ITMI20110357A1 - Sistema microfluidico per scopi di analisi e di diagnosi, nonchè corrispondente procedimento per produrre un sistema microfluidico - Google Patents
Sistema microfluidico per scopi di analisi e di diagnosi, nonchè corrispondente procedimento per produrre un sistema microfluidicoInfo
- Publication number
- ITMI20110357A1 ITMI20110357A1 IT000357A ITMI20110357A ITMI20110357A1 IT MI20110357 A1 ITMI20110357 A1 IT MI20110357A1 IT 000357 A IT000357 A IT 000357A IT MI20110357 A ITMI20110357 A IT MI20110357A IT MI20110357 A1 ITMI20110357 A1 IT MI20110357A1
- Authority
- IT
- Italy
- Prior art keywords
- microfluid system
- diagnosis
- analysis
- purposes
- producing
- Prior art date
Links
- 238000003745 diagnosis Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00783—Laminate assemblies, i.e. the reactor comprising a stack of plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/02—Adapting objects or devices to another
- B01L2200/026—Fluid interfacing between devices or objects, e.g. connectors, inlet details
- B01L2200/027—Fluid interfacing between devices or objects, e.g. connectors, inlet details for microfluidic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/06—Auxiliary integrated devices, integrated components
- B01L2300/0627—Sensor or part of a sensor is integrated
- B01L2300/0663—Whole sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
- B01L2300/0874—Three dimensional network
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0887—Laminated structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/16—Surface properties and coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/036—Micropumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/054—Microvalves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0154—Moulding a cap over the MEMS device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010002990A DE102010002990A1 (de) | 2010-03-18 | 2010-03-18 | Mikrofluidisches System für Analyse- und Diagnosezwecke sowie entsprechendes Verfahren zur Herstellung eines mikrofluidischen Systems |
Publications (1)
Publication Number | Publication Date |
---|---|
ITMI20110357A1 true ITMI20110357A1 (it) | 2011-09-19 |
Family
ID=43977027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT000357A ITMI20110357A1 (it) | 2010-03-18 | 2011-03-08 | Sistema microfluidico per scopi di analisi e di diagnosi, nonchè corrispondente procedimento per produrre un sistema microfluidico |
Country Status (4)
Country | Link |
---|---|
US (1) | US9101929B2 (it) |
DE (1) | DE102010002990A1 (it) |
FR (1) | FR2957535A1 (it) |
IT (1) | ITMI20110357A1 (it) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8748231B2 (en) * | 2011-08-23 | 2014-06-10 | Amphenol Thermometrics, Inc. | Component assembly using a temporary attach material |
DE102013100388B4 (de) * | 2013-01-15 | 2014-07-24 | Epcos Ag | Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung |
US10086370B2 (en) | 2013-02-08 | 2018-10-02 | Infineon Technologies Ag | Microfluidic device and method |
NO20130600A1 (no) * | 2013-04-30 | 2014-10-31 | Sinvent As | Lab-on-a-chip-system og fremstillingsmåte for samme |
FR3008690B1 (fr) * | 2013-07-22 | 2016-12-23 | Commissariat Energie Atomique | Dispositif comportant un canal fluidique muni d'au moins un systeme micro ou nanoelectronique et procede de realisation d'un tel dispositif |
KR101504898B1 (ko) * | 2013-08-12 | 2015-03-23 | 앰코 테크놀로지 코리아 주식회사 | 마이크로 플루이딕 패키지 |
DE102014200483B4 (de) | 2014-01-14 | 2024-05-08 | Robert Bosch Gmbh | Verfahren zum Betreiben eines mikrofluidischen Chips und mikrofluidischer Chip |
US10767219B2 (en) | 2014-03-11 | 2020-09-08 | Illumina, Inc. | Disposable, integrated microfluidic cartridge and methods of making and using same |
DE102015205701A1 (de) * | 2015-03-30 | 2016-10-06 | Robert Bosch Gmbh | Detektionsvorrichtung und Verfahren zum Detektieren zumindest eines Analyten |
DE102016200256A1 (de) * | 2016-01-13 | 2017-07-13 | Robert Bosch Gmbh | Pumpvorrichtung und Partikeldetektor mit einer Pumpvorrichtung |
WO2017210219A1 (en) * | 2016-05-31 | 2017-12-07 | The Regents Of The University Of California | Microfluidic component package |
US10815121B2 (en) * | 2016-07-12 | 2020-10-27 | Hewlett-Packard Development Company, L.P. | Composite wafers |
WO2018013109A1 (en) * | 2016-07-13 | 2018-01-18 | Hewlett-Packard Development Company, L.P. | Microelectromechanical system (mems) devices |
AU2019344001B2 (en) | 2018-09-20 | 2023-11-16 | Cepheid | System, device and methods of sample processing using semiconductor detection chips |
AU2019398452A1 (en) | 2018-12-14 | 2021-07-08 | Cepheid | Diagnostic detection chip devices and methods of manufacture and assembly |
DE102019202722B4 (de) * | 2019-02-28 | 2022-06-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Kombinierte pumpe-sensor-anordnung |
CN110898867B (zh) * | 2019-12-04 | 2021-04-06 | 中国科学院长春光学精密机械与物理研究所 | 一种微流控芯片模板的制备方法 |
CN113327904B (zh) * | 2021-04-29 | 2023-06-02 | 中国电子科技集团公司第二十九研究所 | 一种双面高效散热气密封装结构及其制备方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5932799A (en) * | 1997-07-21 | 1999-08-03 | Ysi Incorporated | Microfluidic analyzer module |
US6117643A (en) * | 1997-11-25 | 2000-09-12 | Ut Battelle, Llc | Bioluminescent bioreporter integrated circuit |
US20020112961A1 (en) * | 1999-12-02 | 2002-08-22 | Nanostream, Inc. | Multi-layer microfluidic device fabrication |
US6453928B1 (en) * | 2001-01-08 | 2002-09-24 | Nanolab Ltd. | Apparatus, and method for propelling fluids |
US6548895B1 (en) * | 2001-02-21 | 2003-04-15 | Sandia Corporation | Packaging of electro-microfluidic devices |
US20020187072A1 (en) | 2001-06-07 | 2002-12-12 | Nanostream, Inc. | Multi-layer microfluidic splitter |
EP1997772A3 (en) * | 2002-05-16 | 2011-01-26 | Micronit Microfluidics B.V. | Method of fabrication of a microfluidic device |
CA2501857A1 (en) * | 2002-10-09 | 2004-04-22 | The Board Of Trustees Of The University Of Illinois | Microfluidic systems and components |
US7004198B1 (en) * | 2004-07-20 | 2006-02-28 | Sandia Corporation | Micro-fluidic interconnect |
GB2438768A (en) * | 2005-02-15 | 2007-12-05 | Univ Singapore | Microfluidics package and method of fabricating the same |
US20090074615A1 (en) * | 2007-09-17 | 2009-03-19 | Ysi Incorporated | Microfluidic module including an adhesiveless self-bonding rebondable polyimide |
US8082810B2 (en) * | 2008-09-29 | 2011-12-27 | Ysi Incorporated | Microfluidic elastic micro-aliquotter |
US8528602B2 (en) * | 2009-06-26 | 2013-09-10 | Nikola Pekas | Microvalve system |
-
2010
- 2010-03-18 DE DE102010002990A patent/DE102010002990A1/de not_active Withdrawn
-
2011
- 2011-03-08 IT IT000357A patent/ITMI20110357A1/it unknown
- 2011-03-17 FR FR1152178A patent/FR2957535A1/fr not_active Withdrawn
- 2011-03-17 US US13/050,762 patent/US9101929B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102010002990A1 (de) | 2011-09-22 |
US20110229375A1 (en) | 2011-09-22 |
US9101929B2 (en) | 2015-08-11 |
FR2957535A1 (fr) | 2011-09-23 |
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