JP2000015776A - Apparatus and method for holding and fixing base - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simply and rapidly hold and fix a printing base having different mounting pattern by facilitating a disposition change of a holding pin. SOLUTION: In the apparatus for holding and fixing a base to hold and fix the base 2 at a predetermined position by pressing the base 2 conveyed to the position from one side via many holding pins 3, many pins 3 are provided over substantially all surface of the base 2, a memory for previously storing the positions of the pins 3 used for holding and fixing to the base 2 less in number than the total number of the pins 3 is provided, and the base 2 is held an fixed only by the pins 3 of the positions designated by the memory.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for holding and fixing a substrate. More specifically, the present invention relates to an improvement in the position setting of a holding pin for holding a substrate from the back side in screen printing of solder on the substrate or the like.

[0002]

2. Description of the Related Art For example, when solder is printed on a substrate by screen printing, printing is performed in a state in which holding pins are applied to the surface on the back side of the printed surface in order to prevent the substrate from bending due to the pressure applied to the printed surface. That is common. At this time, it is desirable to hold the board evenly by using a large number of holding pins.However, when components are mounted on the back surface of the board and hitting the holding pins causes problems or holes are provided. Sets the holding pin so as to avoid such parts and holes.

[0003] The board printed in this way has a different mounting pattern on the board for different models, and the component position changes accordingly. Therefore, when printing is performed on a board of a different model in the above-described printing apparatus, it is necessary to newly set the holding pins so as to match the board.

[0004]

However, the number of holding pins used to hold a substrate is generally large, about several tens to several hundreds, and it is not easy to change the setting for each substrate. Moreover, when the holding pins are set by inserting them into a large number of holes arranged vertically and horizontally, it is necessary to pinch these many pins and reset them, which requires much labor and time. I need it.

To cope with such a problem, a device such as a substrate holding and fixing device 101 described in Japanese Patent Application Laid-Open No. 4-64296 has been proposed. This is the pin 1 supported by the spring 102 as shown in FIG.
Since the substrate 104 is held and fixed by using the components 03,..., 103 regardless of the presence or absence of the mounted components, the difference in height can be absorbed by the elasticity of the spring 102. In order to sufficiently prevent bending, it is necessary to increase the strength of the spring. If the strength is too high, the mounting portion will be pressed by the pins 103,.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a board holding / fixing apparatus and method which can easily and quickly hold and fix printed boards having different mounting patterns by easily changing the arrangement of holding pins. .

[0007]

According to the first aspect of the present invention, a substrate conveyed to a predetermined position is held by a large number of holding pins from one side, and the substrate is held and fixed at a predetermined position. In the substrate holding / fixing device, a large number of holding pins are provided so as to cover almost the entire surface of the substrate, and the positions of the holding pins used for holding and fixing the substrate are stored in advance in a number smaller than the total number of the holding pins. A storage unit is provided to hold and fix the substrate only by holding pins at locations designated by the storage unit.

Accordingly, during the solder printing on the board, the holding pins are held in contact with only the mounting face while keeping the mounting pins in conformity with the mounting pattern on the mounting face of the board and avoiding mounting components and holes. In this case, since the location of the holding pin to be used is stored in the storage unit in advance, it is necessary to change the type of the board and quickly and easily change the arrangement of the holding pin to be used even if the mounting pattern is different. Can be.

According to a second aspect of the present invention, each of the holding pins is individually provided so as to move between a holding position for holding the substrate and a separated position separated from the substrate. , And the substrate is held and fixed only by the driving mechanism at the location designated by the storage unit. Therefore, only the drive mechanism instructed based on the storage of the storage unit is driven, and the movement of the drive mechanism moves the holding pin between the holding position and the separation position.

According to the third aspect of the present invention, there is provided a substrate holding and fixing device, wherein all of the holding pins are provided with a pin holding mechanism which can be engaged and disengaged at both the holding position and the separation position.
After holding and fixing the substrate by the driving mechanism, the position of the holding pin is held by the pin holding mechanism. Thus, the holding pin held by the pin holding mechanism does not move in the axial direction even by the pressure accompanying the solder printing.

According to the present invention, the substrate conveyed to a predetermined position is held by a large number of holding pins from one side,
In a substrate holding and fixing method for holding and fixing a substrate at a predetermined position, a large number of holding pins are provided so as to cover almost the entire surface of the substrate, and the positions of the holding pins used for holding and fixing with respect to the substrate are determined by the total number of the holding pins. By designating a smaller number, the substrate is held and fixed only by the designated holding pins.

Therefore, during the solder printing on the board, the holding pins are aligned with the mounting pattern on the mounting face of the board, and the board is held in the holding position by abutting only on the mounting face while avoiding mounting components and holes. be able to. In this case, since the location of the holding pin to be used is stored in the storage unit in advance, the arrangement of the holding pin to be used can be quickly and easily changed even if the type of the substrate is changed.

In the method for holding and fixing a substrate according to the invention, the substrate is a substrate on which solder printing is performed, and the holding and fixing positions of the holding pins of a plurality of types of substrates having different positions of the holding pins to be held and fixed are stored. The substrate is held and fixed only by the stored holding pins. Therefore, by using the storage in the storage unit, the arrangement of the holding pins to be used can be changed quickly and easily even if the model of the substrate changes.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of the present invention will be described below in detail based on an example of an embodiment shown in the drawings.

1 to 4 show an embodiment of a substrate holding / fixing apparatus and method and an inspection method according to the present invention. The board holding / fixing device 1 holds and fixes the board 2 conveyed to a predetermined position by using a large number of holding pins 3,..., 3 from one side, and particularly holds the board 2 from the mounting surface 2a side on which the components 23 are mounted. This is effective when printing solder on the back side of the back.
Therefore, the board holding and fixing device 1 is provided on a printing stage on which solder printing is performed on the board 2 in a solder printing apparatus, for example, and this printing stage corresponds to the above-described predetermined position. Further, the substrate holding and fixing method of the present invention is to hold and fix the substrate 2 at a predetermined position by using the device 1 and mount only the necessary holding pins 3,. It is to be brought into contact with the surface 2a. As used herein, “holding and fixing” means to hold a target substrate 2 at a predetermined position, and this position holding is performed every time the substrate 2 is provided on a device. (Not shown),
Both the case of supporting against the pressing from above and the case of supporting from above are included.

A large number of the holding pins 3,..., 3 are provided at substantially the entire surface of the substrate 2 at the above-mentioned predetermined positions so as to hold and fix the substrate 2 from the mounting surface 2a side. Each of the holding pins 3,..., 3 has the same shape and size, and is slidably accommodated in the accommodation holes 8,. It is formed so as to have a configuration. In this case, the holding pins 3,..., 3 are housed so as to move vertically with respect to the board surface and to abut on the mounting surface 2a of the board 2 vertically. In the present embodiment, the above-described holding pin 3 has a columnar shape, and the accommodation hole 8 has a circular cross section. However, these shapes are not particularly limited to these, and the shape of the substrate 2 and the like are not particularly limited. Can be changed as needed.

As shown in FIG. 1, the holding pin 3 can move at a predetermined stroke, and the stroke ends are respectively set to a separation position P0 and a holding position P1. The holding pin 3 at the separation position P0 is located at a position separated from the substrate 2 as shown in FIG. 1A, and a gap is provided so as not to contact the mounted component 23. On the other hand, the holding pin 3 that has moved to the holding position P1 and protruded is mounted on the mounting surface 2a as shown in FIG.
, And can maintain that position. As described above, the manner in which the position of the substrate 2 is held includes two cases, as described above, in which the substrate 2 is pressed each time it is provided in the device, and in a case in which the substrate 2 is supported against pressing from above. is there. In order to avoid contact with the mounted component 23 at the separated position P0, the stroke width of the holding pin 3 is set to be equal to or larger than the height of the mounted component 23 as illustrated.

Each of the holding pins 3,..., 3
The driving mechanisms 6,..., 6 provided separately so as to move between the separation position P0 and the holding position P1 and move along the accommodation holes 8,. The drive device 6 in the present embodiment uses the coil 9 as shown in FIG. 1, and moves the holding pin 3 by energizing the coil 9 or stopping the energization. The coil 9
It is provided in a state of being housed inside an annular case 10 provided around the housing hole 8.

On the other hand, a hub 11 with a flange as shown is integrally provided around the holding pin 3.
The hub 11 is formed of a material that is pulled by a magnetic force generated by the coil 9 when energized. When energized, the hub 11 is pulled toward the coil 9 to move the holding pin 3 to the holding position P1. The hub 11 regulates the stroke width of the holding pin 3 by abutting the flange portion thereof on the case 10 to determine the holding position P1. When the power supply to the coil 9 is stopped, the magnetic force disappears, so that the holding pin 3 and the hub 11 are moved down to the separated position P0 by the urging force of the urging means 4 composed of a coil spring or the like and retreat.

Further, in the substrate holding and fixing device 1 of the present invention,
A pin holding mechanism 7 that can be engaged and disengaged at all of the holding pins 3,..., 3 at both the holding position P1 and the separation position P0 is provided, and after the substrate 2 is held and fixed by the driving mechanism 6,
, 3 are held by the pin holding mechanism 7. As shown in FIG. 2, the pin holding mechanism 7 in the present embodiment includes a plurality of lock belts 12,.
, And a fixed plate 13 to which one end of each of the lock belts 12 is attached, and a movable plate 14 to which the other end is attached.

The lock belts 12,..., 12 lock the holding pins 3,..., 3 immovably, and as shown in FIG. It is suspended at the height in contact with the surface. The lock belt 12 is formed of a belt-like member having a frictional force such that the holding pin 3 does not slide and move, and is formed of a material that hardly expands when pulled.

It is preferable that the lock belt 12 is provided so as to be in contact with the holding pin 3 on more surfaces, since the holding pin 3 is held more strongly. For this reason, in the present embodiment, the lock belt 12
Each holding pin 3, so that the contact area with
.., 3 are arranged. That is, in the present embodiment, the holding pins 3,..., 3 and the housing holes 8,. It is arranged so that it may shift. In this case, as shown in FIG. 3, for example, as compared with the case where all the holding pins 3,. Large contact area.
Therefore, even when the lock belts 12,..., 12 are pulled with the same tension, the engagement pins 3,.

The movable plate 14 is provided so as to be movable as shown by an arrow in FIG. 2, and can appropriately apply and release pressure to the lock belts 12,. When the moving plate 14 moves in the locking direction, the lock belts 12,..., 12 are pulled, apply radial pressure to the peripheral surfaces of the holding pins 3,. The pressure in the radial direction is weakened, and the holding pins 3,..., 3 can move. Although not particularly shown, in the present embodiment, the moving plate 14 is moved using a pneumatic cylinder or a drive motor.
However, it goes without saying that other means may be used as long as sufficient tension can be applied to the lock belts 12,...

Further, in the substrate holding and fixing apparatus 1 of the present invention, the positions of the holding pins 3,..., 3 used for holding and fixing to the substrate 2 are stored in advance in a number smaller than the total number of the holding pins 3,. The storage unit 5 is provided. In other words, the storage unit 5 is provided for each substrate 2 having a different mounting pattern.
Holding pin 3 to be moved to the holding position P1 and projected
, 3 are stored in advance, and only the drive mechanisms 6,..., 6 at the location designated by the storage section 5 are driven, and the substrate is held only by the holding pins 3,. 2 is held and fixed.

The operation of holding and fixing the board 2 to be solder-printed using the board holding / fixing device 1 configured as described above is as follows.

As shown in FIG. 4, information for selecting the type of the substrate 2 transported to a predetermined position of the printing apparatus and positioned is read by a reader 16 in advance. Such a reader 16 may be, for example, one that reads a barcode printed on the substrate 2 or one that determines based on the substrate shape. Also, this reader 1
In addition to the model determination according to 6, a means 17 for manually setting the model is also provided, so that the model can be input and set by the manual setting means 17.

The information read by the reader 16 is transmitted to the control unit 1
8, the model of the substrate 2 is determined on the basis thereof. The discrimination information is collated with information stored in the storage unit 5 in advance, and a corresponding model is selected. Based on this information, the control unit 18 drives the specified coil drive circuit 19 by a number smaller than the total number of the holding pins 3,.
, 6 are driven. Which of the driving devices 6,..., 6 is to be driven, for example, the arrangement of the holding pins 3,.
The holding pin 3 at the position where there is no mounting component 23 in both the vertical and horizontal coordinates
.., 3, etc. The driven drive mechanisms 6,..., 6 move the holding pin 3 from the separated position P0 to the holding position P.
1, the moving plate 14 is moved thereafter, and tension is applied to the lock belts 12,..., 12 to hold these holding pins 3,.

The holding pins 3,...
Reference numeral 3 abuts on the mounting surface 2a while avoiding all the mounting components 23 and holes of the substrate 2 at predetermined positions. In this state, the substrate 2
Since the solder printing surface is pressed, the solder printing surface does not bend even when pressed. When the solder printing is completed, each coil 9,
, 9 may be stopped, all the holding pins 3,..., 3 may be returned to the separated position P0, and the substrate 2 may be carried out from the predetermined position.

As described above, according to the present invention, the holding pins 3 to be used for the substrates 2 having different mounting patterns are used.
.., 3 can be very easily changed. Therefore, the labor involved in changing the positions of the holding pins 3,..., 3 is greatly reduced, and the required time is also reduced. In this case, the arrangement of the holding pins 3,..., 3 can be appropriately set based on the information of the reader 16 and the manual setting means 17, and the addition of the storage information in the storage unit 5 allows for more models. become able to.

The above embodiment is an example of a preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications can be made without departing from the spirit of the present invention. In the embodiment described above, the substrate holding and fixing device 1 includes the moving holding pins 3,.
2, the pin holding mechanisms 7,..., 7 are provided. However, the present invention is not particularly limited to this. For example, as shown in FIG.
, 3 and the stepping motors 21,..., 21 can hold and fix the substrate 2.

In this embodiment, as shown in the figure, an internal thread is cut in the holding pin 3 in the axial direction, and a male screw formed by the shaft of the stepping motor 21 is fitted. A notch 22 in the axial direction is provided on the outer periphery of the holding pin 3, and the holding pin 3 is formed by a projection (not shown) provided in the accommodation hole 8.
Is prevented from rotating in the circumferential direction. Therefore, the holding pin 3 moves in the axial direction in accordance with the drive amount only when the stepping motor 21 is driven, and otherwise remains stopped at that position.

As described above, since the position of the holding pin 3 is uniquely determined according to the rotation amount of the stepping motor 21,
Here, the holding pin 3 is moved between the separated position P0 and the holding position P1 by controlling the amount of rotation. In this case, since the stepping motor 21 is used, the rotation amount can be accurately controlled, so that the position of the holding pin 3 can be accurately controlled.

Moreover, since the holding pin 3 cannot move in the axial direction except when the stepping motor 21 is driven, the holding pin 3 is held even if a force is returned via the substrate 2 to the separated position P0. Does not move from position P1. In other words, the pin holding mechanism 7 in this case is included in the substrate holding / fixing device 1. Therefore, in this embodiment, a mechanism for holding the pins 3,..., 3 at the holding position P1 is particularly provided. Even if the substrate 2 is not provided,
Can be securely held and fixed, and bending at the time of solder printing can be prevented.

[0034]

As is apparent from the above description, according to the substrate holding and fixing device of the first aspect of the present invention, during the solder printing on the substrate, the holding pins are aligned with the mounting pattern on the mounting surface of the substrate. It is possible to make contact with only the mounting surface while avoiding the mounted components and holes. Thereby, the substrate can be held and fixed without applying a load to the mounted components and the like. In addition, since the location of the holding pin to be used is stored in the storage unit in advance, the arrangement of the holding pin to be used can be quickly and easily changed even if the type of the substrate is changed.

According to the substrate holding and fixing device of the invention, each of the holding pins is connected to a separately provided drive mechanism, and holds and fixes the substrate only at a position designated by the storage unit. Therefore, no load is applied to the mounted components and the like, and it is possible to quickly and easily cope with a change in the model of the board.

According to the third aspect of the present invention, since the holding pins are held by the pin holding mechanism, the holding pins can move in the axial direction even by the pressure accompanying the solder printing. Absent. Thereby, it is possible to prevent the board from bending during solder printing.

In the method for holding and fixing a substrate according to the present invention, during the solder printing on the substrate, the holding pins are aligned with the mounting pattern on the mounting surface of the substrate so as to avoid mounting components and holes, and only the mounting surface is fixed. Is in contact with Therefore, the substrate can be held and fixed without applying a load to the mounted components and the like, and the arrangement of the holding pins to be used can be quickly and easily changed even if the type of the substrate is changed.

According to the method for holding and fixing a substrate according to the fifth aspect of the present invention, the arrangement of the holding pins to be used can be quickly and easily changed even if the model of the substrate changes, by using the memory of the storage unit. it can.

[Brief description of the drawings]

1A and 1B are diagrams showing one embodiment of a substrate holding and fixing device and a method of the present invention, wherein FIG. 1A is a sectional view showing a state in which a holding pin is at a separated position, and FIG. ing.

FIG. 2 is a plan view showing the arrangement of holding pins and a pin holding mechanism in the substrate holding and fixing device.

FIG. 3 is a plan view showing a case where holding pins are regularly arranged at equal intervals in the vertical and horizontal directions.

FIG. 4 is a diagram showing a flow when holding and fixing a substrate during solder printing.

FIG. 5 is a diagram showing another embodiment of the present invention, wherein (A)
Shows a state where the holding pin is at the separated position, and (B) shows a state where the holding pin is at the holding position.

FIG. 6 is a view showing a conventional substrate holding and fixing device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 substrate holding and fixing device 2 substrate 3 holding pin 5 storage unit 6 driving mechanism 7 pin holding mechanism P0 separation position P1 holding position

Claims (5)

[Claims] 1. A substrate holding / fixing device in which a substrate conveyed to a predetermined position is held by a large number of holding pins from one side and the substrate is held and fixed at a predetermined position. A plurality of storage pins are provided so as to cover the entire surface, and a storage section is provided in which the number of holding pins used for holding and fixing the board is smaller than the total number of the holding pins in advance, and a storage section is provided which is designated by the storage section. A substrate holding and fixing device, wherein the substrate is held and fixed only by the holding pins at locations. 2. The storage section, wherein each of the holding pins is connected to a driving mechanism individually provided to move between a holding position for holding the substrate and a separated position separated from the substrate. 2. The substrate holding and fixing device according to claim 1, wherein the substrate is held and fixed only by a driving mechanism at a position specified by (1). 3. A pin holding mechanism capable of engaging and disengaging at all of the holding pins and at both the holding position and the separation position, holding and fixing the substrate by the driving mechanism, and further comprising the pin holding mechanism 3. The substrate holding / fixing device according to claim 2, wherein the position of the holding pin is held by the following. 4. A substrate holding and fixing method in which a substrate conveyed to a predetermined position is held by a large number of holding pins from one side, and the substrate is held and fixed at a predetermined position. A large number of the holding pins are provided so as to cover the entire surface, and the position of the holding pins used for holding and fixing the substrate is specified by a number smaller than the total number of the holding pins, whereby the substrate is held and fixed only by the specified holding pins. A method for holding and fixing a substrate, the method comprising: 5. The substrate is a substrate on which solder printing is to be performed, and the holding and fixing positions of the holding pins of a plurality of types of substrates having different positions of the holding pins for holding and fixing are respectively stored, and the stored holding pins are stored. 5. The method for holding and fixing a substrate according to claim 4, wherein said substrate is held and fixed only by said means.