JP2000052404A - Method and device for extrusion molding utilizing ultrasonic wave - Google Patents

Method and device for extrusion molding utilizing ultrasonic wave

Info

Publication number
JP2000052404A
JP2000052404A JP10225494A JP22549498A JP2000052404A JP 2000052404 A JP2000052404 A JP 2000052404A JP 10225494 A JP10225494 A JP 10225494A JP 22549498 A JP22549498 A JP 22549498A JP 2000052404 A JP2000052404 A JP 2000052404A
Authority
JP
Japan
Prior art keywords
ultrasonic
mold
extrusion
die
extrusion molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10225494A
Other languages
Japanese (ja)
Other versions
JP3444791B2 (en
Inventor
Fumiaki Matsunaga
文昭 松永
Sadayuki Ueha
貞行 上羽
Yoshikazu Koike
義和 小池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP22549498A priority Critical patent/JP3444791B2/en
Publication of JP2000052404A publication Critical patent/JP2000052404A/en
Application granted granted Critical
Publication of JP3444791B2 publication Critical patent/JP3444791B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a method for extrusion molding utilizing ultrasonic wave in which such a resin film product can be produced that the same has wide width and precision and free from unevennesses on the surface. SOLUTION: In the method for extrusion molding utilizing ultrasonic wave, an ultrasonic vibration driving fitting part is equipped with an ultrasonic lip part 7 tilted at about 45 degrees for the direction of resin flow. An extrusion die 5 consists of structure in which a horizontal hole ranging over the whole width of the die is provided in the position of about 1/2 wavelength of ultrasonic resonance from an outlet part 8 of resin. Uniform ultrasonic vibration free from a node along the direction of resin flow is given to the whole width of the die in the vicinity of the tip of an outlet of resin in the extrusion die 5 by means of both a plurality of ultrasonic vibrators 2 driven through an adiabatic vibrator such as a joint-debooster 4 and an oscillator 1 for drive.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、液晶パネル用樹脂
フィルム等の精密押出成形において、凹凸のない製品を
得る為の超音波利用押出成形方法及び押出成形装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for ultrasonically extruding a resin film for a liquid crystal panel to obtain a product having no irregularities in precision extrusion molding.

【0002】[0002]

【従来の技術】従来の超音波利用による押出成形方法と
装置は、その超音波振動による効果を押出速度の向上
や、押出成形金型の耐久寿命の延長を主な目的とし、金
型の幅方向での均一で節のない振動分布を得ることが困
難であった。特に、縦波の波長の1/3以上の長さにわた
って一様に超音波振動させ均一で節のない振動分布を安
定的に得ることは殆ど不可能であった。そのため、液晶
パネル用樹脂フィルム等の押出成形において、超音波振
動の節の部分でフィルムに凹凸が生じるため、精密なフ
ィルムが得られなかった。
2. Description of the Related Art Conventional extrusion molding methods and apparatuses utilizing ultrasonic waves are mainly intended to increase the extrusion speed and extend the durable life of an extrusion molding die by using the effects of ultrasonic vibrations. It was difficult to obtain a uniform and node-free vibration distribution in the direction. In particular, it has been almost impossible to stably obtain a uniform and node-free vibration distribution by applying ultrasonic vibration uniformly over a length of 1/3 or more of the wavelength of the longitudinal wave. For this reason, in extrusion molding of a resin film for a liquid crystal panel or the like, since a film has irregularities at nodes of ultrasonic vibration, a precise film cannot be obtained.

【0003】[0003]

【発明が解決しようとする課題】本発明の目的は、超音
波振動の縦波の波長の長さの数倍以上の範囲にわたって
均一で一様な振動分布を生じさせ、広幅の精密で、表面
に凹凸のない製品を製造可能な超音波利用押出成形方法
及び装置を提供することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a uniform, uniform vibration distribution over a range of several times the length of the wavelength of the longitudinal wave of ultrasonic vibration, and to provide a wide, precise, surface It is an object of the present invention to provide a method and an apparatus for extrusion using ultrasonic waves, which can produce a product having no irregularities.

【0004】[0004]

【課題を解決するための手段】本発明は、超音波振動子
とダイリップを有する押出成形金型による押出成形にお
いて、押出成形金型の樹脂出口付近に、樹脂流れ方向に
沿った節のない均一な超音波振動を金型幅全体に与える
超音波利用押出成形方法である。好ましくは、押出成形
金型が、樹脂流れ方向に対し15度〜165度の範囲に
設定されたダイリップを有し、超音波振動が発生する樹
脂出口部分から超音波共振の1/2波長の位置付近に、Z
方向の寸法が同位置におけるZ方向の金型の寸法と同一
で、X方向の寸法が同位置におけるX方向の金型の寸法
の90%以上の寸法の横穴を有する超音波利用押出成形
方法及び装置である。更に好ましくは、超音波振動子と
ダイリップとの間に超音波共振の1波長もしくはそれ以
上の長さのジョイント及び/又はデブースターを有し、
超音波振動子に対して金型からの高熱を遮断する機能を
持ち、複数の超音波振動子を同時に発振させて同一のダ
イリップを有する金型に均一な超音波振動を金型幅全体
に与える構造の発振器を有する超音波利用押出成形方法
及び装置である。
SUMMARY OF THE INVENTION The present invention relates to an extrusion molding method using an extrusion mold having an ultrasonic vibrator and a die lip. This is an extrusion method using ultrasonic waves, which applies various ultrasonic vibrations to the entire mold width. Preferably, the extrusion mold has a die lip set in a range of 15 degrees to 165 degrees with respect to the resin flow direction, and a position of 1/2 wavelength of ultrasonic resonance from a resin outlet portion where ultrasonic vibration is generated. Near, Z
An ultrasonic-assisted extrusion molding method having a lateral hole whose dimension in the direction is the same as the dimension of the mold in the Z direction at the same position, and whose dimension in the X direction is 90% or more of the dimension of the mold in the X direction at the same position. Device. More preferably, there is a joint and / or deboostter between the ultrasonic transducer and the die lip having a length of one or more wavelengths of ultrasonic resonance,
It has a function to block high heat from the mold with respect to the ultrasonic vibrator, and simultaneously oscillates multiple ultrasonic vibrators to give uniform ultrasonic vibration to the mold having the same die lip over the entire mold width. An ultrasonic extrusion method and apparatus having an oscillator having a structure.

【0005】[0005]

【発明の実施の形態】本発明の装置の概略を図1(正面
図)及び図2(断面図)に示す。図1、2において、
(1)は複数の超音波振動子を同時に発振させることが
可能な発振器である。(2)は超音波振動子(ランシ゛ュハ゛ン
振動子等)で発振器(1)から高周波電力の供給を受け
て超音波発振し、その超音波振動を本装置のもつ最適共
振周波数の波長(λ)の長さに調整されたシ゛ョイント(3)に
伝える。さらに同じく波長(λ)の長さに調整されたテ゛フ゛
―スタ―(4)等の接続具を経由して、押出金型(5)の
構成要素の一部であるリッフ゜部分(7)に伝え、半波長
(λ/2)の長さに調整されたリッフ゜部分で振幅を拡大され、
最終的に樹脂出口部(8)の樹脂流動面部分を樹脂流れ
方向(9)に沿って、節のない均一な超音波振動を金型
幅全体に生じさせる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The apparatus of the present invention is schematically shown in FIGS. 1 (front view) and 2 (cross sectional view). 1 and 2,
(1) is an oscillator capable of simultaneously oscillating a plurality of ultrasonic transducers. (2) is an ultrasonic vibrator (such as a Lanschurn vibrator) that receives high-frequency power supplied from an oscillator (1) and oscillates ultrasonically. Tell the short (3) adjusted to the length. Further, it is transmitted to the lip part (7), which is a part of the components of the extrusion die (5), via a connector such as a toe-star (4) also adjusted to the length of the wavelength (λ). , Half wavelength
The amplitude is enlarged at the lip part adjusted to the length of (λ / 2),
Finally, a uniform ultrasonic vibration having no nodes is generated over the entire width of the mold along the resin flow direction (9) in the resin flow surface portion of the resin outlet portion (8).

【0006】本発明に使用する超音波振動周波数は、振
幅の出しやすさや、本装置を稼働させる際に作業者が耳
に受ける騒音環境等から可聴領域を避けることを考慮
し、19kHz以上が望ましく、許容できる範囲としては
18〜40kHzの間が好ましい。
The ultrasonic vibration frequency used in the present invention is desirably 19 kHz or more in consideration of the easiness of outputting the amplitude and the avoidance of the audible region due to the noise environment received by the operator when the apparatus is operated. The acceptable range is preferably between 18 and 40 kHz.

【0007】本発明におけるシ゛ョイント、テ゛フ゛―スタ―等の接
続具を構成する材質は押出金型が高熱である場合、金型
からの伝熱を抑える目的で鉄やアルミ合金に比較して、
熱伝導率の比較的低いチタン材料が好ましい。テ゛フ゛―スタ
―は、単に振動を伝えるだけでなく、目的とする振幅の
大きさを調整する機能を有する接続具であり、通常入り
口側の振幅に対し、出口側で、小さくする機能を持つ。
テ゛フ゛―スタ―を適宜使用することで、生産対象とする樹脂
の特性に応じ、最適の樹脂流動面部分振動振幅大きさを
得られやすくする。
[0007] In the present invention, when the extrusion die has a high heat, the material constituting the connection tool such as a shot, a tape star or the like is compared with iron or an aluminum alloy for the purpose of suppressing the heat transfer from the die.
Titanium materials with relatively low thermal conductivity are preferred. The tough star is a connector having a function of adjusting the magnitude of a target amplitude as well as merely transmitting vibration, and has a function of reducing the amplitude at the exit side with respect to the amplitude at the entrance side.
By appropriately using the tape star, it is easy to obtain the optimum amplitude of the partial vibration of the resin flow surface in accordance with the characteristics of the resin to be produced.

【0008】本発明における横穴(6)は樹脂出口部分
から超音波共振の1/2波長の位置付近に金型全幅に設け
られたもので、リッフ゜部分(7)での振動を遮断すると同
時に、振動を反射する腹(自由端)的な機能を有するもの
である。横穴の寸法は、加工のしやすさ、金型の強度、
超音波振動遮断機能等の効果を考慮して、Y方向の幅
が、0.1mm以上10mm以下で、Z方向の寸法が同位置にお
けるZ方向の金型の寸法と同一で、X方向の寸法が同位
置におけるX方向の金型の寸法の90%以上であること
が望ましい。
The horizontal hole (6) in the present invention is provided in the entire width of the mold near a position at a half wavelength of the ultrasonic resonance from the resin outlet portion, and at the same time as blocking the vibration at the lip portion (7), It has an antinode (free end) function of reflecting vibration. The dimensions of the side holes are easy to process, mold strength,
Considering the effects of the ultrasonic vibration blocking function, the width in the Y direction is 0.1 mm or more and 10 mm or less, the dimension in the Z direction is the same as the dimension in the Z direction at the same position, and the dimension in the X direction is It is desirable that it is 90% or more of the dimension of the die in the X direction at the same position.

【0009】超音波振動体が樹脂流れ方向に対し設定さ
れる角度は、15度〜165度の範囲であるが、押出金
型の場合には設計、金型加工の容易さ及び押出金型の実
用性の観点から30度〜90度の範囲が好ましく、更に
好ましくは約45度である。
The angle at which the ultrasonic vibrator is set with respect to the flow direction of the resin is in the range of 15 to 165 degrees. From the viewpoint of practicality, the angle is preferably in the range of 30 to 90 degrees, and more preferably about 45 degrees.

【0010】押出成形金型の樹脂出口付近に、樹脂流れ
方向に沿った節のない均一な超音波振動を金型幅全体に
与えるためには、図1に示したように、金型幅の大きさ
に応じて、適宜必要な複数の超音波振動子を配置するこ
とが必要である。
In order to apply a uniform ultrasonic vibration having no nodes along the resin flow direction near the resin outlet of the extrusion mold to the entire mold width, as shown in FIG. It is necessary to appropriately arrange a plurality of necessary ultrasonic transducers according to the size.

【0011】本発明における超音波振動子振幅の大きさ
と波長との関係を図3(断面図)に示す。本発明におけ
る樹脂流れ方向に沿った節のない均一な超音波振動と
は、図4(正面図)の(11)に示したように、金型の
全幅にわったて節がない振動のことをいう。参考まで
に、従来技術で得られる節のある振動の例を(12)に
示す。
FIG. 3 (cross-sectional view) shows the relationship between the amplitude and the wavelength of the ultrasonic transducer in the present invention. The uniform ultrasonic vibration having no nodes along the resin flow direction in the present invention refers to vibration having no nodes over the entire width of the mold as shown in (11) of FIG. 4 (front view). Say. For reference, an example of a knotted vibration obtained by the conventional technique is shown in (12).

【0012】[0012]

【実施例】≪実施例1≫本発明の装置を用いて ホ゜リエ―
テルスルホン樹脂からなる厚み 約300μm、幅 約400mmのフイ
ルムを 超音波発振周波数 約20kHz、超音波振動振幅 0
〜6μmの範囲で変化させて押出成形を行い、超音波を
加えていない場合との比較実験をこころみたところ、図
5に示されるように、超音波振幅が増大すると超音波振
動を加えない場合に比較し、フイルム面の微少凹凸の大
幅な減少が見られた。
[Embodiment] {Example 1} Wheeler using the apparatus of the present invention
Using a film made of tersulfone resin with a thickness of about 300 μm and a width of about 400 mm, ultrasonic oscillation frequency of about 20 kHz, ultrasonic vibration amplitude 0
Extrusion molding was performed by changing the thickness in the range of ~ 6 µm, and a comparative experiment was conducted with the case where no ultrasonic wave was applied. As shown in Fig. 5, when the ultrasonic amplitude was increased, no ultrasonic vibration was applied. As compared with the case of (1), a significant decrease in fine irregularities on the film surface was observed.

【0013】[0013]

【発明の効果】本発明の超音波利用の押出成形金型と装
置を用いれば、樹脂流れ方向に沿った節のない均一な超
音波振動を金型幅全体に与えることができ、押出成形時
に出口付近で発生する微少凹凸(不要な縞模様として現
れる)を除く事ができる。さらに、押出成形開始後に生
じがちな、樹脂の熱劣化等による異物が樹脂出口部であ
るリッフ゜先端に付着することを防ぎ、その結果として稼働
中のリッフ゜先端部の掃除回数を減少させ、長時間連続運転
を可能とする。
According to the extrusion molding die and apparatus utilizing ultrasonic waves of the present invention, uniform ultrasonic vibrations without nodes along the resin flow direction can be applied to the entire width of the molding die. Fine irregularities (appearing as unnecessary stripes) generated near the exit can be eliminated. Furthermore, foreign matter due to thermal degradation of the resin, which tends to occur after the start of extrusion molding, is prevented from adhering to the tip of the lip, which is the resin outlet. Enables continuous operation.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の超音波利用の押出成形金型と装置概略
の正面図
FIG. 1 is a schematic front view of an extrusion mold and apparatus using ultrasonic waves according to the present invention.

【図2】本発明の超音波利用の押出成形金型と装置概略
の断面図
FIG. 2 is a schematic cross-sectional view of an extrusion mold and apparatus using ultrasonic waves according to the present invention.

【図3】本発明の超音波振動振幅の大きさと波長との関
係図
FIG. 3 is a diagram showing the relationship between the amplitude and the wavelength of the ultrasonic vibration amplitude according to the present invention.

【図4】本発明の樹脂出口部での節のない均一な超音波
振動の説明図
FIG. 4 is an explanatory view of a uniform ultrasonic vibration having no nodes at a resin outlet portion of the present invention.

【図5】本発明の超音波振動を加えた場合のフイルム表
面微少凹凸の減少の一例
FIG. 5 shows an example of the reduction of fine irregularities on the film surface when ultrasonic vibration of the present invention is applied.

【符号の説明】[Explanation of symbols]

1:発振器 2:振動子 3:シ゛ョイント 4:テ゛フ゛―スタ― 5:押出金型 6:横穴 7:リッフ゜部分 8:樹脂出口部分 9:樹脂流れ方向 10:金型固定部 11:節のない均一な振動分布 12:節のある振動分布の例<破線> 1: Oscillator 2: Oscillator 3: Short 4: Tough Star 5: Extrusion Die 6: Side Hole 7: Rip 8: Resin Outlet 9: Resin Flow Direction 10: Mold Fixing Section 11: Uniform without nodes Vibration distribution 12: Example of vibration distribution with nodes <broken line>

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 超音波振動子とダイリップを有する押出
成形金型による押出成形において、押出成形金型の樹脂
出口付近に、樹脂流れ方向に沿った節のない均一な超音
波振動を金型幅全体に与えることを特徴とする超音波利
用押出成形方法。
In an extrusion molding using an extrusion mold having an ultrasonic vibrator and a die lip, a uniform ultrasonic vibration having no nodes along a resin flow direction is provided near a resin outlet of the extrusion mold. An extrusion method using ultrasonic waves, which is applied to the whole.
【請求項2】 押出成形金型が、樹脂流れ方向に対し1
5度〜165度の範囲に設定されたダイリップを有する
請求項1記載の超音波利用押出成形方法。
2. The extrusion molding die has a width of 1 to the resin flow direction.
The method of claim 1, wherein the die has a die lip set in a range of 5 degrees to 165 degrees.
【請求項3】 押出成形金型が、超音波振動が発生する
樹脂出口部分から超音波共振の1/2波長の位置付近に、
Z方向の寸法が同位置におけるZ方向の金型の寸法と同
一で、X方向の寸法が同位置におけるX方向の金型の寸
法の90%以上の寸法の横穴を有する請求項1又は2記
載の超音波利用押出成形方法。
3. An extrusion molding die is positioned near a position of a half wavelength of ultrasonic resonance from a resin outlet where ultrasonic vibration is generated.
The dimension in the Z direction is the same as the dimension of the die in the Z direction at the same position, and the dimension in the X direction has a side hole having a size of 90% or more of the dimension of the die in the X direction at the same position. Extrusion molding method using ultrasonic waves.
【請求項4】 超音波振動子とダイリップとの間に超音
波共振の1波長もしくはそれ以上の長さのジョイント及
び/又はデブースターを有し、超音波振動子に対して金
型からの高熱を遮断する機能を持つ請求項1〜3記載の
超音波利用押出成形方法。
4. A joint and / or a booster having a length of one or more wavelengths of ultrasonic resonance between the ultrasonic vibrator and the die lip, and a high heat generated from a mold with respect to the ultrasonic vibrator. 4. The extrusion molding method using ultrasonic waves according to claim 1, which has a function of shutting off.
【請求項5】 複数の超音波振動子を同時に発振させて
同一のダイリップを有する金型に均一な超音波振動を金
型幅全体に与える構造の発振器を有する請求項1〜4記
載の超音波利用押出成形方法。
5. The ultrasonic wave according to claim 1, further comprising an oscillator having a structure in which a plurality of ultrasonic vibrators are simultaneously oscillated to apply uniform ultrasonic vibration to a mold having the same die lip over the entire width of the mold. Use extrusion molding method.
【請求項6】 超音波振動子とダイリップを有する押出
成形金型からなる押出成形装置において、押出成形金型
が、樹脂流れ方向に対し15度〜165度の範囲に設定
されたダイリップを有することを特徴とする押出成形装
置。
6. An extrusion apparatus comprising an ultrasonic vibrator and an extrusion mold having a die lip, wherein the extrusion mold has a die lip set in a range of 15 to 165 degrees with respect to a resin flow direction. An extrusion molding device characterized by the above-mentioned.
【請求項7】 押出成形金型が、超音波振動が発生する
樹脂出口部分から超音波共振の1/2波長の位置付近に、
Z方向の寸法が同位置におけるZ方向の金型の寸法と同
一で、X方向の寸法が同位置におけるX方向の金型の寸
法の90%以上の寸法の横穴を有する請求項6記載の押
出成形装置。
7. An extruding mold is positioned near a position of 1/2 wavelength of ultrasonic resonance from a resin outlet where ultrasonic vibration is generated.
The extrusion according to claim 6, wherein the dimension in the Z direction is the same as the dimension of the mold in the Z direction at the same position, and the dimension in the X direction has a side hole having a size of 90% or more of the dimension of the mold in the X direction at the same position. Molding equipment.
【請求項8】 超音波振動子とダイリップとの間に超音
波共振の1波長もしくはそれ以上の長さのジョイント及
び/又はデブースターを有し、超音波振動子に対して金
型からの高熱を遮断する機能を持つ請求項6又は7記載
の押出成形装置。
8. An ultrasonic resonator having a joint and / or debooster having a length of one or more wavelengths of ultrasonic resonance between the ultrasonic vibrator and the die lip, and having a high heat from a mold for the ultrasonic vibrator. 8. The extrusion molding apparatus according to claim 6, which has a function of shutting off.
【請求項9】 複数の超音波振動子を同時に発振させて
同一のダイリップを有する金型に均一な超音波振動を金
型幅全体に与える構造の発振器を有する請求項6〜8記
載の押出成形装置。
9. The extrusion molding according to claim 6, further comprising an oscillator configured to simultaneously oscillate a plurality of ultrasonic transducers and apply uniform ultrasonic vibration to a mold having the same die lip over the entire width of the mold. apparatus.
JP22549498A 1998-08-10 1998-08-10 Extrusion molding method and extrusion apparatus utilizing ultrasonic waves Expired - Fee Related JP3444791B2 (en)

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