JP2000015161A - Adhesive applicating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently applicate a discharged adhesive to a correct position by a correct amount even to a part of extremely small area to be stuck by mounting a position control function part controlling the position of a discharge head part discharging a droplet of the adhesive to the part to be stuck. SOLUTION: The position of a part to be adhered T is detected with a sensor, and a pair of discharge head parts 2a and 2b is previously moved in X and Y directions to set at an objective position via a control part 10 based on this detected signal. Then, a driving voltage is applied at first to one side piezoelectric element part 7a via the control part 10. Then the piezoelectric element part 7a is deformed so as to project to a liq. reserving part 5a to apply discharge pressure to an adhesive Aa, and the adhesive is discharged as droplets Aad from a discharge nozzle part 6a and stuck at the part to be adhered T. Thereafter, a driving voltage is applied also to another side piezoelectric element part 7b to discharge an adhesive Ab in another side liq. reserving part 5b as droplets Abd and stuck on the initial adhesive Aa.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive applying apparatus suitable for use when the area of an area to which an adhesive is to be applied is extremely small.

[0002]

2. Description of the Related Art Conventionally, there have been known various kinds of adhesive applying apparatuses for automatically applying (applying) an adhesive to a portion to be applied (see Japanese Patent Application Laid-Open No. 5-49999).

By the way, when the adhesive is applied, it can be applied relatively easily when the area of the portion to be attached is large, but when the area of the portion to be attached is extremely small, the adhesive is applied. It is not easy to efficiently attach an accurate amount to an accurate position, and an adhesive applying apparatus that can sufficiently respond to such a demand has not been proposed.

The present invention has been made in response to such a conventional demand, and is intended to efficiently apply an adhesive to an accurate position and in an accurate amount even in a case where an area to be applied is extremely small. It is an object of the present invention to provide an adhesive applying device capable of performing the above.

[0005]

The adhesive applying apparatus 1 according to the present invention comprises an ejection head 2a for ejecting a droplet Aad of an adhesive Aa to a portion T to be adhered, and the ejection head 2a. An adhesive supply unit 3a for supplying the adhesive Aa to the
A position control function unit 4 for controlling the position of the ejection head unit 2a is provided. Thereby, the adhesive supply unit 3
a, the adhesive Aa is supplied to the ejection head portion 2a, and a droplet Aad of the adhesive Aa is supplied from the ejection head portion 2a to the adhered portion T.
To fly. At this time, the position of the ejection head unit 2a is controlled by the position control function unit 4.

[0006] According to a preferred embodiment, the ejection head section 2a is provided with an adhesive A supplied from an adhesive supply section 3a.
a, a discharge nozzle 6a communicating with the liquid reservoir 5a to discharge the adhesive Aa to the outside, and a liquid reservoir 5a facing the liquid reservoir 5a and being mechanically displaced. Element part 7a for applying a discharge pressure to the adhesive Aa stored in the piezoelectric element part 7a
It comprises. In particular, a pair of ejection heads 2 for independently ejecting the respective adhesives Aa and Ab of the two-component mixed type adhesive.
a, 2b and each adhesive A on each of the ejection heads 2a, 2b.
a, and a pair of adhesive supply units 3a,
3b. In this case, the pair of ejection heads 2a and 2b discharge in the respective ejection heads 2a and 2b so that the adhesives Aa and Ab can be ejected to the same adhered portion T separated by a predetermined distance L in a stopped state. The angles of the nozzles 6a and 6b may be set, or each of the ejection heads may be set so that the adhesives Aa and Ab are ejected onto the same adhered portion T by the pair of ejection heads 2a and 2b. The positions of 2a and 2b may be controlled by the position control function unit 4. On the other hand, the position control function unit 4
A position sensor 8 for detecting the position of the ejection head 2a,
The head moving mechanism 9 is configured to include a head moving mechanism 9 that controls the movement of the head 2b and a control unit 10 that gives a control command to the head moving mechanism 9 based on a position detection value obtained from the position sensor 8.

[0007]

Next, preferred embodiments according to the present invention will be described in detail with reference to the drawings.

First, the configuration of the adhesive application device 1 according to the present embodiment will be described with reference to FIGS.

As shown in FIG. 1, an example of the adhesive applying apparatus 1 includes two adhesives (liquid before mixing) Aa,
A pair of ejection heads 2 for independently ejecting Ab
a and 2b. In this case, each of the ejection heads 2a, 2
b has the same configuration and is symmetrically overlapped and integrated.

[0010] The one discharge head section 2a has a head housing 11a. This head housing 11a
It has a liquid reservoir 5a for accommodating an adhesive Aa supplied from an adhesive supply unit 3a described later, and a discharge nozzle 6a communicating with the liquid reservoir 5a and discharging the adhesive Aa to the front outside. The nozzle inner diameter of the discharge nozzle portion 6a is small, and the embodiment assumes that the diameter of the discharged droplet Aad becomes 1 [mm] or less when it adheres to the adhered portion T. Further, a piezoelectric element 7a facing the liquid reservoir 5a is provided to form a part of the liquid reservoir 5a. By applying a predetermined voltage, the piezoelectric element 7a is deformed into a convex shape so as to enter the liquid reservoir 5a, and the mechanical displacement causes a discharge pressure to be applied to the adhesive Aa contained in the liquid reservoir 5a. Give. By using such a piezoelectric element portion 7a, a small amount of adhesive A
a can also be discharged accurately, and since there is no generation of heat or the like, adverse effects such as chemical change and evaporation on the adhesive Aa can be eliminated. On the other hand, in the other ejection head portion 2b, 5b indicates a liquid reservoir for containing the adhesive Ab, 6b indicates an ejection nozzle portion, and 7b indicates a piezoelectric element portion. In this case, the pair of symmetrically stacked ejection heads 2a and 2b are arranged so that the respective ejection heads 2a and 2b can eject the adhesives Aa and Ab onto the same adherend T separated by a predetermined distance L in a stopped state.
The angles of the discharge nozzle portions 6a and 6b in a and 2b are set.

The adhesive applying device 1 includes adhesive supply units 3a and 3b for supplying adhesives Aa and Ab to the discharge heads 2a and 2b. The adhesive supply units 3a and 3b are provided with storage tanks 12a and 12b storing the adhesives Aa and Ab, respectively.
And the adhesives Aa, A from the storage tanks 12a, 12b.
b leading to the discharge heads 2a, 2b.
3b, and the adhesives Aa and Ab guided by the introduction pipes 13a and 13b are pressure regulators 14a and 14b, respectively.
Supply port 1 formed in the head housing 11a through the
5a and 15b. In FIG. 1, reference numeral 10 denotes a control unit. The output unit is connected to the piezoelectric elements 7a and 7b, and is connected to the pressure regulators 14a and 14b.
Therefore, the pressure of the pressure regulators 14a and 14b can be adjusted by the control unit 10.

Further, the adhesive application device 1 is provided with a position control function unit 4 for controlling the positions of the ejection head units 2a and 2b. As shown in FIG. 2, the position control function unit 4 includes a position sensor 8 for detecting the position of the adhered portion T,
A head moving mechanism section 9 for controlling movement of the heads a and 2b and a control section 10 for controlling the head moving mechanism section 9 based on a position detection value obtained from the position sensor 8 are provided.

In this case, by disposing the head moving mechanism 9 on the movable plate 21, an X-direction moving drive unit 23 using a servomotor 22 for moving the ejection heads 2a and 2b in the X direction, A Y-direction moving drive unit 26 using a servomotor 25 that moves the movable plate 21 (ejection heads 2a and 2b) in the Y direction by disposing the movable plate 21 on the plate 24 is provided.

The control unit 10 includes a computer function unit 31, a head driver 32, and a motor driver 33. The computer function unit 31 stores an MPU (microprocessor unit) 35 including a CPU and the like, and various data. RAM (random access memory) 3
6, a ROM (read only memory) 37 storing various control programs and the like, and an operation panel (keyboard) 38. The computer function unit 31 can communicate with a host computer 39. The servo motors 22 and 25 are connected to the MPU 35 via the motor driver 33.
The piezoelectric elements 7a and 7b of the ejection heads 2a and 2b are connected to the MPU 35 via the head driver 32.

Next, the operation of the adhesive applying apparatus 1 according to the present embodiment will be described with reference to FIGS.

First, in the storage tank 12a, the first adhesive Aa to be one of the two-component mixed type adhesive (liquid before mixing) is used.
And a second adhesive Ab serving as the other adhesive (liquid before mixing) is stored in the storage tank 12b. In this case, both the first adhesive Aa and the second adhesive Ab have a viscosity of 20 so as not to cause clogging of the discharge nozzle portions 6a, 6b.
An adhesive of 0 [cP] or less is selected. Storage tank 12a
The first adhesive Aa in the inside is introduced into the introduction pipe 13a, the pressure regulator 14
a, and the second adhesive Ab in the storage tank 12b is discharged through the inlet pipe 13b, the pressure regulator 14b, and the supply port 15b while filling the liquid reservoir 5a of the discharge head 2a through the supply port 15a. The liquid is filled in the liquid reservoir 5b of the head 2b.

On the other hand, the position of the adhered portion T is detected by the position sensor 8, and the detection result (position detected value) is
0 (MPU 35). In addition, as the adhered portion T, for example, when attaching a small noble metal to the dial or a non-flat base of precious metal jewelry when attaching a small character formed separately to the dial of a small instrument A non-flat base or the like can be assumed. In this case, the position detection value obtained from the position sensor 8 is given to the MPU 35, and the MPU 35 gives a control command to the motor driver 33. Thereby, the motor driver 33 controls the servo motors 22 and 25,
The ejection heads 2a and 2b are moved in the X direction and the Y direction and set at the target position. Further, the support plate 24 is moved in the Z direction by a moving mechanism (not shown) to
The distance L between a, 2b and the adhered portion T is set.

The MPU 35 is a head driver 32
Is given a discharge command. Thereby, the head driver 3
2 applies pulse-like drive voltages Ea and Eb shown in FIG. 3 to the respective piezoelectric element sections 7a and 7b. That is, first, the drive voltage Ea of FIG. 3A is applied to the piezoelectric element portion 7a. Thereby, the piezoelectric element portion 7a shown in FIG. 1 is deformed into a convex shape so as to enter the liquid reservoir 5a, and the discharge pressure is applied to the first adhesive Aa accommodated in the liquid reservoir 5a by this mechanical displacement. Granted. FIG. 1 shows a state in which the piezoelectric element portion 7b indicated by a solid line is deformed by applying a voltage. As a result, the first adhesive Aa in the liquid reservoir 5a becomes a droplet Aad, flies outside from the discharge nozzle 6a, and adheres to the target adhered portion T.

Next, the drive voltage Eb shown in FIG. 3B is applied to the piezoelectric element portion 7b at a predetermined time difference.
Thereby, the piezoelectric element portion 7b shown in FIG. 1 is deformed as shown by the solid line, and a discharge pressure is applied to the second adhesive Ab. As a result, the second adhesive Ab in the liquid reservoir 5b becomes a droplet Abd and flies out of the discharge nozzle 6b to the outside.
By adhering onto the droplet Aad that has already adhered to
The droplets Aad and Abd mix. Therefore, even when the area of the adhered portion T is extremely small, each of the adhesives Aa, A
b can be efficiently deposited at the correct position and in the correct amount.

Next, a modified embodiment and peripheral configuration will be described.
This will be described with reference to FIG. 4 (FIG. 3) and FIG.

FIG. 4 shows a modified embodiment. In the embodiment shown in FIG. 1, each of the discharge heads 2a and 2b is capable of discharging the respective adhesives Aa and Ab onto the same adhered portion T separated by a predetermined distance L in a stopped state. Head part 2a,
2b shows the case where the angles of the discharge nozzles 6a and 6b are set.
The case where the discharge directions of the discharge nozzle portions 6a and 6b of 2b are set in parallel is shown. In the case of the modified embodiment, it is not necessary to set the distance L between the ejection heads 2a, 2b and the adhered portion T, but the adhesives Aa, Ab can be ejected to the same adhered portion T. At the time of ejection, the position of each of the ejection heads 2a and 2b needs to be controlled by the position control function unit 4. That is, when discharging the second adhesive Ab, the discharge heads 2a and 2b are moved at a predetermined speed in the direction of the arrow H1 in FIG. 4 and the driving voltage Eb as shown in FIG.
The output of s is set to a time td set in consideration of the predetermined speed.
Only the case of the embodiment of FIG. 1 needs to be delayed.

FIG. 5 shows a peripheral configuration. The peripheral configuration shows the head maintenance station S. Discharge head 2
When a and 2b are not used, the ejection heads 2a and 2b are used to prevent the adhesives Aa and Ab from leaking, drying, and attaching dust.
2b is moved in the direction H2 in FIG. 5 to return to the home position Ph, and maintenance is performed by the head maintenance station S.

The head maintenance station S includes a head cleaning mechanism 51. The head cleaning mechanism 51 includes head wiping blades 52a, 52
2b, the discharge heads 2a, 2b are returned to the home position Ph, and at the end of the discharge nozzles 6a, 6b,
By contacting the head wiping blades 52a and 52b, the head wiping blades 52a and 52b have a function of wiping the adhesives Aa and Ab attached to the tips of the discharge nozzles 6a and 6b. In this case, the head wiping blades 52a and 52b individually move forward and backward to wipe the corresponding ejection heads 2a and 2b.

The head maintenance station S
Has a capping mechanism 53. The capping mechanism 53 includes caps 54a and 54b that cover the tips of the discharge nozzles 6a and 6b. Thus, at the home position Ph, the tips of the discharge nozzles 6a, 6b are covered by the caps 54a, 54b, and the adhesives Aa, Ab
To prevent leakage, drying, and adhesion of dust. Note that 55
Reference numerals a and 55b denote anti-drying materials placed inside the cap portions 54a and 54b.

Further, the head maintenance station S includes an ejection recovery mechanism 56. Discharge recovery mechanism 5
Reference numeral 6 denotes drain tubes 57a and 57b connected to the cap portions 54a and 54b, suction pumps 58a and 58b connected in the middle of the drain tubes 57a and 57b, and an adhesive discharged from the drain tubes 57a and 57b. A drain tank 59 containing Aa and Ab is provided. Thereby, when the adhesives Aa, Ab are clogged in the discharge nozzle portions 6a, 6b,
The discharge nozzle portions 6a,
By operating the suction pumps 58a and 58b while covering the adhesive 6b, the adhesive A clogged in the discharge nozzles 6a and 6b
a and Ab are extracted and stored in the drainage tank 59.

Although the embodiment has been described in detail, the present invention is not limited to such an embodiment, and the detailed configuration, shape, material, quantity, etc., do not depart from the gist of the present invention. Can be changed, added or deleted arbitrarily.

For example, in the embodiment, the piezoelectric element section 7 is exemplified as the means for applying the discharge pressure. However, other pressurizing means such as an electromagnetic solenoid may be used, or air pressure, vapor pressure, gas pressure, etc. You may use it directly. When using an electromagnetic solenoid, a back pressure generating device is combined, and a back pressure is applied to the adhesive by the back pressure generating device, so that the opening and closing valve is normally closed by the electromagnetic solenoid. May be opened for a set time.

Further, the embodiment shows a case where a pair of ejection heads 2a and 2b for independently ejecting the respective adhesives Aa and Ab of the two-component mixed type adhesive are used. By providing 2a (or 2b), a one-liquid adhesive may be discharged. In this case, before use, the adhesive that has adhered to the tips of the ejection nozzles 6a and 6b and has increased in viscosity is forcibly removed by the ejection recovery mechanism 56. Adhesive to be used, the viscosity is low inside the head part, so that clogging does not occur, the adhesive after the adhesion becomes large,
For example, an adhesive whose viscosity is increased by being exposed to outside air and oxidized, an adhesive whose viscosities are increased by the volatilization of the organic solvent after adhering 0.5% or more of isopropyl alcohol or an acrylic organic solvent, An adhesive or the like whose viscosity increases when exposed to ultraviolet rays or the like can be used.

Further, in the embodiment, the case where the adhesives Aa and Ab are locally adhered has been shown.
b or while moving the adhered portion T, the adhesives Aa, A
By discharging b, the adhesives Aa and Ab can be adhered linearly. In this case, it can be used for manufacturing envelopes and the like. In particular, the position of an envelope or the like is detected by the position sensor 8,
If the position control function unit 4 controls the position of the ejection head units 2a and 2b, the adhesive can be applied to an accurate position (on the line) without displacement.

In the present specification, the adhesive Aa, the adhesive Aa is applied to the same adhered portion T by a pair of ejection heads 2a, 2b.
Discharging Ab does not mean that the adhesives Aa and Ab completely overlap at the time of adhesion, but is a concept that also includes, for example, mixing by applying a member to be adhered without mixing at the time of adhesion. .

[0031]

As described above, the adhesive applying apparatus according to the present invention comprises a discharge head for discharging a droplet of the adhesive to a portion to be adhered, and an adhesive supply unit for supplying the adhesive to the discharge head. And a position control function unit for controlling the position of the ejection head unit, the following remarkable effects can be obtained.

Even when the area of the portion to be adhered is extremely small, the adhesive can be efficiently adhered to an exact position and in an exact amount.

[0033] According to a preferred embodiment, the discharge head unit is configured to include a liquid reservoir for storing the adhesive supplied from the adhesive supply unit, and a discharge nozzle communicating with the liquid reservoir and discharging the adhesive to the outside. And a piezoelectric element that faces the liquid reservoir and applies a discharge pressure to the adhesive contained in the liquid reservoir by mechanical displacement, so that even a small amount of adhesive can be accurately discharged. Since no heat or the like is generated, adverse effects such as chemical change and evaporation on the adhesive can be eliminated.

According to a preferred embodiment, a pair of ejection heads for independently ejecting each adhesive of the two-component mixed adhesive, and a pair of adhesive supply for supplying each adhesive to each ejection head respectively If a part is provided, a low-viscosity adhesive (liquid before mixing) can be used, so even if the area of the part to be adhered is extremely small, the adhesive can be efficiently placed in a precise position and in a precise amount. The effectiveness of the effect of attaching can be enhanced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional configuration diagram illustrating a main part of an adhesive application device according to an embodiment of the present invention;

FIG. 2 is a block diagram of a control system of the adhesive application device;

FIG. 3 is a waveform diagram of a driving voltage applied to a piezoelectric element portion of the adhesive application device.

FIG. 4 is a cross-sectional configuration diagram showing a main part of an adhesive application device according to a modified embodiment of the present invention;

FIG. 5 is a cross-sectional configuration diagram showing a peripheral configuration of the adhesive application device,

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adhesive adhesion apparatus 2a Discharge head part 2b Discharge head part 3a Adhesive supply part 3b Adhesive supply part 4 Position control function part 5a Liquid storage part 6a Discharge nozzle part 7a Piezoelectric element part 8 Position sensor 9 Head movement mechanism part 10 Control Part Aa Adhesive (first adhesive) Ab Adhesive (second adhesive) Aad droplet Abd droplet T Adhered part L Constant distance

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Yasushi Hori 1163 Shimoseikane, Inari-cho, Nagano City, Nagano Prefecture Inside Nagano Japan Radio Co., Ltd. Term (reference) 4F041 AA05 AB01 BA05 BA13 BA22 BA36 BA38 BA43 BA56

Claims (6)

[Claims] 1. A discharge head for discharging a droplet of an adhesive to a portion to be adhered, an adhesive supply unit for supplying an adhesive to the discharge head, and a position control function for controlling a position of the discharge head. An adhesive adhering device comprising a part. 2. The discharge head unit includes: a liquid reservoir that stores an adhesive supplied from the adhesive supply unit; a discharge nozzle that communicates with the liquid reservoir to discharge the adhesive to the outside; 2. The adhesive applying device according to claim 1, further comprising a piezoelectric element facing the liquid reservoir and applying a discharge pressure to the adhesive contained in the liquid reservoir by mechanical displacement. 3. A system comprising a pair of discharge heads for independently discharging each adhesive of a two-component mixed adhesive, and a pair of adhesive supply units for respectively supplying each adhesive to each discharge head. The adhesive application device according to claim 1 or 2, wherein 4. An angle of a discharge nozzle section in each discharge head section is set such that the adhesive can be discharged to a same adhered section separated by a predetermined distance in a stopped state. The adhesive application device according to claim 1, 2 or 3, wherein: 5. The position control function unit controls the position of each of the ejection head units during ejection so that the adhesive can be ejected onto the same adhered portion by a pair of ejection head units. 4. The adhesive application device according to 1, 2, or 3. 6. The position control function unit includes: a position sensor that detects a position of a portion to be adhered; a head moving mechanism that moves and controls the ejection head unit; and a position detection value obtained from the position sensor. 2. The apparatus according to claim 1, further comprising a control unit for giving a control command to the head moving mechanism unit.
The adhesive application device according to claim 1.