JP1660179S - - Google Patents

Info

Publication number
JP1660179S
JP1660179S JPD2019-23721F JP2019023721F JP1660179S JP 1660179 S JP1660179 S JP 1660179S JP 2019023721 F JP2019023721 F JP 2019023721F JP 1660179 S JP1660179 S JP 1660179S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-23721F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-23721F priority Critical patent/JP1660179S/ja
Priority to TW109301937D02F priority patent/TWD209200S/zh
Application granted granted Critical
Publication of JP1660179S publication Critical patent/JP1660179S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-23721F 2019-10-25 2019-10-25 Active JP1660179S (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2019-23721F JP1660179S (enExample) 2019-10-25 2019-10-25
TW109301937D02F TWD209200S (zh) 2019-10-25 2020-04-10 製造半導體裝置用的膜片

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-23721F JP1660179S (enExample) 2019-10-25 2019-10-25

Publications (1)

Publication Number Publication Date
JP1660179S true JP1660179S (enExample) 2020-05-25

Family

ID=70775842

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-23721F Active JP1660179S (enExample) 2019-10-25 2019-10-25

Country Status (2)

Country Link
JP (1) JP1660179S (enExample)
TW (1) TWD209200S (enExample)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5452900B2 (ja) 2007-09-21 2014-03-26 株式会社半導体エネルギー研究所 半導体膜付き基板の作製方法
DE112014005031B4 (de) 2014-11-13 2019-04-25 Shindengen Electric Manufacturing Co., Ltd. Verfahren zur Herstellung eines Halbleiter-Bauelements und Vorrichtung zur Herstellung einer Glasschicht
KR102487552B1 (ko) 2018-02-05 2023-01-11 삼성전자주식회사 보호막 조성물 및 이를 이용한 반도체 패키지 제조 방법

Also Published As

Publication number Publication date
TWD209200S (zh) 2021-01-01

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