JP2000063638A - Damping material - Google Patents

Damping material

Info

Publication number
JP2000063638A
JP2000063638A JP10237819A JP23781998A JP2000063638A JP 2000063638 A JP2000063638 A JP 2000063638A JP 10237819 A JP10237819 A JP 10237819A JP 23781998 A JP23781998 A JP 23781998A JP 2000063638 A JP2000063638 A JP 2000063638A
Authority
JP
Japan
Prior art keywords
liquid butadiene
damping material
epoxidized liquid
butadiene rubber
damping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP10237819A
Other languages
Japanese (ja)
Inventor
Masayuki Ogoshi
雅之 大越
Tetsuro Rogo
哲朗 老後
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SWCC Corp
Original Assignee
Showa Electric Wire and Cable Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Electric Wire and Cable Co filed Critical Showa Electric Wire and Cable Co
Priority to JP10237819A priority Critical patent/JP2000063638A/en
Publication of JP2000063638A publication Critical patent/JP2000063638A/en
Withdrawn legal-status Critical Current

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  • Building Environments (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide damping materials showing a damping effect good in the low frequency region of several hertz or less such as an earthquake motion and low in temperature dependency. SOLUTION: This damping material is composed of a rubber composition comprising (A) an epoxidized liquid butadiene rubber, (B) a plasticizer, and (C) a curing agent, and the epoxidized liquid butadiene rubber (A) is composed of a mixture of at least two epoxidized liquid butadiene rubbers having different glass transition temperatures. Further, the component (B) is composed of bitumen, and the component (C) is composed of an amine compound or an acid anhydride.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、建築物の耐震、制
振のために使用される制振材に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a damping material used for earthquake resistance and damping of buildings.

【0002】[0002]

【従来の技術】従来より、一般車両、建築物の床や壁、
機械等の振動の防止や、音響設備の防音などを目的とし
て、高分子粘弾性材料からなる各種の制振材が開発され
ている。
2. Description of the Related Art Conventionally, general vehicles, floors and walls of buildings,
Various damping materials made of polymer viscoelastic materials have been developed for the purpose of preventing vibration of machines and soundproofing of acoustic equipment.

【0003】例えば、アスファルトを主成分とし、これ
に充填剤等を配合してシート状にしたものが、車両用防
振シートとして提案されている。
For example, a sheet made of asphalt as a main component, which is mixed with a filler or the like to form a sheet, has been proposed as a vehicle vibration-proof sheet.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、このよ
うな従来より知られる制振材は、数十Hz〜数千Hz程度と
比較的高い周波数領域の振動に対しては良好な制振効果
を発揮するものの(高分子粘弾性材料は、通常、高周波
数になるほど制振効果が高くなるという特性を有す
る。)、数Hz以下の低い周波数領域での制振効果は不十
分であるという問題があった。
However, such a conventionally known damping material exerts a good damping effect against vibration in a relatively high frequency range of about several tens Hz to several thousands Hz. However, the high-frequency viscoelastic material generally has the characteristic that the damping effect becomes higher as the frequency becomes higher.) However, there is a problem that the damping effect in the low frequency region of several Hz or less is insufficient. It was

【0005】また、このため、かかる特性が要求され
る、例えば建築物や各種構造物の耐震補強のために用い
る粘弾性ダンパーや制振壁などの用途への適用は困難で
あった。ちなみに、車両用制振材は比較的高周波領域で
使用されるものである。
For this reason, it has been difficult to apply it to applications such as viscoelastic dampers and damping walls used for seismic reinforcement of buildings and various structures, which require such characteristics. Incidentally, the vehicle damping material is used in a relatively high frequency range.

【0006】さらに、制振効果に温度依存性があり、使
用環境によって制振性能が変化するという問題もあっ
た。また、機械的物性に乏しいという問題もあった。
Further, there is a problem that the vibration damping effect has temperature dependency, and the vibration damping performance changes depending on the use environment. There is also a problem that mechanical properties are poor.

【0007】本発明はこのような問題を解決するために
なされたもので、地震動のような数Hz以下の低周波数領
域でも良好な制振効果を示し、かつ、温度依存性が小さ
く、機械的物性も良好な制振材を提供することを目的と
する。
The present invention has been made in order to solve such a problem and shows a good vibration damping effect even in a low frequency region of several Hz or less such as seismic motion, has a small temperature dependency, and has a mechanical property. The purpose is to provide a vibration damping material having good physical properties.

【0008】[0008]

【課題を解決するための手段】本発明の制振材は、
(A)エポキシ化液状ブタジエンゴム、(B)可塑剤、
および(C)硬化剤を含有するゴム組成物からなること
を特徴としている。
The damping material of the present invention is
(A) epoxidized liquid butadiene rubber, (B) plasticizer,
And (C) a rubber composition containing a curing agent.

【0009】以下、本発明を詳細に説明する。The present invention will be described in detail below.

【0010】本発明において使用される(A)成分のエ
ポキシ化液状ブタジエンゴムは、分子中、すなわち分子
鎖末端や分子鎖内部にエポキシ基を有する液状のブタジ
エンゴムであり、具体的には、出光石油化学社製のPoly
bd R-45EPT 、ダイセル化学社製のPB3600、日本曹達社
製のBF1000(以上、商品名)等が例示される。これら
は、 1種を単独で使用してもよく、 2種以上を混合して
使用するようにしてもよいが、特に、ガラス転移温度の
異なるものを 2種以上、好ましくはガラス転移温度が -
10〜20℃の範囲のものと30〜60℃の範囲のものを組み合
わせて使用した場合に、混合物のガラス転移を緩和する
ことができ有利である。なお、 2種以上を混合して使用
する場合、SP値の差が 1以内であることが望ましい。
The epoxidized liquid butadiene rubber of the component (A) used in the present invention is a liquid butadiene rubber having an epoxy group in the molecule, that is, at the end of the molecular chain or inside the molecular chain. Petrochemical Poly
Examples thereof include bd R-45EPT, PB3600 manufactured by Daicel Chemical Co., Ltd., and BF1000 (trade name) manufactured by Nippon Soda Co., Ltd. These may be used singly or in a mixture of two or more, but in particular, two or more having different glass transition temperatures, preferably having a glass transition temperature of-
It is advantageous that the glass transition of the mixture can be relaxed when a combination of those in the range of 10 to 20 ° C. and those in the range of 30 to 60 ° C. is used. When two or more types are mixed and used, it is desirable that the difference in SP value is within 1.

【0011】また、(B)成分の可塑剤としては、アス
ファルト等の瀝青物質の使用が望ましい。その他、ジ-
(2-エチルヘキシル)フタレート等のフタル酸エステ
ル、フタル酸混基エステル、ジブトキシエチルアジペー
ト等のアジピン酸エステル、ポリグリコールエーテル等
のグリコールエステル、イソオクチル・トール油脂肪酸
エステル等のステアリン酸エステル、ジブトキシエトキ
シエチルセバケート等のセバシン酸エステル、トリクレ
ジルホスフェート等のリン酸エステル等のエステル系、
エポキシ化大豆油、エポキシ化アマニ油等のエポキシ
系、ポリエステル系、ポリエーテル系等の公知の可塑剤
を使用することもできる、また、鉱物油系、植物油系、
合成系等のゴム用もしくは樹脂用軟化剤として知られる
ものを使用してもよい。鉱物油系軟化剤としては、アロ
マチック系、芳香族系、ナフテン系等のプロセスオイル
等が、植物油系軟化剤としては、ひまし油、綿実油、あ
まみ油、なたね油、大豆油、パーム油、ヤシ油、落花生
油、木ろう、パインオイル、オリーブ油等があげられ
る。これらは、 1種を単独で使用してもよく、 2種以上
を混合して使用するようにしてもよい。
Further, as the plasticizer of the component (B), it is desirable to use a bituminous substance such as asphalt. Other, J-
Phthalates such as (2-ethylhexyl) phthalate, phthalic acid mixed group esters, adipates such as dibutoxyethyl adipate, glycol esters such as polyglycol ether, stearates such as isooctyl / tole oil fatty acid esters, dibutoxy Sebacic acid ester such as ethoxyethyl sebacate, ester system such as phosphoric acid ester such as tricresyl phosphate,
Epoxidized soybean oil, epoxy-based such as epoxidized linseed oil, polyester-based, it is also possible to use known plasticizers such as polyether-based, mineral oil-based, vegetable oil-based,
You may use what is known as a softener for rubbers or resins, such as a synthetic type. Mineral oil-based softeners include aromatic, aromatic, naphthene-based process oils and the like, and vegetable oil-based softeners include castor oil, cottonseed oil, linseed oil, rapeseed oil, soybean oil, palm oil, palm oil. , Peanut oil, wood wax, pine oil, olive oil and the like. These may be used alone or in combination of two or more.

【0012】この(B)成分の配合量は、(A)成分の
エポキシ化液状ブタジエンゴム 100重量部あたり、通
常、 1〜 200重量部の範囲である。
The blending amount of the component (B) is usually in the range of 1 to 200 parts by weight per 100 parts by weight of the epoxidized liquid butadiene rubber of the component (A).

【0013】次に、(C)成分の硬化剤としては、一般
にエポキシ樹脂の硬化剤として知られているものがあげ
られるが、なかでも、アミン系または酸無水物系硬化剤
の使用が好ましい。アミン系としては、ジエチレントリ
アミン、トリエチレンテトラミン、テトラエチレンペン
タミン、ジプロピレンジアミン等の鎖状脂肪族ポリアミ
ン、N-アミノエチルピペラジン、メンセンジアミン、イ
ソフォロンジアミン等の環状脂肪族ポリアミン、m-キシ
レンジアミン等の脂肪芳香族アミン、メタフェニレンジ
アミン、ジアミノジフェニルメタン、ジアミノジフェニ
ルスルフォン等の芳香族アミンがあげられる。また、酸
無水物系としては、無水フタル酸、無水トリメリット
酸、無水ピロメリット酸、無水ベンゾフェノンテトラカ
ルボン酸等の芳香族酸無水物、無水マレイン酸、無水コ
ハク酸等の環状脂肪族酸無水物、ポリアジピン酸無水
物、ポリアゼライン酸無水物等の脂肪族酸無水物、クレ
ンド酸無水物、テトラブロム無水フタル酸等のハロゲン
化酸無水物等があげられる。これらは、 1種を単独で使
用してもよく、 2種以上を混合して使用するようにして
もよい。本発明においては、特に、イソフォロンジアミ
ンの使用が好ましい。
Next, as the curing agent of the component (C), those generally known as curing agents for epoxy resins can be mentioned. Among them, amine type or acid anhydride type curing agents are preferably used. As the amine type, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, chain aliphatic polyamines such as dipropylenediamine, N-aminoethylpiperazine, mensendiamine, cyclic aliphatic polyamines such as isophoronediamine, m-xylene Examples thereof include aliphatic aromatic amines such as diamine, and aromatic amines such as metaphenylenediamine, diaminodiphenylmethane and diaminodiphenylsulfone. Further, as the acid anhydride system, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, aromatic acid anhydrides such as benzophenone tetracarboxylic acid anhydride, maleic anhydride, cyclic aliphatic acid anhydrides such as succinic anhydride. Compounds, aliphatic acid anhydrides such as polyadipic acid anhydride and polyazelaic acid anhydride, halogenated acid anhydrides such as clendic acid anhydride and tetrabromophthalic anhydride. These may be used alone or in combination of two or more. In the present invention, the use of isophoronediamine is particularly preferable.

【0014】この(C)成分の硬化剤の配合量は、
(A)成分のエポキシ化液状ブタジエンゴムに対し、当
量比で0.75〜1.05の範囲が好ましい。硬化剤の配合量が
この範囲より少ないと、機械的特性が低下し、逆に、多
いと制振効果が小さくなる。
The compounding amount of the curing agent of the component (C) is
The equivalent ratio to the epoxidized liquid butadiene rubber as the component (A) is preferably in the range of 0.75 to 1.05. If the compounding amount of the curing agent is less than this range, the mechanical properties will deteriorate, and conversely, if it is too large, the vibration damping effect will decrease.

【0015】なお、本発明のゴム組成物には、上記成分
の他、この種のゴム組成物に通常配合される添加剤、例
えばカーボンブラック、クレー、炭化水素樹脂、クマロ
ン・インデン樹脂などの充填剤、老化防止剤、顔料等
を、本発明の効果を阻害しない範囲で配合することがで
きる。
In the rubber composition of the present invention, in addition to the above-mentioned components, additives such as carbon black, clay, hydrocarbon resin, coumarone-indene resin, etc. usually added to this type of rubber composition are filled. Agents, anti-aging agents, pigments and the like can be added within a range that does not impair the effects of the present invention.

【0016】本発明の制振材においては、(A)エポキ
シ化液状ブタジエンゴムに、(B)可塑剤および(C)
硬化剤を配合したことにより、低周波領域における制振
効果が改善されるとともに、制振効果の温度依存性が低
減され、さらに、機械的物性が向上する。
In the damping material of the present invention, (A) epoxidized liquid butadiene rubber, (B) plasticizer and (C)
By blending the curing agent, the damping effect in the low frequency region is improved, the temperature dependence of the damping effect is reduced, and the mechanical properties are further improved.

【0017】したがって、低周波数領域での高い制振効
果が要求される建築物の粘弾性ダンパーや制振壁等の用
途にも適用可能となり、様々な用途に広く用いることが
できる。
Therefore, the present invention can be applied to applications such as viscoelastic dampers and damping walls of buildings, which require high damping effect in the low frequency region, and can be widely used in various applications.

【0018】[0018]

【発明の実施の形態】以下、本発明を実施例によりさら
に詳細に説明するが、本発明はこれらの実施例によって
限定されるものではない。なお、以下の実施例および比
較例の記載中「部」とあるのはいずれも「重量部」を示
す。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples. In the description of the following examples and comparative examples, "part" means "part by weight".

【0019】実施例1 ガラス転移温度 8℃のエポキシ化液状ブタジエンゴム P
B3600 (ダイセル化学社製 商品名、エポキシ化液状ブ
タジエンゴムAと表記)75部、ガラス転移温度48℃のエ
ポキシ化液状ブタジエンゴム BF1000 (日本曹達社製
商品名、エポキシ化液状ブタジエンゴムBと表記)25
部、可塑剤としてストレートアスファルト60/80 (出光
興産社製)50部、および硬化剤として変性脂肪族ポリア
ミンEH-220(旭電化社製 商品名)40部をプラネタリミ
キサを用いて均一に混合した後、所定の形状に加熱硬化
させて制振材を得た。
Example 1 Epoxidized liquid butadiene rubber P having a glass transition temperature of 8 ° C.
B3600 (trade name, manufactured by Daicel Chemical Industries, written as epoxidized liquid butadiene rubber A) 75 parts, epoxidized liquid butadiene rubber with a glass transition temperature of 48 ° C BF1000 (manufactured by Nippon Soda Co., Ltd.
Product name, written as epoxidized liquid butadiene rubber B) 25
Parts, 50 parts of straight asphalt 60/80 (made by Idemitsu Kosan Co., Ltd.) as a plasticizer, and 40 parts of modified aliphatic polyamine EH-220 (made by Asahi Denka Co., Ltd.) as a curing agent were uniformly mixed using a planetary mixer. Then, it was heat-cured into a predetermined shape to obtain a damping material.

【0020】実施例2、3 各成分の配合量を表1に示すように変えた以外は、実施
例1と同様にしてプラネタリミキサを用いて均一に混合
した後、所定の形状に加熱硬化させて制振材を得た。
Examples 2 and 3 The procedure of Example 1 was repeated, except that the amounts of the components were changed as shown in Table 1, and the mixture was uniformly mixed using a planetary mixer and then heat-cured into a predetermined shape. I got a damping material.

【0021】比較例1 エポキシ化液状ブタジエンゴムA 100部、および硬化剤
としてEH-220 40 部をプラネタリミキサを用いて均一に
混合した後、所定の形状に加熱硬化させて制振材を得
た。
Comparative Example 1 100 parts of epoxidized liquid butadiene rubber A and 40 parts of EH-220 as a curing agent were uniformly mixed using a planetary mixer and then heat-cured into a predetermined shape to obtain a damping material. .

【0022】比較例2 エポキシ化液状ブタジエンゴムB 100部、および硬化剤
としてEH-220 40 部をプラネタリミキサを用いて均一に
混合した後、所定の形状に加熱硬化させて制振材を得
た。
Comparative Example 2 100 parts of epoxidized liquid butadiene rubber B and 40 parts of EH-220 as a curing agent were uniformly mixed using a planetary mixer and then heat-cured into a predetermined shape to obtain a damping material. .

【0023】比較例3 エポキシ化液状ブタジエンゴムB 50 部、エポキシ化液
状ブタジエンゴムB 050部、および硬化剤としてEH-220
40 部をプラネタリミキサを用いて均一に混合した後、
所定の形状に加熱硬化させて制振材を得た。
Comparative Example 3 50 parts of epoxidized liquid butadiene rubber B, 050 parts of epoxidized liquid butadiene rubber B, and EH-220 as a curing agent
After uniformly mixing 40 parts using a planetary mixer,
A damping material was obtained by heat-curing into a predetermined shape.

【0024】上記各実施例および比較例で得られた制振
材について、温度を -10℃〜50℃の範囲で変化させたと
きの低周波におけるtan δ(損失係数)およびせん断弾
性率の変化をDMTA(Dynamic mechanicalThermal An
alyzer)により測定した。測定は、直径 8mm、厚さ2mm
の試料を用い、周波数 0.5Hz、歪み率20%、昇温速度2
℃/ 分の条件で行った。また、 JIS K 6301 に基づき、
硬さ(厚さ6mm )および伸び(23℃、引張速度 500mm/m
in)を測定した。これらの結果を組成とともに表1に示
す。また、図1に、測定結果に基づくtan δの温度依存
性のグラフを示す。
With respect to the vibration damping materials obtained in each of the above Examples and Comparative Examples, changes in tan δ (loss coefficient) and shear modulus at low frequencies when the temperature was changed in the range of −10 ° C. to 50 ° C. DMTA (Dynamic mechanical Thermal An
alyzer). The measurement is 8 mm in diameter and 2 mm in thickness
Frequency of 0.5Hz, distortion rate of 20%, heating rate of 2
It was carried out under conditions of ° C / min. Also, based on JIS K 6301,
Hardness (thickness 6mm) and elongation (23 ℃, pulling speed 500mm / m
in) was measured. The results are shown in Table 1 together with the composition. Further, FIG. 1 shows a graph of temperature dependence of tan δ based on the measurement results.

【0025】[0025]

【表1】 これらの表および図からも明らかなように、本発明にか
かる制振材は、低周波振動に対しても、良好な制振性能
が温度に依存することなく安定して得られるとともに、
機械的物性にも優れている。
[Table 1] As is clear from these tables and figures, the damping material according to the present invention, even with respect to low-frequency vibration, is obtained with good damping performance stably without depending on temperature,
It also has excellent mechanical properties.

【0026】[0026]

【発明の効果】以上の実施例からも明らかなように、本
発明の制振材によれば、エポキシ化液状ブタジエンゴム
に可塑剤および硬化剤を配合するようにしたので、高周
波数領域はもとより、地震動のような低周波数領域にお
いても良好な制振性能を示すとともに、制振性能の温度
依存性が小さいため、使用環境温度による制振性能の低
下も防止される。さらに、機械的物性も向上する。
As is apparent from the above examples, according to the damping material of the present invention, the epoxidized liquid butadiene rubber is mixed with the plasticizer and the curing agent, so that the high frequency region is not only used. Also, good vibration damping performance is exhibited even in a low frequency region such as earthquake motion, and since the temperature dependence of the vibration damping performance is small, deterioration of the vibration damping performance due to the operating environment temperature is also prevented. Further, mechanical properties are also improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例および比較例で得られた制振材のtan δ
の温度依存性を示すグラフ。
FIG. 1 tan δ of damping materials obtained in Examples and Comparative Examples
The graph which shows the temperature dependence of.

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Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 (A)エポキシ化液状ブタジエンゴム、
(B)可塑剤、および(C)硬化剤を含有するゴム組成
物からなることを特徴とする制振材。
1. (A) Epoxidized liquid butadiene rubber,
A damping material comprising a rubber composition containing (B) a plasticizer and (C) a curing agent.
【請求項2】 請求項1記載の制振材において、(A)
エポキシ化液状ブタジエンゴムは、ガラス転移温度の異
なる少なくとも 2種のエポキシ化液状ブタジエンゴムの
混合物からなることを特徴とする制振材。
2. The vibration damping material according to claim 1, wherein (A)
The epoxidized liquid butadiene rubber is a vibration damping material comprising a mixture of at least two epoxidized liquid butadiene rubbers having different glass transition temperatures.
【請求項3】 請求項1または2記載の制振材におい
て、(B)成分が瀝青物質からなることを特徴とする制
振材。
3. The vibration damping material according to claim 1, wherein the component (B) is composed of a bituminous substance.
【請求項4】 請求項1乃至3のいずれか 1項記載の制
振材において、(C)成分がアミン化合物または酸無水
物からなることを特徴とする制振材。
4. The vibration damping material according to claim 1, wherein the component (C) is an amine compound or an acid anhydride.
JP10237819A 1998-08-24 1998-08-24 Damping material Withdrawn JP2000063638A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10237819A JP2000063638A (en) 1998-08-24 1998-08-24 Damping material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10237819A JP2000063638A (en) 1998-08-24 1998-08-24 Damping material

Publications (1)

Publication Number Publication Date
JP2000063638A true JP2000063638A (en) 2000-02-29

Family

ID=17020878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10237819A Withdrawn JP2000063638A (en) 1998-08-24 1998-08-24 Damping material

Country Status (1)

Country Link
JP (1) JP2000063638A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323136A (en) * 2000-05-16 2001-11-20 Tokai Rubber Ind Ltd High-damping elastomer composition
JP2008163277A (en) * 2007-01-05 2008-07-17 Nippon Tokushu Toryo Co Ltd Two-pot room temperature-curing coating type damping paint composition
WO2012043426A1 (en) 2010-09-30 2012-04-05 株式会社カネカ Composition containing branched polymer for vibration-damping material
JP2021165388A (en) * 2017-12-26 2021-10-14 Dic株式会社 Thermosetting composition, thermosetting resin modifier, cured product of the same, semiconductor sealing material, prepreg, circuit board and build-up film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323136A (en) * 2000-05-16 2001-11-20 Tokai Rubber Ind Ltd High-damping elastomer composition
JP2008163277A (en) * 2007-01-05 2008-07-17 Nippon Tokushu Toryo Co Ltd Two-pot room temperature-curing coating type damping paint composition
WO2012043426A1 (en) 2010-09-30 2012-04-05 株式会社カネカ Composition containing branched polymer for vibration-damping material
JP2021165388A (en) * 2017-12-26 2021-10-14 Dic株式会社 Thermosetting composition, thermosetting resin modifier, cured product of the same, semiconductor sealing material, prepreg, circuit board and build-up film
JP7140235B2 (en) 2017-12-26 2022-09-21 Dic株式会社 Thermosetting composition, thermosetting resin modifier, cured product thereof, semiconductor sealing material, prepreg, circuit board and build-up film

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