 μm was obtained. This was fed into a tunnel-type infrared irradiation furnace at 250 ° C., heat-treated for 30 seconds at the treatment tension shown in Table 2, and then cooled to room temperature.

Table 2 shows the evaluation results of the heat shrinkage of the obtained film.

[0044]

[Table 2]

Example 3 Pyromellitic dianhydride and 4,4'- as diamine component
Diaminodiphenyl ether (70 mol%) and p-
Phenylenediamine (30 mol%) and N,
The polyamic acid solution was obtained by proceeding the reaction while stirring in N-dimethylacetamide.

Acetic anhydride and isoquinoline were added to the polyamic acid solution, and the mixture was stirred. The solution was extruded on a heated support, converted into a polyimide to form a self-supporting film, peeled from the support, and further converted to imide. Was completed, the solvent was dried, and the film was wound up on a roll as a polyimide film having a thickness of 25 μm. This polyimide film was continuously fed into a tunnel-type infrared irradiation furnace at the temperature shown in Table 1, and heat-treated under the conditions shown in Table 1, and then cooled to room temperature while being wound outside the furnace. The film tension during the heat treatment was adjusted by the rotation speed difference between the feed roller and the winding roller, and the heat treatment time was adjusted by the relative rotation speed of each roller.

Table 3 shows the evaluation results of the heat shrinkage of the obtained film.

[0048]

[Table 3]

A similar experiment was conducted with a tension of 0.5 kg / m and a temperature of 260 ° C. for comparison, but it was difficult to continuously wind the film due to the waves.

[0050]

According to the production method of the present invention, the low-shrinkage polyimide film is subjected to heat treatment by irradiating infrared rays while maintaining the longitudinal tension at 1 kg / m or more and 10 kg / m or less. A polyimide film having extremely low heating efficiency and a low shrinkage rate can be obtained in a short time.

Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat II (Reference) B29K 105: 02 C08L 79:08

Claims (2)

[Claims] A polyamic acid solution obtained by polymerizing pyromellitic dianhydride and 4,4′-diaminodiphenyl ether in an organic solvent is cast or extruded into a film,
After drying and heat-treating the polyimide film, the tension is maintained at 1 kg / m or more and 10 kg / m or less in the length direction of the film, and the film is heat-treated in a short time by irradiating far infrared rays.
A method for producing a low-shrinkage polyimide film subjected to a cooling treatment. 2. A catalyst and a dehydrating agent are added to a polyamic acid solution obtained by polymerizing pyromellitic dianhydride and 4,4′-diaminodiphenyl ether in an organic solvent, and the resultant is cast or formed into a film. The polyimide film obtained by extrusion, drying and heat treatment is heated in a short time by irradiating far-infrared rays with the tension kept at 1 kg / m or more and 10 kg / m or less in the length direction of the film, and then cooled. A method for producing a low shrinkage polyimide film.