JP2000058977A5 - - Google Patents

Description

0011
[Problems to be Solved by the Invention]
However, the light transmitting portion and a light receiving unit used in such a conventional optical / RF communication has been a separate configuration. Therefore, the optical transmitter unit and the optical receiver unit exist separately, which has a problem that the size of the apparatus becomes large.

In the tenth invention (corresponding to the invention according to claim 10), the optical / high frequency communication unit according to any one of the first to ninth inventions, wherein the high frequency circuit board includes an amplifier for amplifying a high frequency signal. Is.

[Simple explanation of drawings]
FIG. 1
FIG. 2 is a block diagram of an optical / high frequency communication unit according to the first embodiment of the present invention.
FIG. 3 is a component mounting diagram of the optical / high frequency communication unit according to the first embodiment of the present invention.
FIG. 4 is a matching circuit diagram of the high frequency circuit 51 according to the first embodiment of the present invention.
FIG. 5 is a matching circuit diagram of the high frequency circuit 52 according to the first embodiment of the present invention.
FIG . 6 shows the high-frequency signal transmission efficiency of the optical / high-frequency communication unit according to the first embodiment of the present invention.
FIG. 7 is a block diagram of an optical / high frequency communication unit according to a second embodiment of the present invention.
FIG. 8 shows the high-frequency / optical signal conversion efficiency of the optical / high-frequency communication unit according to the second embodiment of the present invention.
FIG. 9 is a block diagram of an optical / high frequency communication unit according to a third embodiment of the present invention.
Shows an optical / RF signal conversion efficiency of the light-RF communication unit according to the third embodiment of the present invention and FIG. 10
FIG. 11 is a diagram showing high-frequency signal transmission efficiency of the optical / high-frequency communication unit according to the fourth embodiment of the present invention.
FIG. 12 is a configuration diagram of an optical communication system according to a fifth embodiment of the present invention.
FIG. 13 is a configuration diagram of an optical communication system according to a fifth embodiment of the present invention.
FIG. 14 is a diagram showing high-frequency signal transmission efficiency of the optical / high-frequency communication unit according to the fifth embodiment of the present invention.
FIG. 15 is a circuit diagram of a high frequency circuit 51 according to a first embodiment of the present invention.
FIG. 16 is a circuit diagram of a high frequency circuit 52 according to a first embodiment of the present invention.
FIG. 17 is a configuration diagram of an optical communication system in which an optical / high frequency communication unit according to a conventional configuration is used.
FIG. 18 is a configuration diagram of optical / high frequency communication according to a conventional configuration.
Diagram showing high-frequency signal transmission efficiency of the optical / high-frequency communication configuration related to the conventional configuration [Explanation of symbols]
1 High frequency / optical signal conversion element 2 Optical / high frequency signal conversion element 6 Control circuit board 7 Unit package 9 Shields 31, 32 High frequency signal terminals 41, 42 Optical signal terminal 51 High frequency circuit board 52 on the transmitter side High frequency circuit board 71 on the receiver side Optical / high frequency communication unit 72 on the master station side Optical / high frequency communication unit 81, 82 on the slave station side Circuit board 101 in which a high-frequency circuit and a control circuit are mixed and wired Master station 102 Slave stations 103, 104 Optical fiber 105 Mobile station 106 Modem 107 Commoner 110 Antenna 201 Coaxial package semiconductor laser module 202 Coaxial package semiconductor photodiode modules 231 and 232 Coaxial connectors 241 and 242 Optical fiber 243 Extra length processing unit 251 of optical fiber High frequency circuit board 252 on the optical transmitter side High frequency circuit board 206 on the optical receiver side Control circuit board 207 Unit package 209 Shield 301, 302, 401, 402 Signal transmission lines 303, 403 Inductance elements 304, 305, 306, 404, 405, 406 Capacitance elements 307, 407 Amplifier 1081 Optical transmitter 1082 on the master station side Optical transmitter 1091 on the slave station side Optical receiver 1092 on the master station side Optical receiver on the slave station side

Claims (14)

An optical semiconductor module;
A high frequency circuit board that inputs a high frequency signal from the optical semiconductor module or outputs a high frequency signal to the optical semiconductor module;
A control circuit board for controlling the driving of the optical semiconductor module,
The high-frequency circuit board and the control circuit board are configured on different substrates, and are shielded to suppress interference in the frequency domain, or spatial interference with each other,
The optical / high-frequency communication unit, wherein the optical semiconductor module is connected to the high-frequency circuit board and the control circuit board. A first optical semiconductor module that converts a high-frequency signal into an optical signal and outputs the optical signal;
A second optical semiconductor module that converts an optical signal into a high-frequency signal;
A first high-frequency circuit board that inputs the high-frequency signal to the first optical semiconductor module;
A second high-frequency circuit board that obtains and outputs the high-frequency signal from the second optical semiconductor module;
A control circuit board for controlling the driving of the first and second optical semiconductor modules,
The first high-frequency circuit board, the second high-frequency circuit board, and the control circuit board are configured on different substrates, and interference in the frequency domain between these substrates, or spatial Shield to suppress unwanted interference,
The first optical semiconductor module is connected to the first high-frequency circuit board and the control circuit board, and the second optical semiconductor module includes the second high-frequency circuit board and the control circuit board. An optical / high-frequency communication unit connected to the unit. The optical semiconductor module is a laser diode module and a photodiode module,
A unit package for incorporating the laser diode module, the photodiode module, the high-frequency circuit board, the control circuit board, and the shield;
A high-frequency signal terminal for inputting or outputting the high-frequency signal;
An optical signal terminal for inputting or outputting the optical signal;
The optical / high frequency communication unit according to claim 1, further comprising: The first and second optical semiconductor modules are a laser diode module and a photodiode module;
A unit package for incorporating the laser diode module, the photodiode module, the first and second high-frequency circuit boards, the control circuit board, and the shield;
A first high-frequency signal terminal for inputting a signal to the first high-frequency circuit board; a second high-frequency signal terminal for outputting a signal from the second high-frequency circuit board;
A first optical signal terminal for outputting an optical signal from the first optical semiconductor module;
A second optical signal terminal for inputting an optical signal to the second optical semiconductor module;
The optical / high frequency communication unit according to claim 2, further comprising:   5. The optical / high-frequency communication unit according to claim 3, wherein the high-frequency circuit board includes an impedance matching circuit for matching impedance between the optical semiconductor module and the high-frequency signal terminal.   6. The optical / high frequency communication unit according to claim 5, wherein the impedance matching circuit is a resonance type circuit including a reactance element capable of obtaining a good transfer characteristic in a desired frequency band.   6. The optical / high frequency communication unit according to claim 5, wherein the impedance matching circuit is set so that transmission efficiency is good in a plurality of desired frequency bands.   The desired frequency band obtained by the impedance matching circuit and the desired frequency band obtained by the impedance matching circuit of a high-frequency circuit connected to the optical semiconductor module are set to be different from each other. Item 6. The optical / high-frequency communication unit according to Item 5.   The control circuit board controls both the laser diode module and the photodiode module, and the control circuit for controlling the laser diode module and the control circuit for controlling the photodiode module are formed on the same board. The optical / high-frequency communication unit according to any one of claims 1 to 5. The high frequency circuit board, the light-RF communication unit according to any one of claims 1 to 9, characterized in that it comprises an amplifier for amplifying the high frequency signal. 10. The unit package according to claim 1, wherein the unit package is made of an alloy containing nickel, iron or cobalt as a main material, an alloy containing copper or tungsten as a main material, or a material containing aluminum. The optical / high-frequency communication unit according to any one of the above. It said unit package, light, high frequency communication unit according to any one of claims 1-9, characterized in that it is formed of ceramic or resin, and alumina as a main material. The optical / high-frequency communication unit according to any one of claims 1 to 12, wherein the high-frequency signal terminal is a coaxial connector. The high-frequency signal terminal, optical and RF communication unit according to any one of claims 1 to 12, characterized in that a lead line for the metal as a main material.