JP2000068017A - Electrically connecting device for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To removably mount an electronic component. SOLUTION: An electrically connecting device 10 for an electronic component includes an electrically insulating substrate, maintaining members 32 that are arranged at intervals on the substrate and maintain the electronic components in cooperation with each other, and a plurality of contact electrodes 34 that are provided for the substrate and project from at least one surface of the substrate. The electronic component is pressed into a maintaining region formed between the maintaining members 32 and held by them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection device for an electronic component having a plurality of projecting electrodes.

[0002]

2. Description of the Related Art Chip scale packages (CS)
P) is known as an electronic component in which a semiconductor product such as an integrated circuit is assembled into a chip-sized package.

In general, this type of electronic component has a plurality of electrode portions spaced from each other formed on a land of wiring of a circuit board such as a wiring board by melting a hemispherical solder formed on their flat surfaces. By bonding, it is mounted on a circuit board.

However, with such a mounting technique, the mounted electronic components cannot be removed from the circuit board for the purpose of replacement, inspection, and the like.

[0005]

Therefore, it is important to removably assemble the electronic components assembled on the CSP.

[0006]

According to the present invention, there is provided an electrical connection device comprising: an electrically insulating substrate; a maintenance member disposed at a distance from the substrate and cooperating with each other to maintain an electronic component;
A plurality of contact electrodes provided on the substrate and protruding from at least one surface of the substrate.

[0007] The electronic component is pushed into the maintenance region formed by the maintenance member with the electrode portion in contact with the contact electrode with the electrode portion facing the substrate. Thereby, the electronic component is assembled on the substrate and held by the maintenance member.

According to the electrical connection device of the present invention, since the electrode portion of the electronic component is not bonded to the contact electrode, the electronic component can be removed from the substrate.

The maintenance member includes a main body extending from an edge of the substrate to one side and a stopper formed at a tip of the main body, and receives the electronic component to position the main body relative to the substrate. A stopper portion and a claw portion formed at a tip end portion of the main body portion, which is locked to the electronic component to prevent the electronic component from dropping out of the electrical connection device in cooperation with the stopper portion. And a claw portion.
Thereby, the electronic component is positioned with respect to the substrate, and the drop of the electronic component from the electrical connection device is prevented.

[0010] The maintaining member may further include a guide surface formed at a tip end of the main body, the guide surface being inclined closer to the substrate toward the center of the substrate. Thus, when the electronic component is pushed between the holding members, the electronic component is naturally guided to a correct position on the substrate by the guide surface, and as a result, the electronic component is easily assembled to the substrate.

[0011] The contact electrode may have a top surface substantially parallel to the substrate, the top surface being in contact with the electrode portion of the electronic component, and may have a recess opened to the top surface. As a result, the electronic component has a portion of the electrode portion received in the recess of the contact electrode,
Changes to the substrate are more reliably prevented.

In the case of an electronic component having a bump electrode in the electrode portion, the recess of the contact electrode can have substantially the same cross-sectional area from the top surface to a predetermined depth. Thus, the force of crushing the base of the bump electrode of the electronic component toward the main part of the electronic component acts on the bump electrode of the electronic component, but the force of crushing the top of the bump electrode of the electronic component toward the axis thereof is Since it does not act on the bump electrode of the electronic component, the height dimension and the top shape of the bump electrode of the electronic component are not changed.

The contact electrode may penetrate the substrate in the thickness direction, and may have a bump electrode on a side opposite to the top surface. Further, a plurality of the maintaining members can be arranged to face the substrate.
In the latter case, the electronic component is assembled on the substrate by being pushed between the holding members, and is held by the holding members.

The substrate may have a plurality of wiring portions, and each contact electrode may be electrically connected to the wiring portion. In this case, the maintenance member may be received at one end by the substrate so that it extends from one surface of the substrate, or may be fixed to the substrate at one end by bonding, screwing, or the like. .

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1 to FIG. 4, an electric connection device 10 includes an electronic component 12 made of a semiconductor product such as an integrated circuit as shown in FIGS.
4 is used as a device to be mounted.

The electronic component 12 is assembled in a chip scale package (CSP) as shown in FIGS. Therefore, the electronic component 12 has the plurality of electrodes 16 in a matrix on one surface of the main body 18 in the shape of a rectangular plate. As shown in FIG. 6, each electrode 16 includes a flat land 16a and a bump electrode 16b provided on the land 16a. Bump electrode 16b
Is formed by melting and then solidifying the solder.

As shown in FIG. 5, the circuit board 14 is a wiring board having a plurality of wiring portions (not shown) on an electrically insulating substrate 20, and a land 22 electrically connected to the wiring portion. On one side. The wiring part of the circuit board 14
Either formed on any surface of the substrate 20 or
It is formed in one or more layers. Land 22
Correspond to the electrode portions 16 of the electronic component 12 and are arranged in the same pattern as the electrode portions 16.

Referring again to FIGS. 1 to 4, the electrical connection device 10 includes an electrically insulating substrate 30 and a plurality of electrically insulating holding members or maintenance members provided at intervals on the substrate 30. 32 and a plurality of contact electrodes 34 formed in a matrix on the substrate 30.

The substrate 30 is made of an electrically insulating synthetic resin such as polyimide, and has a planar shape similar to the planar shape of the electronic component 12 to be mounted. In the illustrated example, the electronic component 12 and the substrate 30 have a rectangular shape.

On the substrate 30, two maintenance members 32 are provided at each of two opposing edges at intervals in the longitudinal direction of the corresponding edges, and the other opposing two edges are provided.
One retaining member 32 is provided at each of the two edges. As a result, a holding region for holding the electronic components 12 is formed between the holding members 32. Substrate 30
The maintenance members 32 arranged on the opposite edge portions of are opposed to each other.

Each holding member 32 has the shape of a rectangular parallelepiped block, and is formed integrally with the substrate 30 so as to rise from a corresponding edge of the substrate 30 in the illustrated example. . However, the maintenance member 32 may be formed as a separate member from the substrate 30 and attached to the substrate 30 with an adhesive, a screw member, or the like.

Each of the holding members 32 is formed on the main body 36 extending from the edge of the substrate 30 to one side, a stopper 38 formed inside the front end of the main body 36, and formed inside the front end of the main body 36. And a guide surface 42 formed at the tip of the main body 36.

The main body 36 is formed of an electrically insulating material in the form of a rectangular parallelepiped block. Stopper part 3
Reference numeral 8 denotes an upwardly-facing step formed inside the upper portion of the main body 36, which keeps the height position of the electronic component 12 relative to the substrate 36 constant.

The claw portion 40 protrudes inward from the upper end of the main body portion 36, and therefore forms a recess 44 for fitting the edge of the main body portion 18 of the electronic component 12 in cooperation with the stopper portion 38. I have.

The guide surface 42 is an inclined surface formed on the inner side of the upper surface of the main body 36 so that the inner side is closer to the substrate 30, and extends from the inside of the top surface of the main body 36 to the tip of the claw 40. ing.

Each contact electrode 34 corresponds to the electrode portion 16 of the electronic component 12 and penetrates through the substrate 30 in the thickness direction.

A portion of each contact electrode 34 projecting above the substrate 30 is a truncated hemispherical contact portion 48 having a top surface 46 substantially parallel to the substrate 30.
On the other hand, the portion projecting below the substrate 30 is formed by the land 50 of the contact electrode 34 and the bump electrode 52 provided on the land 50.

The portion from the contact portion 48 to the land 50 is formed of a conductive metal material such as nickel. The bump electrodes 52 are formed by melting and solidifying the solder.

The contact electrode 34 has a recess 54 that is open on the top surface 46. The recess 54 has substantially the same cross-sectional area and cross-sectional shape from the top surface 46 to a predetermined depth position. Such a recess 54 can be formed by drilling from the top surface 46 side. In the illustrated example, the recess 54 has a circular cross-sectional shape, but may have a polygonal cross-sectional shape.

Note that the transverse section is a plane perpendicular to the axis of the contact electrode 34. In the drawings, only twelve electrode portions 16 and contact electrodes 34 are shown, but actually more electrode portions 16 and contact electrodes 34 are provided.

The electrical connection device 10 is mounted on the board 20 in advance, as shown in FIG. Electrical connection device 10
For example, in a state where the bump electrodes 52 of the contact electrodes 34 are lightly pressed against the lands 22 of the circuit board 20, the solder bump electrodes 52 are melted and then solidified to be mounted on the circuit board 20. . Thereby, the bump electrode 52 becomes flat.

As shown in FIG. 5, the main part 18 of the electronic component 12 is sucked by the head 56 of the suction mechanism with the electrode part 16 facing down, and in this state, the edge of the main part 18 is held by the holding member. The main body portion 18 is attached to the electrical connection device 10 by being pushed between the holding members 32 until the main body portion 18 is fitted into the recess 44 of the 32.

When the main body 18 is pushed between the holding members 32, the upper portions of the respective holding members 32 are pushed outward by the frusto-conical surfaces 58 on the outer periphery of the lower end of the head 56, and the upper portions of the opposing holding members 32 are pressed. Can be spread. Thus, even if each of the retaining members 32 has the claw 40 forming the recess 44 at the upper end, the electronic component 12 can be easily mounted on the electrical connection device without being hindered by the claw 40.

The edge of the main part 18 is
In the state where the electronic component 12 is fitted to the electronic component 4, the electronic component 12 is gripped by the opposing maintenance member 32 at the edge of the main body 18, and is positioned with respect to the substrate 30 by the stopper 38 and the claw 40. The claw portion 40 is engaged with the edge of the main body portion 18, and thereby cooperates with the stopper portion 38.
2 is prevented from dropping from the electrical connection device 10.
Therefore, the maintenance member 32 is used to connect the electronic component 12 to the substrate 30.
It acts as a positioning member or a positioning guide for positioning with respect to.

The edge of the main body 18 is
4, the electrode part 1 of the electronic component 12
6 is pressed by the contact portion 48 of the contact electrode 34. At this time, as shown in FIG. 6, the bump electrode 16b of the electronic component 12 is deformed so that its base is crushed toward the land 16a and its top bites into the recess 54 of the contact electrode 34.

Thus, the base of the bump electrode 16b is deformed so as to be crushed toward the land 16a, and a step is formed near the boundary between the base and the top of the bump electrode 16b. These deformations cause the base of the bump electrode 16b to bulge, but do not affect the height and the shape of the top of the bump electrode 16b.

When the cross-sectional area and the cross-sectional shape of the recess 54 are substantially the same up to a predetermined depth position, even if the top of the bump electrode 16b bites into the recess 54, the top of the bump electrode 16b is moved to the side of its axis. A force for deforming the bump electrode 16b does not act on the bump electrode 16b. Therefore, even if the bump electrode 16b is pressed by the contact electrode 34, the electrical connection device 10 does not change the height dimension and the shape of the top of the bump electrode 16b. This is true even if the cross-sectional area is slightly different.

The electronic component 12 is separated from the electrical connection device 10 by expanding the opposing upper portion of the holding member 32 by appropriate means and removing the claw 40 of the holding member 32 from the main portion 18 of the electronic component 12. Can be easily removed.

According to the electrical connection device 10 as described above, it is easy to assemble the electromagnetic components into the electrical connection device 10 and, even though the electronic components 12 do not fall off, the electronic components 12 are electrically connected. Can be easily removed from the dynamic connection device 10.

The order of attaching the electrical connection device 10 to the circuit board 20 and attaching the electronic component 12 to the electrical connection device 10 may be reversed. in this case,
When the bump electrode 52 of the electrical connection device 10 is melted, it is desirable that the bump electrode 16b of the electronic component 12 is not melted.

FIGS. 7 and 8 show an embodiment of an electrical connection device 60 using a wiring board as a substrate. The board 62 used in the electrical connection device 60 is an electrically insulating wiring board having a plurality of wiring portions 63. Wiring section 63 of substrate 62
Are formed on any surface of the substrate 62 or are formed in the substrate 62 in a single-layer or multi-layer state.

The substrate 62 has a plurality of rectangular mounting areas each for mounting the electronic component 12. In each mounting area, a plurality of maintaining members 64 extending upward from the substrate 62,
A plurality of contact electrodes 6 penetrating the substrate 62 in the thickness direction
6 are provided.

In each of the mounting areas, two holding members 64 are provided at each of two opposing edges at intervals in the longitudinal direction of the corresponding edge, and the other two opposing edges are provided. One retaining member 64 is provided for each of the parts. The holding members 64 arranged on the opposite edges of the mounting area are opposed.

As in the case of the holding member 32 of the electrical connection device 10, each holding member 64 is formed inside a rectangular parallelepiped main body 36 extending upward from the edge of the substrate 30 and inside the front end of the main body 36. The main body 36 includes a stopper 38, a claw 40 formed inside the distal end of the main body 36, and a guide surface 42 formed at the distal end of the main body 36.

Each holding member 64 is assembled to the substrate 62 by receiving its lower end 68 into a through hole formed in the substrate 62. But glue,
Each maintenance member 66 may be assembled to the substrate 62 by a screw member or the like.

Each contact electrode 66 is arranged on the substrate 62 at the same pattern as the electrode section 16 of the electronic component 12. Each contact electrode 66 is connected to the electrical connection device 10.
Is formed in the same structure and arranged in the same pattern as the contact electrode 34 except that the bump electrode 52 does not have the bump electrode 52 and the recess 54 is a through hole penetrating the contact electrode 66 in the axial direction. Have been.

Therefore, each contact electrode 66 also has a truncated hemispherical contact portion 48 having a top surface 46 above the substrate 62 and substantially parallel to the substrate 62;
2 and a land 50 provided below. The recess 54 of the contact electrode 66 has substantially the same cross-sectional area and cross-sectional shape over the entire thickness of the substrate 62. Also. The contact electrode 66 corresponds to the corresponding wiring portion 6
3 is electrically connected.

The electric connection device 60 is also the electric connection device 1
The electronic component 12 can be mounted on the maintenance member 64 and can be removed from the maintenance member 64 in the same manner as in the case of FIG. However, the electrical connection device 60 may use the substrate 62 itself as a circuit substrate,
A bump electrode made of solder may be provided on the land 50, and may be mounted on the circuit board by the bump electrode or by another method.

A plurality of positioning members may be provided at each edge of the electronic component, or one long positioning member extending in the direction of the edge may be used. Instead of providing a plurality of positioning members, a cylindrical integrated positioning member corresponding to the planar shape of the electronic component may be used.

In each of the above embodiments, the so-called ball grid array (BGA) type electronic component 12 having a plurality of bump electrodes 16b in a matrix (that is, a grid) on one surface of the main body 18 is used. However, the present invention can also be used for mounting electronic components other than the BGA type.

The present invention can be applied not only to a mounting device for mounting an electronic component on a circuit board, but also to an auxiliary device used for an electrical inspection of the electronic component.

The present invention is not limited to the above embodiment. For example, instead of the shape of each contact portion being a truncated hemisphere, it may be a plate shape. Further, the recess 54 need not be provided in the contact electrode. Further, the contact electrode does not have to penetrate the substrate. Therefore, the present invention can be changed to various embodiments without departing from the gist thereof.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of an electrical connection device according to the present invention.

FIG. 2 is a sectional view taken along line 2-2 in FIG.

FIG. 3 is an enlarged plan view showing one embodiment of a contact electrode.

FIG. 4 is an enlarged sectional view showing one embodiment of a maintenance member and a contact electrode.

FIG. 5 is a cross-sectional view showing one embodiment in which the electrical connection device is mounted on a circuit board and electronic components are mounted on the electrical connection device.

FIG. 6 is an enlarged cross-sectional view showing one embodiment of a contact state between an electrode portion of an electronic component and a contact electrode of an electrical connection device.

FIG. 7 is a plan view showing another embodiment of the electrical connection device according to the present invention, showing the electronic component mounted thereon.

FIG. 8 is a sectional view taken along line 8-8 in FIG. 7;

[Explanation of symbols]

 10, 60 Electrical connection device 12 Electronic component 14 Circuit board 16 Electrode portion of electronic component 18 Main component of electronic component 20 Substrate 22 Land of wiring portion 24 First protrusion 30 Substrate of electrical connection device 32 Electrical connection device Maintainer 34 Contact electrode of electrical connection device 36 Main body of maintainer 38 Stopper 40 Claw 42 Guide surface 44 Depression for receiving electronic components 46 Top surface of contact electrode 48 Contact part of contact electrode 50 Contact electrode land 52 bump electrode of contact electrode 54 recess of contact electrode 62 substrate 64 retaining member 66 contact electrode 68 lower end of retaining member

Claims (9)

[Claims] 1. An electrically insulating substrate, a maintenance member disposed on the substrate at a distance and cooperating with each other to maintain an electronic component, and provided on the substrate and protruding from at least one surface of the substrate. A plurality of contact electrodes,
An electrical connection device for electronic components. 2. The maintenance member, comprising: a main body extending from an edge of the substrate to one side; and a stopper formed at a front end of the main body to position the electronic component with respect to the substrate. The electronic device according to claim 1, further comprising: a stopper portion; and a claw portion formed at a distal end portion of the main body portion, the claw portion cooperating with the stopper portion to prevent the electronic component from falling off from the electrical connection device. 2. The electrical connection device according to 1. 3. The holding member according to claim 2, wherein the holding member further includes a guide surface formed at a tip of the main body portion, the guide surface being inclined closer to the substrate toward the center of the substrate. Electrical connection device. 4. The contact electrode has a top surface that is substantially parallel to the substrate and has a top surface with which an electrode portion of the electronic component contacts, and has a recess that is open to the top surface.
The electrical connection device according to claim 1, 2 or 3. 5. The electrical connection device according to claim 1, wherein said contact electrode penetrates through said substrate in a thickness direction thereof. 6. The electrical connection device according to claim 4, wherein the contact electrode has a bump electrode on a side opposite to the side of the top surface. 7. The electrical connection device according to claim 1, wherein a plurality of said maintaining members are arranged to face said substrate. 8. The electrical connection device according to claim 1, wherein the substrate has a plurality of wiring portions, and each contact electrode is electrically connected to the wiring portions. 9. The electrical connection device according to claim 8, wherein the retaining member has one end received by the substrate so as to extend from one surface of the substrate.