ITUB20169865A1 - PROCEDURE FOR ASSEMBLING COMPONENTS ON A SUBSTRATE, SUBSTRATE AND CORRESPONDENT DEVICE - Google Patents

PROCEDURE FOR ASSEMBLING COMPONENTS ON A SUBSTRATE, SUBSTRATE AND CORRESPONDENT DEVICE

Info

Publication number
ITUB20169865A1
ITUB20169865A1 ITUB2016A009865A ITUB20169865A ITUB20169865A1 IT UB20169865 A1 ITUB20169865 A1 IT UB20169865A1 IT UB2016A009865 A ITUB2016A009865 A IT UB2016A009865A IT UB20169865 A ITUB20169865 A IT UB20169865A IT UB20169865 A1 ITUB20169865 A1 IT UB20169865A1
Authority
IT
Italy
Prior art keywords
substrate
procedure
assembling components
correspondent device
correspondent
Prior art date
Application number
ITUB2016A009865A
Other languages
Italian (it)
Inventor
Federico Poggi
Andrea Viale
Original Assignee
Osram Gmbh
Osram Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh, Osram Spa filed Critical Osram Gmbh
Priority to ITUB2016A009865A priority Critical patent/ITUB20169865A1/en
Publication of ITUB20169865A1 publication Critical patent/ITUB20169865A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
ITUB2016A009865A 2016-01-07 2016-01-07 PROCEDURE FOR ASSEMBLING COMPONENTS ON A SUBSTRATE, SUBSTRATE AND CORRESPONDENT DEVICE ITUB20169865A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ITUB2016A009865A ITUB20169865A1 (en) 2016-01-07 2016-01-07 PROCEDURE FOR ASSEMBLING COMPONENTS ON A SUBSTRATE, SUBSTRATE AND CORRESPONDENT DEVICE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUB2016A009865A ITUB20169865A1 (en) 2016-01-07 2016-01-07 PROCEDURE FOR ASSEMBLING COMPONENTS ON A SUBSTRATE, SUBSTRATE AND CORRESPONDENT DEVICE

Publications (1)

Publication Number Publication Date
ITUB20169865A1 true ITUB20169865A1 (en) 2017-07-07

Family

ID=55795127

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUB2016A009865A ITUB20169865A1 (en) 2016-01-07 2016-01-07 PROCEDURE FOR ASSEMBLING COMPONENTS ON A SUBSTRATE, SUBSTRATE AND CORRESPONDENT DEVICE

Country Status (1)

Country Link
IT (1) ITUB20169865A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4389771A (en) * 1981-01-05 1983-06-28 Western Electric Company, Incorporated Treatment of a substrate surface to reduce solder sticking
US20080093114A1 (en) * 2004-01-16 2008-04-24 Lee Yu-Tuan Circuit board
WO2010090055A1 (en) * 2009-02-05 2010-08-12 株式会社村田製作所 Electrode connection structure and method for manufacturing the same
EP2234466A1 (en) * 2007-12-26 2010-09-29 Fujikura, Ltd. Mounted board and method for manufacturing the same
WO2013153673A1 (en) * 2012-04-14 2013-10-17 新電元工業株式会社 Wiring base material for mounting electronic component thereon, method for manufacturing wiring base material for mounting electronic component thereon, electronic circuit module, and land forming apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4389771A (en) * 1981-01-05 1983-06-28 Western Electric Company, Incorporated Treatment of a substrate surface to reduce solder sticking
US20080093114A1 (en) * 2004-01-16 2008-04-24 Lee Yu-Tuan Circuit board
EP2234466A1 (en) * 2007-12-26 2010-09-29 Fujikura, Ltd. Mounted board and method for manufacturing the same
WO2010090055A1 (en) * 2009-02-05 2010-08-12 株式会社村田製作所 Electrode connection structure and method for manufacturing the same
WO2013153673A1 (en) * 2012-04-14 2013-10-17 新電元工業株式会社 Wiring base material for mounting electronic component thereon, method for manufacturing wiring base material for mounting electronic component thereon, electronic circuit module, and land forming apparatus

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