ITMI20050289A1 - APPARATUS FOR ELIMINATING OR REDUCING THE FLOW FROM THE METALLIC PART OF A SEMICONDUCTOR DEVICE - Google Patents

APPARATUS FOR ELIMINATING OR REDUCING THE FLOW FROM THE METALLIC PART OF A SEMICONDUCTOR DEVICE

Info

Publication number
ITMI20050289A1
ITMI20050289A1 ITMI20050289A ITMI20050289A1 IT MI20050289 A1 ITMI20050289 A1 IT MI20050289A1 IT MI20050289 A ITMI20050289 A IT MI20050289A IT MI20050289 A1 ITMI20050289 A1 IT MI20050289A1
Authority
IT
Italy
Prior art keywords
eliminating
reducing
flow
semiconductor device
metallic part
Prior art date
Application number
Other languages
Italian (it)
Inventor
Carmel Cauchi
Adrian Vigar
Original Assignee
Stmicroelectronics Ltd Malta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stmicroelectronics Ltd Malta filed Critical Stmicroelectronics Ltd Malta
Priority to ITMI20050289 priority Critical patent/ITMI20050289A1/en
Priority to PCT/EP2006/060047 priority patent/WO2006089860A1/en
Priority to CNA2006800131177A priority patent/CN101164137A/en
Publication of ITMI20050289A1 publication Critical patent/ITMI20050289A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
ITMI20050289 2005-02-24 2005-02-24 APPARATUS FOR ELIMINATING OR REDUCING THE FLOW FROM THE METALLIC PART OF A SEMICONDUCTOR DEVICE ITMI20050289A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
ITMI20050289 ITMI20050289A1 (en) 2005-02-24 2005-02-24 APPARATUS FOR ELIMINATING OR REDUCING THE FLOW FROM THE METALLIC PART OF A SEMICONDUCTOR DEVICE
PCT/EP2006/060047 WO2006089860A1 (en) 2005-02-24 2006-02-17 Apparatus for removing or decreasing the resin flush from the metallic part of a semiconductor device.
CNA2006800131177A CN101164137A (en) 2005-02-24 2006-02-17 Apparatus for removing or decreasing the resin flush from the metallic part of a semiconductor device.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI20050289 ITMI20050289A1 (en) 2005-02-24 2005-02-24 APPARATUS FOR ELIMINATING OR REDUCING THE FLOW FROM THE METALLIC PART OF A SEMICONDUCTOR DEVICE

Publications (1)

Publication Number Publication Date
ITMI20050289A1 true ITMI20050289A1 (en) 2006-08-25

Family

ID=36177843

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI20050289 ITMI20050289A1 (en) 2005-02-24 2005-02-24 APPARATUS FOR ELIMINATING OR REDUCING THE FLOW FROM THE METALLIC PART OF A SEMICONDUCTOR DEVICE

Country Status (3)

Country Link
CN (1) CN101164137A (en)
IT (1) ITMI20050289A1 (en)
WO (1) WO2006089860A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147125A (en) * 1982-02-26 1983-09-01 Nippon Telegr & Teleph Corp <Ntt> Wet processing device
JPH0728002B2 (en) * 1991-06-20 1995-03-29 株式会社石井表記 IC frame bra swing method and apparatus
US5891257A (en) * 1996-11-08 1999-04-06 International Business Machines Corporation Tool for removing protective encapsulants

Also Published As

Publication number Publication date
CN101164137A (en) 2008-04-16
WO2006089860A1 (en) 2006-08-31

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