JP2000061820A - Chemical supply device - Google Patents
Chemical supply deviceInfo
- Publication number
- JP2000061820A JP2000061820A JP10231000A JP23100098A JP2000061820A JP 2000061820 A JP2000061820 A JP 2000061820A JP 10231000 A JP10231000 A JP 10231000A JP 23100098 A JP23100098 A JP 23100098A JP 2000061820 A JP2000061820 A JP 2000061820A
- Authority
- JP
- Japan
- Prior art keywords
- chemical liquid
- chemical
- liquid supply
- tank
- supply device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、一般に薬液を薬液
供給場所へ供給する薬液供給装置、特に薬液の重力によ
る落下を利用する薬液供給装置に関し、さらに詳しく
は、例えば半導体装置製造装置であるＣＭＰ装置（Ｃｈ
ｅｍｉｃａｌ Ｍｅｃｈａｎｉｃａｌ Ｐｏｌｉｓｈ）
へ薬液を供給する薬液供給装置の薬液供給方法、及び薬
液供給装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates generally to a chemical liquid supply device for supplying a chemical liquid to a chemical liquid supply place, and more particularly to a chemical liquid supply device utilizing the drop of the chemical liquid due to gravity, and more specifically, for example, a CMP which is a semiconductor device manufacturing apparatus. Device (Ch
(eco-mechanical Polish)
TECHNICAL FIELD The present invention relates to a chemical liquid supply method for a chemical liquid supply device that supplies a chemical liquid to, and a chemical liquid supply device.
【０００２】[0002]
【従来の技術】ＬＳＩ等の半導体装置は年々、集積度が
増しており、そのデザインルールは０．２５μｍから
０．１８μｍといったように益々微細化している。しか
しながら配線幅は微細化されているが、配線抵抗を低い
レベルに保ち、信号の伝播遅延や各種のマイグレーショ
ンを防止するためには配線の断面積を確保する必要があ
り、配線の高さはあまり縮小できない。また集積度が上
がるに従って配線は多層配線構造をとり、その総数も微
細化に従って増している。2. Description of the Related Art The degree of integration of semiconductor devices such as LSI is increasing year by year, and the design rules thereof are becoming finer from 0.25 μm to 0.18 μm. However, although the wiring width is miniaturized, it is necessary to secure the wiring cross-sectional area in order to keep the wiring resistance at a low level and prevent signal propagation delay and various migrations. It cannot be reduced. Further, as the integration degree increases, the wiring has a multi-layer wiring structure, and the total number thereof also increases with the miniaturization.
【０００３】多層配線構造を形成する場合、上層配線は
下層配線の段差の影響を受けるため、多層配線構造は上
層へ行くほど段差が大きくなる。しかしながら配線の微
細化は、レジストパターンニングのにおける露光波長の
短波長化やレンズの高ＮＡ化を必要とし、リソグラフィ
の焦点深度の低下を余儀なくする。また段差の増大は上
層配線のステップカバレージを低下させる。従って配線
工程における下地（層間絶縁膜）の段差を小さくする必
要がある。When forming a multi-layer wiring structure, the upper layer wiring is affected by the step difference of the lower layer wiring, so that the multi-layer wiring structure has a larger step difference toward the upper layer. However, miniaturization of the wiring requires a shorter exposure wavelength in resist patterning and a higher NA of the lens, which inevitably lowers the depth of focus of lithography. Further, the increase in the step reduces the step coverage of the upper layer wiring. Therefore, it is necessary to reduce the step difference of the base (interlayer insulating film) in the wiring process.
【０００４】層間絶縁膜の段差を解消するために、層間
絶縁膜の平坦化が必要になる。現在知られている層間絶
縁膜平坦化の１つの手段として、ＣＭＰ（Ｃｈｅｍｉｃ
ａｌＭｅｃｈａｎｉｃａｌ Ｐｏｌｉｓｈ）が開発され
ている。ＣＭＰによる平坦化の手法は、例えば１９９７
年株式会社サイエンスフォーラム発行の「ＣＭＰのサイ
エンス」等に、ＣＭＰによる平坦化の総説が掲載されて
いる。In order to eliminate the step difference in the interlayer insulating film, it is necessary to flatten the interlayer insulating film. As one of the currently known means for planarizing an interlayer insulating film, CMP (Chemical) is used.
alMechanical Polish) has been developed. A method of flattening by CMP is, for example, 1997.
A review article on flattening by CMP is published in "CMP Science" published by Science Forum Co., Ltd.
【０００５】図１にＣＭＰプロセスの概略を断面図で示
す。図１（ａ）は、シリコンウェハー１上に形成された
配線２の上にＣＶＤ（Chemical Vapor Deposition）
等によりデポした層間絶縁膜３に、段差４が発生してい
る。ここでＣＭＰ装置でウェハー表面全体を研磨し、ウ
ェハー表面に段差が残らない部分まで研磨を行うことに
よって層間絶縁膜の平坦化を行う。ＣＭＰによる層間絶
縁膜平坦化後は図１（ｂ）に示すよう層間絶縁膜の段差
が解消される。FIG. 1 is a sectional view showing the outline of the CMP process. FIG. 1A shows a CVD (Chemical Vapor Deposition) on a wiring 2 formed on a silicon wafer 1.
A step 4 is generated in the interlayer insulating film 3 deposited by the above. Here, the entire surface of the wafer is polished by a CMP apparatus, and the interlayer insulating film is flattened by polishing the portion where no step remains on the surface of the wafer. After planarizing the interlayer insulating film by CMP, the step of the interlayer insulating film is eliminated as shown in FIG.
【０００６】図２にＣＭＰ装置の概略を示す断面図を示
す。同図において、回転するウェハーキャリア５に研磨
面を下向きにして被研磨ウェハー６を保持し、その下に
回転する研磨プレートであるターンテーブル７が配置さ
れる。また、研磨薬液であるスラリー８が薬液供給装置
からターンテーブル上の薬液供給場所９に送液されるよ
うになっている。ウェハー６を保持したウェハーキャリ
ア５を回転しながら荷重をかけ、これもまた回転してい
るターンテーブル７にランディングさせ、またランディ
ング中にスラリー８をターンテーブル７上に供給するこ
とによって、ウェハー表面の研磨が行われ、層間絶縁膜
３の平坦化が行われる。FIG. 2 is a sectional view showing the outline of the CMP apparatus. In the figure, a rotating wafer carrier 5 holds a wafer 6 to be polished with its polishing surface facing downward, and a rotating turntable 7 which is a rotating polishing plate is disposed below the wafer to be polished 6. Further, the slurry 8 which is a polishing chemical liquid is sent from the chemical liquid supply device to the chemical liquid supply place 9 on the turntable. A load is applied while rotating the wafer carrier 5 holding the wafer 6, and this is also landed on the rotating turntable 7, and the slurry 8 is supplied onto the turntable 7 during the landing, whereby the wafer surface Polishing is performed to flatten the interlayer insulating film 3.
【０００７】従って、薬液供給装置はＣＭＰ装置が研磨
中は、常にスラリーをターンテーブル上へ供給し続ける
ことが必要となる。スラリー供給にはポンプによる送
液、或いは圧送が行われていた。Therefore, it is necessary for the chemical liquid supply device to continuously supply the slurry onto the turntable while the CMP device is polishing. The slurry was supplied by pumping or pressure feeding.
【０００８】[0008]
【発明が解決しようとする課題】図３（ａ）に従来のポ
ンプによる送液の概略を示す。スラリー８をポンプ１０
によってＣＭＰ装置１１の薬液供給場所９まで送液す
る。このポンプ１０によるスラリー送液方式では次のよ
うな問題点があった。第１に、送液のためにポンプ１０
が必要となり、薬液供給装置１２の価格に当然ポンプ１
０の代金も含まれ、その分薬液供給装置１２の価格が上
がる。第２に、ポンプ１０を駆動すること自体に何らか
のエネルギー、例えば電気、圧力の高い気体、例えばＮ
2等が必要になる。第３に、ポンプ１０は使用するうち
にポンプの部品が劣化するため、定期的なメンテナンス
が必要となり、メンテナンスにも人件費、部品代といっ
たコストがかかってくる。FIG. 3 (a) shows an outline of liquid feeding by a conventional pump. Slurry 8 pump 10
Then, the solution is sent to the chemical solution supply place 9 of the CMP device 11. The slurry feeding system using the pump 10 has the following problems. First, the pump 10 for liquid delivery
Is required, and the price of the chemical solution supply device 12 is naturally pump 1
A price of 0 is also included, and the price of the chemical liquid supply device 12 increases. Secondly, driving the pump 10 itself requires some energy, such as electricity, high pressure gas, such as N 2.
2nd grade is required. Third, since the pump parts deteriorate during use, the pump 10 requires regular maintenance, and the maintenance costs also include personnel costs and parts costs.
【０００９】次に図３（ｂ）に、従来の気体の圧力によ
る送液の概略を示す。高圧ガス１３によって薬液供給タ
ンク１４容器内の薬液１５を押し出し、ＣＭＰ装置１１
の薬液供給場所９まで送液する。気体の一例としては窒
素ガス等が使用される。このスラリー送液方式では、次
のような問題点があった。送液を行うこと自体に圧力の
高い気体が必要になる。また、圧力により薬液を供給す
るため、薬液供給装置に気密性が要求され、配管継ぎ手
等は、その圧力に耐えるうる耐久性が要求される。Next, FIG. 3 (b) shows an outline of conventional liquid feeding by gas pressure. The high-pressure gas 13 pushes out the chemical solution 15 in the chemical solution supply tank 14 container, and the CMP apparatus 11
The liquid is sent to the chemical liquid supply place 9 of. Nitrogen gas or the like is used as an example of the gas. This slurry feeding system has the following problems. A gas having a high pressure is required for the liquid transfer itself. Further, since the chemical liquid is supplied by pressure, the chemical liquid supply device is required to be airtight, and the pipe joint and the like are required to have durability to withstand the pressure.
【００１０】本発明は、上記問題点を改善するため、送
液を行うこと自体に対して、ポンプなどの特別な装置を
使用せず、それに伴う維持工数、費用を削減した、重力
のみを利用し薬液を供給する薬液供給装置を提供するこ
とを目的とする。In order to solve the above-mentioned problems, the present invention utilizes only gravity, which does not use a special device such as a pump, but reduces the maintenance man-hours and costs associated with the liquid delivery itself. An object of the present invention is to provide a chemical liquid supply device for supplying a chemical liquid.
【００１１】[0011]
【課題を解決するための手段】この発明の請求項１記載
の薬液供給装置は、薬液を薬液供給場所へ供給する際
に、薬液の重力による落下を利用するようになってい
る。According to the first aspect of the present invention, the chemical liquid supply device utilizes the drop of the chemical liquid due to gravity when the chemical liquid is supplied to the chemical liquid supply place.
【００１２】この発明の請求項２記載の薬液供給装置
は、薬液供給タンクが薬液供給場所よりも上部に配置さ
れるようになっている。In the chemical liquid supply device according to the second aspect of the present invention, the chemical liquid supply tank is arranged above the chemical liquid supply place.
【００１３】この発明の請求項３記載の薬液供給装置
は、薬液供給タンクへ薬液を補充するタンクを１つ、或
いは複数以上備え、薬液供給タンクへ薬液をこまめに補
充できるようになっている。According to the third aspect of the present invention, there is provided one or a plurality of tanks for replenishing the medicinal solution to the medicinal solution supply tank so that the medicinal solution can be replenished frequently.
【００１４】この発明の請求項４記載の薬液供給装置
は、薬液供給タンクと請求項３記載の薬液補充タンクの
間に配管を持ち、なおかつその配管に弁を持つようにな
っている。According to a fourth aspect of the present invention, there is provided a chemical liquid supply device, wherein a pipe is provided between the chemical liquid supply tank and the chemical liquid replenishment tank according to the third aspect, and the pipe is provided with a valve.
【００１５】この発明の請求項５記載の薬液供給装置
は、薬液供給タンクにタンク内液面センサーを持つよう
になっている。According to a fifth aspect of the present invention, there is provided a chemical liquid supply device having a tank liquid level sensor in the chemical liquid supply tank.
【００１６】この発明の請求項６記載の薬液供給装置
は、請求項５記載のタンク内液面センサーにより、請求
項４記載の薬液補充弁のスイッチングを行うようになっ
ている。According to a sixth aspect of the present invention, there is provided a chemical liquid supply device for switching the chemical liquid replenishing valve according to the fourth aspect by the tank liquid level sensor according to the fifth aspect.
【００１７】この発明の請求項７記載の薬液供給装置
は、薬液砥出配管部分に流量調節弁を持つようになって
いる。The chemical liquid supply apparatus according to the seventh aspect of the present invention has a flow rate control valve in the chemical liquid polishing pipe portion.
【００１８】この発明の請求項８記載の薬液供給装置
は、広い断面積のタンク容器を持つ構造になっている。The chemical liquid supply apparatus according to the eighth aspect of the present invention has a structure having a tank container having a wide sectional area.
【００１９】[0019]
【作用】この発明の請求項１記載の薬液供給装置におい
ては、薬液は重力による落下により送液されるため、薬
液の送液のために何か特別なエネルギー、例えば電力な
どを必要としないという効果が得られる。また、薬液の
送液のために何か特別な部品、例えばポンプなどを必要
とせず、請求項１記載の薬液供給装置の構造が、基本的
には薬液タンクと送液配管のみというシンプルな構造に
できるという効果が得られる。さらに、薬液の送液のた
めに何か特別な部品、例えばポンプなどを必要とせず、
ポンプ等のための費用・メンテンナンスが必要ないとい
う効果が得られる。In the chemical liquid supply device according to the first aspect of the present invention, since the chemical liquid is delivered by dropping due to gravity, it does not require any special energy such as electric power for delivering the chemical liquid. The effect is obtained. Further, the chemical liquid supply device according to claim 1 does not require any special parts such as a pump for delivering the chemical liquid, and the structure of the chemical liquid supply device is basically a simple structure including only the chemical liquid tank and the liquid supply pipe. The effect that can be obtained is obtained. Furthermore, it does not require any special parts, such as a pump, to deliver the drug solution,
The effect is that there is no need for cost and maintenance for pumps, etc.
【００２０】この発明の請求項２記載の薬液供給装置に
おいては、薬液供給タンクが薬液供給場所よりも上部に
配置してあるため、薬液が重力によって薬液自身の重み
のみによって送液出来るという効果が得られる。In the chemical liquid supply apparatus according to the second aspect of the present invention, since the chemical liquid supply tank is arranged above the chemical liquid supply place, the chemical liquid can be delivered by gravity only by the weight of the chemical liquid itself. can get.
【００２１】この発明の請求項３記載の薬液供給装置に
おいては、薬液供給タンクへ薬液を補充するタンクを１
個以上持つことにより、薬液供給タンクへこまめに薬液
を補充し、薬液供給タンク内の薬液の供給により液面が
低下し落下圧力が低下することを抑えるという効果が得
られる。In the chemical liquid supply apparatus according to the third aspect of the present invention, a tank for replenishing the chemical liquid to the chemical liquid supply tank is provided with 1
By having more than one, it is possible to obtain the effect that the chemical solution is frequently replenished to the chemical solution supply tank and the drop of the drop pressure due to the decrease of the liquid level due to the supply of the chemical solution in the chemical solution supply tank is suppressed.
【００２２】この発明の請求項４記載の薬液供給装置に
おいては、薬液供給タンクと請求項３記載の薬液補充タ
ンクの間に配管を持つことによって、請求項３記載の薬
液補充タンクから薬液供給タンクへ薬液を補充できるを
という効果が得られる。なおかつその配管に弁を持つこ
とにより、請求項３記載の薬液補充タンクから薬液供給
タンクへ薬液を供給する、供給しないを制御できるとい
う効果が得られる。In the chemical liquid supply apparatus according to the fourth aspect of the present invention, a pipe is provided between the chemical liquid supply tank and the chemical liquid replenishment tank according to the third aspect, so that the chemical liquid replenishment tank is moved from the chemical liquid replenishment tank to the chemical liquid supply tank. The effect that the chemical solution can be replenished can be obtained. Furthermore, by providing a valve in the pipe, it is possible to control the supply or non-supply of the chemical liquid from the chemical liquid replenishment tank to the chemical liquid supply tank according to the third aspect.
【００２３】この発明の請求項５記載の薬液供給装置に
おいては、薬液供給タンク内に液面センサーを持つこと
により、薬液供給タンク内の液面がどのレベルにあるか
を検知するという効果が得られる。In the chemical liquid supply device according to the fifth aspect of the present invention, by having the liquid level sensor in the chemical liquid supply tank, it is possible to obtain an effect of detecting at which level the liquid level in the chemical liquid supply tank is. To be
【００２４】この発明の請求項６記載の薬液供給装置に
おいては、請求項５記載の薬液供給タンク内の液面セン
サーにより、請求項４記載の弁を開閉するタイミングを
制御することで、薬液タンクの薬液の液面が低下した場
合、ある薬液液面レベルになれば弁を開いて薬液タンク
内へ薬液を補充する、また薬液補充により薬液タンクの
薬液の液面があるレベル以上になれば弁を閉じて、補充
を停止するといった制御が可能になるといった効果が得
られる。In the chemical liquid supply device according to claim 6 of the present invention, the liquid level sensor in the chemical liquid supply tank according to claim 5 controls the timing of opening and closing the valve according to claim 4, thereby the chemical liquid tank. When the liquid level of the liquid medicine of the above is lowered, the valve is opened to refill the liquid medicine tank when the liquid surface level reaches a certain level, and when the liquid level of the liquid medicine in the liquid tank exceeds a certain level due to the liquid refill, the valve is opened. It is possible to obtain an effect that it becomes possible to control such that the refill is stopped by closing the.
【００２５】この発明の請求項７記載の薬液供給装置に
おいては、請求項１記載の薬液供給装置と薬液供給され
る場所との間の配管に、流量調節弁を設けることによ
り、薬液砥出圧力を所望の圧力に調節できるといった効
果が得られる。According to a seventh aspect of the present invention, there is provided a flow rate control valve in a pipe between the first and second locations where the chemical solution is supplied to the chemical solution supply device. Can be adjusted to a desired pressure.
【００２６】この発明の請求項８記載の薬液供給装置に
おいては、請求項２記載の薬液供給タンクが広い断面積
をした容器の形態をとるため、薬液の供給による液面低
下が緩やかに進むため、供給圧力の低下がより緩やかと
なり、従ってより安定した供給圧力による薬液供給がで
きるといった効果が得られる。In the chemical liquid supply device according to the eighth aspect of the present invention, since the chemical liquid supply tank according to the second aspect takes the form of a container having a wide cross-sectional area, the liquid level is gradually lowered by the supply of the chemical liquid. Therefore, the supply pressure is reduced more gradually, so that the chemical liquid can be supplied at a more stable supply pressure.
【００２７】[0027]
【発明の実施の形態】以下、本発明の実施の形態の一例
を、図面に基づいて説明する。BEST MODE FOR CARRYING OUT THE INVENTION An example of an embodiment of the present invention will be described below with reference to the drawings.
【００２８】１例として本発明の薬液供給装置をＣＭＰ
装置と組み合わせて使用する場合について説明する。As an example, the chemical liquid supply device of the present invention is CMP
The case of using in combination with the device will be described.
【００２９】まず、薬液供給装置とＣＭＰ装置の配置に
ついて図４により説明する。図４は薬液供給装置１２と
ＣＭＰ装置１１の配置断面図である。クリーンルーム内
１階に設置されたＣＭＰ装置の上のクリーンルーム２階
に薬液供給装置１２が設置され、これにより薬液１５は
ＣＭＰ装置１１の上部へ配置されることとなり、薬液供
給に重力を利用できるような配置になっている。ＣＭＰ
装置１１の薬液供給場所９へ様々な流量で薬液を供給す
るためには、供給圧力をなるべく大きくする方がよい。
そうすることにより流量は薬液供給タンク１４とＣＭＰ
装置１１との間の配管に流量調節弁１６を取り付けるこ
とにより調節できる。供給圧力を高くするには薬液供給
タンク１４に入った薬液１５の液面とＣＭＰ装置１１の
薬液供給場所９の高さを大きくすればよい。例えば層間
絶縁膜用のスラリーは水とほぼ同じ比重であり、１００
ｃｍの高さで１００ｇ重／ｃｍ2程度の圧力が得られる
ため、１ｍ以上の高さに薬液供給装置１２を設置するこ
とが好ましい。なお薬液の比重が大きければ、比重と圧
力の関係は比例しているため、同じ高さによる圧力は水
の場合より高くなるため問題とはならない。First, the arrangement of the chemical liquid supply device and the CMP device will be described with reference to FIG. FIG. 4 is a layout cross-sectional view of the chemical liquid supply device 12 and the CMP device 11. The chemical liquid supply device 12 is installed on the second floor of the clean room above the CMP device installed on the first floor of the clean room, whereby the chemical liquid 15 is arranged on the upper part of the CMP device 11 so that gravity can be used for supplying the chemical liquid. It is arranged like this. CMP
In order to supply the chemical liquid to the chemical liquid supply location 9 of the device 11 at various flow rates, it is better to increase the supply pressure as much as possible.
By doing so, the flow rate will be the same as the chemical solution supply tank 14 and the CMP.
It can be adjusted by attaching a flow control valve 16 to the pipe between the device 11 and the device. In order to increase the supply pressure, the height of the liquid surface of the chemical liquid 15 in the chemical liquid supply tank 14 and the height of the chemical liquid supply place 9 of the CMP device 11 may be increased. For example, the slurry for the interlayer insulating film has almost the same specific gravity as that of water.
Since a pressure of about 100 gf / cm 2 can be obtained at a height of cm, it is preferable to install the chemical solution feeder 12 at a height of 1 m or more. If the specific gravity of the chemical solution is large, the relationship between the specific gravity and the pressure is proportional, and therefore the pressure at the same height is higher than that of water, so there is no problem.
【００３０】次に、薬液供給装置１２について説明す
る。薬液供給装置１２は大きく分けて薬液供給装置へ薬
液をセットする部分１７と薬液補充タンク１８と薬液供
給タンク１４に分かれている。例えば薬液１９がドラム
缶等の容器によって提供される場合は、薬液容器を薬液
補充タンク１８の上面よりも高い位置に容器をセットす
れば容器の薬液はすべて薬液補充タンク１８へ注がれ
る。薬液補充タンク１８は薬液セット部１７の薬液容器
よりも低く、薬液供給タンク１４上面よりも高い位置に
配置されており、これにより薬液補充タンク１８から薬
液供給タンク１４への薬液補充が可能となる。Next, the chemical liquid supply device 12 will be described. The chemical liquid supply device 12 is roughly divided into a portion 17 for setting the chemical liquid in the chemical liquid supply device, a chemical liquid replenishment tank 18, and a chemical liquid supply tank 14. For example, when the chemical liquid 19 is provided by a container such as a drum, if the chemical liquid container is set at a position higher than the upper surface of the chemical liquid replenishment tank 18, all the chemical liquid in the container is poured into the chemical liquid replenishment tank 18. The chemical solution replenishment tank 18 is arranged at a position lower than the chemical solution container of the chemical solution setting unit 17 and higher than the upper surface of the chemical solution supply tank 14, whereby the chemical solution can be replenished from the chemical solution replenishment tank 18 to the chemical solution supply tank 14. .
【００３１】また、薬液供給圧力は、薬液の落下を供給
に利用する為、薬液供給タンク１４内の液面の高さに比
例して変動する。この圧力変動はできるだけ小さい方が
安定した供給流量となるため、薬液供給タンク１４内の
液面は出来るだけ一定に保つことが望ましい。従って薬
液供給タンク１４内に設けた液面センサー２０がＬｏｗ
レベルを検知すれば、補充弁２１を開き薬液１９を薬液
補充タンク１８から薬液供給タンク１４へ補充する。ま
た補充開始後、液面センサー２０がＨｉｇｈレベルを検
知すれば補充弁２１を閉じ、薬液供給タンク１４への薬
液の供給を停止する。こうすることによって、薬液供給
における供給圧力の変動を一定の範囲内に納めることが
でき、安定した流量を確保することができる。一例を示
すと薬液供給タンク内液面の高さが１ｍで、供給タンク
内の液面センサーのＨｉｇｈとＬｏｗレベルの幅が１０
ｃｍの場合、薬液供給時における供給圧力変動の幅は１
０ｇ重／ｃｍ2となり、±５％以内の変動で安定した圧
力で供給できる。Further, since the chemical liquid supply pressure is used for supply, the chemical liquid supply pressure fluctuates in proportion to the height of the liquid level in the chemical liquid supply tank 14. Since the smaller the fluctuation of the pressure is, the more stable the supply flow rate becomes, the liquid level in the chemical solution supply tank 14 is preferably kept as constant as possible. Therefore, the liquid level sensor 20 provided in the chemical liquid supply tank 14 is Low.
When the level is detected, the replenishment valve 21 is opened to replenish the chemical solution 19 from the chemical solution supplement tank 18 to the chemical solution supply tank 14. When the liquid level sensor 20 detects a high level after the start of replenishment, the replenishment valve 21 is closed and the supply of the chemical liquid to the chemical liquid supply tank 14 is stopped. By doing so, the fluctuation of the supply pressure in supplying the chemical liquid can be kept within a certain range, and a stable flow rate can be secured. As an example, the height of the liquid level in the chemical supply tank is 1 m, and the width of the High and Low levels of the liquid level sensor in the supply tank is 10 m.
In the case of cm, the fluctuation range of the supply pressure when the chemical solution is supplied is 1
It becomes 0 g weight / cm 2 and can be supplied at a stable pressure with a fluctuation within ± 5%.
【００３２】さらに、安定した圧力での薬液供給のた
め、薬液供給装置１２の薬液供給タンク１４の容器断面
積２２を広くする。こうすることによって薬液供給タン
ク１４内の液面低下が緩やかになり、安定した圧力での
供給が行われる。１例を示すと、ＣＭＰプロセスにおけ
る薬液供給量は１００ｍｌ〜２００ｍｌ程度で行われ
る。Further, in order to supply the chemical liquid at a stable pressure, the container cross-sectional area 22 of the chemical liquid supply tank 14 of the chemical liquid supply device 12 is widened. By doing so, the drop in the liquid level in the chemical liquid supply tank 14 becomes gradual, and stable pressure supply is performed. As an example, the chemical solution supply amount in the CMP process is about 100 ml to 200 ml.
【００３３】液面の１ｃｍ低下による供給圧力変動は１
ｇ重／ｃｍ2であり、断面積が１００００ｃｍ2程度あれ
ば、ここで薬液供給レートを２００ｍｌ／分とすれば、
５０分間薬液を供給する間の供給圧力変動は１ｇ重／ｃ
ｍ2以内となり、これはほぼ同一の供給圧力と見なすこ
とができる。以上のような方法によれば薬液供給装置か
らの薬液供給圧力が一定に近い状態で薬液を供給できる
ため、薬液供給タンク１４とＣＭＰ装置１１との間の、
配管の開度を調節する流量調節弁１６を調節することに
よって、ＣＭＰ装置１１の薬液供給場所９における薬液
流量を薬液供給圧力の範囲内で自在に制御することが可
能となる。The fluctuation of the supply pressure due to the decrease of the liquid surface by 1 cm is 1
g weighs / cm 2, if the cross-sectional area 10000 cm 2 degrees, wherein when the chemical liquid supply rate and 200ml / min,
Fluctuation of supply pressure during supplying chemical liquid for 50 minutes is 1 g weight / c
It is within m 2 , which can be regarded as almost the same supply pressure. According to the method as described above, since the chemical liquid can be supplied in a state where the chemical liquid supply pressure from the chemical liquid supply device is close to a constant value, between the chemical liquid supply tank 14 and the CMP device 11,
By adjusting the flow rate adjusting valve 16 that adjusts the opening of the pipe, the flow rate of the chemical liquid at the chemical liquid supply location 9 of the CMP device 11 can be freely controlled within the range of the chemical liquid supply pressure.
【００３４】[0034]
【発明の効果】以上、説明したように本発明によれば、
薬液供給タンクが薬液供給場所よりも上部に配置したた
め、薬液を薬液供給場所へ供給する際に、薬液の重力に
よる落下を利用する薬液の供給ができる。また、薬液の
送液のために何か特別な部品を必要としないため、基本
的には薬液タンクと送液配管のみというシンプルな構造
にできる。さらに、薬液の送液のために何か特別な部品
がないため、その部分にかかっていた費用・メンテンナ
ンス労力を削減できる。As described above, according to the present invention,
Since the chemical liquid supply tank is arranged above the chemical liquid supply place, when supplying the chemical liquid to the chemical liquid supply place, it is possible to supply the chemical liquid by utilizing the drop of the chemical liquid due to gravity. In addition, since no special parts are required to deliver the chemical solution, it is possible to basically have a simple structure including only the chemical solution tank and the solution delivery pipe. Furthermore, since there is no special part for sending the chemical liquid, the cost and maintenance labor required for that part can be reduced.
【００３５】また、本発明の薬液供給装置は、薬液供給
タンクにタンク内液面センサーを持ち、タンク内液面セ
ンサーにより、薬液補充弁のスイッチングを行い、薬液
を補充するタンクから、薬液の補充弁の開閉により薬液
供給タンクへ薬液をこまめに補充する事により、安定し
た圧力での薬液供給ができる。さらに広い断面積の薬液
供給タンク容器を持つことで、送液圧力の変動が緩やか
になり、より安定した圧力での薬液供給ができる。Further, the chemical liquid supply apparatus of the present invention has a tank liquid level sensor in the chemical liquid supply tank, and the chemical liquid replenishment valve is switched by the tank liquid level sensor to replenish the chemical liquid from the tank for replenishing the chemical liquid. By frequently refilling the chemical solution supply tank with the chemical solution by opening and closing the valve, the chemical solution can be supplied at a stable pressure. By having the chemical liquid supply tank container having a wider cross-sectional area, the fluctuation of the liquid supply pressure becomes gentle, and the chemical liquid can be supplied at a more stable pressure.
【００３６】また、本発明の薬液供給装置は、薬液砥出
配管部分に流量調節弁を持つことで、薬液供給流量を自
在に制御することができる。Further, in the chemical liquid supply device of the present invention, the chemical liquid supply flow rate can be freely controlled by having the flow rate adjusting valve in the chemical liquid polishing pipe portion.
【図１】従来のＣＭＰプロセスの概略図。FIG. 1 is a schematic view of a conventional CMP process.
【図２】従来のＣＭＰ装置研磨部断面図。FIG. 2 is a sectional view of a conventional CMP apparatus polishing section.
【図３】従来の（ａ）ポンプ式（ｂ）圧送式薬液供給方
法概略図。FIG. 3 is a schematic view of a conventional (a) pump type (b) pressure feed type chemical liquid supply method.
【図４】本発明の薬液供給装置概略図。FIG. 4 is a schematic view of a chemical liquid supply device of the present invention.
１ シリコンウェハー ２ 配線 ３ 層間絶縁膜 ４ 段差 ５ ウェハーキャリア ６ ウェハー ７ ターンテーブル ８ スラリー ９ 薬液供給場所 １０ ポンプ １１ ＣＭＰ装置 １２ 薬液供給装置 １３ 高圧ガス １４ 薬液供給タンク １５ 薬液（薬液供給タンク内） １６ 弁（流量調節用） １７ 薬液セット部 １８ 薬液補充タンク １９ 薬液（薬液補充タンク内） ２０ 液面センサー ２１ 弁（薬液補充用） ２２ 薬液供給タンク断面積 1 Silicon wafer 2 wiring 3 Interlayer insulation film 4 steps 5 Wafer carrier 6 wafers 7 turntable 8 slurries 9 Chemical supply place 10 pumps 11 CMP equipment 12 Chemical supply device 13 High pressure gas 14 Chemical supply tank 15 Chemical liquid (in the chemical liquid supply tank) 16 valves (for flow rate adjustment) 17 Chemicals set section 18 Chemical replenishment tank 19 chemicals (in chemical replenishment tank) 20 Liquid level sensor 21 valve (for chemical replenishment) 22 Chemical solution supply tank cross-sectional area
Claims (8)
の重力による落下を利用する薬液供給装置。1. A chemical liquid supply device which utilizes the drop of a chemical liquid due to gravity when the chemical liquid is supplied to a chemical liquid supply location.
ンクが薬液供給場所よりも上部に配置されていることを
特徴とする、請求項１記載の薬液供給装置。2. The chemical liquid supply device according to claim 1, wherein in the chemical liquid supply device, the chemical liquid supply tank is arranged above the chemical liquid supply place.
ンクを１つ、或いは複数以上備え、薬液供給タンクへ薬
液をこまめに補充できることを特徴とした請求項１記載
の薬液供給装置。3. The chemical liquid supply apparatus according to claim 1, wherein one or more tanks for replenishing the chemical liquid to the chemical liquid supply tank are provided, and the chemical liquid can be frequently replenished to the chemical liquid supply tank.
求項３記載の薬液補充タンクの間に配管を持ち、尚かつ
その配管に弁を持つことを特徴とした請求項１記載の薬
液供給装置。4. The chemical liquid according to claim 1, wherein a pipe is provided between the chemical liquid supply tank according to claim 2 and the chemical liquid replenishment tank according to claim 3, and a valve is provided in the pipe. Supply device.
ンク内液面センサーを持つことを特徴とする請求項１記
載の薬液供給装置。5. The chemical liquid supply apparatus according to claim 1, wherein the chemical liquid supply tank according to claim 2 has a tank liquid level sensor.
ーの信号により、請求項４記載の弁のスイッチングを行
うことを特徴とした請求項１記載の薬液供給装置。6. The chemical liquid supply apparatus according to claim 1, wherein the switching of the valve according to claim 4 is performed by the signal from the liquid level sensor in the tank according to claim 5.
て薬液吐出配管部分に流量調節弁を持つことを特徴とし
た請求項１記載の薬液供給装置。7. The chemical liquid supply device according to claim 1, wherein the chemical liquid supply device according to claim 1 has a flow rate adjusting valve in a chemical liquid discharge pipe portion.
いて、広い断面積のタンク容器を持つことを特徴とし
た、請求項１記載の薬液供給装置。8. The chemical liquid supply apparatus according to claim 1, wherein the chemical liquid supply tank according to claim 2 has a tank container having a wide cross-sectional area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10231000A JP2000061820A (en) | 1998-08-17 | 1998-08-17 | Chemical supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10231000A JP2000061820A (en) | 1998-08-17 | 1998-08-17 | Chemical supply device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000061820A true JP2000061820A (en) | 2000-02-29 |
Family
ID=16916671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10231000A Withdrawn JP2000061820A (en) | 1998-08-17 | 1998-08-17 | Chemical supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000061820A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006517466A (en) * | 2003-02-11 | 2006-07-27 | リエッキ オイ | Method for supplying liquid to a flame spraying apparatus |
-
1998
- 1998-08-17 JP JP10231000A patent/JP2000061820A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006517466A (en) * | 2003-02-11 | 2006-07-27 | リエッキ オイ | Method for supplying liquid to a flame spraying apparatus |
| JP4705565B2 (en) * | 2003-02-11 | 2011-06-22 | リエッキ オイ | Method for supplying liquid to a flame spraying apparatus |
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