JP1665227S - - Google Patents

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Publication number
JP1665227S
JP1665227S JPD2019-26361F JP2019026361F JP1665227S JP 1665227 S JP1665227 S JP 1665227S JP 2019026361 F JP2019026361 F JP 2019026361F JP 1665227 S JP1665227 S JP 1665227S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-26361F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-26361F priority Critical patent/JP1665227S/ja
Priority to TW109302374F priority patent/TWD211239S/zh
Priority to US29/735,896 priority patent/USD997892S1/en
Application granted granted Critical
Publication of JP1665227S publication Critical patent/JP1665227S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-26361F 2019-11-28 2019-11-28 Active JP1665227S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2019-26361F JP1665227S (enExample) 2019-11-28 2019-11-28
TW109302374F TWD211239S (zh) 2019-11-28 2020-05-04 晶圓保持器之部分
US29/735,896 USD997892S1 (en) 2019-11-28 2020-05-26 End effector for handling wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-26361F JP1665227S (enExample) 2019-11-28 2019-11-28

Publications (1)

Publication Number Publication Date
JP1665227S true JP1665227S (enExample) 2020-08-03

Family

ID=71843040

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-26361F Active JP1665227S (enExample) 2019-11-28 2019-11-28

Country Status (3)

Country Link
US (1) USD997892S1 (enExample)
JP (1) JP1665227S (enExample)
TW (1) TWD211239S (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1107669S1 (en) 2022-05-02 2025-12-30 Lam Research Corporation Processing chamber purge plate
JP1744835S (ja) * 2022-10-13 2023-05-25 ロボット用グリッパー
USD1077046S1 (en) * 2022-12-01 2025-05-27 Koninklijke Philips N.V. Handle for nanoimprinting machine
TWD228828S (zh) 2023-03-23 2023-12-01 復泰科技股份有限公司 晶圓承盤
USD1106977S1 (en) * 2023-04-10 2025-12-23 Asm Ip Holding B.V. End effector
USD1107089S1 (en) * 2023-12-08 2025-12-23 Applied Materials, Inc. Substrate-handling robot end effector
TWD239150S (zh) 2024-08-02 2025-07-01 張寶杰 末端傳輸叉
USD1106082S1 (en) * 2025-03-06 2025-12-16 Asm Ip Holding B.V. End effector

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417757A (en) * 1981-11-09 1983-11-29 Morrison Thomas R Recording disc handling device
US4410209A (en) * 1982-03-11 1983-10-18 Trapani Silvio P Wafer-handling tool
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US4813732A (en) * 1985-03-07 1989-03-21 Epsilon Technology, Inc. Apparatus and method for automated wafer handling
US5004399A (en) * 1987-09-04 1991-04-02 Texas Instruments Incorporated Robot slice aligning end effector
KR0152324B1 (ko) * 1994-12-06 1998-12-01 양승택 웨이퍼 측면파지 이송 반도체 제조장치
US5622400A (en) * 1995-06-07 1997-04-22 Karl Suss America, Inc. Apparatus and method for handling semiconductor wafers
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
USD398207S (en) * 1997-06-13 1998-09-15 Nippon Light Metal Company Ltd. Disc holding tool
US6293749B1 (en) * 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
JPH11195687A (ja) * 1997-12-27 1999-07-21 Nippon Seiko Kk 基板搬送装置
CN1291345A (zh) * 1998-02-18 2001-04-11 应用材料有限公司 用在处理系统晶片搬运器上的端部操作装置
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
US6183026B1 (en) * 1999-04-07 2001-02-06 Gasonics International Corporation End effector
US6578893B2 (en) * 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
US7334826B2 (en) * 2001-07-13 2008-02-26 Semitool, Inc. End-effectors for handling microelectronic wafers
US6615113B2 (en) * 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US6678581B2 (en) * 2002-01-14 2004-01-13 Taiwan Semiconductor Manufacturing Co. Ltd Method of calibrating a wafer edge gripping end effector
JP2005209954A (ja) * 2004-01-23 2005-08-04 Kawasaki Heavy Ind Ltd 基板保持装置
US8182009B2 (en) * 2008-03-13 2012-05-22 Xyratex Technology, Ltd. End effector
TWD133946S1 (zh) * 2008-07-21 2010-03-21 Ａｓｍ吉尼泰克韓國股份有限公司 用於半導體沉積器械之基底轉換器
USD674365S1 (en) * 2011-01-20 2013-01-15 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD673923S1 (en) * 2011-01-20 2013-01-08 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD701498S1 (en) * 2011-10-20 2014-03-25 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
USD695240S1 (en) * 2011-10-20 2013-12-10 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor
SG194239A1 (en) * 2012-04-09 2013-11-29 Semiconductor Tech & Instr Inc End handler
JP2014086472A (ja) * 2012-10-19 2014-05-12 Sinfonia Technology Co Ltd クランプ装置及びワーク搬送ロボット
WO2014165406A1 (en) * 2013-04-01 2014-10-09 Brewer Science Inc. Apparatus and method for thin wafer transfer
US9536764B2 (en) * 2015-01-27 2017-01-03 Lam Research Corporation End effector for wafer transfer system and method of transferring wafers
JP6594177B2 (ja) * 2015-11-24 2019-10-23 平田機工株式会社 ハンド部材およびハンド
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
JP6276317B2 (ja) * 2016-03-31 2018-02-07 平田機工株式会社 ハンドユニットおよび移載方法
USD911986S1 (en) * 2019-05-03 2021-03-02 Raytheon Company Handheld semiconductor wafer handling tool

Also Published As

Publication number Publication date
TWD211239S (zh) 2021-05-01
USD997892S1 (en) 2023-09-05

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