JP1655194S - - Google Patents

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Publication number
JP1655194S
JP1655194S JPD2019-12240F JP2019012240F JP1655194S JP 1655194 S JP1655194 S JP 1655194S JP 2019012240 F JP2019012240 F JP 2019012240F JP 1655194 S JP1655194 S JP 1655194S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-12240F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-12240F priority Critical patent/JP1655194S/ja
Priority to US29/713,752 priority patent/USD915308S1/en
Application granted granted Critical
Publication of JP1655194S publication Critical patent/JP1655194S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-12240F 2019-06-04 2019-06-04 Active JP1655194S (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2019-12240F JP1655194S (enExample) 2019-06-04 2019-06-04
US29/713,752 USD915308S1 (en) 2019-06-04 2019-11-19 Light emitting diode chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-12240F JP1655194S (enExample) 2019-06-04 2019-06-04

Publications (1)

Publication Number Publication Date
JP1655194S true JP1655194S (enExample) 2020-03-16

Family

ID=69780529

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-12240F Active JP1655194S (enExample) 2019-06-04 2019-06-04

Country Status (2)

Country Link
US (1) USD915308S1 (enExample)
JP (1) JP1655194S (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods
USD1102268S1 (en) 2024-06-12 2025-11-18 Creeled, Inc. Light-emitting diode package

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1104971S1 (en) * 2022-01-18 2025-12-09 Creeled, Inc. Light-emitting device package
USD1057674S1 (en) * 2023-02-08 2025-01-14 Autosystems, A Division Of Magna Exteriors Inc. Light emitting chip scale package
USD1102396S1 (en) * 2023-08-08 2025-11-18 Creeled, Inc. Light-emitting device package

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223112A (ja) * 2004-02-05 2005-08-18 Citizen Electronics Co Ltd 表面実装型発光ダイオード
TWD110647S1 (zh) * 2004-10-19 2006-05-01 羅姆電子股份有限公司 發光二極體
US10008637B2 (en) * 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
KR101020910B1 (ko) * 2008-12-24 2011-03-09 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR101853067B1 (ko) * 2011-08-26 2018-04-27 엘지이노텍 주식회사 발광 소자 패키지
KR20140070045A (ko) * 2012-11-30 2014-06-10 서울반도체 주식회사 발광 다이오드 및 그것을 제조하는 방법
US20150171274A1 (en) * 2013-12-17 2015-06-18 Industrial Technology Research Institute Led structure
KR20160032328A (ko) * 2014-09-15 2016-03-24 삼성전자주식회사 반도체 발광소자 패키지
US10431568B2 (en) * 2014-12-18 2019-10-01 Cree, Inc. Light emitting diodes, components and related methods
JP1553788S (enExample) * 2015-11-05 2016-07-11
KR102601579B1 (ko) * 2015-12-16 2023-11-13 삼성전자주식회사 발광소자 실장용 회로 기판 및 이를 이용한 반도체 발광소자 패키지
KR102659370B1 (ko) * 2016-11-25 2024-04-22 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
JP1599551S (enExample) 2017-08-23 2018-03-12
US10790267B2 (en) * 2017-08-28 2020-09-29 Lumens Co., Ltd. Light emitting element for pixel and LED display module
KR102471689B1 (ko) * 2017-12-22 2022-11-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods
USD1102268S1 (en) 2024-06-12 2025-11-18 Creeled, Inc. Light-emitting diode package

Also Published As

Publication number Publication date
USD915308S1 (en) 2021-04-06

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