JP1604437S - - Google Patents
Info
- Publication number
- JP1604437S JP1604437S JPD2017-23264F JP2017023264F JP1604437S JP 1604437 S JP1604437 S JP 1604437S JP 2017023264 F JP2017023264 F JP 2017023264F JP 1604437 S JP1604437 S JP 1604437S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-23264F JP1604437S (ja) | 2017-10-20 | 2017-10-20 | |
| US29/642,721 USD855572S1 (en) | 2017-10-20 | 2018-04-02 | Connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-23264F JP1604437S (ja) | 2017-10-20 | 2017-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1604437S true JP1604437S (ja) | 2018-05-21 |
Family
ID=62151176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2017-23264F Active JP1604437S (ja) | 2017-10-20 | 2017-10-20 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD855572S1 (ja) |
| JP (1) | JP1604437S (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1624136S (ja) * | 2018-08-24 | 2019-02-12 | ||
| JP1624135S (ja) * | 2018-08-24 | 2019-02-12 | ||
| JP1682881S (ja) * | 2020-09-29 | 2021-04-05 | ||
| JP1703900S (ja) * | 2021-05-14 | 2022-01-04 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5073116A (en) * | 1991-03-01 | 1991-12-17 | Amp Incorporated | Surface mount LCC socket |
| US6452113B2 (en) * | 1999-07-15 | 2002-09-17 | Incep Technologies, Inc. | Apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| US6752632B1 (en) * | 2003-03-21 | 2004-06-22 | The Boeing Company | Connector interface pad for structurally integrated wiring |
| US6780056B1 (en) * | 2003-07-31 | 2004-08-24 | Intercon Systems, Inc. | EMI-shielded interposer assembly |
| USD531122S1 (en) * | 2004-03-12 | 2006-10-31 | Smk Corporation | Electrical connector |
| US7029308B2 (en) * | 2005-02-17 | 2006-04-18 | Hirose Electric Co., Ltd. | Socket for electronic module |
| TWM279071U (en) * | 2005-02-25 | 2005-10-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| WO2006093155A1 (ja) * | 2005-03-01 | 2006-09-08 | Matsushita Electric Industrial Co., Ltd. | 基板間接続コネクタ及び基板間接続コネクタを用いた回路基板装置 |
| USD524246S1 (en) * | 2005-03-08 | 2006-07-04 | Cheng, Uei Precision Industry Co., Ltd. | Camera module socket connector |
| US7371076B2 (en) * | 2006-08-02 | 2008-05-13 | A Point Technology Co., Ltd. | Chip socket structure |
| TWM367467U (en) * | 2009-04-13 | 2009-10-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
-
2017
- 2017-10-20 JP JPD2017-23264F patent/JP1604437S/ja active Active
-
2018
- 2018-04-02 US US29/642,721 patent/USD855572S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD855572S1 (en) | 2019-08-06 |