ITMI20130598A1 - MICROELETTROMECANICAL COMPONENT CHIPPACKAGE WITH MICROELETTROMECANICAL COMPONENT AND PROCEDURE FOR MANUFACTURING A CHIPPACKAGE WITH A MICROELECTRANCANICAL COMPONENT - Google Patents

MICROELETTROMECANICAL COMPONENT CHIPPACKAGE WITH MICROELETTROMECANICAL COMPONENT AND PROCEDURE FOR MANUFACTURING A CHIPPACKAGE WITH A MICROELECTRANCANICAL COMPONENT

Info

Publication number
ITMI20130598A1
ITMI20130598A1 ITMI20130598A ITMI20130598A1 IT MI20130598 A1 ITMI20130598 A1 IT MI20130598A1 IT MI20130598 A ITMI20130598 A IT MI20130598A IT MI20130598 A1 ITMI20130598 A1 IT MI20130598A1
Authority
IT
Italy
Prior art keywords
component
microelettromecanical
chippackage
microelectrancanical
procedure
Prior art date
Application number
Other languages
Italian (it)
Inventor
Georg Bischopink
Juergen Graf
Roland Mueller-Fiedler
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20130598A1 publication Critical patent/ITMI20130598A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
ITMI20130598 2012-04-30 2013-04-12 MICROELETTROMECANICAL COMPONENT CHIPPACKAGE WITH MICROELETTROMECANICAL COMPONENT AND PROCEDURE FOR MANUFACTURING A CHIPPACKAGE WITH A MICROELECTRANCANICAL COMPONENT ITMI20130598A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201210207165 DE102012207165A1 (en) 2012-04-30 2012-04-30 Micro-electromechanical device e.g. micro-electromechanical sensor such as inertial sensor, has electrically conductive metallization portion which is arranged on surface of substrate and is partially formed of chemically active getter

Publications (1)

Publication Number Publication Date
ITMI20130598A1 true ITMI20130598A1 (en) 2013-10-31

Family

ID=49323286

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI20130598 ITMI20130598A1 (en) 2012-04-30 2013-04-12 MICROELETTROMECANICAL COMPONENT CHIPPACKAGE WITH MICROELETTROMECANICAL COMPONENT AND PROCEDURE FOR MANUFACTURING A CHIPPACKAGE WITH A MICROELECTRANCANICAL COMPONENT

Country Status (3)

Country Link
DE (1) DE102012207165A1 (en)
FR (1) FR2989966A1 (en)
IT (1) ITMI20130598A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015213443A1 (en) 2015-07-17 2017-01-19 Robert Bosch Gmbh Micromechanical component and method for adjusting the internal pressure in a micromechanical component

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1110295B (en) 1979-02-05 1985-12-23 Getters Spa NON-EVAPORABLE TERNARY GETTERING ALLOY PARTICULARLY FOR THE ABSORPTION OF WATER AND WATER VAPOR IN FUEL BARS OF NUCLEAR REACTORS
IT1110271B (en) 1979-02-05 1985-12-23 Getters Spa NON-EVAPORABLE TERNARY GETTERING ALLOY AND METHOD OF ITS USE FOR THE ABSORPTION OF WATER, WATER VAPOR, OTHER GASES
IT1228392B (en) 1989-01-24 1991-06-14 Getters Spa GETTER MATERIALS FOR VACUUM INSULATION OF STORAGE CONTAINERS OR LIQUID HYDROGEN TRANSPORT LINES.
IT1248676B (en) 1990-06-01 1995-01-26 Getters Spa RECOVERY OF TRITIUM AND DEUTERIUM FROM THEIR OXIDES AND INTERMETALLIC COMPOUNDS USEFUL FOR THIS PURPOSE
US6499354B1 (en) 1998-05-04 2002-12-31 Integrated Sensing Systems (Issys), Inc. Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices
JP2000323484A (en) 1999-05-07 2000-11-24 Mitsubishi Electric Corp Semiconductor device and semiconductor memory
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US6958264B1 (en) 2001-04-03 2005-10-25 Advanced Micro Devices, Inc. Scribe lane for gettering of contaminants on SOI wafers and gettering method
US6534850B2 (en) * 2001-04-16 2003-03-18 Hewlett-Packard Company Electronic device sealed under vacuum containing a getter and method of operation
TW533188B (en) 2001-07-20 2003-05-21 Getters Spa Support for microelectronic, microoptoelectronic or micromechanical devices
WO2005015637A1 (en) * 2003-08-08 2005-02-17 Matsushita Electric Industrial Co., Ltd. Electronic device and method of producing the same

Also Published As

Publication number Publication date
DE102012207165A1 (en) 2013-10-31
FR2989966A1 (en) 2013-11-01

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