JP1646388S - - Google Patents

Info

Publication number
JP1646388S
JP1646388S JPD2019-9324F JP2019009324F JP1646388S JP 1646388 S JP1646388 S JP 1646388S JP 2019009324 F JP2019009324 F JP 2019009324F JP 1646388 S JP1646388 S JP 1646388S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-9324F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-9324F priority Critical patent/JP1646388S/ja
Priority to US29/710,426 priority patent/USD929534S1/en
Priority to TW108306619F priority patent/TWD213830S/zh
Application granted granted Critical
Publication of JP1646388S publication Critical patent/JP1646388S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-9324F 2019-04-25 2019-04-25 Active JP1646388S (enrdf_load_stackoverflow)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2019-9324F JP1646388S (enrdf_load_stackoverflow) 2019-04-25 2019-04-25
US29/710,426 USD929534S1 (en) 2019-04-25 2019-10-23 Liquid discharge nozzle for semiconductor substrate processing apparatus
TW108306619F TWD213830S (zh) 2019-04-25 2019-10-24 液體噴吐用噴嘴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-9324F JP1646388S (enrdf_load_stackoverflow) 2019-04-25 2019-04-25

Publications (1)

Publication Number Publication Date
JP1646388S true JP1646388S (enrdf_load_stackoverflow) 2021-11-15

Family

ID=68610921

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-9324F Active JP1646388S (enrdf_load_stackoverflow) 2019-04-25 2019-04-25

Country Status (3)

Country Link
US (1) USD929534S1 (enrdf_load_stackoverflow)
JP (1) JP1646388S (enrdf_load_stackoverflow)
TW (1) TWD213830S (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD960300S1 (en) * 2019-09-18 2022-08-09 P. Bekkers Holding B.V. Nozzle for fluid distribution

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD341418S (en) * 1991-02-22 1993-11-16 Tokyo Electron Limited Supply nozzle for applying liquid resist to a semiconductor wafer
USD469790S1 (en) 2001-05-18 2003-02-04 Oy Trial Ab Nozzle
JP5638768B2 (ja) 2009-04-24 2014-12-10 武蔵エンジニアリング株式会社 ノズル回転機構およびそれを備える塗布装置
TWD141728S1 (zh) * 2010-01-27 2011-08-01 新東工業股份有限公司 鼓風用空氣噴嘴
TWD141729S1 (zh) * 2010-01-27 2011-08-01 新東工業股份有限公司 鼓風用噴嘴
USD774908S1 (en) 2014-04-10 2016-12-27 3M Innovative Properties Company Nozzle for syringe
USD771248S1 (en) 2014-10-01 2016-11-08 Adhezion Biomedical, Llc Dispensing applicator having a curved elongated nozzle
USD783784S1 (en) 2015-01-30 2017-04-11 Criser, S.A. De C.V. Nozzle for a drain hose
USD824966S1 (en) * 2016-10-14 2018-08-07 Oerlikon Metco (Us) Inc. Powder injector
USD823906S1 (en) * 2017-04-13 2018-07-24 Oerlikon Metco (Us) Inc. Powder injector
USD906485S1 (en) * 2017-09-27 2020-12-29 Natural Gas Solutions North America, Llc Shaft seal
USD910145S1 (en) * 2018-08-01 2021-02-09 Lutz Pumpen Gmbh Dispenser nozzle
USD903836S1 (en) * 2019-05-29 2020-12-01 Carefusion 303, Inc. Y-spigot body

Also Published As

Publication number Publication date
TWD213830S (zh) 2021-09-11
USD929534S1 (en) 2021-08-31

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