JP2000056450A - Positive visible light sensitive resin composition and its use - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition capable of being treated under light safelight conditions and superior in sensitivity by incorporating a specified benzopyyromethene compound photosensitizer in the photosensitive resin composition and making the absorbance of a nonexposed film formed from this composition to a specified value or less in the specified region of the maximum wavelength of the safelight. SOLUTION: This positive visible light sensitive resin composition is used under the environment irradiated with safelight high in a relative luminosity factor having a maximum wavelength selected from the region of 1,500-620 nm. This composition contains a positive visible light sensitive resin and a photosensitizer of a benzopyyromethene compound represented by formula and the absorbance of a nonexposed film formed from this composition is made to <=0.5 in the region of the maximum wavelength of the safelight, ±30 nm. In the formula, each of R1-R3 and R5-R9 is, independently, an H or halogen atom or a nitro, cyano, or hydroxy group or the like; R4 is an H atom or a cyano group or the like and each of R10 and R11 is, independently, a halogen atom or an alkyl group or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positive visible light-sensitive resin composition containing a photosensitizer of a benzopyrromethene compound having a peculiar structure for use with a specific safety light.

[0002]

2. Description of the Related Art In recent years, in the field of information using light reaction or image recording, instead of the conventional recording method using ultraviolet light using a film original or the like, an electronically edited original by a computer is directly used as a high output laser. A method of directly outputting and recording the data by using is being studied. This method has the advantage that the recording and image forming steps can be greatly simplified by direct writing with a laser.

At present, many high-power and stable laser light sources generally used have an output wavelength in the visible region. Specifically, the wavelength 488 nm and 51
Argon laser with stable oscillation line at 4.5 nm or YAG with emission line at 532 nm as second harmonic
Lasers and the like are widely used. Therefore, compounds having high sensitivity to these wavelengths have been desired, but conventionally used ultraviolet light-sensitive agents cannot be used due to low sensitivity in the visible region. Although the addition of a pyrylium salt or a thiopyrylium salt can improve the sensitivity in the visible region, the storage stability of the photosensitive layer is low and it has been difficult to use the photosensitive layer.

As compounds having photosensitivity in the visible region,
For example, 7-diethylamino-3-benzothiazoylcoumarin (common name: coumarin-6) or bis [3
-(7-diethylaminocoumaryl)] ketone (common name:
Ketocoumarin) is known, but since these have a maximum absorption wavelength of about 450 nm, they have a shorter wavelength than 488 nm of an argon laser and have insufficient sensitivity. Also, 4-substituted-3 described in JP-A-4-18088.
-The benzothiazoyl coumarin compound shows high photosensitivity at 488 nm of an argon laser, but is 514.5.
532 which is the second harmonic of nm or YAG laser
nm has almost no absorption, leaving room for improvement in sensitivity.

[0005] When handling the positive-type visible light-sensitive resin composition to be reacted with visible light as described above, a dark red colorant is coated on the outer tube or the dark red film is removed. An electric light such as a fluorescent light colored by being wound around a tube is used as a safety light (work light). However, under such a dark red safety light environment, it is not easy to inspect the state of the coating film after application, and it is not easy to inspect the coating device, irradiation device, transport device, etc. There is a problem that work efficiency, product quality stability and the like are inferior. When a non-colored fluorescent lamp is used as a safety light, the working environment is bright and there is no problem.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a positive type visible light photosensitive resin composition which can be handled under bright safe light conditions and has excellent sensitivity.

[0007]

Means for Solving the Problems The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, have developed a specific visible light photosensitive resin composition used with a specific safety light. As a result, they have found that the conventional problems can be solved, and have completed the present invention.

That is, the present invention relates to a positive-type visible light-sensitive resin composition for use in an environment in which a safety light having a maximum wavelength selected from the range of 1,500 to 620 nm and a high relative luminous efficiency is used. The composition is a positive-type visible light-sensitive resin composition containing a positive-type visible light-sensitive resin and a photosensitizer of a benzopyrromethene compound represented by the following general formula (1). The absorbance of the formed unexposed film is ± 3 of the maximum wavelength of the safe light.
A positive visible light-sensitive resin composition, which is 0.5 or less in a range of 0 nm,

[0009]

Embedded image [Wherein R ₁ , R ₂ , R ₃ , R ₅ , R ₆ , R ₇ , R ₈ , and R ₉ each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydroxy group, an amino group, Carboxyl group, sulfonic acid group, alkyl group, halogenoalkyl group, alkoxyalkyl group, alkoxy group, alkoxyalkoxy group, aryloxy group, acyl group, alkoxycarbonyl group, aminocarbonyl group, alkylaminocarbonyl group, dialkylaminocarbonyl group, Alkylcarbonylamino group, arylcarbonylamino group, arylaminocarbonyl group, aryloxycarbonyl group, aralkyl group, aryl group, heteroaryl group, alkylthio group, arylthio group, alkenyloxycarbonyl group, aralkyloxycarbonyl group, alkoxycarbonylalkoxy Aryloxycarbonyl group, an alkylcarbonyl alkoxycarbonyl group, mono (hydroxyalkyl) aminocarbonyl group, di (hydroxyalkyl) aminocarbonyl group, mono (alkoxyalkyl) aminocarbonyl group, di (alkoxyalkyl) aminocarbonyl group,
Represents an alkenyl group, an alkylamino group, a dialkylamino group, a mono (hydroxyalkyl) amino group or a di (hydroxyalkyl) amino group, R ₄ represents a hydrogen atom,
Cyano group, an alkyl group, an aralkyl group, an aryl group, a heteroaryl group or an alkenyl group, R _10, R ₁₁
Each independently represents a halogen atom, an alkyl group, an aralkyl group, an aryl group, a heteroaryl group, an alkoxy group or an alkoxyalkoxy group. ]

2. The positive visible light-sensitive resin composition as described above, wherein the safety light is generated by a discharge lamp containing sodium as a main component (mainly a D line having a light wavelength of 589 nm). 3, a composition for a positive-type visible light-sensitive material comprising the above-described positive-type visible light-sensitive resin composition and a solvent; The present invention relates to a positive-type visible light-sensitive material containing:

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention is a photosensitive resin composition having excellent photosensitivity to visible light, and the safe light used in the present invention is not sensitive to the visible light photosensitive resin composition of the present invention. In addition to the safety light that does not cause a light reaction, the safety light to be used is a region with high relative luminous efficiency of human beings, so it feels very bright at the same illumination light intensity compared to the conventional one, so that safe workability, It has excellent effects on work efficiency, product quality stability, etc.

The term "composition for a positive-type visible light-sensitive material" used in the present invention includes, for example, paints, inks, adhesives,
It means a printing plate material, a resist material, and a non-photosensitive film formed from these materials.

Further, a conventional safety light is a fluorescent light colored red, but the emission spectrum of the fluorescent light has a wavelength range (FIG. 5) covering a wide range from ultraviolet light to visible light. In addition, even the visible light-sensitive resin coating portion that does not require a light reaction is reacted, and a clear resist pattern cannot be formed by the development process. For this reason, there is a problem that the working environment is further darkened since the intensity of the illumination light is reduced. On the other hand, the safety light used in the present invention has a sharp wavelength like a sodium lamp, for example, so that the above-mentioned problem is solved.

The safety light used in the present invention is 500 to 62.
It is a visible light having a large relative luminous efficiency having a maximum wavelength within a range of 0 nm, preferably 510 to 600 nm. This safety light can be obtained, for example, by using a discharge lamp that emits light having a maximum wavelength in the above-described range by discharging in a gas such as sodium. Among these, the sodium lamp emits light having a wavelength of 58 nm.
It is mainly composed of a 9-nm yellow D line, and since it is monochromatic light, chromatic aberration is small and an object can be seen sharply, so that safety, work environment and the like are excellent. FIG. 1 shows the wavelength of the spectral distribution of the low-pressure sodium lamp. As shown in the spectral distribution diagram of the sodium lamp, other than the D-line having the maximum wavelength of the sodium lamp, the lamp has a high energy ray (low wavelength region) to such an extent that the visible light curable resin composition is not adversely affected. No problem. In addition, a filter in which a high-energy ray other than the D ray is cut by applying a filter to a sodium lamp can also be used. FIG. 2 shows the spectral distribution of the sodium lamp from which the high energy rays have been cut.

Further, a filter can be used for the safety light used in the present invention. As the filter,
For example, "Fantac FD-1081 Scarlet", "Fantac FC-1431 Sunflower"
Yellow (trade name, manufactured by Kansai Paint Co., Ltd.), Lintec Lumicool Film No. 190
5 "(trade name, manufactured by Lintec Corporation).

As the safety light used in the present invention, it is preferable to use a sharp monochromatic light having a light beam of 589 nm, such as a sodium lamp. Safety light having wavelengths distributed in the wavelength ranges of light and infrared light may be used. However, when using safety light having such a distribution, it is necessary that the distributed light beam region is a safe light region which does not adversely affect (photosensitize) the positive-type visible light photosensitive resin composition. It is.

Such a safe high energy ray region (low wavelength region) is related to the energy intensity of the distributed light beam and the absorbance of the positive-type visible light photosensitive resin composition in that region, and the energy intensity of the light beam is large. In the case where the composition has a small absorbance, and in the case where the energy intensity of the light beam is small, the composition can be used in which the absorbance is relatively larger than the former, so that the composition is taken into account in consideration of these. Can have a high-energy ray region to such an extent that it does not adversely affect the light beam. However, even if an ordinary fluorescent lamp having a maximum wavelength in the range of 500 to 620 nm is used as the safety light, it is still 5 mils.
Since it has a large light energy intensity of less than 00 nm, particularly 400 to 499 nm, it cannot be used as a safety light for a positive-type visible light photosensitive resin composition which is exposed to a visible light laser having an oscillation line at 488 nm or 532 nm.

The absorbance used in the present invention is -log (I
/ I ₀ ). Here, I is the intensity of transmitted light of the coating obtained by applying the photosensitive resin composition on the surface of the transparent substrate and drying (removing the solvent), and I ₀ is a blank [sample (photosensitive resin composition) is applied. Of a transparent substrate (eg, a polyethylene terephthalate sheet) for transmission.

How bright light is perceived by human eyes can be represented by relative luminous efficiency. The relative luminous efficiency is JI
As defined in SZ8113, 2005, under certain observation conditions, when it is determined that the monochromatic radiation of a certain wavelength λ has the same brightness as the radiation used as a reference for comparison, the monochromatic radiation of a wavelength λ is determined. It is defined as a value obtained by normalizing the reciprocal of the relative value of the radiance, usually, the maximum value when λ is changed to 1. FIG. 3 shows a relative luminous efficiency curve of 380 to 780 nm, which is a wavelength region of visible light. In FIG. 3, the vertical axis represents the ratio, with the maximum value of the relative luminous efficiency set to 100. From this curve, the conventional red wavelength range of 640 to
At 780 nm, the relative luminous efficiency is low, and it is perceived as dark by human eyes. For example, it can be seen that the radiation intensity must be further increased in order to feel the same brightness as the wavelength of 589 nm. The maximum value of relative luminous efficiency is about 555 nm (J
IS-Z8113 2008).

The positive visible light-sensitive resin composition of the present invention is a positive visible light-sensitive resin composition containing a positive visible light-sensitive resin and a photosensitizer of a benzopyrromethene compound having a specific structure. Wherein the absorbance of the unexposed film formed from the composition is within ± 30 nm (-30n) of the maximum wavelength of the safe light selected from the above maximum wavelength range.
m to +30 nm), preferably in the range of ± 20 nm (−2
0 nm to +20 nm), and a range of ± 10 nm (−1
(0 nm to +10 nm), it is 0.5 or less, preferably 0.2 or less, and more preferably 0.1 or less.

The photosensitizer of the benzopyrromethene compound represented by the general formula (1) is excited by absorbing light in the visible light region of 400 to 700 nm, in particular, light of 400 to 600 nm, and generates a resin or And a compound having an interaction with a photoacid generator. The term "interaction" as used herein includes energy transfer and electron transfer from the excited photosensitizer to the resin or photoacid generator. For this reason, the benzopyrromethene compound represented by the general formula (1) used here is a very useful compound as a photosensitizer.

In the compound represented by the general formula (1) of the present invention, specific examples of R ₁ , R ₂ , R ₃ , R ₅ , R ₆ , R ₇ , R ₈ and R ₉ include a hydrogen atom; Nitro group; cyano group; hydroxy group; amino group; carboxyl group; sulfonic acid group; halogen atom such as fluorine atom, chlorine atom, bromine atom; methyl group, ethyl group, n-propyl group, isopropyl group, n
-Alkyl groups such as -butyl group, isobutyl group, t-butyl group, n-pentyl group, isopentyl group, neopentyl group, n-hexyl group, n-octyl group, 2-ethylhexyl group, cyclohexyl group, decalyl group, and icosanyl group Groups; chloromethyl, dichloromethyl, fluoromethyl, trifluoromethyl, pentafluoroethyl, 1,1,1,3,3,3-hexafluoro-2-propyl, nonafluorobutyl and the like A halogenoalkyl group; an alkoxyalkyl group such as a methoxyethyl group, an ethoxyethyl group, an isopropyloxyethyl group, a 3-methoxypropyl group, and a 2-methoxybutyl group;

Methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, n-pentyloxy, n-hexyloxy, n-octyloxy, n-decyloxy, cyclopentyloxy, Alkoxy groups such as cyclohexyloxy group and 4-methylcyclohexyloxy group; alkoxyalkoxy groups such as methoxyethoxy group, ethoxyethoxy group, 3-methoxypropoxy group and 3- (isopropyloxy) propoxy group; phenoxy group and 2-methylphenoxy Aryloxy groups such as a group, 4-methylphenoxy group, 4-t-butylphenoxy group, 2-methoxyphenoxy group and 4-isopropylphenoxy group; formyl group, acetyl group, ethylcarbonyl group, n-propylcarbonyl group, isopropyl Carbonyl group, Acyl groups such as a sobutylcarbonyl group, a t-butylcarbonyl group, an isopentylcarbonyl group and a benzylcarbonyl group; a methoxycarbonyl group, an ethoxycarbonyl group, an n-butoxycarbonyl group, an n-hexyloxycarbonyl group, and an n-octyloxycarbonyl An alkoxycarbonyl group such as a group, an n-decyloxycarbonyl group, a cyclopentyloxycarbonyl group, a cyclohexyloxycarbonyl group, a 4-methylcyclohexyloxycarbonyl group;

An aminocarbonyl group; an alkylaminocarbonyl group such as a methylaminocarbonyl group, an n-butylaminocarbonyl group, an n-hexylaminocarbonyl group, a cyclohexylaminocarbonyl group, a 4-methylcyclohexylaminocarbonyl group; a dimethylaminocarbonyl group; Dialkylaminocarbonyl groups such as diethylaminocarbonyl group, di-n-butylaminocarbonyl group, di-n-hexylaminocarbonyl group, di-n-octylaminocarbonyl group, N-isoamyl-N-methylaminocarbonyl group; acetylamino Alkylcarbonylamino groups such as a group, an ethylcarbonylamino group and an isobutylcarbonylamino group; a phenylcarbonylamino group;
Arylcarbonylamino groups such as 4-ethylphenylcarbonylamino group, 3-isopropylphenylcarbonylamino group and 2-methoxyphenylcarbonylamino group; phenylaminocarbonyl group, 4-methylphenylaminocarbonyl group and 2-methoxyphenylaminocarbonyl group , An arylaminocarbonyl group such as 4-n-propylphenylaminocarbonyl group; a phenoxycarbonyl group, a 4-methylphenoxycarbonyl group, a 3-methylphenoxycarbonyl group, a 2-methylphenoxycarbonyl group, a 2,4-dimethylphenoxycarbonyl group ,
2,6-dimethylphenoxycarbonyl group, 2,4,6
Aryloxycarbonyl groups such as -trimethylphenoxycarbonyl group, 4-phenylphenoxycarbonyl group;

Aralkyl groups such as benzyl and phenethyl; phenyl, 3-nitrophenyl, 4-cyanophenyl, 4-hydroxyphenyl, 2-methylphenyl, 3,5-dimethylphenyl, Trifluoromethylphenyl group, 4-chlorophenyl group, 4-methoxyphenyl group, 4- (dimethylamino) phenyl group,
Aryl groups such as naphthyl group, biphenyl group and fluorenyl group; pyrrolyl group, thienyl group, furanyl group, oxazoyl group, isoxazoyl group, oxadiazoyl group,
Heteroaryl groups such as thiadiazoyl, imidazoyl, benzothiazoyl, benzoxazoyl, benzoimidazoyl, benzofuranyl and indo-3-yl;

Alkylthio groups such as methylthio, ethylthio, n-propylthio, isopropylthio, n-butylthio, isobutylthio, t-butylthio, 3,5,5-trimethylhexylthio; phenylthio; Arylthio groups such as 4-methylphenylthio group, 2-methoxyphenylthio group, 4-t-butylphenylthio group, and naphthylthio group; allyloxycarbonyl group;
Alkenyloxycarbonyl groups such as 2-butenoxycarbonyl group; aralkyloxycarbonyl groups such as benzyloxycarbonyl group, 4-methylbenzyloxycarbonyl group and phenethyloxycarbonyl group; methoxycarbonylmethoxycarbonyl group, ethoxycarbonylmethoxycarbonyl group; alkoxycarbonylalkoxycarbonyl groups such as n-propoxycarbonylmethoxycarbonyl group and isopropoxycarbonylmethoxycarbonyl group; alkylcarbonylalkoxycarbonyl groups such as methylcarbonylmethoxycarbonyl group and ethylcarbonylmethoxycarbonyl group;

Hydroxyethylaminocarbonyl group, 2
Mono (hydroxyalkyl) aminocarbonyl groups such as -hydroxypropylaminocarbonyl group and 3-hydroxypropylaminocarbonyl group; di (hydroxyethyl) aminocarbonyl group, di (2-hydroxypropyl) aminocarbonyl group, di (3-hydroxy Di (hydroxyalkyl) such as propyl) aminocarbonyl group
Aminocarbonyl group; methoxymethylaminocarbonyl group, methoxyethylaminocarbonyl group, ethoxymethylaminocarbonyl group, ethoxyethylaminocarbonyl group, mono (alkoxyalkyl) aminocarbonyl group such as propoxyethylaminocarbonyl group; di (methoxymethyl) amino Di (alkoxyalkyl) aminocarbonyl groups such as carbonyl group, di (methoxyethyl) aminocarbonyl group, di (ethoxymethyl) aminocarbonyl group, di (ethoxyethyl) aminocarbonyl group, di (propoxyethyl) aminocarbonyl group;

Vinyl, propenyl, 1-butenyl, 1-pentenyl, 2-pentenyl, 3-methyl-1-butenyl, 2,2-dicyanovinyl, 1,
Alkenyl groups such as 2,2-tricyanovinyl group Methylamino group, n-butylamino group, n-hexylamino group, cyclohexylamino group, alkylamino group such as 4-methylcyclohexylamino group; dimethylamino group, diethylamino group , Di-n-butylamino group, di-
n-hexylamino group, di-n-octylamino group, N
Dialkylamino groups such as -isoamyl-N-methylamino group; mono (hydroxyalkyl) groups such as hydroxymethylamino group, hydroxyethylamino group, 2-hydroxypropylamino group and 3-hydroxypropylamino group
Amino group; di (hydroxyalkyl) amino group such as di (hydroxymethyl) amino group, di (hydroxyethyl) amino group, di (2-hydroxypropyl) amino group and di (3-hydroxypropyl) amino group; be able to.

Specific examples of R ₄ include a hydrogen atom; a cyano group; a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group,
-Pentyl group, isopentyl group, n-hexyl group, n-
Alkyl groups such as octyl group, 2-ethylhexyl group, cyclohexyl group, decalyl group and icosanyl group; benzyl group, 2-methylbenzyl group, 4-ethylbenzyl group,
Aralkyl groups such as phenethyl group; phenyl group, 3-nitrophenyl group, 4-cyanophenyl group, 4-hydroxyphenyl group, 2-methylphenyl group, 3,5-dimethylphenyl group, 3-trifluoromethylphenyl group, 4-
Aryl groups such as chlorophenyl group, 4-methoxyphenyl group, 4- (dimethylamino) phenyl group, naphthyl group, biphenyl group and fluorenyl group;

Pyrrolyl group, N-methylpyrrolyl group, N-
Ethylpyrrolyl, N-propylpyrrolyl, N-butylpyrrolyl, N-isobutylpyrrolyl, N-isopentylpyrrolyl, N-octylpyrrolyl, N-methoxymethylpyrrolyl, N-methoxyethylpyrrolyl Group, N-ethoxymethylpyrrolyl group, N-ethoxyethylpyrrolyl group, N-methoxycarbonylmethylpyrrolyl group, N-methoxycarbonylethylpyrrolyl group, N-ethoxycarbonylmethylpyrrolyl group, N-ethoxycarbonyl Ethylpyrrolyl group, N-benzylpyrrolyl group, N
-Phenylpyrrolyl group, N-tolylpyrrolyl group, N-allylpyrrolyl group, N-butenylpyrrolyl group, N-pentenylpyrrolyl group, thienyl group, furyl group, pyridyl group,
Quinolyl group, isoquinolyl group, oxazoyl group, isoxazoyl group, oxadiazoyl group, thiadiazoyl group, imidazoyl group, benzothiazoyl group, benzoxazoyl group, benzimidazoyl group, benzofuryl group,
A heteroaryl group such as an ind-3-yl group; a vinyl group;
Propenyl group, 1-butenyl group, 1-pentenyl group, 2
-Pentenyl group, 3-methyl-1-butenyl group, 2,2
And alkenyl groups such as -dicyanovinyl group and 1,2,2-tricyanovinyl group.

Specific examples of R ₁₀ and R ₁₁ include halogen atoms such as fluorine, chlorine and bromine; methyl, ethyl and n-
Propyl, isopropyl, n-butyl, isobutyl, t-butyl, n-pentyl, isopentyl, neopentyl, n-hexyl, n-octyl, 2-ethylhexyl, cyclohexyl, decalyl An alkyl group such as an icosanyl group; a benzyl group;
Aralkyl groups such as -methylbenzyl group, 4-ethylbenzyl group and phenethyl group;

Phenyl, 3-nitrophenyl, 4-
Cyanophenyl group, 4-hydroxyphenyl group, 2-methylphenyl group, 3,5-dimethylphenyl group, 3-trifluoromethylphenyl group, 4-chlorophenyl group,
Aryl groups such as 4-methoxyphenyl group, 4- (dimethylamino) phenyl group, naphthyl group, biphenyl group and fluorenyl group; pyrrolyl group, N-methylpyrrolyl group,
N-ethylpyrrolyl group, N-propylpyrrolyl group, N-
Butylpyrrolyl group, N-isobutylpyrrolyl group, N-isopentylpyrrolyl group, N-octylpyrrolyl group, N-
Methoxymethylpyrrolyl group, N-methoxyethylpyrrolyl group, N-ethoxymethylpyrrolyl group, N-ethoxyethylpyrrolyl group, N-methoxycarbonylmethylpyrrolyl group, N-methoxycarbonylethylpyrrolyl group, N-
Ethoxycarbonylmethylpyrrolyl group, N-ethoxycarbonylethylpyrrolyl group, N-benzylpyrrolyl group,
N-phenylpyrrolyl group, N-tolylpyrrolyl group, N-
Allylpyrrolyl group, N-butenylpyrrolyl group, N-pentenylpyrrolyl group, thienyl group, furyl group, pyridyl group, quinolyl group, isoquinolyl group, oxazoyl group, isoxazoyl group, oxadiazoyl group, thiadiazoyl group, imidazoyl group, benzothiazoyl group, Heteroaryl groups such as a benzoxazoyl group, a benzimidazoyl group, a benzofuryl group and an indo-3-yl group;

Methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, n-pentyloxy, n-hexyloxy, n-octyloxy, n-decyloxy, cyclopentyloxy, An alkoxy group such as a cyclohexyloxy group and a 4-methylcyclohexyloxy group; and an alkoxyalkoxy group such as a methoxyethoxy group, an ethoxyethoxy group, a 3-methoxypropoxy group, and a 3- (isopropyloxy) propoxy group.

Table 1 below shows specific examples of the benzopyrromethene-based boron compound represented by the general formula (1), but the present invention is not limited to these examples.

[0035]

[Table 1]

[0036]

[Table 2]

[0037]

[Table 3]

[0038]

[Table 4]

The benzopyrromethene boron compound represented by the general formula (1) according to the present invention can be produced by the following method. That is, typically, first, a compound represented by the general formula (2) and a compound represented by the general formula (3) or a compound represented by the general formula (4) in the presence of an acid catalyst such as hydrobromic acid or hydrogen chloride. The compound represented by the general formula (6) can be obtained by reacting the compound represented by the general formula (5) with the compound represented by the general formula (5). Next, the compound represented by the general formula (7) can be obtained by reacting the compound represented by the general formula (6) with boron trihalide. When at least one of them is a substituent of R ₁₀ and R ₁₁ which is not a halogen atom, a benzopyrromethene compound represented by the general formula (1) is obtained by substituting a part or all of the halogen atoms of the compound of the general formula (7). A boron compound can be obtained.

[0040]

Embedded image (In the formula, R _{4 to} R ₉ are the same as described above.)

[0041]

Embedded image (In the formula, R _{1 to} R ₃ are the same as described above.)

[0042]

Embedded image (In the formula, R _{5 to} R ₉ are the same as described above.)

[0043]

Embedded image (In the formula, R _{1 to} R ₄ are the same as described above.)

[0044]

Embedded image (In the formula, R _{1 to} R ₉ are the same as described above.)

[0045]

Embedded image (In the formula, R _{1 to} R ₉ are the same as described above, and X represents a halogen atom.)

The photosensitizer contains at least one benzopyrromethene compound photosensitizer represented by the general formula (1), and may be used in combination with other known photosensitizers. Good.

The other known photosensitizers are not particularly limited as long as they are commonly used photosensitizers, but ketocoumarin, coumarin-6 and JP-A-4-18.
Coumarin compounds described in JP-A-088 / 88.

In this case, the content of the photosensitizer of the benzopyrromethene compound represented by the general formula (1) in the photosensitizer is not particularly limited, however, in order to obtain a desired effect in the present invention. The content of the photosensitizer of the benzopyrromethene compound represented by the general formula (1) in the photosensitizer is 10% by weight.
Or more, more preferably 20% by weight.
Or more, more preferably 30% by weight or more,
Photosensitizers containing 50% by weight or more are particularly preferred.

The amount of the benzopyrromethene compound photosensitizer used depends on the type and amount of the benzopyrromethene compound photosensitizer represented by the general formula (1) contained in the photosensitizer and the interaction. Although it depends on the type of the resin component to be used, the amount of the photosensitizer of the benzopyrromethene compound represented by the general formula (1) is usually 0.1 to 100 parts by weight per 100 parts by weight of the resin component.
10 parts by weight, preferably in the range of 0.3 to 5 parts by weight is suitable. When the amount of the photosensitizer of the benzopyrromethene compound is too small, the photosensitivity of the formed film tends to decrease when the amount is less than 0.1 part by weight. It tends to be difficult to keep things uniform.

The positive-type visible light-sensitive resin composition of the present invention comprises a conventionally known positive-type visible light-sensitive resin composition (for example, a coating material) which decomposes upon exposure and shows solubility in a developing solution. , An ink, an adhesive, a printing plate material, a resist material for a printed wiring board) containing a photosensitizer of the benzopyrromethene compound represented by the general formula (1) as an essential component. .

Representative examples of the above-mentioned conventionally known positive-type visible light-sensitive resin compositions will be described below.

Examples of the composition include a resin containing a photoacid generator, a resin containing components other than the photoacid generator component (for example, a photobase generator, etc.), and a resin which itself decomposes by light. No. When these resins are decomposed by light, their properties, such as polarity and molecular weight, change, whereby the resins become soluble in substances such as a developer (aqueous solution, organic solvent, etc.). The resin may have a component such as a photoacid generator incorporated therein or may be a mixture of a component such as a photoacid generator and a resin having a group that is decomposed by an acid or the like. Further, other resins or the like for adjusting the solubility of the developing solution can be further added to these as required.

The resin containing the photoacid generator component will be described. The resin includes a resin in which a photoacid generator is incorporated in a resin skeleton (for example, a resin in which a resin generates an acid group upon exposure to light, thereby enabling alkali development) or a mixture of a photoacid generator and a resin [ The acid generated by the photoacid generator causes the resin to be cut to have a low molecular weight, an acid group to be added to the resin, or a change into a soluble substance (for example, (poly) P-hydroxystyrene). Or exhibiting dispersibility or solubility in an organic solvent or an aqueous developer].

These include, for example, a composition containing, as a main component, a resin in which quinonediazidesulfonic acid is bonded to a base resin such as an acrylic resin having an ion-forming group via a sulfonic ester bond. -20
No. 6293, JP-A-7-133449, etc.), that is, a naphthoquinonediazide photosensitive composition utilizing a reaction of photolyzing a quinonediazide group by irradiation light to form indenecarboxylic acid via ketene; A chemically amplified photosensitive material utilizing a change in solubility between an irradiated part and an unirradiated part by causing a elimination reaction in a base resin (polymer) in a chain using a photoacid generator that generates an acid group as a catalyst ( JP-A-4-226461, U.S. Pat.
491,628, JP-A-59-45439, JP-A-63-250542, Polymers in Electronic
s ”Davidson T. Editing. ACS Symposium Series 242, Americ
an Chemical Society, Washington DC ,, 1984-11
Page ”, N. Hayashi, T. Ueno, M. Toriumi, etc, ACS Po
lym. Materials Sci. Eng., 61, 417 (1989), H. Ito,
CG Wilson, ACS Symp. Ser., 242, 11 (1984), etc.);
A crosslinked film insoluble in a solvent or an alkaline aqueous solution is formed by heating, and the crosslinked structure is further cut by a photoacid generator that generates an acid group by irradiation with light, and the irradiated portion becomes soluble in the solvent or the aqueous alkaline solution. Positive photosensitive composition utilizing a mechanism (JP-A-6-295064, JP-A-6-308733, JP-A-6-313)
134, JP-A-6-313135, JP-A-6-313136, JP-A-7-146552, etc.) and the like.

In the above-mentioned compounds, the functional groups (hydroxyl group, carboxyl group, etc.) which control the solubility in a developer in a resin are blocked (acid-labile groups) to make them insoluble, and the blocks are blocked by a photoacid generator. It dissociates and restores the solubility of the polymer. Examples of the acid labile group (R group of —OR) in which the hydroxyl group (—OH group) is blocked include, for example, t-butoxycarbonyl group (t-BOC group), t-butoxy group, t-butoxycarbonylmethyl group, Examples include a tetrahydropyranyl group, a trimethylsilyl group, an iso-propoxycarbonyl group, and the like. The resin having a hydroxyl group is not particularly limited as long as it exhibits the above-mentioned effects, but is usually a phenolic hydroxyl group. As the acid labile group, a t-BOC group and a t-butoxy group are particularly preferable, and examples thereof include poly (t-butoxycarbonyloxystyrene) and poly (t-butoxycarbonyloxy-α-styrene). , Poly (t-butoxystyrene) and copolymers of these monomers with other polymerizable monomers (eg, C1-24 alkyl or cycloalkyl esters of methyl (meth) acrylic acid, maleimide, sulfone, etc.) And the like. The t
The composition of poly (t-butoxycarbonyloxystyrene) containing a -BOC group is described, for example, as follows.
The acid generated by the photoacid generator decomposes the t-BOC group, evaporates isobutene and carbon dioxide to form polystyrene, and changes (increases) the polarity of the resin by changing the t-BOC group to a hydroxyl group. This makes use of the property of improving the solubility in a developing solution (aqueous alkaline solution). Examples of the acid labile group (R ′ group of —COOR ′) in which a carboxyl group (—COOH group) is blocked include carboxylic acid ester derivatives having a t-butyl group.

Further, as the components thereof, a two-component system of a resin having an acid labile group and a photoacid generator, and a three-component system of a resin having an acid labile group, a photoacid generator, and other resins Can be used as The other resin is
By using this, for example, the coating workability of the composition can be improved or the solubility in a developer can be changed.

The above resins contain a resin (a) containing a carboxyl group and / or a hydroxyphenyl group, an olefinically unsaturated compound containing an ether bond (b), and a photoacid generator that generates an acid group upon irradiation with light. Or a liquid or solid resin composition.

In the case where the resin (a) has both a carboxyl group and a hydroxyphenyl group, even if these groups are present in the same molecule, a mixture of resins containing these groups differently is used. Either resin or both may be used.

Examples of the carboxyl group-containing resin (a-1) include acrylic resins and polyester resins.

The above resin (a-1) is generally used in an amount of about 500
It preferably has a number average molecular weight of from about 100,000, especially from about 1500 to 30,000, and the carboxyl group is preferably from about 0.5 to 10 mol, especially about 0.7 to 5 mol per kg of resin. .

Hydroxyphenyl group-containing resin (a-2)
As a condensate of a monofunctional or polyfunctional phenol compound, an alkylphenol compound, or a mixture thereof with a carbonyl compound such as formaldehyde and acetone; and a hydroxyphenyl group-containing unsaturated monomer such as P-hydroxystyrene. Depending on the above, copolymers with the above-mentioned other polymerizable unsaturated monomers can be used.

The above resin (a-2) is generally used in an amount of about 500
It preferably has a number average molecular weight of about 10000 to about 100000, particularly about 1500 to 30000, and the hydroxyphenyl group is preferably about 1.0 mol or more, more preferably about 2 to 8 mol per kg of resin.

When the resin (a-1) and the resin (a-2) are used as a mixture, the mixing ratio is 90/1.
It is preferable to mix them in a weight ratio of 0 to 10/90.

Examples of the resin (a-3) having a carboxyl group and a hydroxyphenyl group include a carboxyl group-containing polymerizable unsaturated monomer ((meth) acrylic acid and the like) and a hydroxyphenyl group-containing polymerizable unsaturated monomer. (Hydroxystyrene, etc.) and, if necessary, other polymerizable unsaturated monomers (methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) A) C1-C12 alkyl esters of acrylic acid such as acrylate, aromatic compounds such as styrene, (meth)
A copolymer with hydroxybenzoic acids, gallic acid, resorcinic acid, or a mixture thereof with phenol, naphthols, resorcinol, catechol, etc., with formaldehyde. And the like.

The above resin (a-3) is generally used in an amount of about 500.
It preferably has a number average molecular weight of from about 100,000, especially from about 1500 to 30,000, and the carboxyl group is preferably from about 0.5 to 10 mol, especially about 0.7 to 5 mol per kg of resin. . The hydroxyphenyl group is present in an amount of about 1.0 mol or more, preferably about 2 to 8
Molar is preferred.

The olefinically unsaturated compound (b) containing an ether bond includes, for example, about 1 to 4 unsaturated ether groups such as a vinyl ether group, a 1-propenyl ether group and a 1-butenyl ether group at the molecular terminal. To do. The compound (b) has the formula -R "in one molecule.
—OA—where A represents a vinyl group, a 1-propenyl group or an olefinically unsaturated group of 1-butenyl, and R ″ represents a linear or linear olefin having 1 to 6 carbon atoms such as ethylene, propylene and butylene. Represents a branched alkylene group], and is a low molecular weight or high molecular weight compound containing at least one, preferably 2 to 4 unsaturated ether groups, such as bisphenol A, bisphenol F, bisphenol S, Polyphenol compounds such as phenolic resins, ethylene glycol, propylene glycol, trimethylolpropane, trimethylolethane,
Condensation products of polyols such as pentaerythritol with alkyl halide unsaturated ethers such as chloroethyl vinyl ether; polyisocyanate compounds such as tolylene diisocyanate, xylylene diisocyanate, hexamethylene diisocyanate and isophorone diisocyanate and hydroxy such as hydroxyethyl vinyl ether Reaction products with alkyl unsaturated ethers and the like can be mentioned. In particular, a condensate of the above polyphenol compound and a halogenated alkyl unsaturated ether and a reaction product of a polyisocyanate compound having an aromatic ring and a hydroxyalkyl unsaturated ether are preferable from the viewpoint of etching resistance, accuracy of a formed pattern, and the like. It is. The compound (b)
Is usually about 5 to 15 parts per 100 parts by weight of the resin (a).
0 parts by weight, preferably about 10 to 100 parts by weight.

In the composition containing the components (a) and (b), the coating film formed therefrom is cross-linked by heating and by an addition reaction between a carboxyl group and / or a hydroxyphenyl group and an unsaturated ether group to form a solvent. When it becomes insoluble in water or alkaline aqueous solution, then is irradiated with active energy rays, and then heated, the crosslinked structure is cut by the catalytic action of the generated acid, and the irradiated part becomes soluble again in solvent or aqueous alkaline solution. It is a type visible light photosensitive resin composition.

In the composition, an acid hydrolysis reaction is caused in an exposed portion by an acid generated when a film to be formed is exposed, but water must be present to allow the acid hydrolysis reaction to proceed smoothly. Is desirable. Therefore, in the composition of the present invention, by incorporating a hydrophilic resin such as polyethylene glycol, polypropylene glycol, methylcellulose, and ethylcellulose, the water required for the above reaction can be easily incorporated into the formed coating film. You can do so. The amount of the hydrophilic resin to be added is generally 20 parts by weight or less, preferably 0.1 to 10 parts by weight, per 100 parts by weight of the resin component.

Further, the photoacid generator described above is
It is a compound that generates an acid upon exposure and decomposes the resin using the generated acid as a catalyst. A conventionally known compound can be used. Examples thereof include sulfonium salts, ammonium salts, phosphonium salts, onium salts such as iodonium salts and selenium salts, iron-allene complexes, silanol-metal chelate complexes, triazine compounds, diazidonaphthoquinone compounds, sulfones Acid esters, sulfonic imide esters, halogen compounds, and the like can be used.
Further, in addition to the above, JP-A-7-146552,
Photoacid generators described in Japanese Patent Application No. 9-289218 can also be used. This photoacid generator component may be a mixture with the above-mentioned resin or a compound bonded to the resin. The content of the photoacid generator is preferably about 0.1 to 40 parts by weight, particularly about 0.2 to 20 parts by weight, based on 100 parts by weight of the resin.

In the composition of the present invention, in addition to the above-mentioned resins, solubility in an organic solvent or an aqueous developer can be improved,
In addition, the above-mentioned other resins which are insoluble or dissolved (or dispersed) in water or an organic solvent, which can make the composition worse, can be added as necessary.
Specifically, for example, a phenolic resin, a polyester resin, an acrylic resin, a vinyl resin, a vinyl acetate resin, an epoxy resin, a silicon resin, a fluorine resin, and a mixture or modified product of two or more of these resins Is mentioned.

Further, in order to impart appropriate flexibility and non-adhesiveness to a film formed using the composition of the present invention, a plasticizer such as phthalic acid ester is added to the composition of the present invention. A polyester resin, an acrylic resin, or the like can be added.

Further, the composition of the present invention may contain a coloring agent such as a fluidity regulator, a plasticizer, a dye and a pigment, if necessary.

The positive-type visible light-sensitive resin composition of the present invention may be any of commonly used known photosensitive materials, for example,
It can be used for a wide range of applications, such as paints, inks, adhesives, resist materials, printing plate materials (plate making materials for flat plates and letterpress, PS plates for offset printing, etc.), information recording materials, and relief image forming materials.

The dry film thickness (excluding solvent) formed from the positive-type visible light-sensitive resin composition of the present invention is the maximum value at which the absorbance of the non-photosensitive film formed from the composition is selected from the above range. ± 30 nm of the maximum wavelength of safety light having a wavelength
May be set to be 0.5 or less in the range, but from the viewpoint of practicality, it is usually in the range of 0.5 to 50 μm, preferably 1 to 30 μm. The absorbance varies depending on the type and the amount of the photoacid generator, the photosensitizer and the like contained in the composition, but varies depending on the thickness of the film even with the same composition. That is, in the same composition, as the film thickness increases, the absorbance increases due to an increase in the concentration of the photoacid generator and the photosensitizer contained in the film, while on the other hand, when the film thickness decreases, the absorbance increases. The absorbance is reduced due to the lower concentration of the above components. From these facts, by adjusting the film thickness to be formed, the absorbance can be adjusted to fall within the above-mentioned range.

Next, typical resist materials (for example, a general positive photosensitive resist material and a positive resist material for electrodeposition coating) of the visible light curable resin composition of the present invention will be described.

As a general positive-type photosensitive resist material, for example, the positive-type visible light-sensitive resin composition of the present invention is dispersed or dissolved in a solvent (including water). Pigment is finely dispersed) to prepare a photosensitive solution,
This can be used as a positive resist material by a method of applying it on a support using a coating device such as a roller, a roll coater, or a spin coater, and drying.

Solvents used for dissolving or dispersing the positive visible light-sensitive resin composition include, for example, ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone) and esters (ethyl acetate, butyl acetate, benzoic acid). Methyl ether, methyl propionate, etc.), ethers (tetrahydrofuran, dioxane, dimethoxyethane, etc.), cellosolves (methyl cellosolve, ethyl cellosolve, diethylene glycol monomethyl ether, etc.), aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) , Halogenated hydrocarbons (chloroform, trichloroethylene, dichloromethane, etc.), alcohols (ethyl alcohol, benzyl alcohol, etc.), others (dimethylformamide, dimethylsulfoxide, etc.), water and the like. .

As the support, for example, a sheet of a metal such as aluminum, magnesium, copper, zinc, chromium, nickel, iron or the like or an alloy containing them as a component, a printed circuit board whose surface is treated with these metals, a plastic , Glass or silicon wafer, carbon and the like.

When the composition is used as a positive resist material for electrodeposition coating, the positive visible light-sensitive resin composition of the present invention is first made into a water-dispersed product or a water-soluble product.

The aqueous dispersion or water-solubility of the positive-type visible light photosensitive resin composition is determined by neutralizing the resin composition with an alkali (neutralizing agent) when an anionic group such as a carboxyl group is introduced into the resin. Or when a cationic group such as an amino group is introduced, neutralization with an acid (neutralizing agent) is performed. Examples of the alkali neutralizer used in this case include alkanolamines such as monoethanolamine, diethanolamine, and triethanolamine; alkylamines such as triethylamine, diethylamine, monoethylamine, diisopropylamine, trimethylamine, and diisobutylamine; Alkyl alkanolamines such as dimethylaminoethanol; alicyclic amines such as cyclohexylamine; alkali metal hydroxides such as sodium hydroxide and sodium hydroxide; ammonia; Further, examples of the acid neutralizing agent include monocarboxylic acids such as formic acid, acetic acid, lactic acid, and butyric acid. These neutralizing agents can be used alone or in combination. The amount of the neutralizing agent used is the amount of the ionic group 1 contained in the photosensitive resin composition.
0.2 to 1.0 equivalent, particularly 0.3 to 1.0 equivalent per equivalent
A range of 0.8 equivalents is desirable.

In order to further improve the fluidity of the water-soluble or water-dispersed resin component, if necessary, a hydrophilic solvent such as methanol, ethanol, isopropanol, n- Butanol, t-butanol, methoxyethanol, ethoxyethanol, butoxyethanol, diethylene glycol monomethyl ether, dioxane, tetrahydrofuran and the like can be added. The amount of the hydrophilic solvent used is generally 30 per 100 parts by weight of the resin solid component.
It can be up to 0 parts by weight, preferably up to 100 parts by weight.

In order to increase the amount of coating on the object to be coated, a hydrophobic solvent such as a petroleum solvent such as toluene and xylene; methyl ethyl ketone, methyl isobutyl Ketones such as ketones; esters such as ethyl acetate and butyl acetate; alcohols such as 2-ethylhexyl alcohol and benzyl alcohol can also be added. The amount of these hydrophobic solvents is usually 2 parts per 100 parts by weight of the resin solid component.
It can be up to 00 parts by weight, preferably 100 parts by weight or less.

The preparation of a positive visible light-sensitive resin composition as an electrodeposition coating material can be carried out by a conventionally known method. For example, a resin or a resin mixture water-solubilized by the neutralization, a photosensitizer of a benzopyrromethene compound, and further, if necessary, a solvent and other components are thoroughly mixed,
It can be prepared by adding water.

The composition thus prepared is further diluted with water in a usual manner, for example, with a pH in the range of 4 to 9 and a bath concentration (solid concentration) of 3 to 25% by weight, preferably Is an electrodeposition paint (or electrodeposition bath) in the range of 5 to 15% by weight
It can be.

The electrodeposition paint prepared as described above is
The coating can be performed on the surface of the conductor to be coated as follows. That is, first, the pH and bath concentration of the bath are adjusted to the above ranges, and the bath temperature is adjusted to 15 to 40 ° C., preferably 1
Control at 5-30 ° C. Next, in the electrodeposition coating bath controlled in this way, the conductor to be coated is immersed in a conductor to be coated as an anode when the electrodeposition coating is of an anionic type and as a cathode when the electrodeposition coating is of a cationic type. Apply DC current. An appropriate energization time is 10 seconds to 5 minutes.

The resulting film thickness is a dry film thickness, generally 0.5
５０50 μm, preferably 1-20 μm. After the electrodeposition coating, the object to be coated is pulled up from the electrodeposition bath and washed with water, and then the water and the like contained in the electrodeposition coating film are dried and removed with hot air or the like (the compositions (a) and (b) are used). In this case, the coated substrate is subjected to temperature and time conditions under which a crosslinking reaction between the carboxyl group and / or hydroxyphenyl group-containing polymer and the vinyl ether group-containing compound substantially occurs, for example, from about 60 to about Heat at a temperature of 150 ° C for about 1 minute to about 30 minutes to crosslink and cure the coating).

As the conductor, a conductive material such as metal, carbon, tin oxide or the like, or a material in which these are fixed to the surface of plastic or glass by lamination, plating or the like can be used.

The visible light resist material formed on the conductor surface as described above, and the visible light resist electrodeposition coating film obtained by electrodeposition coating are exposed to visible light according to an image and decomposed. An image can be formed by removing the exposed portion by a developing process.

As the light source for exposure, light sources such as ultra-high pressure, high pressure, medium pressure and low pressure mercury lamps, chemical lamps, carbon arc lamps, xenon lamps, metal halide lamps, fluorescent lamps, tungsten lamps, sunlight and the like can be used. Among the light sources used, there can be used light rays in the visible region in which ultraviolet rays are cut by an ultraviolet cut filter, various lasers having oscillation lines in the visible region, and the like. As a high power and stable laser light source,
An argon laser or a second harmonic (532 nm) of a YAG laser is preferable.

The developing treatment is carried out by washing with an aqueous alkali solution when the exposed film is anionic, and with an aqueous acid solution having a pH of 5 or less when the exposed film is cationic. Alkaline aqueous solutions that can be neutralized with free carboxylic acids in the coating film, such as sodium hydroxide, sodium carbonate, sodium hydroxide, aqueous ammonia, etc., to give water solubility, and acid aqueous solutions are acetic acid, formic acid, lactic acid, etc. Can be used.

In the case of a photosensitive resin having no ionic group, development processing is carried out by dissolving the exposed portion using a solvent such as 1,1,1-trichloroethane, tricrene, methyl ethyl ketone, or methylene chloride. The coated film after development is washed with water and dried with hot air or the like, so that a desired image is formed on the conductor. If necessary, the printed circuit board can be manufactured by performing etching to remove the exposed conductor portion, and then removing the resist film.

When (a) and (b) are used as the composition, the cross-linked structure of the cured coating film is cut in the presence of an acid generated by the irradiation of the substrate irradiated with visible light. Under such temperature and time conditions, for example, heating is performed at a temperature of about 60 to about 150 ° C. for about 1 to about 30 minutes to substantially cut the crosslinked structure of the coating film on the irradiated portion. At that time, preferably,
The substrate irradiated with visible light is brought into contact with water in advance. The contact with water facilitates the generation of an acid and facilitates the subsequent cleavage reaction of the crosslinked structure. The contact with water can be performed by immersing the substrate in room temperature water or hot water, or by spraying water vapor.

The positive-type visible light-sensitive resin composition of the present invention may further include, for example, a transparent resin film such as a polyester resin such as polyethylene terephthalate, an acrylic resin, polyethylene, or a polyvinyl chloride resin which is used as a cover film layer. On top, the composition of the present invention roll coater,
It is applied using a blade coater, a curtain flow coater or the like, and dried to form a resist film (dry film thickness of about 0.5 to 5 μm).
After forming m), the film can be used as a dry film resist in which a protective film is attached to the surface of the film.

After the protective film is peeled off from the dry film resist, the resist film can be bonded to the support by thermocompression bonding so that the resist film comes into contact with the support to form a resist film. The resist film can be exposed to visible light and developed according to the image in the same manner as the above-mentioned electrodeposition coating film to form an image.

[0095]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to embodiments. In the examples and comparative examples, “parts” indicates “parts by weight”.

Example 1 200 parts of tetrahydrofuran, 65 parts of P-hydroxystyrene, 28 parts of n-butyl acrylate, acrylic acid 1
1 part and 3 parts of azobisisobutyronitrile are mixed with 1 part
The reaction product obtained by reacting at 00 ° C. for 2 hours is 1500 c
The resulting mixture was poured into a toluene solvent (c) to precipitate and separate the reaction product. The precipitate was dried at 60 ° C. to obtain a photosensitive resin having a molecular weight of about 5200 and a hydroxyphenyl group content of 4.6 mol / kg. Next, 60 parts of a divinyl ether compound (condensate of 1 mol of a bisphenol compound and 2 mol of 2-chloroethyl vinyl ether) was added to 100 parts of this product, and NAI-
105 (photoacid generator, manufactured by Midori Kagaku Co., Ltd., trade name)
A mixture of 10 parts and 1.5 parts of the compound of Table 1-1 as a photosensitizing dye was dissolved in diethylene glycol dimethyl ether and adjusted to a solid content of 20% to obtain a photosensitive solution.

The photosensitive solution was applied to a glass fiber reinforced epoxy substrate plated with copper in a dark room with a bar coater to a dry film thickness of 5 μm.
m and dried at 120 ° C. for 8 minutes to prepare a substrate having a resist film.

Next, the surface of the substrate having the resist film obtained above was irradiated with the sodium lamp of FIG. 1 for 24 hours so that the illuminance intensity became 40 lux. Then
After heating this at 80 ° C for 10 minutes in a dark room, 1%
As a result of immersion in an aqueous solution of sodium carbonate as a developing solution at 30 ° C. for 1 minute, the resist film was not dissolved in the aqueous solution of sodium carbonate and was good without being adversely affected by irradiation with a sodium lamp.

Further, the substrate having the above resist film was irradiated with an argon laser having an intensity of 1 mJ / m ² ,
After heating at 10 ° C. for 10 minutes and developing with a 1% aqueous solution of sodium carbonate, the exposed portions were completely dissolved and removed by the aqueous solution of sodium carbonate, and a resist pattern having excellent contrast was formed. Also, no decrease or swelling of the film in the unexposed portion was observed. Similar results were obtained by irradiation with a xenon lamp (cutting the ultraviolet wavelength region) and the second harmonic (532 nm) of a YAG laser.

The above photosensitive solution was applied to a transparent polyethylene terephthalate sheet with a bar coater so as to have a thickness of 5 μm, and dried at 60 ° C. for 10 minutes, and the absorbance of the film was measured. FIG. 4 shows the results. The vertical axis indicates absorbance and the horizontal axis indicates wavelength nm.

From the wavelength of the safety light in FIG. 1 and the absorbance curve in FIG. 4, it was confirmed that the safety light had no adverse effect on the photosensitive solution, and that the safety light was bright light from the relative visibility curve in FIG. it can.

Examples 2 to 50 In Example 1, 1-2 to 1- of Table 1 were used as photosensitizers.
A photosensitive solution having the same composition as in Example 1 was obtained except that 50 was used.

The photosensitive solution was applied to a glass fiber reinforced epoxy substrate plated with copper in a dark room with a bar coater to a dry film thickness of 5 μm.
m and dried at 120 ° C. for 8 minutes to prepare a substrate having a resist film.

Next, the surface of the substrate having the resist film (dry film thickness 5 μm) obtained above was irradiated with the sodium lamp of FIG. 1 for 24 hours so that the illuminance intensity became 40 lux. Next, this was heated in a dark room at 80 ° C. for 10 minutes, and then immersed in a 1% aqueous solution of sodium carbonate at 30 ° C. for 1 minute using a 1% aqueous solution of sodium carbonate as a developer. It was good without any adverse effects.

Example 51 22 parts of acrylic acid, 50 parts of styrene, 28 parts of n-butyl methacrylate, azobisisobutyronitrile (AI
BN) A mixture of 5 parts was dropped into 60 parts of methyl isobutyl ketone, which was heated to 80 ° C. and stirred, over 2 hours, and then kept at that temperature for another 2 hours to obtain a solid content of about 62.5%. %, A carboxyl group 3 mol / kg polymer was obtained.

80 parts of the carboxyl group-containing polymer (solid content: 62.5%) obtained above, 20 parts of a P-hydroxystyrene polymer (molecular weight: 1000), a divinyl ether compound (1 mol of bisphenol compound and 2-chloroethyl 60 parts of a condensate with 2 mol of vinyl ether), 2 parts of polyethylene glycol (average molecular weight: 400), NAI-10
5 (photoacid generator, manufactured by Midori Kagaku Co., Ltd., trade name) 10
Of a photosensitizer used in Example 1 was dissolved in diethylene glycol dimethyl ether to obtain a 20% by weight photosensitive solution.

The photosensitive solution was applied to a glass-fiber reinforced epoxy substrate plated with copper in a dark room with a bar coater to a dry film thickness of 5 μm.
m and dried at 120 ° C. for 8 minutes to prepare a substrate having a resist film.

Next, the surface of the substrate having the resist film (dry film thickness 5 μm) obtained above was irradiated with the sodium lamp of FIG. 1 for 24 hours so that the illuminance intensity became 40 lux. Next, this was heated in a dark room at 80 ° C. for 10 minutes, and then immersed in a 1% aqueous solution of sodium carbonate at 30 ° C. for 1 minute using a 1% aqueous solution of sodium carbonate as a developer. It was good without any adverse effects.

Example 52 P-hydroxystyrene polymer (molecular weight: 1000) 10
0 parts, a divinyl ether compound (condensate of 1 mol of bisphenol compound and 2 mol of 2-chloroethyl vinyl ether) 60 parts, polyethylene glycol (average molecular weight 4
A mixture of 2 parts, 10 parts of NAI-105 (photoacid generator, manufactured by Midori Chemical Co., Ltd., trade name) and 1.5 parts of the photosensitizer used in Example 1 was dissolved in diethylene glycol dimethyl ether. A photosensitive solution of 20% by weight was obtained.

The photosensitive solution was applied to a glass fiber reinforced epoxy substrate plated with copper in a dark room with a bar coater to a dry film thickness of 5 μm.
m and dried at 120 ° C. for 8 minutes to prepare a substrate having a resist coating.

Next, the surface of the substrate having the resist film (dry film thickness 5 μm) obtained above was irradiated with the sodium lamp of FIG. 1 for 24 hours so that the illuminance intensity was 40 lux. Next, this was heated in a dark room at 80 ° C. for 10 minutes, and then immersed in a 1% aqueous solution of sodium carbonate at 30 ° C. for 1 minute using a 1% aqueous solution of sodium carbonate as a developer. It was good without any adverse effects.

Example 53 100 parts (solid content) of the photosensitive solution obtained in Example 1 was mixed with 0.8 equivalent of triethylamine with respect to the carboxyl group, stirred and then dispersed in deionized water to obtain a water-dispersed resin solution ( (Solid content 15%).

The obtained water-dispersed resin solution was used as an electrodeposition coating bath, anion electrodeposition coating was performed so that the dry film thickness was 5 μm using the laminated copper plate as an anode, washed with water, and washed at 120 ° C. for 8 hours.
After heating for a minute, a substrate having a resist coating was prepared.

Next, the surface of the substrate having the resist film (dry film thickness 5 μm) obtained above was irradiated with the sodium lamp of FIG. 1 for 24 hours so that the illuminance intensity became 40 lux. Next, this was heated in a dark room at 80 ° C. for 10 minutes, and then immersed in a 1% aqueous solution of sodium carbonate at 30 ° C. for 1 minute using a 1% aqueous solution of sodium carbonate as a developer. It was good without any adverse effects.

Example 54 200 parts of tetrahydrofuran, 65 parts of P-hydroxystyrene, 18 parts of dimethylaminoethyl methacrylate,
A reaction product obtained by reacting a mixture of 17 parts of n-butyl acrylate and 3 parts of azobisisobutyronitrile at 100 ° C. for 2 hours is poured into 1500 cc of a toluene solvent, and the reaction product is precipitated and separated. The product was dried at 60 ° C. to obtain a photosensitive resin having a molecular weight of about 5000 and a hydroxyphenyl group content of 4.6 mol / kg. Next, 60 parts of a divinyl ether compound (condensate of 1 mol of bisphenol compound and 2 mol of 2-chloroethyl vinyl ether) and 10 parts of NAI-105 (photoacid generator, manufactured by Midori Kagaku Co., Ltd.) A mixture of 1.5 parts of the photosensitizer used in Example 1 was dissolved in diethylene glycol dimethyl ether and adjusted to a solid content of 60% to obtain a photosensitive solution.

100 parts (solid content) of the photosensitive solution obtained above
After mixing and stirring 0.8 equivalents of acetic acid with respect to the amino group,
Disperse in deionized water to form a water-dispersed resin solution (solid content 15
%).

The obtained water-dispersed resin solution was used as an electrodeposition coating bath, a cationic copper electrodeposition coating was performed so that the dry film thickness was 5 μm, using a laminated copper plate as a cathode, and then washed with water.
After heating for a minute, a substrate having a resist coating was prepared.

Next, the surface of the substrate having the resist film (dry film thickness 5 μm) obtained above was irradiated with the sodium lamp of FIG. 1 for 24 hours so that the illuminance intensity became 40 lux. Next, this was heated in a dark room at 80 ° C. for 10 minutes, and then immersed in a 1% aqueous solution of sodium carbonate at 30 ° C. for 1 minute using a 1% aqueous solution of sodium carbonate as a developer. It was good without any adverse effects.

Example 55 50 parts of poly (t-butoxycarbonyloxystyrene) (molecular weight: 1000) was added to 1,000 parts of tetrahydrofuran.
50 parts of the following novolak phenolic resin, NAI-105
10 parts of a photoacid generator (trade name, manufactured by Midori Kagaku KK) and 1.5 parts of the photosensitizing dye used in Example 1 were blended to obtain a photosensitive solution having a solid content of 9%.

Production of novolak phenolic resin 1490 parts of o-cresol, 30% formalin 114
5 parts, 130 parts of deionized water and 6.5 parts of oxalic acid were placed in a flask and heated to reflux for 60 minutes. Then add 1% 15% hydrochloric acid
After adding 3.5 parts and heating and refluxing for 40 minutes, 400 parts of deionized water at about 15 ° C. were added to keep the contents at about 75 ° C. to precipitate the resin. The aqueous layer was removed after neutralization by adding 35% sodium hydroxide solution, and 400 parts of deionized water was added.
After washing the resin at 5 ° C., the aqueous layer was removed and the same washing operation was repeated twice, followed by drying at about 120 ° C. under reduced pressure to obtain a novolak phenol resin having a molecular weight of 600.

Using the photosensitive solution obtained above, coating was performed to a dry film thickness of 5 μm, followed by heating at 120 ° C. for 8 minutes to prepare a substrate having a resist film.

Next, the surface of the substrate having the resist film (dry film thickness 5 μm) obtained above was irradiated with the sodium lamp of FIG. 1 for 24 hours so that the illuminance intensity was 40 lux. Next, this was heated in a dark room at 80 ° C. for 10 minutes, and then immersed in a 1% aqueous solution of sodium carbonate at 30 ° C. for 1 minute using a 1% aqueous solution of sodium carbonate as a developer. It was good without any adverse effects.

Example 56 50 parts of poly (tetrahydropyranyl ether styrene) (molecular weight: 1000) was added to 1,000 parts of tetrahydrofuran,
50 parts of the novolak phenolic resin of Example 62, NAI
A photosensitive solution having a solid content of 9% was obtained by mixing 10 parts of -105 (photoacid generator, manufactured by Midori Kagaku Co., Ltd., trade name) and 1.5 parts of the photosensitizing dye used in Example 1.

Using this photosensitive liquid, a photosensitive layer was formed in the same manner as in Example 1, and the solvent was evaporated.
m, and then washed with water and dried at 120 ° C for 8 hours.
After heating for a minute, a substrate having a resist coating was prepared.

Next, the surface of the substrate having the resist film (dry film thickness 5 μm) obtained above was irradiated with the sodium lamp of FIG. 1 for 24 hours so that the illuminance intensity became 40 lux. Next, this was heated in a dark room at 80 ° C. for 10 minutes, and then immersed in a 1% aqueous solution of sodium carbonate at 30 ° C. for 1 minute using a 1% aqueous solution of sodium carbonate as a developer. It was good without any adverse effects.

Comparative Example 1 A test was performed in the same manner as in Example 1 except that a fluorescent lamp was used instead of the sodium lamp. As a result, the resist film was poorly dissolved in the aqueous solution of sodium carbonate.

FIG. 5 shows the spectral distribution of the fluorescent lamp used in the comparative example.
Shown in

[0128]

According to the present invention, a positive visible light-sensitive resin composition containing a specific compound as a photosensitizer is a composition having extremely high practical utility. Conventionally, in a field of information recording using a photolysis reaction, a method of directly outputting and recording an original electronically edited by a computer directly using a laser has a problem with low sensitivity.

However, the positive-type visible light-sensitive resin composition of the present invention has a very good compatibility between the photosensitive resin and the photosensitizer, is dissolved in a general-purpose coating solution, and is uniform on a support.
In addition, a coated surface having excellent storage stability over time can be obtained.

The benzopyrromethene compound photosensitizer having a specific structure used in the present invention is 488 nm.
And an argon laser having a stable oscillation line at 514.5 nm or a YA having a bright line at 532 nm as a second harmonic.
Since it has extremely high sensitivity to general-purpose visible lasers such as G lasers, the photosensitive material obtained using the positive-type visible light-sensitive resin composition of the present invention can be subjected to high-speed scanning exposure with such lasers. It is possible. When an image is formed by high-speed scanning exposure, an extremely fine high-resolution image can be obtained.

The positive visible light-sensitive resin composition of the present invention can be applied and printed under bright environmental conditions without decomposing and dissociating under safe light irradiation environmental conditions. It exerts remarkable effects excellent in safety workability, work efficiency, product quality stability and the like.

[Brief description of the drawings]

FIG. 1 is a graph showing an example of a spectral distribution of a discharge lamp containing sodium as a main component of safety light that can be used in the present invention.

FIG. 2 is a graph showing a spectral distribution when the sodium discharge lamp shown in FIG. 1 is filtered.

FIG. 3 is a diagram showing a relative luminosity curve in a wavelength range of visible light of 380 to 780 nm.

FIG. 4 is a view showing an absorbance curve of a resist film used in Example 1.

FIG. 5 is a diagram showing a spectral distribution of a fluorescent lamp (daylight (D)).

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Hideo Kogure 4-17-1, Higashi-Hachiman, Hiratsuka-shi, Kanagawa Prefecture Inside Kansai Paint Co., Ltd. (72) Akira Ogiso 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Chemicals Co., Ltd. Within the company (72) Inventor Denmi Misawa 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Prefecture Inside Mitsui Chemicals Co., Ltd. (72) Inventor Taizo Nishimoto 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Chemicals Corporation (72) Inventor Tsukahara U 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Pref. Mitsui Chemicals Co., Ltd. (72) Inventor Keisuke Takuma 1190 Kasama-cho, Sakae-ku, Yokohama-shi Kanagawa Pref. CB52 4J011 RA03 RA07 RA10 RA11 RA12 SA78 SA86 SA90 TA07 UA02 UA06 WA01

Claims (4)

[Claims] 1. A positive-type visible light-sensitive resin composition used in an environment in which a safety light having a maximum wavelength selected from the range of 500 to 620 nm and a high relative luminous efficiency is used. A positive-type visible light-sensitive resin composition containing a visible light-sensitive resin and a photosensitizer of a benzopyrromethene compound represented by the following general formula (1), and a non-photosensitive coating formed from the composition. A positive visible light-sensitive resin composition, wherein the absorbance of the resin is 0.5 or less in a range of ± 30 nm of the maximum wavelength of the safety light. Embedded image [Wherein R ₁ , R ₂ , R ₃ , R ₅ , R ₆ , R ₇ , R ₈ , and R ₉ each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydroxy group, an amino group, Carboxyl group, sulfonic acid group, alkyl group, halogenoalkyl group, alkoxyalkyl group, alkoxy group, alkoxyalkoxy group, aryloxy group, acyl group, alkoxycarbonyl group, aminocarbonyl group, alkylaminocarbonyl group, dialkylaminocarbonyl group, Alkylcarbonylamino group, arylcarbonylamino group, arylaminocarbonyl group, aryloxycarbonyl group, aralkyl group, aryl group, heteroaryl group, alkylthio group, arylthio group, alkenyloxycarbonyl group, aralkyloxycarbonyl group, alkoxycarbonylalkoxy Aryloxycarbonyl group, an alkylcarbonyl alkoxycarbonyl group, mono (hydroxyalkyl) aminocarbonyl group, di (hydroxyalkyl) aminocarbonyl group, mono (alkoxyalkyl) aminocarbonyl group, di (alkoxyalkyl) aminocarbonyl group,
Represents an alkenyl group, an alkylamino group, a dialkylamino group, a mono (hydroxyalkyl) amino group or a di (hydroxyalkyl) amino group, R ₄ represents a hydrogen atom,
Cyano group, an alkyl group, an aralkyl group, an aryl group, a heteroaryl group or an alkenyl group, R _10, R ₁₁
Each independently represents a halogen atom, an alkyl group, an aralkyl group, an aryl group, a heteroaryl group, an alkoxy group or an alkoxyalkoxy group. ] 2. A discharge lamp mainly composed of sodium as a safety light (mainly a D line having a light wavelength of 589 nm).
The positive visible light-sensitive resin composition according to claim 1, wherein 3. A composition for a positive-type visible light-sensitive material, comprising the positive-type visible light-sensitive resin composition according to claim 1 and a solvent. 4. A positive visible light-sensitive material comprising the positive visible light-sensitive resin composition according to claim 1 on a substrate.