JP2000068053A - Manufacture of organic luminescent device - Google Patents

Manufacture of organic luminescent device

Info

Publication number
JP2000068053A
JP2000068053A JP10230417A JP23041798A JP2000068053A JP 2000068053 A JP2000068053 A JP 2000068053A JP 10230417 A JP10230417 A JP 10230417A JP 23041798 A JP23041798 A JP 23041798A JP 2000068053 A JP2000068053 A JP 2000068053A
Authority
JP
Japan
Prior art keywords
mask
organic light
metal mask
manufacturing
pixel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10230417A
Other languages
Japanese (ja)
Inventor
Ritsuo Inaba
律夫 稲葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10230417A priority Critical patent/JP2000068053A/en
Publication of JP2000068053A publication Critical patent/JP2000068053A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To dispense with the positioning of a metal mask and provide a large and precise organic luminescent device by determining the width ratio of a part corresponding to a light emitting part and the boundary part of a luminescent pixel above a specific range relative to an evaporation mask used, when the pixels of the luminescent element are distinguished or when a multicolored luminescent pixel is manufactured. SOLUTION: The line width of a metal mask for determining a pixel boundary of a cathode electrode for determing the pixel of a luminescent element is taken large. That is, the ratio of the width of a part corresponding particularly to a light generating part (an exposed part of a mask) and a boundary part of a luminescent pixel (a metal part of the mask) is set so as to be above 1:0.5 in a deposition mask. In a metal mask 2, for example, the ratio of an exposed part on which the cathode electrode is to be deposited and a meal part 22 as a mask part is determined to be 1:2, a base is moved by one pixel after the first deposition, and then the base is moved once more to realize the luminescent pixel of RGB. As a result, the positioning of the metal mask 2 becomes unnecessary.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は有機発光ディスプレ
ーデバイスに関するもので、特に高精細度のディスプレ
ーの構成とその製造方法と製造装置に関するものである
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light-emitting display device, and more particularly to a structure of a high-definition display and a method and apparatus for manufacturing the same.

【0002】[0002]

【従来の技術】有機発光素子を用いて、大型化または高
精細度化を目指したディスプレーを作製する場合には、
各画素を区分して発光させる必要がある。各画素を区分
するためには通常縦方向の電極と横方向の電極との交差
した部分が発光点となり、その画素複数個設けて大画面
化するのが一般的である。
2. Description of the Related Art When an organic light-emitting device is used to manufacture a display aiming at enlargement or high definition,
It is necessary to make each pixel emit light separately. In order to divide each pixel, a portion where a vertical electrode and a horizontal electrode intersect usually serves as a light emitting point, and it is general to provide a plurality of the pixels to enlarge the screen.

【0003】有機発光ディスプレーは、ガラス基板上に
透明電極を細長い線として構成して一方向の電極部を確
保する。他方向横方向は、有機発光素子のカソード電極
作製時のメタルマスクを蒸着部分が抜けた形にしてお
き、その抜けた部分にカソード電極を蒸着して作製す
る。
In an organic light emitting display, a transparent electrode is formed as an elongated line on a glass substrate to secure an electrode portion in one direction. In the other direction, in the lateral direction, the metal mask used for manufacturing the cathode electrode of the organic light emitting element is formed in such a manner that a vapor deposition portion is left out, and the cathode electrode is vapor-deposited in the left portion.

【0004】有機発光ディスプレーの機能を一歩進めた
時、例えば高精細度化、大面積化、カラー化等を行う時
には、単純なメタルマスクを用いた有機発光ディスプレ
の作製方法が使えなくなる。
When the function of the organic light emitting display is advanced one step, for example, when a high definition, a large area, and a color are performed, a method of manufacturing an organic light emitting display using a simple metal mask cannot be used.

【0005】一例として、0.3mm角の発光画素のデ
ィスプレーの作製を考えた時、ディスプレー作製に用い
るメタルマスクは発光部の0.3mmに対応する穴が開
いた形が必要となる。
As an example, when a display of a 0.3 mm square light emitting pixel is considered, a metal mask used for manufacturing the display needs to have a hole having a hole corresponding to 0.3 mm of a light emitting portion.

【0006】さらに、画素間を分離する部分、マスク上
ではカソード電極の付着を防止するマスクのメタル線
(この分離幅は発光領域の開口面積を大きく取るため出
来る限り少ないことが求められるため、発光領域の6分
の1の0.05mmとすると)が多数並んだ形となる。
Further, a metal line of a mask for preventing adhesion of a cathode electrode on a portion for separating pixels, that is, a mask metal line for preventing the adhesion of a cathode electrode (this separation width is required to be as small as possible in order to increase the opening area of a light emitting region. (If one sixth of the area is set to 0.05 mm), a large number of lines are arranged.

【0007】0.05mmの線が0.3mm複数本平行
に並んだメタルマスクは、安定に機能するためのその長
さ方向は線幅の100倍から200倍が限度となるた
め、この構成ではメタルマスクを用いた有機発光ディス
プレーの発光幅(勿論他の方向はこの議論には当てはま
らない)はせいぜい20mmが限界となる。
A metal mask in which a plurality of lines of 0.05 mm are arranged in parallel with a plurality of lines of 0.3 mm has a limit in a length direction of 100 to 200 times the line width in order to function stably. The emission width of an organic light-emitting display using a metal mask (of course, other directions do not apply to this discussion) is limited to at most 20 mm.

【0008】[0008]

【発明が解決しようとする課題】本発明は、従来の有機
発光ディスプレーの作製において、メタルマスクの構造
とその使い方を替えることによって大型化と高精細度化
への課題を解決するものである。
SUMMARY OF THE INVENTION The present invention solves the problem of increasing the size and increasing the definition by changing the structure of a metal mask and its use in the production of a conventional organic light emitting display.

【0009】従来のメタルマスクを大きく出来ない理由
を再度記すと、従来例で示したように、メタルマスクの
線幅と長さの割合が有る範囲を超えた時に幾何学的な安
定性に限界が生じるためである。
The reason why the conventional metal mask cannot be enlarged is described again. As shown in the conventional example, when the ratio between the line width and the length of the metal mask exceeds a certain range, the geometric stability is limited. Is caused.

【0010】その限界要因を決める一つは、温度による
メタルマスクの膨張によるもので、他は機械的な剛性不
足によるもので、わずかな振動、応力(内部応力の緩和
等を含めたもの)でマスクの線の位置がずれるため、幾
何学的な位置が確保されないことによるものである。
One of the limiting factors is due to the expansion of the metal mask due to temperature, and the other is due to insufficient mechanical rigidity, and is caused by slight vibration and stress (including the relaxation of internal stress). This is because the position of the line of the mask is displaced, so that the geometrical position is not secured.

【0011】第2の課題は、単色の場合には、ディスプ
レーの発光領域は単純な発光画素が単にその数が多くな
っただけであり、メタルマスク作業は一回で済むが、多
色化を行う際には、各色の発光画素位置とメタルマスク
の位置関係を確保しなければならない。その位置決め精
度確保が課題となる。
The second problem is that, in the case of a single color, the number of simple light-emitting pixels in the light-emitting area of the display is simply increased, and the metal mask work is performed only once. When performing this, it is necessary to ensure the positional relationship between the positions of the light emitting pixels of each color and the metal mask. The problem is how to secure the positioning accuracy.

【0012】勿論、以上の課題は現時点の技術で克服出
来ない課題では無いが、真空装置内でのミクロン精度の
位置合わせは簡単な技術では無い。
[0012] Of course, the above-mentioned problems are not problems that cannot be overcome by the current technology, but alignment with micron precision in a vacuum device is not a simple technology.

【0013】本発明は以上の欠点を克服するために、一
つはメタルマスクの剛性を高くすることと、メタルマス
クの位置合わせを無くす(位置決め精度を極端に緩くす
る)ことが発明の主要な点である。
In order to overcome the above-mentioned drawbacks, the present invention mainly involves increasing the rigidity of the metal mask and eliminating alignment of the metal mask (extremely loose positioning accuracy). Is a point.

【0014】[0014]

【課題を解決するための手段】本発明は、有機発光素子
を複数個並べて構成される有機発光素子ディスプレーの
作製において、発光素子画素を区分する時または多色の
発光画素を作製する際に用いる蒸着マスクを、特に発光
部に相当する部分(マスクではあいた部分)と発光画素
の境界部分(マスクではメタル部分)の幅の割合を1対
0.5以上に取ったことを特徴とする。
SUMMARY OF THE INVENTION The present invention is used for manufacturing an organic light emitting device display comprising a plurality of organic light emitting devices arranged side by side when dividing light emitting device pixels or manufacturing multicolor light emitting pixels. The vapor deposition mask is characterized in that the ratio of the width of the portion corresponding to the light emitting portion (the open portion in the mask) and the width of the boundary portion between the light emitting pixels (the metal portion in the mask) is 1: 0.5 or more.

【0015】[0015]

【発明の実施の形態】メタルマスクの剛性を高めるため
に取った手段は、発光素子の画素を決めるカソード電極
の画素境界を決めるメタルマスクの線幅を大きく取るこ
とを行ったことである。
The means taken to increase the rigidity of the metal mask is to increase the line width of the metal mask which determines the pixel boundary of the cathode electrode which determines the pixel of the light emitting element.

【0016】従来例で示した発光領域0.3mm幅で、
境界決定のための線幅0.05mmの構造を、一例とし
て発光領域は0.3mmと同一に取って、境界決定のメ
タルマスク線幅を発光領域と同様な幅0.3mmに取
る。
With the light emitting area of 0.3 mm width shown in the conventional example,
For example, a structure having a line width of 0.05 mm for determining a boundary has the same light emitting area as 0.3 mm as an example.

【0017】この構成で境界領域決定のメタルマスクの
線幅を比較するならば、0.05mmから0.3mmに
増加することで、単純計算でも6倍の剛性の増大が期待
される。
If the line width of the metal mask for determining the boundary area is compared with this configuration, it is expected that the rigidity will be increased by a factor of six even in a simple calculation by increasing the line width from 0.05 mm to 0.3 mm.

【0018】勿論、基板の厚みを増加させることも可能
となるため、この実施例でも一桁以上の剛性の増大が可
能となる。勿論、線幅領域をさらに大きく取ることによ
ってより一層の剛性の増大が得られる。
Of course, since the thickness of the substrate can be increased, the rigidity of the present embodiment can be increased by one digit or more. Of course, by further increasing the line width region, a further increase in rigidity can be obtained.

【0019】次に熱膨張による変形防止があげられる
が、蒸着時に蒸発材料を加熱する際にメタルマスクの温
度上昇が生じる。マスクの温度上昇によって膨張しなけ
れば、または少なければ変形量が少ない。
Next, the prevention of deformation due to thermal expansion can be mentioned. However, when the evaporation material is heated during vapor deposition, the temperature of the metal mask rises. If the temperature does not expand due to a rise in the temperature of the mask, or if it is small, the amount of deformation is small.

【0020】本発明は、温度上昇の際に、さらにマスク
材料の膨張係数を負に取って逆に収縮する事を目指した
もので、メタルマスクに張力を与えて機械的な剛性、特
に共鳴振動数を上げるものである。
The present invention aims at reducing the expansion coefficient of the mask material to a negative value and conversely contracting it when the temperature rises. To increase the number.

【0021】その効果をより一層大きく取るために、メ
タルマスクの外枠を設けて外枠にマスクより膨張係数の
大きな材料を用いて積極的に応力を加えることも効果を
高めるための一方法である。
In order to further increase the effect, it is also possible to increase the effect by providing an outer frame of a metal mask and actively applying stress to the outer frame using a material having a larger expansion coefficient than the mask. is there.

【0022】メタルマスクの境界の線幅を大きく取るこ
とを可能にするための理由は、蒸着の作業を分けること
によって可能となる。
The reason why the line width at the boundary of the metal mask can be made large can be attained by dividing the vapor deposition operation.

【0023】蒸着作業を詳細に記すと、第一回目の蒸着
は従来通りの方法で行い、次にメタルマスクまたは基板
を一画素分(特に一画素に限る必要は無い)移動させて
第2回目の蒸着を行う。
The vapor deposition operation is described in detail. The first vapor deposition is performed by a conventional method, and then the metal mask or the substrate is moved by one pixel (not particularly limited to one pixel), and the second vapor deposition is performed. Is deposited.

【0024】ここでは第1回目の蒸着と第2回目の蒸着
は全く同一の作業である。結果は基板上に第1回目のパ
ターンと第2回目のパターンが平行した形で蒸着され
る。
Here, the first vapor deposition and the second vapor deposition are completely the same operation. The result is that the first and second patterns are deposited on the substrate in parallel.

【0025】従来は0.3mm(開き部分)、0.05
mm(メタル部分)、0.3mm、0.05mmと並ん
だものを、本発明のメタルマスクでは0.3mm(開き
部分)のパターンを0.35mm移動させることによっ
て同様な蒸着パターンを実現することが出来る。その
際、とばした部分はメタルマスクが開いていないことが
条件となる。
Conventionally, 0.3 mm (open portion), 0.05
A similar vapor deposition pattern can be realized by moving a 0.3 mm (open portion) pattern by 0.35 mm in the metal mask of the present invention from a line of mm (metal portion), 0.3 mm, and 0.05 mm. Can be done. At that time, the skipped portion must have the metal mask not opened.

【0026】特に、カラー化を行う際にはRGBと発光
画素が並ぶが、第1回の蒸着でR部の場所に赤色の有機
発光材を蒸着して、さらに同時にメタルマスクを蒸着す
る。
In particular, when colorization is performed, RGB and light-emitting pixels are arranged side by side, but a red organic light-emitting material is vapor-deposited at the R portion in the first vapor deposition, and a metal mask is vapor-deposited at the same time.

【0027】次に、第2回の蒸着では一画素分マスクま
たは基板を移動させてG、すなわち緑の有機材料とメタ
ルマスクの蒸着を行う。
Next, in the second deposition, the mask or the substrate is moved by one pixel to deposit G, that is, a green organic material and a metal mask.

【0028】さらに、第3回目のB、すなわち青の蒸着
を行う。この蒸着作業では各色の有機材料とその位置で
のカソード電極が同時に出来るため、メタルマスクの位
置合わせは特に必要なく、単に一画素分の移動を行えば
良いため、従来の蒸着作業を替えることは無い。
Further, a third B, ie, blue deposition is performed. In this vapor deposition work, the organic material of each color and the cathode electrode at that position can be formed at the same time, so there is no particular need to position the metal mask, and it is only necessary to move one pixel. There is no.

【0029】以下、本発明の実施の形態について図面を
参照しながら説明する。図1に本発明の有機発光ディス
プレーデバイスの素子構成を示す。
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an element configuration of the organic light emitting display device of the present invention.

【0030】図1において、11はディスプレーの基板
を示し、12はガラス基板上に設けた透明電極を示す。
13はホール輸送材料、14は電子輸送材料、15はカ
ソード電極である。
In FIG. 1, reference numeral 11 denotes a display substrate, and reference numeral 12 denotes a transparent electrode provided on a glass substrate.
13 is a hole transport material, 14 is an electron transport material, and 15 is a cathode electrode.

【0031】有機発光素子の作製の一実施例を記すと、
ガラス基板上の透明電極をフォトリゾグラフイーで構成
した上にホール輸送材料13と電子輸送材料14を基板
の全面に蒸着する。さらにカソード電極15は電極形状
に応じたメタルマスクを用意しておき、真空装置内で蒸
着作業で設ける。
One embodiment of the production of the organic light emitting device is as follows.
A transparent electrode on a glass substrate is formed by photolithography, and a hole transport material 13 and an electron transport material 14 are deposited on the entire surface of the substrate. Further, the cathode electrode 15 is prepared by preparing a metal mask corresponding to the electrode shape and performing a vapor deposition operation in a vacuum device.

【0032】図2に本発明のメタルマスクの一実施例を
示す。図2において、21はカソード電極が蒸着され
る、マスクでは開き部分で、22は遮蔽部分となる金属
(メタル)部分を示す。図2では、RGBの3色の画素
を設けることを目的とするために、開き部分21とメタ
ル部分22との割合を1対2に取って有る。
FIG. 2 shows an embodiment of the metal mask of the present invention. In FIG. 2, reference numeral 21 denotes an open portion of a mask on which a cathode electrode is deposited, and reference numeral 22 denotes a metal portion serving as a shielding portion. In FIG. 2, the ratio between the open portion 21 and the metal portion 22 is set to 1: 2 for the purpose of providing RGB three-color pixels.

【0033】図3に蒸着装置の構成例を示す。図中、1
は蒸着源、2はメタルマスク、3は基板を示す。本実施
例では第1回目の蒸着後、基板3を一画素動かして、さ
らにもう一度基板を動かしてRGBの発光画素を実現す
る。
FIG. 3 shows an example of the structure of a vapor deposition apparatus. In the figure, 1
Denotes an evaporation source, 2 denotes a metal mask, and 3 denotes a substrate. In this embodiment, the substrate 3 is moved by one pixel after the first vapor deposition, and the substrate is moved again to realize RGB light emitting pixels.

【0034】移動精度は本発明ではRGB、RGBの繰
り返しが一度に出来るため、第一回目の位置と第3回目
の位置が重ならなければ良いことで、0.3mmの画素
幅でギャップを0.05mmに取るとき、メタルマスク
を0.6mm移動した時の位置決め精度が0.05mm
以下であることが必要である。
In the present invention, RGB and RGB can be repeated at one time in the present invention, so that the first position and the third position do not have to overlap each other. 0.05 mm, the positioning accuracy when the metal mask is moved 0.6 mm is 0.05 mm
It must be:

【0035】移動距離とその移動に伴う位置決め精度の
相対精度は0.05/0.3=0.16となり、10%
以下の送り精度が確保されれば良いことが分かる。
The relative accuracy of the movement distance and the positioning accuracy accompanying the movement is 0.05 / 0.3 = 0.16, which is 10%.
It can be seen that the following feeding accuracy should be ensured.

【0036】尚、蒸着マスクは、発光部に相当する部分
(マスクではあいた部分)と発光画素の境界部分(マス
クではメタル部分)の幅の割合を、特に1対2内外に取
ることが望ましい。
It is preferable that the ratio of the width of the portion corresponding to the light emitting portion (open portion in the mask) and the width of the boundary portion between the light emitting pixels (metal portion in the mask) be 1 to 2 in particular.

【0037】また、メタルマスクの使用時に前記メタル
マスク周囲からバネで引っ張って平坦度を確保して用い
てもよい。
Further, when the metal mask is used, the metal mask may be pulled from the periphery of the metal mask with a spring to ensure flatness.

【0038】[0038]

【発明の効果】以上のように、本発明によれば、メタル
マスクのパターン構成と蒸着作業をわずか替えるだけ
で、ファインパターンの画素の実現とマスク合わせなし
にフルカラー化ディスプレーの作製が可能となり、大型
化と高精細度化が容易となる。
As described above, according to the present invention, a fine pattern pixel can be realized and a full-color display can be produced without mask alignment by only slightly changing the pattern configuration and the vapor deposition operation of the metal mask. Large size and high definition can be easily achieved.

【0039】特に、真空装置内でのミクロン精度の位置
合わせなどを行うことなしに、ミクロン精度に相当する
位置合わせ技術が可能になったことは、技術の波及を促
進する意味で、効果は大なるものがある。
In particular, the fact that the positioning technology corresponding to the micron accuracy has been made possible without performing the positioning with a micron accuracy in a vacuum apparatus has a great effect in terms of promoting the spread of the technology. There is something.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態における有機発光デバイ
スの構成を示す図
FIG. 1 is a diagram showing a configuration of an organic light emitting device according to an embodiment of the present invention.

【図2】本実施の形態におけるメタルマスク構造を示す
FIG. 2 is a diagram showing a metal mask structure according to the embodiment;

【図3】本発明の有機発光デバイスの作製装置の概略図FIG. 3 is a schematic view of an apparatus for manufacturing an organic light emitting device of the present invention.

【符号の説明】[Explanation of symbols]

1 蒸着源 2 メタルマスク 3 基板 11 ディスプレー基板 12 ITO透明電極 13 ホール輸送材料 14 電子輸送材料 15 カソード電極 21 開き部分 22 メタル部分 DESCRIPTION OF SYMBOLS 1 Deposition source 2 Metal mask 3 Substrate 11 Display substrate 12 ITO transparent electrode 13 Hole transport material 14 Electron transport material 15 Cathode electrode 21 Open part 22 Metal part

フロントページの続き Fターム(参考) 3K007 AB04 AB06 AB17 AB18 BA06 CB01 DA01 DB03 EB00 FA01 4K029 AA09 BB03 BD00 HA05 5C094 AA05 AA14 AA43 AA46 AA48 BA12 BA27 CA19 DA13 DB01 EA05 FA01 FB03 FB12 GB10 JA08 Continued on the front page F term (reference) 3K007 AB04 AB06 AB17 AB18 BA06 CB01 DA01 DB03 EB00 FA01 4K029 AA09 BB03 BD00 HA05 5C094 AA05 AA14 AA43 AA46 AA48 BA12 BA27 CA19 DA13 DB01 EA05 FA01 FB03 FB12 GB10 JA08

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】有機発光素子を複数個並べて構成される有
機発光素子ディスプレーの作製において、発光素子画素
を区分する時または多色の発光画素を作製する際に用い
る蒸着マスクを、発光部に相当する部分(マスクではあ
いた部分)と発光画素の境界部分(マスクではメタル部
分)の幅の割合を1対0.5以上に取ったことを特徴と
する有機発光デバイスの製造方法。
1. An organic light-emitting element display comprising a plurality of organic light-emitting elements arranged, a deposition mask used for dividing light-emitting element pixels or for producing multicolor light-emitting pixels corresponds to a light-emitting portion. A method of manufacturing an organic light-emitting device, wherein a ratio of a width of a portion to be formed (a portion opened by a mask) to a boundary portion of a light-emitting pixel (a metal portion in a mask) is set to 1: 0.5 or more.
【請求項2】蒸着マスクを、発光部に相当する部分(マ
スクではあいた部分)と発光画素の境界部分(マスクで
はメタル部分)の幅の割合を、1対2内外に取ったこと
を特徴とする請求項1記載の有機発光デバイスの製造方
法。
2. The method according to claim 1, wherein a ratio of a width of a portion corresponding to a light emitting portion (open portion in the mask) and a width of a boundary portion of the light emitting pixel (metal portion in the mask) is 1: 2. The method for manufacturing an organic light emitting device according to claim 1.
【請求項3】有機発光素子を複数個並べて構成される有
機発光素子ディスプレーの作製において、発光素子画素
を区分する時、または多色の発光画素を作製する際に用
いるメタルマスクを、同一作業で有機発光材料の作製の
際に用いてかつカソード電極作製の際に用いることを特
徴とする請求項1または2記載の有機発光デバイスの製
造方法。
3. A method of manufacturing an organic light-emitting device display comprising a plurality of organic light-emitting devices, wherein a metal mask used for dividing light-emitting device pixels or for manufacturing multicolor light-emitting pixels is formed by the same operation. 3. The method for manufacturing an organic light emitting device according to claim 1, wherein the method is used when manufacturing an organic light emitting material and when manufacturing a cathode electrode.
【請求項4】メタルマスクの材料に熱膨張係数の負の材
料を用いることを特徴とする請求項1〜3のいずれかに
記載の有機発光デバイスの製造方法。
4. The method for manufacturing an organic light emitting device according to claim 1, wherein a material having a negative thermal expansion coefficient is used as a material of the metal mask.
【請求項5】メタルマスクの使用時に前記メタルマスク
周囲からバネで引っ張って平坦度を確保して用いること
を特徴とする請求項1〜4のいずれかに記載の有機発光
デバイスの製造方法。
5. The method for manufacturing an organic light-emitting device according to claim 1, wherein when the metal mask is used, the flatness is secured by pulling the metal mask from the periphery thereof with a spring.
【請求項6】メタルマスクの周囲部に前記メタルマスク
の熱膨張係数より大きい材料を枠として用いることを特
徴とする請求項1〜5のいずれかに記載の有機発光デバ
イスの製造方法。
6. The method for manufacturing an organic light emitting device according to claim 1, wherein a material having a coefficient of thermal expansion larger than that of the metal mask is used as a frame around the metal mask.
【請求項7】請求項1〜6のいずれかに記載のメタルマ
スクを用いた有機発光デバイスの作製装置。
7. An apparatus for manufacturing an organic light-emitting device using the metal mask according to claim 1.
JP10230417A 1998-08-17 1998-08-17 Manufacture of organic luminescent device Pending JP2000068053A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10230417A JP2000068053A (en) 1998-08-17 1998-08-17 Manufacture of organic luminescent device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10230417A JP2000068053A (en) 1998-08-17 1998-08-17 Manufacture of organic luminescent device

Publications (1)

Publication Number Publication Date
JP2000068053A true JP2000068053A (en) 2000-03-03

Family

ID=16907569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10230417A Pending JP2000068053A (en) 1998-08-17 1998-08-17 Manufacture of organic luminescent device

Country Status (1)

Country Link
JP (1) JP2000068053A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284046A (en) * 2000-03-31 2001-10-12 Sanyo Electric Co Ltd Manufacturing method of electroluminescence display device
EP1207557A3 (en) * 2000-09-28 2005-10-12 SANYO ELECTRIC Co., Ltd. Method of attaching layer material and forming layer in predetermined pattern on substrate using mask
KR100741052B1 (en) * 2000-10-16 2007-07-19 삼성에스디아이 주식회사 Vacuum evaporation mask of EL display device, and vacuum evaporation method and apparatus utilizing the same
US7439667B2 (en) 2003-12-12 2008-10-21 Semiconductor Energy Laboratory Co., Ltd. Light emitting device with specific four color arrangement
US7508126B2 (en) 2003-12-17 2009-03-24 Semiconductor Energy Laboratory Co., Ltd. Display device with specific pixel configuration and manufacturing method thereof
CN110071217A (en) * 2019-03-29 2019-07-30 武汉华星光电半导体显示技术有限公司 The production method and display device of mask plate, display panel

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284046A (en) * 2000-03-31 2001-10-12 Sanyo Electric Co Ltd Manufacturing method of electroluminescence display device
EP1207557A3 (en) * 2000-09-28 2005-10-12 SANYO ELECTRIC Co., Ltd. Method of attaching layer material and forming layer in predetermined pattern on substrate using mask
KR100741052B1 (en) * 2000-10-16 2007-07-19 삼성에스디아이 주식회사 Vacuum evaporation mask of EL display device, and vacuum evaporation method and apparatus utilizing the same
US7439667B2 (en) 2003-12-12 2008-10-21 Semiconductor Energy Laboratory Co., Ltd. Light emitting device with specific four color arrangement
US7898166B2 (en) 2003-12-12 2011-03-01 Semiconductor Energy Laboratory Co., Ltd. Light emitting device emitting four specific colors
US8334645B2 (en) 2003-12-12 2012-12-18 Semiconductor Energy Laboratory Co., Ltd. Light emitting device emitting four specific colors
US8791629B2 (en) 2003-12-12 2014-07-29 Semiconductor Energy Laboratory Co., Ltd. Light emitting device including pixel the pixel including sub-pixels
US9214493B2 (en) 2003-12-12 2015-12-15 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US7508126B2 (en) 2003-12-17 2009-03-24 Semiconductor Energy Laboratory Co., Ltd. Display device with specific pixel configuration and manufacturing method thereof
EP1544928A3 (en) * 2003-12-17 2011-06-15 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
CN110071217A (en) * 2019-03-29 2019-07-30 武汉华星光电半导体显示技术有限公司 The production method and display device of mask plate, display panel
CN110071217B (en) * 2019-03-29 2023-12-12 武汉华星光电半导体显示技术有限公司 Mask plate, manufacturing method of display panel and display device

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