USD317592S
(en)
*
|
1987-01-19 |
1991-06-18 |
Canon Kabushiki Kaisha |
Semiconductor element
|
US5347160A
(en)
*
|
1992-09-28 |
1994-09-13 |
Sundstrand Corporation |
Power semiconductor integrated circuit package
|
JP2891665B2
(en)
*
|
1996-03-22 |
1999-05-17 |
株式会社日立製作所 |
Semiconductor integrated circuit device and method of manufacturing the same
|
USD401567S
(en)
*
|
1997-04-25 |
1998-11-24 |
Micron Technology, Inc. |
Temporary package for semiconductor dice
|
EP0884781A3
(en)
*
|
1997-06-12 |
1999-06-30 |
Hitachi, Ltd. |
Power semiconductor module
|
US6268650B1
(en)
*
|
1999-05-25 |
2001-07-31 |
Micron Technology, Inc. |
Semiconductor device, ball grid array connection system, and method of making
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USD441726S1
(en)
*
|
1999-07-14 |
2001-05-08 |
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho |
Semiconductor element
|
JP4151209B2
(en)
*
|
2000-08-29 |
2008-09-17 |
三菱電機株式会社 |
Power semiconductor device
|
US6774465B2
(en)
*
|
2001-10-05 |
2004-08-10 |
Fairchild Korea Semiconductor, Ltd. |
Semiconductor power package module
|
USD522470S1
(en)
*
|
2004-09-09 |
2006-06-06 |
Kabushiki Kaisha Toshiba |
Portion of a semiconductor device
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JP5041798B2
(en)
*
|
2006-12-15 |
2012-10-03 |
三菱電機株式会社 |
Semiconductor device
|
USD653634S1
(en)
*
|
2010-10-28 |
2012-02-07 |
Fuji Electric Co., Ltd. |
Semiconductor
|
USD653633S1
(en)
*
|
2010-12-14 |
2012-02-07 |
Fuji Electric Co., Ltd. |
Semiconductor
|
USD686174S1
(en)
*
|
2011-08-12 |
2013-07-16 |
Fuji Electric Co., Ltd |
Semiconductor device
|
USD774479S1
(en)
*
|
2014-11-28 |
2016-12-20 |
Fuji Electric Co., Ltd. |
Semiconductor module
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USD748595S1
(en)
*
|
2015-02-03 |
2016-02-02 |
Infineon Technologies Ag |
Power semiconductor module
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USD766851S1
(en)
*
|
2015-02-04 |
2016-09-20 |
Mitsubishi Electric Corporation |
Semiconductor device
|
USD799439S1
(en)
*
|
2016-05-31 |
2017-10-10 |
Rohm Co., Ltd. |
Power converting semiconductor module
|
USD864884S1
(en)
*
|
2017-10-23 |
2019-10-29 |
Mitsubishi Electric Corporation |
Semiconductor device
|