ITTO20060089A1 - METHOD FOR LASER TREATMENT OF IMPLANTABLE DEVICES, IMPLANTABLE DEVICES OBTAINED WITH THIS METHOD AND LASER SYSTEM FOR THE TREATMENT OF IMPLANTABLE DEVICES - Google Patents

METHOD FOR LASER TREATMENT OF IMPLANTABLE DEVICES, IMPLANTABLE DEVICES OBTAINED WITH THIS METHOD AND LASER SYSTEM FOR THE TREATMENT OF IMPLANTABLE DEVICES Download PDF

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Publication number
ITTO20060089A1
ITTO20060089A1 IT000089A ITTO20060089A ITTO20060089A1 IT TO20060089 A1 ITTO20060089 A1 IT TO20060089A1 IT 000089 A IT000089 A IT 000089A IT TO20060089 A ITTO20060089 A IT TO20060089A IT TO20060089 A1 ITTO20060089 A1 IT TO20060089A1
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IT
Italy
Prior art keywords
pores
generator
diameter
laser beam
laser
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Application number
IT000089A
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Italian (it)
Inventor
Narda Francesca Di
Enrico Gallus
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R T M S P A
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Filing date
Publication date
Application filed by R T M S P A filed Critical R T M S P A
Priority to IT000089A priority Critical patent/ITTO20060089A1/en
Priority to EP07705559A priority patent/EP1991169A1/en
Priority to PCT/IB2007/000295 priority patent/WO2007091155A1/en
Publication of ITTO20060089A1 publication Critical patent/ITTO20060089A1/en

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C13/00—Dental prostheses; Making same
    • A61C13/0003—Making bridge-work, inlays, implants or the like
    • A61C13/0006—Production methods
    • A61C13/0018—Production methods using laser
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C8/00—Means to be fixed to the jaw-bone for consolidating natural teeth or for fixing dental prostheses thereon; Dental implants; Implanting tools
    • A61C8/0012—Means to be fixed to the jaw-bone for consolidating natural teeth or for fixing dental prostheses thereon; Dental implants; Implanting tools characterised by the material or composition, e.g. ceramics, surface layer, metal alloy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C8/00—Means to be fixed to the jaw-bone for consolidating natural teeth or for fixing dental prostheses thereon; Dental implants; Implanting tools
    • A61C8/0018—Means to be fixed to the jaw-bone for consolidating natural teeth or for fixing dental prostheses thereon; Dental implants; Implanting tools characterised by the shape
    • A61C8/0037—Details of the shape
    • A61C2008/0046—Textured surface, e.g. roughness, microstructure
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02—Prostheses implantable into the body
    • A61F2/30—Joints
    • A61F2/30767—Special external or bone-contacting surface, e.g. coating for improving bone ingrowth
    • A61F2/30771—Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves
    • A61F2002/30795—Blind bores, e.g. of circular cross-section
    • A61F2002/30807—Plurality of blind bores
    • A61F2002/30808—Plurality of blind bores parallel
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02—Prostheses implantable into the body
    • A61F2/30—Joints
    • A61F2/30767—Special external or bone-contacting surface, e.g. coating for improving bone ingrowth
    • A61F2/30771—Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves
    • A61F2002/30838—Microstructures
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02—Prostheses implantable into the body
    • A61F2/30—Joints
    • A61F2/30767—Special external or bone-contacting surface, e.g. coating for improving bone ingrowth
    • A61F2/30771—Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves
    • A61F2002/3085—Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves with a threaded, e.g. self-tapping, bone-engaging surface, e.g. external surface
    • A61F2002/30871—Trapezoidal threads
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02—Prostheses implantable into the body
    • A61F2/30—Joints
    • A61F2/3094—Designing or manufacturing processes
    • A61F2002/3097—Designing or manufacturing processes using laser
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00—Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005—The prosthesis being constructed from a particular material
    • A61F2310/00011—Metals or alloys
    • A61F2310/00023—Titanium or titanium-based alloys, e.g. Ti-Ni alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/14—Titanium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Description

D E SC R I Z ION E DESCRIPTION

di brevetto per invenzione industriale di patent for industrial invention of

La presente invenzione si riferisce ad un metodo per il trattamento laser di dispositivi impiantabili, a dispositivi impiantabili ottenuti con tale metodo, nonché ad un sistema laser per il trattamento laser di dispositivi impiantabili. The present invention refers to a method for the laser treatment of implantable devices, to implantable devices obtained with this method, as well as to a laser system for the laser treatment of implantable devices.

Nel campo dell'implantologia, ed in particolare dell'implantologia orale, è noto che la risposta cellulare del tessuto ospite è influenzata dalla rugosità superficiale dell'impianto. In the field of implantology, and in particular of oral implantology, it is known that the cellular response of the host tissue is influenced by the surface roughness of the implant.

E' stato infatti dimostrato che la microtopografia superficiale dell'impianto influenza l'adesione, la proliferazione, la crescita, la migrazione, l'orientamento e la differenziazione delle cellule del tessuto ospite. Indeed, implant surface microtopography has been shown to influence adhesion, proliferation, growth, migration, orientation and differentiation of host tissue cells.

Gli studi condotti hanno dimostrato che superiici microlavorate, caratterizzate da un controllo della struttura superficiale più preciso di quello consentito dalle comuni tecniche di irruvidimento superficiale (sabbiatura, mordenzatura, plasma-spray) , migliorano e accelerano l'integrazione di un dispositivo medico nel tessuto circostante. The studies conducted have shown that micro-finished products, characterized by a control of the surface structure more precise than that allowed by common surface roughening techniques (sandblasting, etching, plasma-spray), improve and accelerate the integration of a medical device into the surrounding tissue. .

Scopo della presente invenzione è la realizzazione di un metodo di trattamento laser che consenta di ottenere sul dispositivo impiantabile una superficie con caratteristiche morfologiche ripetibili e controllate a livello micrometrico, in grado di ottimizzare la risposta del tessuto circostante al dispositivo, senza introdurre nel contempo contaminazioni chimiche. The purpose of the present invention is the realization of a laser treatment method that allows to obtain on the implantable device a surface with repeatable morphological characteristics and controlled at a micrometric level, capable of optimizing the response of the surrounding tissue to the device, without introducing at the same time chemical contamination. .

Ulteriore scopo della presente invenzione è, nel contempo, quello di ottenere un'elevata velocità di processo e quindi un'elevata produttività. A further object of the present invention is, at the same time, that of obtaining a high process speed and therefore a high productivity.

Il suddetto scopo è raggiunto da un metodo di trattamento laser di un dispositivo impiantabile comprendente la fasi di The above object is achieved by a method of laser treatment of an implantable device comprising the steps of

generare un fascio laser impulsato mediante un generatore laser allo stato solido pompato a diodi (DPSS) in regime di Q-switch; generating a pulsed laser beam by means of a diode-pumped solid-state laser generator (DPSS) in the Q-switch regime;

focalizzare il fascio laser su una superficie del dispositivo impiantabile; e focusing the laser beam on a surface of the implantable device; And

movimentare il fascio laser rispetto alla detta superficie secondo un moto relativo di scansione per realizzare una morfologia superficiale comprendente una distribuzione controllata e sostanzialmente omogenea di pori, moving the laser beam with respect to said surface according to a relative scanning motion to achieve a surface morphology comprising a controlled and substantially homogeneous distribution of pores,

la potenza del fascio laser essendo determinata in modo da realizzare pori aventi diametro e profondità compresi fra 3 e 150 pm, the power of the laser beam being determined so as to produce pores having a diameter and depth between 3 and 150 µm,

il moto di scansione e la frequenza degli impulsi essendo controllati in modo da realizzare pori con un passo compreso fra 3 e 300 μm. the scanning motion and the frequency of the pulses being controlled so as to create pores with a pitch of between 3 and 300 μm.

La presente invenzione è altresì relativa ad un sistema laser per il trattamento di un dispositivo impiantabile per realizzare sul detto dispositivo una morfologia superficiale comprendente una distribuzione controllata di pori, caratterizzato dal fatto di comprendere un generatore allo stato solido pompato a diodi (DPSS) in regime di Q-switch per generare un fascio laser impulsato di potenza tale da realizzare pori aventi diametro compreso fra 3 e 150 pm, mezzi di focalizzazione del fascio laser su una superficie del dispositivo, mezzi di movimentazione relativa per spostare il fascio laser rispetto alla detta superficie per realizzare un moto relativo di scansione della detta superficie mediante il detto fascio laser, e mezzi di controllo dei detti mezzi di movimentazione relativa per realizzare un moto di scansione tale da produrre pori con un passo compreso fra 3 e 300 pm. The present invention also relates to a laser system for the treatment of an implantable device to create a surface morphology on said device comprising a controlled distribution of pores, characterized in that it comprises a diode pumped solid state generator (DPSS) in steady state of Q-switches to generate a pulsed laser beam of such power as to create pores having a diameter between 3 and 150 µm, means for focusing the laser beam on a surface of the device, relative movement means for moving the laser beam with respect to said surface for realizing a relative scanning motion of said surface by means of said laser beam, and control means for said relative moving means for realizing a scanning motion such as to produce pores with a pitch of between 3 and 300 µm.

La presente invenzione è inoltre relativa ad un dispositivo impiantabile comprendente una superficie provvista di una distribuzione controllata di pori aventi diametro e profondità compresi fra 3 e 150 pm e un passo compreso fra 3 e 300 pm. The present invention also relates to an implantable device comprising a surface provided with a controlled distribution of pores having a diameter and depth between 3 and 150 µm and a pitch between 3 and 300 µm.

Per una migliore comprensione della presente invenzione vengono descritte nel seguito alcune forme preferite di attuazione, a titolo di esempi non limitativi e con riferimento ai disegni allegati, nei quali: For a better understanding of the present invention, some preferred embodiments are described below, by way of non-limiting examples and with reference to the attached drawings, in which:

la figura 1 è una vista schematica in elevazione di un impianto endosseo realizzato secondo la presente invenzione; Figure 1 is a schematic elevation view of an endosseous implant made according to the present invention;

la figura 2 illustra schematicamente una porzione di superficie dell'impianto; Figure 2 schematically illustrates a surface portion of the implant;

le figure 3, 4 e 5 sono immagini ingrandite, con ingrandimenti crescenti, di un particolare di una superficie dell'impianto trattata mediante il metodo della presente invenzione; e Figures 3, 4 and 5 are enlarged images, with increasing enlargements, of a detail of an implant surface treated by the method of the present invention; And

le figure 6 e 7 sono due schemi di sistemi laser per il trattamento di impianti endossei secondo la presente invenzione. Figures 6 and 7 are two diagrams of laser systems for the treatment of endosseous implants according to the present invention.

Con riferimento alla figura 1, è indicato nel suo complesso con 1 un impianto endosseo, in particolare un impianto dentale. With reference to Figure 1, the reference number 1 as a whole indicates an endosseous implant, in particular a dental implant.

L'impianto 1, illustrato a puro titolo esemplificativo, comprende un gambo filettato 2 ed una testa 3 sostanzialmente cilindrica o leggermente conica, ed è provvisto di una sede interna 4 assiale filettata, assialmente aperta dalla parte della testa 3, per il collegamento di un elemento protesico. L'impianto 1 è atto ad essere inserito in un sito impiantare ricavato chirurgicamente in un osso mandibolare o mascellare del paziente, ed è realizzato in titanio commercialmente puro oppure in una lega metallica biocompatibile, ad esempio una lega di titanio. The implant 1, illustrated purely by way of example, comprises a threaded shank 2 and a substantially cylindrical or slightly conical head 3, and is provided with an axial threaded internal seat 4, axially open from the part of the head 3, for the connection of a prosthetic element. The implant 1 is adapted to be inserted in an implant site surgically obtained in a mandibular or maxillary bone of the patient, and is made of commercially pure titanium or of a biocompatible metal alloy, for example a titanium alloy.

Secondo la presente invenzione, la superficie laterale 4 dell'impianto 1 presenta microfori o pori 5 superficiali realizzati mediante un trattamento laser. According to the present invention, the lateral surface 4 of the implant 1 has microholes or surface pores 5 made by means of a laser treatment.

I pori 5 sono disposti secondo una pluralità di file 6 affiancate ed equispaziate fra loro. Le file possono avere andamento rettilineo o preferibilmente elicoidale, come meglio descritto nel seguito. I pori possono presentare una disposizione a matrice quadrata, a nido d'ape o altra configurazione. The pores 5 are arranged according to a plurality of rows 6 side by side and equally spaced from each other. The rows can have a rectilinear or preferably helical course, as better described below. The pores may have a square matrix, honeycomb or other configuration.

Diametro e profondità dei pori sono compresi fra 3 e 150 μm, preferibilmente fra 3 e 30 μm ed ancor più preferibilmente fra 5 e 20 μm. Il passo medio fra pori adiacenti è pari a 3-300 μm, preferibilmente 5-150 μιη e ancor più preferibilmente 10-30μπι. Diameter and depth of the pores are between 3 and 150 μm, preferably between 3 and 30 μm and even more preferably between 5 and 20 μm. The average pitch between adjacent pores is equal to 3-300 μm, preferably 5-150 μιη and even more preferably 10-30μπι.

Prove svolte in vitro su campioni di titanio trattati laser con pori rispettivamente di 5, 10 e 20 μm di diametro e profondità hanno rivelato una tendenza alla proliferazione cellulare crescente con le dimensioni dei pori. Tests carried out in vitro on laser-treated titanium samples with pores of 5, 10 and 20 μm in diameter and depth, respectively, revealed a tendency for cell proliferation increasing with pore size.

Dimensioni minori dei pori sono peraltro considerate maggiormente "biomimetiche", cioè in grado di simulare meglio la morfologia del tessuto osseo e pertanto stimolare la differenziazione cellulare a vantaggio di caratteristiche di tipo osteoblastico . Smaller pore sizes are also considered to be more "biomimetic", ie able to better simulate the morphology of the bone tissue and therefore stimulate cell differentiation to the advantage of osteoblastic characteristics.

Si ritiene pertanto che il miglior compromesso fra la proliferazione e la differenziazione cellulare sia ottenibile nel campo di dimensioni dei pori compreso fra 5 e 20 μm. It is therefore believed that the best compromise between cell proliferation and differentiation is obtainable in the pore size range between 5 and 20 μm.

Le figure da 3 a 5 sono fotografie realizzate al microscopio, con livelli crescenti di ingrandimento, di un esempio di impianto trattato al laser secondo la presente invenzione. Figures 3 to 5 are photographs taken under the microscope, with increasing levels of magnification, of an example of a laser-treated implant according to the present invention.

Le figure 6 e 7 illustrano due possibili sistemi laser 10, 11 per il trattamento degli impianti. Figures 6 and 7 illustrate two possible laser systems 10, 11 for treating implants.

La figura 6 illustra un sistema 10 semplificato in grado di realizzare una distribuzione di pori sulla superficie dell'impianto sostanzialmente omogenea anche se non perfetta, ma con una produttività moto elevata. Figure 6 illustrates a simplified system 10 capable of providing a substantially homogeneous distribution of pores on the surface of the implant although not perfect, but with a very high productivity.

Il sistema 10 comprende un generatore laser 12, una testa 13 a scansione, ed un gruppo porta-pezzo 14 per il supporto, il posizionamento e la movimentazione degli impianti 1 durante la lavorazione . The system 10 comprises a laser generator 12, a scanning head 13, and a workpiece holder assembly 14 for supporting, positioning and moving the systems 1 during processing.

Il gruppo portapezzo 14 comprende essenzialmente una tavola orizzontale 15 mobile secondo due assi orizzontali (X, Y) mutuamente perpendicolari fra loro, ed un mandrino 16 di presa del pezzo girevole intorno ad un proprio asse a coincidente in uso con l'asse dell'impianto in lavorazione. Il mandrino è portato da una testa 17 portata dalla tavola 15 ed orientabile intorno ad un asse β orizzontale e perpendicolare all'asse a, in modo da poter variare l'inclinazione dell'asse (a) dell'impianto e compensare l'eventuale conicità dell'impianto da lavorare . The workpiece holder assembly 14 essentially comprises a horizontal table 15 movable along two horizontal axes (X, Y) mutually perpendicular to each other, and a mandrel 16 for gripping the workpiece that can rotate around its own axis a coinciding in use with the axis of the plant. under processing. The spindle is carried by a head 17 carried by the table 15 and can be oriented around a horizontal β axis and perpendicular to the a axis, so as to be able to vary the inclination of the axis (a) of the implant and compensate for any taper of the plant to be processed.

Il generatore laser 12 è di tipo DPSS (allo stato solido pompato a diodi) in regime di Q-switch. Il fascio laser L generato viene inviato lungo un percorso ottico P alla testa 13 a scansione disposta al disopra della tavola. La testa 13 a scansione è atta a fare oscillare il fascio laser lungo un piano verticale contenente l'asse a del mandrino 16, con un moto alternato di andata e ritorno fra due posizioni limite formanti un angolo prefissato fra loro, così da dirigere il fascio sull'impianto sostanzialmente lungo una generatrice dell'impianto stesso. The laser generator 12 is of the DPSS type (solid state diode pumped) in Q-switch regime. The generated laser beam L is sent along an optical path P to the scanning head 13 arranged above the table. The scanning head 13 is adapted to make the laser beam oscillate along a vertical plane containing the axis a of the spindle 16, with an alternating back and forth motion between two limit positions forming a predetermined angle between them, so as to direct the beam. on the plant substantially along a generator of the plant itself.

La testa 13 a scansione è convenientemente provvista di un obiettivo 18 f-theta in grado di focalizzare correttamente il fascio L al variare della sua posizione durante il movimento di scansione . The scanning head 13 is conveniently provided with an f-theta objective 18 capable of correctly focusing the beam L as its position varies during the scanning movement.

La testa 13 a scansione è convenientemente montata su una guida verticale 20 (asse Z) che consente di regolarne la posizione verticale. The scanning head 13 is conveniently mounted on a vertical guide 20 (Z axis) which allows its vertical position to be adjusted.

Un'unità di controllo 24 comanda in modo coordinato il generatore laser 12, la testa 13 a scansione ed il gruppo portapezzo 14. A control unit 24 controls the laser generator 12, the scanning head 13 and the workpiece holder assembly 14 in a coordinated manner.

Da quanto precede, risulta evidente che gli assi X, Y, Z e β sono soltanto assi di posizionamento preliminare, che non vengono interessati dai movimenti della lavorazione. From the above, it is evident that the X, Y, Z and β axes are only preliminary positioning axes, which are not affected by the machining movements.

La lavorazione viene eseguita mediante scansione dell'impianto 1 con il fascio laser L mosso dalla testa 13 a scansione, e la contemporanea rotazione dell'impianto intorno all'asse a. The processing is performed by scanning the implant 1 with the laser beam L moved by the scanning head 13, and the simultaneous rotation of the implant around the axis a.

Il laser in regime di Q-sw (impulsi a nanosecondi) consente di realizzare durante il moto di scansione una successione di pori, sincronizzando opportunamente velocità di scansione e frequenza degli impulsi. Grazie all'elevata frequenza degli impulsi (es. 10 kHz) è possibile operare a velocità di scansione molto elevate (es. 300 mm/s). The laser in the Q-sw regime (nanosecond pulses) makes it possible to create a succession of pores during the scanning motion, suitably synchronizing the scanning speed and the frequency of the pulses. Thanks to the high pulse frequency (eg 10 kHz) it is possible to operate at very high scanning speeds (eg 300 mm / s).

La rotazione del pezzo può essere intermittente oppure, preferibilmente, continua. Nel primo caso, ciascuna corsa del moto di scansione laser descrive una generatrice dell'impianto, che rimane fermo durante la lavorazione; l'impianto viene quindi ruotato di un passo al termine di ciascuna corsa di scansione . The rotation of the piece can be intermittent or, preferably, continuous. In the first case, each stroke of the laser scanning motion describes a generator of the implant, which remains stationary during processing; the implant is then rotated one step at the end of each scan stroke.

Nel secondo caso, la scansione laser, in combinazione con la rotazione continua dell'impianto, descrive su quest'ultimo una successione di linee elicoidali . In the second case, laser scanning, in combination with the continuous rotation of the implant, describes a succession of helical lines on the latter.

In questo modo è possibile semplificare al massimo i controlli ed ottimizzare la velocità di produzione. In this way it is possible to simplify the controls as much as possible and optimize the production speed.

Poiché il fascio laser L è sempre diretto sull'impianto 1 in direzione sostanzialmente perpendicolare alla generatrice scandita (a meno dell'inclinazione dovuta al moto di scansione), l'incidenza del fascio laser è effettivamente normale alla superficie dell'impianto soltanto nelle zone di valle e di cresta del filetto, ma è necessariamente inclinata nella zona dei fianchi dei filetti. Ciò può produrre sia un'alterazione dimensionale dei pori, sia una variazione locale nella distribuzione degli stessi. In questo caso, le dimensioni ed il passo dei pori descritti e rivendicati sono da intendersi come valori medi. Since the laser beam L is always directed on the implant 1 in a direction substantially perpendicular to the scanned generator (except for the inclination due to the scanning motion), the incidence of the laser beam is actually normal to the implant surface only in the areas of valley and crest of the fillet, but it is necessarily inclined in the area of the sides of the fillets. This can produce both a dimensional alteration of the pores and a local variation in their distribution. In this case, the dimensions and the pitch of the pores described and claimed are to be understood as average values.

In generale, queste disuniformità sono tollerabili e non alterano in modo significativo le caratteristiche biomimetiche della finitura superficiale 1. In general, these non-uniformities are tolerable and do not significantly alter the biomimetic characteristics of the surface finish 1.

Il sistema 11 della figura 7 differisce da quello della figura 6 in quanto è in grado di controllare l'angolo di incidenza del fascio laser sull'impianto . The system 11 of Figure 7 differs from that of Figure 6 in that it is able to control the angle of incidence of the laser beam on the plant.

In questo caso, il fascio laser L è diretto sull'impianto da una testa di focalizzazione 24 mobile secondo due assi Y e Z, mediante i quali è possibile controllare la posizione del fascio L lungo l'asse dell'impianto 1 e la distanza della testa di focalizzazione rispetto alla superficie dell'impianto. L'impianto è montato su una testa porta-pezzo 26 avente due gradi di libertà rotazionali (intorno agli assi a e β). In this case, the laser beam L is directed on the implant by a focusing head 24 movable along two axes Y and Z, by means of which it is possible to control the position of the beam L along the axis of the implant 1 and the distance of the focusing head with respect to the implant surface. The implant is mounted on a workpiece head 26 having two rotational degrees of freedom (around the a and β axes).

L'unità di controllo 24 controlla i quattro assi in modo coordinato durante la lavorazione, in modo da mantenere la direzione di incidenza del fascio laser sull'impianto 1 istante per istante sostanzialmente perpendicolare alla superficie dell'impianto stesso. The control unit 24 controls the four axes in a coordinated manner during processing, so as to maintain the direction of incidence of the laser beam on the implant 1 instant by instant substantially perpendicular to the surface of the implant itself.

Per la realizzazione di pori con dimensioni comprese fra 3 e 15 μm vengono utilizzati convenientemente laser DPSS in Q-switch nell'UV (terza e quarta armonica, lunghezza d'onda di 355 e 266nm, rispettivamente) in singolo modo ΤΕΜ00. Per la realizzazione di pori con dimensioni comprese fra 15 e 30 μm viene utilizzata convenientemente la seconda armonica (532nm) nel verde, sempre in singolo modo, e per pori con dimensioni comprese fra 30 e 50 μm viene utilizzata convenientemente la lunghezza d'onda fondamentale (1064nm) nell'IR, ancora in singolo modo. For the realization of pores with dimensions between 3 and 15 μm, DPSS lasers are conveniently used in Q-switch in the UV (third and fourth harmonic, wavelength of 355 and 266nm, respectively) in single mode ΤΕΜ00. For the realization of pores with dimensions between 15 and 30 μm the second harmonic (532nm) in the green is conveniently used, always in single mode, and for pores with dimensions between 30 and 50 μm the fundamental wavelength is conveniently used (1064nm) in IR, again in single mode.

Per fori con dimensioni maggiori, possono essere utilizzate le stesse sorgenti laser, ma funzionanti in multimodo (potenza maggiore). For holes with larger dimensions, the same laser sources can be used, but operating in multimode (higher power).

Da un esame delle caratteristiche dell'invenzione sono evidenti i vantaggi che essa consente di ottenere. From an examination of the characteristics of the invention, the advantages it allows to obtain are evident.

L'impiego di una sorgente laser di tipo DPSS in regime di Q-switch consente di realizzare in modo rapido ed economico degli impianti provvisti di una topografia superficiale ottimizzata ed atta a favorire la proliferazione e la differenziazione delle cellule di tipo osteoblastico. The use of a DPSS-type laser source in the Q-switch regime allows for the rapid and economical creation of implants equipped with an optimized surface topography suitable for promoting the proliferation and differentiation of osteoblastic cells.

Risulta infine chiaro che al metodo ed ai sistema laser descritti possono essere apportate modifiche e varianti che non escono dall'ambito di tutela definito dalle rivendicazioni. Finally, it is clear that modifications and variations may be made to the described method and laser system which do not depart from the scope of protection defined by the claims.

In particolare, il metodo ed i sistemi laser possono essere utilizzati per il trattamento di dispositivi impiantabili di altro tipo, non necessariamente per la chirurgia orale. In particular, the laser method and systems can be used for the treatment of other types of implantable devices, not necessarily for oral surgery.

Claims (25)

RIVENDICAZIONI 1. Metodo di trattamento laser di un dispositivo (1) impiantabile comprendente le fasi di generare un fascio laser (L) impulsato mediante un generatore (12) allo stato solido pompato a diodi (DPSS) in regime di Q-switch; focalizzare il fascio laser (L) su una superficie (4) del dispositivo; e movimentare il fascio laser (L) rispetto alla detta superficie (4) secondo un moto relativo di scansione per realizzare una morfologia superficiale comprendente una distribuzione controllata di pori (5), la potenza del fascio laser (L) essendo determinata in modo da realizzare pori (5) aventi diametro e profondità compresi fra 3 e 150 pm, il moto di scansione e la frequenza degli impulsi essendo controllati in modo da realizzare pori (5) con un passo compreso fra 3 e 300 pm. CLAIMS A method of laser treatment of an implantable device (1) comprising the steps of generating a pulsed laser beam (L) by means of a diode pumped solid state generator (12) (DPSS) in the Q-switch regime; focusing the laser beam (L) on a surface (4) of the device; And moving the laser beam (L) with respect to said surface (4) according to a relative scanning motion to achieve a surface morphology comprising a controlled distribution of pores (5), the power of the laser beam (L) being determined so as to produce pores (5) having a diameter and depth between 3 and 150 µm, the scanning motion and the frequency of the pulses being controlled so as to produce pores (5) with a pitch of between 3 and 300 µm. 2. Metodo secondo la rivendicazione 1, caratterizzato dal fatto di comprendere la fase di realizzare pori (5) aventi diametro e profondità compresi fra 3 e 30 pm. 2. Method according to claim 1, characterized in that it comprises the step of making pores (5) having a diameter and depth of between 3 and 30 µm. 3. Metodo secondo la rivendicazione 1 o 2 , caratterizzato dal fatto di comprendere la fase di realizzare pori (5) aventi diametro e profondità compresi fra 5 e 20 μm. 3. Method according to claim 1 or 2, characterized in that it comprises the step of making pores (5) having a diameter and depth of between 5 and 20 μm. 4. Metodo secondo la rivendicazione 1, caratterizzato dal fatto che il passo fra i pori (5) è pari a 5-150μm. 4. Method according to claim 1, characterized in that the pitch between the pores (5) is equal to 5-150μm. 5. Metodo secondo la rivendicazione 1 o 4, caratterizzato dal fatto che il passo fra i pori (5) è pari a 10-30μm. 5. Method according to claim 1 or 4, characterized in that the pitch between the pores (5) is equal to 10-30μm. 6. Metodo secondo la rivendicazione 1 per la realizzazione di pori (5) con diametro compreso fra 3 e 15 μm, caratterizzato dal fatto di impiegare un generatore (12) DPSS nell'UV in singolo modo ΤΕΜ00. 6. Method according to claim 1 for the production of pores (5) with a diameter between 3 and 15 μm, characterized by the fact of using a DPSS generator (12) in the UV in single mode ΤΕΜ00. 7. Metodo secondo la rivendicazione 1 per la realizzazione di pori (5) con diametro compreso fra 15 e 30 μm, caratterizzato dal fatto di impiegare un generatore (12) DPSS nel verde in singolo modo ΤΕΜ00. 7. Method according to claim 1 for producing pores (5) with a diameter between 15 and 30 μm, characterized by using a DPSS generator (12) in the green in single mode ΤΕΜ00. 8. Metodo secondo la rivendicazione 1 per la realizzazione di pori (5) con diametro compreso fra 30 e 50 μm, caratterizzato dal fatto di impiegare un generatore (12) DPSS operante nell'IR in singolo modo ΤΕΜ00. 8. Method according to claim 1 for the production of pores (5) with a diameter between 30 and 50 μm, characterized by the fact of using a DPSS generator (12) operating in the IR in a single mode ΤΕΜ00. 9. Metodo secondo la rivendicazione 1 per la realizzazione di pori (5) con diametro compreso fra 50 e 150 μm, caratterizzato dal fatto di impiegare un generatore (12) DPSS in multi-modo. Method according to claim 1 for producing pores (5) with a diameter between 50 and 150 μm, characterized by using a DPSS generator (12) in a multi-mode. 10. Sistema laser (10, 11) per il trattamento di un dispositivo (1) impiantabile per realizzare sul detto dispositivo una morfologia superficiale comprendente una distribuzione controllata di pori (5), caratterizzato dal fatto di comprendere un generatore (12) allo stato solido pompato a diodi (DPSS) in regime di Q-switch per generare un fascio laser (L) impulsato di potenza tale da realizzare pori (5) aventi diametro compreso fra 3 e 150 μm, mezzi di focalizzazione (18, 25) del fascio laser (L) su una superficie (4) del dispositivo (1), mezzi di movimentazione relativa (13, 14, 15) per spostare il fascio laser (L) rispetto alla detta superficie (4) per realizzare un moto relativo di scansione della detta superficie (4) mediante il detto fascio laser (L), e mezzi di controllo (24) dei detti mezzi di movimentazione relativa (13, 14, 15) per realizzare un moto di scansione tale da produrre pori (5) con un passo compreso fra 3 e 300 pm. 10. Laser system (10, 11) for the treatment of an implantable device (1) to create a surface morphology on said device comprising a controlled distribution of pores (5), characterized in that it comprises a solid-state generator (12) diode pumped (DPSS) in Q-switch regime to generate a pulsed laser beam (L) of such power as to create pores (5) having a diameter between 3 and 150 μm, focusing means (18, 25) of the laser beam (L) on a surface (4) of the device (1), relative movement means (13, 14, 15) to move the laser beam (L) with respect to said surface (4) to achieve a relative scanning motion of said surface (4) by means of said laser beam (L), and control means (24) of said relative movement means (13, 14, 15) to achieve a scanning motion such as to produce pores (5) with a pitch included between 3 and 300 pm. 11. Sistema laser secondo la rivendicazione 10, caratterizzato dal fatto che il detto generatore (12) opera nell'UV. 11. Laser system according to claim 10, characterized in that said generator (12) operates in the UV. 12. Sistema laser secondo la rivendicazione 10, caratterizzato dal fatto che il detto generatore (12) opera nel verde. Laser system according to claim 10, characterized in that said generator (12) operates in the green. 13. Sistema laser secondo la rivendicazione 10, caratterizzato dal fatto che il detto generatore (12) opera nell'IR. 13. Laser system according to claim 10, characterized in that said generator (12) operates in the IR. 14. Sistema laser secondo la rivendicazione 10, caratterizzato dal fatto che il detto generatore (12) opera in singolo modo ΤΕΜ00. 14. Laser system according to claim 10, characterized in that said generator (12) operates in a single mode ΤΕΜ00. 15. Sistema laser secondo la rivendicazione 10, caratterizzato dal fatto che il detto generatore (12) opera in multi-modo. 15. Laser system according to claim 10, characterized in that said generator (12) operates in a multi-mode. 16. Sistema laser secondo la rivendicazione 10, caratterizzato dal fatto che i detti mezzi di movimentazione relativa comprendono mezzi di supporto (16, 26) per il detto dispositivo (1) girevoli intorno ad un primo asse (a) coincidente con un asse del dispositivo (1) stesso. 16. Laser system according to claim 10, characterized in that said relative movement means comprise support means (16, 26) for said device (1) rotatable around a first axis (a) coinciding with an axis of the device (1) itself. 17. Sistema secondo la rivendicazione 16, caratterizzato dal fatto che i detti mezzi di supporto (16, 26) per il detto dispositivo (1) sono girevoli intorno ad un secondo asse (β) ortogonale rispetto al detto primo asse (a). System according to claim 16, characterized in that said support means (16, 26) for said device (1) are rotatable around a second axis (β) orthogonal with respect to said first axis (a). 18. Sistema secondo la rivendicazione 16 o 17, caratterizzato dal fatto che i detti mezzi di movimentazione relativa comprendono mezzi (13, 25) per muovere il detto fascio laser (L) di moto alternato sostanzialmente lungo una generatrice del detto dispositivo (1). 18. System according to claim 16 or 17, characterized in that said relative movement means comprise means (13, 25) for moving said laser beam (L) with reciprocating motion substantially along a generator of said device (1). 19. Sistema secondo la rivendicazione 18, caratterizzato dal fatto che i detti mezzi di movimentazione relativa comprendono una testa (13) a scansione . 19. System according to claim 18, characterized in that said relative movement means comprise a scanning head (13). 20. Sistema secondo la rivendicazione 19, caratterizzato dal fatto che i detti mezzi di focalizzazione comprendono un obiettivo (18) f-theta portato dalla detta testa a scansione (13). 20. System according to claim 19, characterized in that said focusing means comprise an f-theta objective (18) carried by said scanning head (13). 21. Dispositivo impiantabile comprendente una superficie provvista di una distribuzione controllata di pori (5) aventi diametro e profondità compresi fra 3 e 150 pm e un passo compreso fra 3 e 300 pm. 21. Implantable device comprising a surface provided with a controlled distribution of pores (5) having a diameter and depth between 3 and 150 µm and a pitch between 3 and 300 µm. 22. Dispositivo impiantabile secondo la rivendicazione 21, caratterizzato dal fatto che i detti pori (5) hanno diametro e profondità compresi fra 3 e 30 pm. 22. Implantable device according to claim 21, characterized in that said pores (5) have a diameter and depth between 3 and 30 µm. 23. Dispositivo impiantabile secondo la rivendicazione 21 o 22, caratterizzato dal fatto che i detti pori (5) hanno diametro e profondità compresi fra 5 e 20 pm. 23. Implantable device according to claim 21 or 22, characterized in that said pores (5) have a diameter and depth comprised between 5 and 20 µm. 24. Dispositivo impiantabile secondo la rivendicazione 23, caratterizzato dal fatto che il passo fra i pori (5) è pari a 5-150μm. 24. Implantable device according to claim 23, characterized in that the pitch between the pores (5) is equal to 5-150μm. 25. Dispositivo impiantabile secondo la rivendicazione 21 o 24, caratterizzato dal fatto che il passo fra i pori (5) è pari a 10-30μm.25. Implantable device according to claim 21 or 24, characterized in that the pitch between the pores (5) is equal to 10-30μm.
IT000089A 2006-02-08 2006-02-08 METHOD FOR LASER TREATMENT OF IMPLANTABLE DEVICES, IMPLANTABLE DEVICES OBTAINED WITH THIS METHOD AND LASER SYSTEM FOR THE TREATMENT OF IMPLANTABLE DEVICES ITTO20060089A1 (en)

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EP07705559A EP1991169A1 (en) 2006-02-08 2007-02-08 A method for laser treatment of implantable devices, implantable devices obtained using said method, and a laser system for treatment of implantable devices
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