ITMI20130707A1 - LIGHT SOURCE DEVICE EQUIPPED WITH A HARMONIZED COVER AT THE PASSAGE OF LIGHT - Google Patents

LIGHT SOURCE DEVICE EQUIPPED WITH A HARMONIZED COVER AT THE PASSAGE OF LIGHT

Info

Publication number
ITMI20130707A1
ITMI20130707A1 IT000707A ITMI20130707A ITMI20130707A1 IT MI20130707 A1 ITMI20130707 A1 IT MI20130707A1 IT 000707 A IT000707 A IT 000707A IT MI20130707 A ITMI20130707 A IT MI20130707A IT MI20130707 A1 ITMI20130707 A1 IT MI20130707A1
Authority
IT
Italy
Prior art keywords
light
harmonized
passage
cover
source device
Prior art date
Application number
IT000707A
Other languages
Italian (it)
Inventor
Rene Steinberg
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20130707A1 publication Critical patent/ITMI20130707A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3584—Increasing rugosity, e.g. roughening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
IT000707A 2012-05-14 2013-04-30 LIGHT SOURCE DEVICE EQUIPPED WITH A HARMONIZED COVER AT THE PASSAGE OF LIGHT ITMI20130707A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201210207969 DE102012207969A1 (en) 2012-05-14 2012-05-14 Light source device e.g. LED has light source cover whose specific side portion is clouded, melted and partially removed, so that predetermined target light intensity and/or target radiation level are adjusted

Publications (1)

Publication Number Publication Date
ITMI20130707A1 true ITMI20130707A1 (en) 2013-11-15

Family

ID=49475558

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000707A ITMI20130707A1 (en) 2012-05-14 2013-04-30 LIGHT SOURCE DEVICE EQUIPPED WITH A HARMONIZED COVER AT THE PASSAGE OF LIGHT

Country Status (5)

Country Link
CN (1) CN103423704A (en)
DE (1) DE102012207969A1 (en)
FR (1) FR2990566A1 (en)
IT (1) ITMI20130707A1 (en)
TW (1) TW201411891A (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243722A (en) 2002-02-22 2003-08-29 Rohm Co Ltd Package-type light emitting apparatus
JP2007194552A (en) 2006-01-23 2007-08-02 Nihon Kaiheiki Industry Co Ltd Light-emitting diode
DE102007054800A1 (en) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Luminescence conversion film for e.g. luminescence diode chip, has luminescence conversion material with fluorescent substance that is in form of organic particles, where film exhibits specific transparency to visible wavelength range
CN101626051A (en) * 2008-07-09 2010-01-13 光燿科技股份有限公司 Light emitting diode and brightness control method thereof
CN101629679A (en) * 2008-07-14 2010-01-20 光燿科技股份有限公司 LED and LED efficacy control method
DE102009051748A1 (en) * 2009-11-03 2011-05-05 Osram Opto Semiconductors Gmbh Radiation-emitting semiconductor component i.e. LED, manufacturing method, involves spotty electro-etching of conversion element by radiation such that chromaticity coordinate of mixing light changes toward target-chromaticity coordinate

Also Published As

Publication number Publication date
CN103423704A (en) 2013-12-04
TW201411891A (en) 2014-03-16
DE102012207969A1 (en) 2013-11-14
FR2990566A1 (en) 2013-11-15

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