ITMI931505A1 - CONSTRUCTION GROUP FOR ELECTRONIC CONTROL DEVICES - Google Patents

CONSTRUCTION GROUP FOR ELECTRONIC CONTROL DEVICES

Info

Publication number
ITMI931505A1
ITMI931505A1 IT001505A ITMI931505A ITMI931505A1 IT MI931505 A1 ITMI931505 A1 IT MI931505A1 IT 001505 A IT001505 A IT 001505A IT MI931505 A ITMI931505 A IT MI931505A IT MI931505 A1 ITMI931505 A1 IT MI931505A1
Authority
IT
Italy
Prior art keywords
electronic control
control devices
construction group
construction
group
Prior art date
Application number
IT001505A
Other languages
Italian (it)
Inventor
Werner Hofmeister
Peter Jares
Dieter Karr
Martin Rau
Karl Schupp
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI931505A0 publication Critical patent/ITMI931505A0/en
Publication of ITMI931505A1 publication Critical patent/ITMI931505A1/en
Application granted granted Critical
Publication of IT1264911B1 publication Critical patent/IT1264911B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
IT93MI001505A 1992-07-17 1993-07-09 CONSTRUCTION GROUP FOR ELECTRONIC CONTROL DEVICES IT1264911B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4223522A DE4223522A1 (en) 1992-07-17 1992-07-17 Electronic control device circuit module - has power components attached in two rows in two respective arms of U=shaped cooling element

Publications (3)

Publication Number Publication Date
ITMI931505A0 ITMI931505A0 (en) 1993-07-09
ITMI931505A1 true ITMI931505A1 (en) 1995-01-09
IT1264911B1 IT1264911B1 (en) 1996-10-17

Family

ID=6463425

Family Applications (1)

Application Number Title Priority Date Filing Date
IT93MI001505A IT1264911B1 (en) 1992-07-17 1993-07-09 CONSTRUCTION GROUP FOR ELECTRONIC CONTROL DEVICES

Country Status (4)

Country Link
JP (1) JPH06164173A (en)
DE (1) DE4223522A1 (en)
FR (1) FR2694676B1 (en)
IT (1) IT1264911B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10223995C1 (en) * 2002-05-29 2003-11-27 Epcos Ag Coil body for annular choke coil has wire guide devices at its ends for maintaining wire windings in required pattern
DE102013107706B3 (en) * 2013-07-19 2014-04-10 Insta Elektro Gmbh Electrical / electronic installation device
DE102015001588A1 (en) * 2015-02-11 2016-08-11 Abb Ag Electronic installation device of building installation technology

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2578710B1 (en) * 1985-03-07 1988-03-04 Bendix Electronics Sa MULTIPLE FASTENING CLIP AND DEVICE FOR COLLECTIVE MOUNTING OF ELECTRONIC POWER COMPONENTS
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors

Also Published As

Publication number Publication date
DE4223522A1 (en) 1994-01-20
IT1264911B1 (en) 1996-10-17
ITMI931505A0 (en) 1993-07-09
FR2694676B1 (en) 1995-04-21
JPH06164173A (en) 1994-06-10
FR2694676A1 (en) 1994-02-11

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970718