JP1621290S - - Google Patents
Info
- Publication number
- JP1621290S JP1621290S JPD2018-12018F JP2018012018F JP1621290S JP 1621290 S JP1621290 S JP 1621290S JP 2018012018 F JP2018012018 F JP 2018012018F JP 1621290 S JP1621290 S JP 1621290S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EM45378430001 | 2017-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1621290S true JP1621290S (en:Method) | 2019-01-07 |
Family
ID=64899804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2018-12018F Active JP1621290S (en:Method) | 2017-12-06 | 2018-05-31 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD873225S1 (en:Method) |
| JP (1) | JP1621290S (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD214051S (zh) * | 2021-03-23 | 2021-09-11 | 勤誠興業股份有限公司 | 機殼面板 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD375725S (en) * | 1996-02-28 | 1996-11-19 | Dodson Douglas A | Cooling device |
| USD398589S (en) * | 1997-05-27 | 1998-09-22 | Dodson Douglas A | Cooling device |
| USD407714S (en) * | 1998-01-21 | 1999-04-06 | Ming Hsin Yeh | Cooling device for the CPU of computer |
| USD403666S (en) * | 1998-04-01 | 1999-01-05 | Rockford Corporation | Heat sink |
| USD428892S (en) * | 1999-03-25 | 2000-08-01 | Avcom Technologies, Inc. | Equipment face |
| USD449587S1 (en) * | 2001-02-28 | 2001-10-23 | Andrew Corporation | Heat sink |
| USD490785S1 (en) * | 2002-04-11 | 2004-06-01 | Innoveta Technologies | Converter |
| USD483019S1 (en) * | 2002-12-10 | 2003-12-02 | Vanner, Inc. | Heat sink for electronic equipment |
| USD496939S1 (en) * | 2003-05-05 | 2004-10-05 | Motorola, Inc. | Sealed central processing unit cooling apparatus |
| USD508047S1 (en) * | 2004-01-06 | 2005-08-02 | Pfu Limited | Computing device |
| USD606017S1 (en) * | 2006-08-21 | 2009-12-15 | Siemens Aktiengesellschaft | Convection cooled frequency converter |
| US8605434B2 (en) * | 2012-05-01 | 2013-12-10 | Adlink Technology Inc. | Wall-mounting structure for wall-mounted electronic device |
| USD727920S1 (en) * | 2013-04-02 | 2015-04-28 | Nec Corporation | Front panel for a computer |
| JP1552176S (en:Method) * | 2015-10-23 | 2016-06-20 | ||
| DE202016101176U1 (de) | 2016-03-04 | 2016-06-03 | Omron Corporation | Gehäuse für einen Monitor eines Industriecomputers, Monitor für einen Industriecomputer und Industriecomputer |
| JP1566258S (en:Method) * | 2016-04-15 | 2016-12-26 | ||
| JP1567358S (en:Method) * | 2016-07-26 | 2017-01-23 |
-
2018
- 2018-05-31 JP JPD2018-12018F patent/JP1621290S/ja active Active
- 2018-06-05 US US29/650,237 patent/USD873225S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD873225S1 (en) | 2020-01-21 |